CN110958775B - Hole plugging method for anti-welding hole of circuit board - Google Patents
Hole plugging method for anti-welding hole of circuit board Download PDFInfo
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- CN110958775B CN110958775B CN201911316769.3A CN201911316769A CN110958775B CN 110958775 B CN110958775 B CN 110958775B CN 201911316769 A CN201911316769 A CN 201911316769A CN 110958775 B CN110958775 B CN 110958775B
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- hole
- circuit board
- solder mask
- cap
- welding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a hole plugging method of a solder mask hole of a circuit board, which is carried out according to the following steps: injecting ink into the anti-welding hole after the lower end of the anti-welding hole arranged on the circuit board substrate is plugged into the first cover cap; after the anti-welding hole is filled with the ink, a second cover cap is plugged into the other end of the anti-welding hole, and the second cover cap is pressed towards one end of the first cover cap until the ink flows out of the anti-welding hole and then is taken down; pre-baking the circuit board at 60-100 deg.C for 30-60 min. The method can ensure that the solder mask holes of the circuit board are fully filled, and after the ink is cured and molded, no fault or hole exists in the solder mask holes, and the solder mask holes cannot crack. The method solves the problem of high poor soldering tin ratio caused by high poor hole rate of the circuit board cap surface, thereby greatly reducing the poor product rate of products.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing processes, in particular to a hole plugging method for a solder mask hole of a circuit board.
Background
In order to facilitate the assembly and use of the circuit board, during the processing of the circuit board, a plurality of through holes are usually formed in the circuit board, such as lock screw through holes for fixing with an external connector or pin insertion holes of an electronic component. When a circuit board is processed, solder mask treatment must be carried out on through holes on the circuit board, because when electronic elements are welded on the circuit board, the circuit board mostly needs to be subjected to tin passing treatment which is completed in a tin furnace, therefore, the through holes on the circuit board need to be subjected to hole plugging treatment before tin passing, namely, the through holes on the circuit board need to be subjected to solder mask treatment, otherwise, tin liquid easily flows to one side of a non-welding surface of the circuit board from the through holes of the circuit board, and therefore the circuit board is affected.
Generally, the hole plugging mode of the solder mask hole of the circuit board is to fill ink into the solder mask hole for hole plugging, however, under the influence of bubbles in the ink or other factors, the ink is difficult to completely fill the whole solder mask hole, the hole oil is sunken greatly, and bubbles or cracks at the joint are caused, so that hole cracking occurs at the solder mask hole or a cavity is formed in the ink inside the solder mask hole after curing molding, as shown in fig. 1 and 2, therefore, partial tin liquid still enters into a through hole of the circuit board during tin passing, so that insufficient soldering and wrong soldering of the circuit board are caused, and the reject ratio of the circuit board is greatly increased.
Disclosure of Invention
In order to overcome the defects, the invention aims to provide a hole plugging method of a solder mask hole of a circuit board. The hole plugging method can effectively improve the filling degree of the ink in the anti-welding hole and effectively avoid the anti-welding hole from cracking, thereby effectively solving the problem of high product reject ratio caused by the hole plugging of the anti-welding hole.
The hole plugging method of the anti-welding hole of the circuit board comprises the following steps:
(1) injecting ink into the anti-welding hole after the lower end of the anti-welding hole arranged on the circuit board substrate is plugged into the first cover cap;
(2) after the anti-welding hole is filled with the ink, a second cover cap is plugged into the other end of the anti-welding hole, and the second cover cap is pressed towards one end of the first cover cap until the ink flows out of the anti-welding hole and then is taken down;
(3) pre-baking the circuit board at 60-100 deg.C for 30-60 min. By utilizing the method, under the extrusion action of the second cover cap, the ink filling degree in the solder mask hole is good, no fault exists in the filled solder mask hole, and the poor soldering rate of the circuit board can be effectively reduced.
Furthermore, the second cap is provided with a compression leg capable of extending into the anti-welding hole, and the outer diameter of the compression leg is smaller than the diameter of the anti-welding hole. Therefore, when the second cap is pressed into the anti-welding hole towards one end of the first cap, the ink can overflow from the edge of the second cap, so that the ink in the anti-welding hole is ensured to be free of bubbles, and the ink in the pre-baked anti-welding hole is free of holes.
Furthermore, a secondary hole plugging step is further included after the step (3), and the end part of the welding-proof hole in the step (2) where the second cap is arranged is injected with the filling material again and then is subjected to curing treatment.
