CN111769812B - Surface acoustic wave filter chip packaging structure and packaging method - Google Patents
Surface acoustic wave filter chip packaging structure and packaging method Download PDFInfo
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- CN111769812B CN111769812B CN202010456137.3A CN202010456137A CN111769812B CN 111769812 B CN111769812 B CN 111769812B CN 202010456137 A CN202010456137 A CN 202010456137A CN 111769812 B CN111769812 B CN 111769812B
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- acoustic wave
- wave filter
- surface acoustic
- filter chip
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- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 100
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 112
- 238000003466 welding Methods 0.000 claims abstract description 97
- 229910000679 solder Inorganic materials 0.000 claims abstract description 48
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 239000000853 adhesive Substances 0.000 claims description 40
- 230000001070 adhesive effect Effects 0.000 claims description 40
- 230000008093 supporting effect Effects 0.000 claims description 38
- 239000000084 colloidal system Substances 0.000 claims description 16
- 239000003292 glue Substances 0.000 abstract description 9
- 230000005611 electricity Effects 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 32
- 230000000694 effects Effects 0.000 description 6
- 230000004927 fusion Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 238000005215 recombination Methods 0.000 description 3
- 230000006798 recombination Effects 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 210000005056 cell body Anatomy 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The invention provides a surface acoustic wave filter chip packaging structure and a packaging method, and belongs to the technical field of chip packaging. The surface acoustic wave filter chip packaging structure comprises: the substrate, be formed with the welding hole on the face of one side of substrate, the circuit electricity in welding hole's bottom and the substrate is connected, and the welding hole intussuseption is filled with conductive glue, and the lug solder joint of surface acoustic wave filter chip stretches into in the welding hole and is connected with conductive glue, and the working area of surface acoustic wave filter chip is towards the substrate, and surface acoustic wave filter chip encircles working area and substrate sealing connection, forms the cavity between working area and the substrate. The invention aims to provide a packaging structure and a packaging method of a surface acoustic wave filter chip, which can enhance the connection strength between a bump welding point of the surface acoustic wave filter chip and a substrate, thereby reducing the probability of bad influence of external force on the packaging structure.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a surface acoustic wave filter chip packaging structure and a packaging method.
Background
The surface acoustic wave filter (SAW FILTER) uses lithium niobate or lead titanate piezoelectric crystal as substrate, and two groups of interdigital metal electrodes with energy conversion function, namely input transducer and output transducer, are made by photoetching process. The input transducer and the output transducer are utilized to convert the input signal of the electric wave into mechanical energy, and after the mechanical energy is processed, the mechanical energy is converted into an electric signal to be output, so that the aim of filtering unnecessary signals and noise is achieved, and the receiving quality is improved. Due to the product performance and design function requirements of the surface acoustic wave filter, the functional area of the surface acoustic wave filter chip needs to be ensured not to contact any substance, namely the cavity structure design.
In the prior art, the packaging structure of the surface acoustic wave filter chip is generally formed by dispensing on a substrate, flip-chip mounting the chip on the substrate, and soldering the chip with the corresponding solder pad of the substrate through the bump solder pad of the chip, so that the chip is electrically connected with the substrate, and bonding the chip with the substrate for sealing through dispensing on the substrate, so that a closed cavity is formed between the working area of the chip and the substrate. In the cavity structure, the gap between the chip and the substrate is supported by the bump welding point of the chip, so that the welding structure between the bump welding point of the chip and the substrate is easy to crack under the influence of external force, and poor performance of the packaging structure is caused.
Disclosure of Invention
The invention aims to provide a packaging structure and a packaging method of a surface acoustic wave filter chip, which can enhance the connection strength between a bump welding point of the surface acoustic wave filter chip and a substrate, thereby reducing the probability of bad influence of external force on the packaging structure.
Embodiments of the present invention are implemented as follows:
in one aspect of the embodiment of the present invention, there is provided a surface acoustic wave filter chip package structure, including: the substrate, be formed with the welding hole on the face of one side of substrate, the circuit electricity in welding hole's bottom and the substrate is connected, and the welding hole intussuseption is filled with conductive glue, and the lug solder joint of surface acoustic wave filter chip stretches into in the welding hole and is connected with conductive glue, and the working area of surface acoustic wave filter chip is towards the substrate, and surface acoustic wave filter chip encircles working area and substrate sealing connection, forms the cavity between working area and the substrate.
