JP2015076580A - Method for manufacturing electrical apparatus and electrical apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a resin from adhering to a resin injection nozzle in a resin sealing process for embedding a printed board in a case with the resin.SOLUTION: An electrical apparatus 1 includes: a case 2 which has a bottom 3 and side parts 4, 5 and opens upwardly; a printed board 10 including a resin injection hole 11 penetrating through in a thickness direction thereof; and a spacer member 6 having a tubular resin dam part 7 with a predetermined height. A method for manufacturing the electrical apparatus 1 includes the steps of: arranging the resin dam part 7 of the spacer member 6 on the upper face of the printed board 10; placing the printed board 10 in the case 2 so that a lower face 10b of the printed board 10 faces an inner face 3a of the bottom 3 of the case 2; and inserting a tip 51 of a resin pouring nozzle 50 into the resin dam part 7 and injecting the resin poured through the resin pouring nozzle 50 into an internal space S via the spacer member 6 and the resin injection hole 11, the internal space S being defined by the case 2 and the printed board 10.

Description

  The present invention relates to a method for manufacturing an electrical device, and an electrical device. More specifically, the present invention relates to a method for manufacturing an electric device in which a printed board in a case is embedded with a resin, and the electric device.

  2. Description of the Related Art Conventionally, an electric device in which a printed circuit board on which electronic components are mounted is stored in a case is known. In such an electric device, a printed circuit board and an electronic component stored in the case may be embedded using a resin such as a hard potting resin for vibration resistance, heat dissipation, waterproofing, and the like.

  In the resin sealing process of embedding the printed circuit board in the case, the resin is placed in the internal space so that no bubbles remain in the space defined by the printed circuit board and the case (hereinafter also simply referred to as “internal space”). The method of press-fitting into is adopted. In this method, a through hole (resin injection hole) is provided in a substantially central portion of the printed board, and a resin injection nozzle is inserted into the through hole to press-fit resin into the internal space (see, for example, Patent Document 1).

  The resin press-fitted into the internal space from the resin injection hole spreads concentrically and reaches the side of the case, and then jets out to the upper side of the printed circuit board through the gap between the edge of the printed circuit board and the side of the case. To do. When the resin filling of the internal space is completed, the resin injection nozzle is removed from the resin injection hole, the resin is dropped from above the printed board, and the upper surface of the printed board is covered with the resin. In this way, the printed circuit board and the electronic component in the case are embedded with the resin.

JP 2000-106492 A

  In the above-described resin sealing step, from the viewpoint of preventing bubbles from being generated in the resin filled in the internal space, the resin is continuously pressed through the resin injection hole until the resin filling of the internal space is completed. Is preferred.

  However, in practice, it may be difficult to provide the resin injection hole in the central portion of the printed circuit board due to the arrangement of electronic components. Further, the shape of the case in plan view is often a substantially rectangular shape. For this reason, even if the resin injection hole is provided in the central portion of the printed circuit board, the distance between the side portion of the case and the resin injection hole may not be constant.

  In such a case, the timing at which the resin is ejected from the internal space differs for each side of the printed circuit board. Specifically, the resin is ejected first from the gap on the long side of the case, which is shorter than the short side of the case, and the distance from the resin injection hole. As a result, before the resin filling of the internal space is completed, the resin ejected from the gap between the long side case side and the edge of the printed circuit board spreads to the center while covering the upper surface of the printed circuit board. There was a problem of adhering to the injection nozzle.

  If the resin adheres to the resin injection nozzle, the resin injection nozzle may become clogged and cause a failure, or the resin attached to the resin injection nozzle may fall and contaminate the appearance of the product.

  Therefore, the present invention provides a method for manufacturing an electrical device capable of preventing the resin from adhering to the resin injection nozzle in the resin sealing step of embedding the printed circuit board in the case with the resin, and to provide the electrical device. Objective.

A method for manufacturing an electrical device according to one embodiment of the present invention includes:
A case having a bottom portion and a plurality of side portions and opened upward; a printed circuit board provided with a resin injection hole penetrating in a thickness direction; and a spacer member having a cylindrical resin damming portion of a predetermined height; A method for manufacturing an electrical device comprising:
An arrangement step of arranging the cylindrical resin damming portion of the spacer member on the upper surface of the printed circuit board so that a straight line passing through the cylindrical resin damming portion in the height direction passes through the resin injection hole; ,
Installing the printed circuit board in the case such that the lower surface of the printed circuit board faces the inner surface of the bottom of the case;
The tip of the resin pouring nozzle is inserted into the cylindrical resin damming portion, and the resin poured out from the resin pouring nozzle is inserted into the case and the printed board through the spacer member and the resin injection hole. Injecting into the internal space defined by
It is characterized by providing.

In the method for manufacturing the electrical device,
At the time when the resin filling portion is filled with the resin in the internal space, the resin reaching the resin blocking portion out of the resin that has circulated from the internal space to the upper surface side of the printed circuit board, What is set so that it may become higher than the height from the upper surface of the said printed circuit board may be used as said spacer member.