Furthermore, when secondary hole plugging is carried out, after the filler overflows from the anti-welding holes, flattening treatment is carried out on the filler at the anti-welding holes of the circuit board.
Further, the first cap is removed after the pre-baking is completed.
Furthermore, the curing temperature of the filler in the secondary hole plugging step is 100-130 ℃, and the curing time is 15-20 min. Because most spaces in the solder mask holes are filled with the ink, the filler at the ends of the solder mask holes can be quickly cured only by short treatment for more than ten minutes during secondary hole plugging, meanwhile, the pre-baked ink can be further cured in the step, and the filler can enter gaps of the pre-baked ink during secondary hole plugging, so that the solder mask holes are ensured to have higher filling rate.
Further, the filler in the second hole plugging step is ink or resin.
Furthermore, the first cover cap has elasticity, the first cover cap comprises a cover body and an annular clamping edge extending into the welding-proof hole, and the thickness of the clamping edge is not more than one tenth of the diameter of the welding-proof hole. Therefore, the volume of the solder mask hole occupied by the first cap is reduced to the maximum extent, and the ink in the solder mask hole is fully filled.
Furthermore, the portable electronic device further comprises a bearing plate, wherein the cover body of each first cover cap is arranged on the bearing plate, and the clamping edge is perpendicular to the bearing plate and extends away from the bearing plate.
Drawings
FIG. 1 is a schematic diagram of a prior art weld hole for preventing cracking;
FIG. 2 is a schematic cross-sectional view of a solder mask hole of the prior art;
FIG. 3 is a schematic perspective view of a first cap according to a preferred embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a first cap disposed on a carrier plate according to a preferred embodiment of the invention;
FIG. 5 is a schematic structural view illustrating the first cap and the second cap being plugged into the solder-proof hole of the circuit board according to a preferred embodiment of the present invention;
FIG. 6 is a schematic view of the surface condition of a solder mask hole after filling by the method of the present invention;
fig. 7 is a schematic cross-sectional structural view of a solder mask hole filled by the method of the present invention.
In the figure:
1-a first cover cap, 11-a cover body, 12-a clamping edge, 2-a bearing plate, 3-a second cover cap and 31-a compression column.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
The first cover cap used in the hole plugging method for the anti-welding hole of the circuit board is made of elastic silicon rubber materials, as shown in fig. 3, the first cover cap 1 comprises a cover body 11 and an annular clamping edge 12 capable of extending into the anti-welding hole, and the thickness of the clamping edge 12 is not more than one tenth of the diameter of the anti-welding hole, so that when the first cover cap 1 is plugged into the anti-welding hole, the volume of the anti-welding hole occupied by the first cover cap 1 is reduced as much as possible, and the anti-welding hole is fully filled with ink.
Referring to fig. 4, the carrier plate 2 is further included for fixing the first caps 1 of the present invention, the cover 11 of each first cap is disposed on the carrier plate 2, and the locking edge 12 is perpendicular to the carrier plate 2 and extends away from the carrier plate 2, so that the first caps 1 can be correspondingly disposed on the carrier plate 2 according to the positions of the solder holes on the circuit board, thereby enabling the first caps 1 to be quickly plugged into the plurality of solder holes on the circuit board. Referring to fig. 5, the second cap 3 inserted into the upper end of the solder mask hole of the present invention has a pressing post 31 capable of extending into the solder mask hole, and the outer diameter of the pressing post 31 is smaller than the diameter of the solder mask hole.
The hole plugging method of the anti-welding hole of the circuit board is carried out according to the following steps:
(1) injecting ink into the anti-welding hole after the lower end of the anti-welding hole arranged on the circuit board substrate is plugged into the first cover cap;
(2) after the anti-welding hole is filled with the ink, a second cover cap is plugged into the upper end of the anti-welding hole, the second cover cap is pressed towards one end of the first cover cap until the ink flows out of the anti-welding hole, and then the second cover cap is taken down;
(3) pre-baking the circuit board at 60-100 deg.C for 30-60min, and taking off the first cap after pre-baking;
(4) secondary hole plugging, namely injecting the filler into the end part of the welding-proof hole in the step (2) at the end provided with the second cap again until the filler overflows from the welding-proof hole, and flattening the filler at the welding-proof hole of the circuit board;
(5) curing treatment, wherein the curing temperature is 100-130 ℃, and the curing time is 15-20 min.