Optionally, the surface acoustic wave filter chip is formed with a groove body surrounding the working area, and the groove body is filled with colloid, and the colloid is bonded with the substrate.
Optionally, a connection pad corresponding to the groove body is formed on the substrate, and the colloid is connected with the connection pad.
Optionally, a gap is provided between the land and the surface of the saw filter chip.
Optionally, a supporting body is arranged in the welding hole, and the supporting body is connected with the bottom of the welding hole and the bump welding point.
Optionally, the support body includes a support column with two ends respectively connected with the bottom of the welding hole and the bump welding point.
Optionally, the support column has a plurality.
Optionally, the support body includes the branch that both ends are connected with the bottom and the lug solder joint of welding hole respectively, is connected with the tow bar on the branch, and the tow bar is located the tip and the lug solder joint connection of branch, and tow bar and branch intercrossing.
Optionally, the tow bar is perpendicular to the strut.
Optionally, a boss connected to a side wall of the soldering hole is formed at a bottom of the soldering hole, and the boss is used for supporting the bump pads.
Optionally, the bump solder joint includes a conductive post and a solder ball, two ends of the conductive post are respectively connected with the saw filter chip and the solder ball, and the solder ball is connected with the support body and the conductive adhesive.
In another aspect of the embodiment of the present invention, there is provided a surface acoustic wave filter chip packaging method, including:
forming a soldering hole on the substrate so that the bottom of the soldering hole is electrically connected with a circuit in the substrate;
Filling conductive adhesive into the welding holes;
And attaching the surface acoustic wave filter chip so that bump welding points of the surface acoustic wave filter chip extend into the welding holes to be connected with the conductive adhesive, forming a cavity towards the substrate by the working area of the surface acoustic wave filter chip, and sealing and connecting the working area around the surface acoustic wave filter chip with the substrate.
Optionally, before the surface acoustic wave filter chip is mounted, the method further includes:
and forming a groove body surrounding the working area on the surface of the working area of the surface acoustic wave filter chip, and filling colloid into the groove body.
The beneficial effects of the embodiment of the invention include:
The embodiment of the invention provides a surface acoustic wave filter chip packaging structure, which comprises a substrate, wherein a welding hole is formed on one side surface of the substrate, the bottom of the welding hole is electrically connected with a circuit in the substrate, and conductive adhesive is filled in the welding hole. The bump welding points of the surface acoustic wave filter chip extend into the welding holes and are connected with the conductive adhesive, so that the communication between the surface acoustic wave filter chip and the circuit in the substrate is realized. The working area of the surface acoustic wave filter chip faces to the substrate, the working area is connected with the substrate in a sealing way, and a cavity is formed between the working area of the chip and the substrate under the support of the bump welding points of the chip. According to the packaging structure, the bump welding points of the surface acoustic wave filter chip can be protected through the welding holes, so that the shearing stress and bending stress born by the bump welding points under the influence of external force are reduced. And, because the welding hole is filled with conductive adhesive, and the bump welding point of the surface acoustic wave filter chip is connected with the conductive adhesive, the connection strength of the connection between the bump welding point and the substrate can be enhanced through the bonding and recombination of the conductive adhesive and the bump welding point. Therefore, the probability of poor performance and the like of the packaging structure due to the influence of external force is reduced.