In the method for manufacturing the electrical device,
When the resin filling of the internal space is completed, the resin injection nozzle is removed from the spacer member, and the resin is continuously poured out while maintaining a predetermined distance from the printed circuit board so that the printed circuit board is embedded with the resin. May be.

In the method for manufacturing the electrical device,
The spacer member further has a tubular portion communicating with the cylindrical resin damming portion and having an outer diameter equal to or smaller than the diameter of the resin injection hole,
In the arrangement step, the tubular portion may be inserted into the resin injection hole.

In the method for manufacturing the electrical device,
The spacer member communicates with the tubular resin weir and has a tubular portion with an outer diameter equal to or less than the diameter of the resin injection hole;
On the outer periphery of the tubular portion, a linear convex portion extending along the central axis direction of the tubular portion is provided,
In the arranging step, the tubular portion may be press-fitted into the resin injection hole by elastically deforming the convex portion.

In the method for manufacturing the electrical device,
You may make it the internal diameter of the said tubular part be more than the diameter of the resin spout of a resin injection nozzle.

In the method for manufacturing the electrical device,
The spacer member is provided on an end surface of the cylindrical resin damming portion, and has a plurality of pins extending along a central axis of the cylindrical resin damming portion,
In the arranging step, the plurality of pins may be inserted into a plurality of pin insertion holes formed in the vicinity of the resin injection hole of the printed board.

In the method for manufacturing the electrical device,
In the arranging step, the resin damming portion may be arranged on the printed circuit board so that a central axis of the cylindrical resin damming portion is orthogonal to an upper surface of the printed circuit board.

In the method for manufacturing the electrical device,
The spacer member may be made of resin or rubber.

An electrical device according to one embodiment of the present invention is provided.
A case having a bottom and a plurality of sides and opening upward;
A printed circuit board that is provided in the case so that a resin injection hole penetrating in the thickness direction is provided, and a lower surface thereof is opposed to an inner surface of the bottom;
A spacer member having a cylindrical resin damming portion having a predetermined height, and an upper surface of the printed circuit board so that a straight line passing through the cylindrical resin damming portion in the height direction passes through the resin injection hole. A spacer member disposed in
Sealing resin formed by injecting resin into the internal space defined by the case and the printed circuit board through the spacer member and the resin injection hole, and filling the internal space, A sealing resin for embedding a printed circuit board;
It is characterized by providing.

  In the present invention, before the resin sealing step, a spacer member having a cylindrical resin damming portion is disposed in the resin injection hole of the printed circuit board, so that the resin wraps around from the inner space to the upper surface side of the printed circuit board. Is blocked by the resin blocking portion of the spacer member, and the resin can be prevented from adhering to the resin injection nozzle.

  Therefore, according to the present invention, there is provided a method for manufacturing an electrical device capable of preventing the resin from adhering to a resin injection nozzle in a resin sealing step of embedding a printed board in a case with a resin, and the electrical device. be able to.

It is a perspective view of the spacer member used in one embodiment of the present invention. It is a figure for demonstrating the manufacturing method of the electric equipment which concerns on one Embodiment of this invention. It is a figure for demonstrating the manufacturing method of the electric equipment which concerns on one Embodiment of this invention following FIG. 2A. It is a figure for demonstrating the manufacturing method of the electric equipment which concerns on one Embodiment of this invention following FIG. 2B. It is a figure for demonstrating the manufacturing method of the electric equipment which concerns on one Embodiment of this invention following FIG. 2C. It is a figure for demonstrating the manufacturing method of the electric equipment which concerns on one Embodiment of this invention following FIG. 2D. (A) shows the top view of the electric equipment which concerns on one Embodiment of this invention, (b) is sectional drawing which follows the AA line of (a). (A) is a perspective view of the spacer member which concerns on a 1st modification, (b) is a bottom view of this spacer member. (A) is a perspective view of the spacer member which concerns on a 2nd modification, (b) is a bottom view of this spacer member. It is sectional drawing of the printed circuit board with which the spacer member which concerns on a 2nd modification is arrange | positioned.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, the component which has an equivalent function is attached | subjected the same code | symbol, and detailed description of the component of the same code | symbol is not repeated.

  First, with reference to FIG. 1, the structure of the spacer member 6 used for manufacture of the electric equipment 1 which concerns on this embodiment is demonstrated. Then, with reference to FIG. 2A-FIG. 2E and FIG. 3, the manufacturing method of the electric equipment 1 and the structure of the electric equipment 1 are demonstrated.

  As shown in FIG. 1, the spacer member 6 includes a cylindrical resin damming portion 7 and a tubular portion 8 communicating with the resin damming portion 7.

  The resin damming portion 7 is for preventing the resin that has entered the upper surface side of the printed circuit board 10 (described later) from the internal space from adhering to the resin injection nozzle, and has a predetermined height.

  The tubular portion 8 is a portion that is inserted into the resin injection hole 11 of the printed circuit board 10. Details will be described later with reference to FIG. 2A.