The filling material in the secondary hole filling step of the step (4) of the hole filling method for the solder-proof hole of the circuit board can be ink or resin.
The appearance of the plug hole obtained after the plug hole and the solidification treatment are carried out on the solder mask hole of the circuit board by using the method of the invention is shown in figure 5, and the filling degree of the interior of the plug hole is shown in figure 6, so that the surface of the solder mask hole after the solder mask hole is filled by using the method of the invention has no crack, the interior of the solder mask hole has no hole and no fault, and the filling rate of the solder mask hole is more than 90 percent.
By utilizing the method, firstly, the ink in the anti-welding hole is fully filled under the extrusion action of the second cover cap, and then, the soldering tin surface side of the circuit board of the through hole is fully filled through the secondary hole filling step. The method can ensure that the anti-welding holes are fully filled, and after the printing ink is solidified and formed, no fault or hole exists in the anti-welding holes, and the anti-welding holes cannot crack. The method solves the problem of high poor soldering tin ratio caused by high poor hole rate of the circuit board cap surface, thereby greatly reducing the poor product rate of products.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (9)
1. A hole plugging method for a solder mask hole of a circuit board is characterized by comprising the following steps:
(1) injecting ink into the anti-welding hole after the lower end of the anti-welding hole arranged on the circuit board substrate is plugged into the first cover cap;
(2) after the anti-welding hole is filled with the ink, a second cover cap is plugged into the other end of the anti-welding hole, and the second cover cap is pressed towards one end of the first cover cap until the ink flows out of the anti-welding hole and then is taken down;
(3) pre-baking the circuit board at 60-100 deg.C for 30-60 min.
2. The method for plugging a solder mask hole of a circuit board according to claim 1, wherein said second cap has a press post capable of protruding into said solder mask hole, said press post having an outer diameter smaller than a diameter of said solder mask hole.
3. The method for plugging solder mask holes of a circuit board according to claim 2, further comprising a secondary plugging step after step (3), wherein the end of the solder mask hole at the end where the second cap is provided in step (2) is subjected to curing treatment after being filled with the filler again.
4. The method of claim 3, wherein the filling material at the solder mask hole of the circuit board is flattened after the filling material overflows from the solder mask hole during the second filling process.
5. A hole plugging method for solder mask holes of a circuit board according to claim 3, wherein the first cap is removed after the pre-baking.
6. The method as claimed in claim 5, wherein the curing temperature of the filler material in the second plugging step is 100-130 ℃ and the curing time is 15-20 min.
7. The method of claim 3, wherein the filler in the second plugging step is ink or resin.
8. The method for plugging a solder mask hole of a circuit board according to claim 1, wherein the first cap has elasticity, the first cap comprises a cover body and an annular clamping edge extending into the solder mask hole, and the thickness of the clamping edge is not more than one tenth of the diameter of the solder mask hole.
9. The method of claim 8, further comprising a carrier plate, wherein the cover of each first cap is disposed on the carrier plate, and the locking rim is perpendicular to the carrier plate and extends away from the carrier plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911316769.3A CN110958775B (en) | 2019-12-19 | 2019-12-19 | Hole plugging method for anti-welding hole of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911316769.3A CN110958775B (en) | 2019-12-19 | 2019-12-19 | Hole plugging method for anti-welding hole of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110958775A CN110958775A (en) | 2020-04-03 |
| CN110958775B true CN110958775B (en) | 2021-07-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911316769.3A Active CN110958775B (en) | 2019-12-19 | 2019-12-19 | Hole plugging method for anti-welding hole of circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117998760B (en) * | 2024-01-31 | 2024-07-05 | 广东达源设备科技有限公司 | PCB prevents welding development equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3250988B2 (en) * | 1998-10-23 | 2002-01-28 | 株式会社鈴木 | Method for producing resin sheet having filled vias |
| CN102938981A (en) * | 2012-11-10 | 2013-02-20 | 大连太平洋电子有限公司 | Vacuum defoaming processing method of thick copper soldering-resistance plate |
| CN103517564B (en) * | 2013-11-08 | 2016-04-20 | 东莞生益电子有限公司 | Method for plugging in circuit board making |
| CN105722327B (en) * | 2016-03-31 | 2018-06-05 | 东莞美维电路有限公司 | PCB blind slot plug resin process |
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