According to the surface acoustic wave filter chip packaging method provided by the embodiment of the invention, the welding hole can be formed on the substrate, so that the bottom of the welding hole is electrically connected with the circuit in the substrate, and the conductive adhesive is filled in the welding hole. And then, the surface acoustic wave filter chip is attached so that bump welding points of the surface acoustic wave filter chip extend into the welding holes to be connected with the conductive adhesive, a cavity is formed between the working area of the surface acoustic wave filter chip and the substrate towards the substrate, and the surface acoustic wave filter chip surrounds the working area to be connected with the substrate in a sealing way, so that the surface acoustic wave filter chip packaging structure is manufactured. The surface acoustic wave filter chip manufactured by the method can protect the bump welding points of the surface acoustic wave filter chip by using the welding holes so as to reduce the shearing stress and bending stress born by the bump welding points under the influence of external force. And, because the welding hole is filled with conductive adhesive, and the bump welding point of the surface acoustic wave filter chip is connected with the conductive adhesive, the connection strength of the connection between the bump welding point and the substrate can be enhanced through the bonding and recombination of the conductive adhesive and the bump welding point. Therefore, the probability of poor performance and the like of the packaging structure due to the influence of external force is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a surface acoustic wave filter chip package structure according to an embodiment of the present invention;
Fig. 2 is a schematic structural diagram of a surface acoustic wave filter chip according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a soldering hole of a surface acoustic wave filter chip package structure according to an embodiment of the present invention;
FIG. 4 is a second schematic diagram of a solder hole of a surface acoustic wave filter chip package structure according to an embodiment of the present invention;
Fig. 5 is a schematic flow chart of a surface acoustic wave filter chip packaging method according to an embodiment of the present invention.
Icon: 110-a substrate; 120-welding holes; 121-conductive adhesive; 130-a surface acoustic wave filter chip; 131-working area; 132-a tank body; 133-colloid; 140-bump pads; 150-connecting discs; 160-a support; 161-supporting columns; 162-struts; 163-tow bar.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
An embodiment of the present invention provides a surface acoustic wave filter chip package structure, as shown in fig. 1, including: the substrate 110, be formed with the welding hole 120 on the face of one side of substrate 110, the circuit electricity in welding hole 120 is connected with the substrate 110 is downthehole to be filled with conductive adhesive 121 in the welding hole 120, and the lug solder joint 140 of saw filter chip 130 stretches into in welding hole 120 and is connected with conductive adhesive 121, and the workspace 131 of saw filter chip 130 is towards substrate 110, and saw filter chip 130 encircles workspace 131 and substrate 110 sealing connection, forms the cavity between workspace 131 and substrate 110.
It should be noted that, the inner wall of the soldering hole 120 may be made of a conductive material, so as to improve the electrical connection effect between the soldering hole 120, the conductive adhesive 121, the circuit in the substrate 110, and the surface wave filter chip. For example, the circuit layer may be formed on the inner wall of the soldering hole 120, or the circuit layer may be formed by lamination technology, then the shape structure of the soldering hole 120 may be made of conductive material and the bottom may be electrically connected to the circuit of the circuit layer, and then the shape of the soldering hole 120 may be laminated and packaged by the packaging layer to form the circuit layer, the packaging layer, and the substrate 110 formed by the shape structure of the soldering hole 120. Of course, in practical application, the inner wall of the soldering hole 120 may not be conductive, and only the bottom of the soldering hole 120 may be conductive with the circuit in the substrate 110, i.e. the conductive adhesive 121 may be conductive with the circuit in the substrate 110 in the soldering hole 120, which is not limited herein.
In the surface acoustic wave filter chip packaging structure, the connection between the conductive adhesive 121 in the soldering hole 120 and the bump solder 140 can be performed by adopting a hot-pressing fusion welding technology, so that the conductive adhesive 121 can be bonded and recombined with the bump solder 140, and the connection strength between the bump solder 140 and the conductive adhesive 121 is improved.
It should be noted that, in order to form a cavity between the working area 131 of the saw filter chip 130 and the substrate 110, after the bump pads 140 of the saw filter chip 130 are connected to the conductive adhesive 121 in the bonding holes 120 of the substrate 110, a gap is required between the saw filter chip 130 and the substrate 110, and thus, a specific height design of the bump pads 140 can be determined by those skilled in the art according to the depth of the bonding openings, the filling height of the conductive adhesive 121, and the required cavity height, which is not limited herein.
In practical applications, the saw filter chip 130 is sealed and connected with the substrate 110 around the working area 131, and may be a sealant dispensing process performed on the substrate 110 around the area corresponding to the working area 131 of the chip, so that the saw filter chip 130 can be sealed and connected with the substrate 110 around the working area 131 by using the sealant during chip mounting. Of course, in the embodiment of the present invention, the saw filter chip 130 is hermetically connected to the substrate 110 around the working area 131 thereof, which is not limited herein.
It should be noted that, as will be appreciated by those skilled in the art, the package structure may further be provided with a plastic package to protect the saw filter chip 130, and a solder ball or a pin connected to a circuit in the substrate 110 is formed on a side of the substrate 110 facing away from the saw filter chip 130, so as to connect the package structure with an external device.
The surface acoustic wave filter chip package structure provided in the embodiment of the present invention may include a substrate 110, a soldering hole 120 is formed on a side surface of the substrate 110, a bottom of the soldering hole 120 is electrically connected to a circuit in the substrate 110, and a conductive adhesive 121 is filled in the soldering hole 120. The bump pads 140 of the saw filter chip 130 extend into the solder holes 120 and are connected to the conductive adhesive 121, thereby realizing communication between the saw filter chip 130 and the circuits in the substrate 110. The working area 131 of the saw filter chip 130 faces the substrate 110, and is connected with the substrate 110 in a sealing manner around the working area 131, and a cavity is formed between the working area 131 of the chip and the substrate 110 under the support of the bump pads 140 of the chip. The package structure can protect the bump pads 140 of the saw filter chip 130 through the solder apertures 120 to reduce the shear stress and bending stress borne by the bump pads 140 under the influence of external force. Further, since the conductive paste 121 is filled in the bonding hole 120 and the bump pad 140 of the saw filter chip 130 is connected to the conductive paste 121, the connection strength of the connection between the bump pad 140 and the substrate 110 can be enhanced by the adhesion and re-fusion of the conductive paste 121 and the bump pad 140. Therefore, the probability of poor performance and the like of the packaging structure due to the influence of external force is reduced.
Alternatively, as shown in fig. 1 and 2, the surface acoustic wave filter chip 130 is formed with a groove 132 surrounding the working area 131, and the groove 132 is filled with a gel 133, and the gel 133 is bonded to the substrate 110.
It should be noted that, since the groove 132 surrounds the working area 131 of the saw filter chip 130, the groove 132 is located on a side surface of the saw filter chip 130 where the functional area is located, and in order to avoid the influence of the groove 132 on the function of the saw filter chip 130, the groove 132 is usually located away from the chip circuit, that is, the bump pads 140 of the chip are located in the area surrounded by the groove 132.
By forming the groove 132 on the saw filter chip 130 and filling the colloid 133 in the groove 132, after the saw filter chip 130 is mounted on the substrate 110, the chip and the substrate 110 can be conveniently and hermetically connected by using the colloid 133 by using the hot-press fusion welding technology, and dispensing operation is not required on the substrate 110, so that single cutting can be performed after the whole mounting, and the packaging efficiency is improved.
Alternatively, as shown in fig. 1, a land 150 corresponding to the groove 132 is formed on the substrate 110, and the colloid 133 is connected to the land 150.
The bonding pad 150 corresponding to the groove 132 formed on the substrate 110 of the surface acoustic wave filter chip 130 can facilitate the connection of the colloid 133 to the substrate 110 by thermocompression bonding, and can improve the connection reliability between the colloid 133 and the substrate 110.
Alternatively, the land 150 may have a gap with the surface of the surface acoustic wave filter chip 130.
By providing the land 150 with a gap between the surface of the surface acoustic wave filter chip 130, for example, the surface of the land 150 is leveled with the surface of the substrate 110. The glue 133 in the groove 132 of the chip can flow out from the groove 132 and be connected to the land 150 during the thermocompression bonding, and the contact area between the glue 133 and the land 150 can be increased, thereby improving the connection effect between them.
Of course, in practical application, the connection pad 150 may be abutted against the opening of the groove 132 of the saw filter chip 130, so that the connection pad 150 can play a supporting role on the saw filter chip 130, thereby further reducing the influence of external force on the bump pads 140 of the saw filter chip 130.
Optionally, a supporting body 160 is disposed in the soldering hole 120 as shown in fig. 3 and 4, and the supporting body 160 is connected to the bottom of the soldering hole 120 and the bump pad 140.
The bump pad 140 can be supported by the support 160 disposed in the soldering hole 120, thereby reinforcing the connection strength of the bump pad 140 to reduce the influence of external force on the bump pad 140. The glue 133 in the soldering hole 120 may partially cover the supporting body 160 or completely cover the same according to the actual filling height, which is not limited herein. In practical applications, after the bump pads 140 are connected to the supporting body 160 in the soldering hole 120, the glue 133 can cover the bump pads 140 and the supporting body 160 at the connection position therebetween, so as to improve the connection strength of the bump pads 140 to the substrate 110.
Alternatively, as shown in connection with fig. 4, the supporting body 160 includes a supporting column 161 having both ends connected to the bottom of the soldering hole 120 and the bump pad 140, respectively.
The bump pad 140 is supported by the support column 161 to have an effect of reinforcing the connection strength of the bump pad 140, and the structure is convenient to set and has relatively low cost.
Illustratively, the support columns 161 may also be provided in a plurality depending on the actual strength requirements of the bump pads 140.
By providing the support columns 161 in plurality, the supporting effect of the support columns 161 on the bump pads 140 can be further enhanced.
In practical application, the support column 161 may be replaced by a vertical sheet structure, which is not limited in the embodiment of the present invention.
Alternatively, as shown in fig. 3, the supporting body 160 includes a supporting rod 162 having both ends respectively connected to the bottom of the welding hole 120 and the bump pad 140, a drag rod 163 is connected to the supporting rod 162, the drag rod 163 is connected to the bump pad 140 at the end of the supporting rod 162, and the drag rod 163 and the supporting rod 162 cross each other.
By providing the supporting body 160 in the structure of the strut 162 and the strut 163, it is possible to increase the range of contact with the bump pad 140 by the strut 163, thereby improving the effect of supporting the bump pad 140 to enhance the connection strength of the bump pad 140 within the soldering hole 120.
Illustratively, the tow bar 163 may be disposed perpendicular to the struts 162, thereby enabling the tow bar 163 to better support the bump pads 140 and provide better stability.
Optionally, the bottom of the soldering hole 120 is formed with a boss connected to a sidewall thereof, and the boss is used to support the bump pad 140.
The bump pads 140 are supported by forming bosses at the bottoms of the soldering holes 120.
When the solder hole 120 of the package structure has the supporting body 160 therein, and the supporting body 160 is a supporting column 161 with two ends respectively connected to the bottom of the solder hole 120 and the bump pad 140, the supporting column 161 may be connected to a boss formed at the bottom of the solder hole 120.
Optionally, as shown in fig. 1, the bump pads 140 include conductive pillars and solder balls (not shown), and two ends of the conductive pillars are respectively connected to the saw filter chip 130 and the solder balls, and the solder balls are connected to the supporting body 160 and the conductive adhesive 121.
By providing the solder balls, the solder balls and the conductive paste 121 can be recombined and connected to the supporting body 160 by thermal compression welding, and a composite body is formed at the connection thereof, thereby improving the strength and reliability of the connection between the bump pads 140 and the conductive paste 121 and the supporting body 160. Thereby improving the impact resistance of the bump pads 140.
The conductive pillars may be copper pillars, and the solder balls may be solder paste, which is not limited herein, as long as the conductive pillars have conductivity and the solder balls can realize thermocompression bonding.
In practical application, after the solder balls are recombined with the conductive adhesive 121, the portion of the support 160 connected with the solder balls can be covered, so as to improve the strength and the firmness of the overall connection structure.
Wherein, when the supporting body 160 is provided in a structure including the supporting rod 162 and the towing rod 163, the towing rod 163 can be wrapped by the solder balls, and the solder balls can be better supported and fixed through the towing rod 163, so that the connection stability and strength between the supporting body 160 and the solder balls are enhanced. The plurality of the hauling rods 163 can be arranged, the plurality of the hauling rods 163 can play the role of framework support through the cladding of the solder balls on the plurality of the hauling rods 163, to improve structural stability and strength of the resultant body after the solder balls and the conductive paste 121 are recombined. Also, the plurality of the drag bars 163 may be disposed parallel to each other or disposed to cross each other.
When the bottom of the soldering hole 120 of the package structure is formed with a boss, the solder ball may be held by the boss to improve the fusion effect with the glue 133 when the solder ball is thermally pressed and welded.
In another aspect of the embodiments of the present invention, a surface acoustic wave filter chip packaging method is provided, which can be used to manufacture the surface acoustic wave filter chip packaging structure, so as to enhance the connection strength between the bump pads of the surface acoustic wave filter chip and the substrate, and thereby reduce the probability of the packaging structure being affected by external force to generate defects.
As shown in fig. 5, the surface acoustic wave filter chip packaging method may include:
s501: a solder hole is formed in the substrate such that the bottom of the solder hole is electrically connected to a wiring in the substrate.
S502: and filling conductive adhesive into the welding holes.
S503: and attaching the surface acoustic wave filter chip so that bump welding points of the surface acoustic wave filter chip extend into the welding holes to be connected with the conductive adhesive, forming a cavity towards the substrate by the working area of the surface acoustic wave filter chip, and sealing and connecting the working area around the surface acoustic wave filter chip with the substrate.
The circuit layer is formed on the substrate, then the conductive layer is laminated, the conductive layer is etched to form a solder hole-shaped structure and the bottom of the conductive layer is electrically connected with the circuit of the circuit layer, and then the solder hole-shaped structure is laminated and packaged by the laminated packaging layer to form the whole substrate composed of the circuit layer, the packaging layer and the solder hole-shaped structure. Of course, in practical application, the solder holes and the like may also be formed by drilling holes in the substrate and forming conductive layers on the inner walls of the holes, and the present invention is not limited thereto. As long as a solder hole whose bottom is electrically connected to the wiring in the substrate can be formed in the substrate.
In practical application, a support may be disposed in the soldering hole before the conductive paste is filled in the soldering hole. So that the bump pads can be connected with the support body after chip mounting, and the bump pads are structurally supported by the support body.
The surface acoustic wave filter chip can be bonded by adopting a hot-pressing fusion welding technology, so that the conductive adhesive in the welding hole and the bump welding point of the chip are fused again to form a composite body for connection, and the connection strength of the bump welding point is improved.
According to the surface acoustic wave filter chip packaging method provided by the embodiment of the invention, the welding hole can be formed on the substrate, so that the bottom of the welding hole is electrically connected with the circuit in the substrate, and the conductive adhesive is filled in the welding hole. And then, the surface acoustic wave filter chip is attached so that bump welding points of the surface acoustic wave filter chip extend into the welding holes to be connected with the conductive adhesive, a cavity is formed between the working area of the surface acoustic wave filter chip and the substrate towards the substrate, and the surface acoustic wave filter chip surrounds the working area to be connected with the substrate in a sealing way, so that the surface acoustic wave filter chip packaging structure is manufactured. The surface acoustic wave filter chip manufactured by the method can protect the bump welding points of the surface acoustic wave filter chip by using the welding holes so as to reduce the shearing stress and bending stress born by the bump welding points under the influence of external force. And, because the welding hole is filled with conductive adhesive, and the bump welding point of the surface acoustic wave filter chip is connected with the conductive adhesive, the connection strength of the connection between the bump welding point and the substrate can be enhanced through the bonding and recombination of the conductive adhesive and the bump welding point. Therefore, the probability of poor performance and the like of the packaging structure due to the influence of external force is reduced.
Optionally, before the surface acoustic wave filter chip is mounted, the method further includes:
and forming a groove body surrounding the working area on the surface of the working area of the surface acoustic wave filter chip, and filling colloid into the groove body.
Through forming the cell body on the SAW filter chip, and fill colloid in the cell body, can make this SAW filter chip paste after mounting on the base plate, utilize hot pressing fusion welding technique alright be convenient with chip and base plate utilize colloid sealing connection, and need not carry out the point gum operation on the base plate, thereby can realize carrying out single cutting again after the whole subsides dress, improve encapsulation efficiency.
In practical application, after the soldering hole is formed on the substrate, a connection pad corresponding to the groove body of the surface acoustic wave filter chip can be formed, so that the colloid in the groove body can be connected with the substrate more reliably. When the bonding holes are formed using a lamination technique, the lands may be formed by etching of the conductive layer together with the bonding holes. There is no limitation in this regard.
It will be clearly understood by those skilled in the art that, for convenience and brevity of description, specific embodiments and effects of the structure and the like involved in the surface acoustic wave filter chip packaging method described above may refer to corresponding descriptions and explanations in the foregoing surface acoustic wave filter chip packaging structure embodiments, which are not repeated in the present invention.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A surface acoustic wave filter chip package structure, comprising: the surface acoustic wave filter comprises a substrate, wherein a welding hole is formed in one side surface of the substrate, the bottom of the welding hole is electrically connected with a circuit in the substrate, conductive adhesive is filled in the welding hole, a bump welding point of the surface acoustic wave filter chip extends into the welding hole and is connected with the conductive adhesive, a working area of the surface acoustic wave filter chip faces the substrate, the surface acoustic wave filter chip surrounds the working area and is connected with the substrate in a sealing mode, and a cavity is formed between the working area and the substrate; a supporting body is arranged in the welding hole, and the supporting body is connected with the bottom of the welding hole and the bump welding point; a boss connected with the side wall of the welding hole is formed at the bottom of the welding hole and used for supporting the bump welding point;
The support body comprises a support column with two ends respectively connected with the bottom of the welding hole and the bump welding point, and the support column is provided with a plurality of support columns; or the support body comprises a supporting rod, wherein two ends of the supporting rod are respectively connected with the bottom of the welding hole and the bump welding points, a pulling rod is connected to the supporting rod, the pulling rod is positioned at the end part of the supporting rod and connected with the bump welding points, the pulling rod is mutually intersected with the supporting rod, and the pulling rod is perpendicular to the supporting rod.
2. The surface acoustic wave filter chip package structure as set forth in claim 1, wherein the surface acoustic wave filter chip is formed with a groove body surrounding the working area, the groove body being filled with a gel, the gel being bonded to the substrate.
3. The surface acoustic wave filter chip package structure as set forth in claim 2, wherein lands corresponding to the groove bodies are formed on the substrate, and the colloid is connected to the lands.
4. The surface acoustic wave filter chip package structure as set forth in claim 3, wherein a gap is provided between the land and the surface of the surface acoustic wave filter chip.
5. The surface acoustic wave filter chip package structure of claim 1, wherein the bump pads comprise conductive posts and solder balls, two ends of the conductive posts are respectively connected with the surface acoustic wave filter chip and the solder balls, and the solder balls are connected with the support body and the conductive adhesive.
6. A surface acoustic wave filter chip packaging method for obtaining the surface acoustic wave filter chip packaging structure according to any one of claims 1 to 5, comprising:
forming a welding hole on a substrate so that the bottom of the welding hole is electrically connected with a circuit in the substrate;
filling conductive adhesive into the welding holes;
and mounting the surface acoustic wave filter chip so that bump welding points of the surface acoustic wave filter chip extend into the welding holes to be connected with the conductive adhesive, wherein a working area of the surface acoustic wave filter chip faces to the substrate to form a cavity, and the surface acoustic wave filter chip surrounds the working area to be connected with the substrate in a sealing way.
7. The surface acoustic wave filter chip packaging method as set forth in claim 6, wherein before the mounting of the surface acoustic wave filter chip, the method further comprises:
And forming a groove body surrounding the working area on the surface of the working area of the surface acoustic wave filter chip, and filling colloid into the groove body.
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| KR20180064175A (en) * | 2016-12-05 | 2018-06-14 | 삼성전기주식회사 | Acoustic wave filter device |
| US11109162B2 (en) * | 2017-05-05 | 2021-08-31 | Goertek Inc. | MEMS microphone |
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| JP2005318435A (en) * | 2004-04-30 | 2005-11-10 | Toyo Commun Equip Co Ltd | Piezoelectric device and oscillator |
| CN1808897A (en) * | 2005-01-17 | 2006-07-26 | 精工爱普生株式会社 | Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for implementing the same |
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