  The size of the outer shape of the tubular portion 8 is smaller than the size of the outer shape of the resin damming portion 7, and more specifically, is equal to or smaller than the diameter of the resin injection hole 11 of the printed circuit board 10.

  The material of the spacer member 6 is not particularly limited, but is a material (for example, resin or rubber) that is relatively inexpensive and does not damage the resin injection nozzle because of the cost and the resin injection nozzle are made of metal. It is preferable.

  Moreover, the external shape of the resin damming part 7 and the tubular part 8 is not limited to a cylindrical shape, and may be, for example, a polygonal column shape.

  Next, with reference to FIG. 2A-FIG. 2E and FIG. 3, the manufacturing method of the electric equipment 1 which concerns on this embodiment, and the structure of the electric equipment 1 are demonstrated. FIG. 2A is a cross-sectional view of the printed circuit board 10 on which the spacer member 6 is mounted. 2B, 2 </ b> C, and 2 </ b> E are cross-sectional views along a line passing through the resin injection hole 11 of the printed circuit board 10 and the side portion 4 of the case 2. FIG. 2D is a cross-sectional view taken along a line passing through the resin injection hole 11 of the printed circuit board 10 and the side portion 5 of the case 2.

  First, as shown in FIG. 2A, a printed circuit board 10 is prepared on which electronic parts 12 such as various chip parts (for example, semiconductor switches, resistors, capacitors) and electronic parts 13 such as electrolytic capacitors are mounted. The printed circuit board 10 is provided with a resin injection hole 11 that penetrates the printed circuit board 10 in the thickness direction. In FIG. 2A, the electronic component is mounted only on the lower surface 10b of the printed circuit board 10, but the electronic component may be mounted on the upper surface 10a.

  A case 2 for storing the printed circuit board 10 is prepared. The case 2 has a bottom portion and a plurality of side portions, and is open upward. In the present embodiment, the case 2 has a substantially rectangular shape in plan view as shown in FIG.

  That is, the case 2 has a substantially rectangular bottom 3, two side parts 4 connected to the short side of the bottom part 3, and two side parts 5 connected to the long side of the bottom part 3. The planar shape of the case 2 is not limited to a substantially rectangular shape, and may be another substantially polygonal shape such as a substantially square shape or a substantially pentagonal shape. The case 2 is made of resin, for example, but may be made of other materials (metal or the like).

  Next, as shown in FIG. 2A, the spacer member 6 is disposed on the printed circuit board 10 so that the tubular portion 8 of the spacer member 6 is inserted into the resin injection hole 11 (arrangement step).

  More generally speaking, in this arrangement step, the printed circuit board 10 is arranged such that a straight line passing through the resin damming portion 7 of the spacer member 6 in the height direction passes through the resin injection hole 11. Arranged on the upper surface 10a. A straight line penetrating the resin damming portion 7 in the height direction is a straight line penetrating the resin damming portion 7 in the length direction, for example, as a central axis L in FIG.

  In this arrangement step, as shown in FIG. 2A, the resin damming portion 7 may be arranged on the printed circuit board 10 so that the central axis L of the resin damming portion 7 is orthogonal to the upper surface 10 a of the printed circuit board 10. preferable.

  The spacer member 6 may be mounted on the printed circuit board 10 using a device such as a chip mounter.

  In addition, it is preferable to use a spacer member 6 made of resin or rubber.

  Next, as shown in FIG. 2B, the printed circuit board 10 is installed in the case 2 so that the lower surface 10 b of the printed circuit board 10 faces the inner surface 3 a of the bottom 3 of the case 2 (installation process). The printed circuit board 10 is placed on a pedestal or the like (not shown) provided on the bottom 3 so as to maintain a predetermined distance from the bottom 3 of the case 2. By housing the printed circuit board 10 in the case 2, an internal space S defined by the case 2 and the printed circuit board 10 is formed as shown in FIG. 2B.

  Next, as shown in FIG. 2C, the distal end portion 51 of the resin dispensing nozzle 50 is inserted into the resin damming portion 7. Then, the resin (such as hard potting resin) poured out from the resin dispensing nozzle 50 is injected into the internal space S through the spacer member 6 and the resin injection hole 11 (resin sealing step).

  In addition, when inserting the front-end | tip part 51 in the resin damming part 7 in this invention, the insertion depth of the front-end | tip part 51 is not specifically limited. That is, the front end portion 51 may be brought into contact with the resin damming portion 7, or the front end portion 51 may be inserted through the resin damming portion 7.

  Moreover, you may pour out resin with a high viscosity from the resin injection | pouring nozzle 50 for the purpose of ensuring heat conductivity. In this case, the resin poured out from the resin dispensing nozzle 50 is press-fitted into the internal space S through the spacer member 6 and the resin injection hole 11.

  FIG. 2D shows a cross-sectional view at the time when the resin sealing process proceeds and the resin filling of the internal space S is completed. The sealing resin 20 is a resin injected or press-fitted into the internal space S. Of the sealing resin 20, the resin 20 a is a resin that is ejected through a gap between the edge of the printed circuit board 10 and the side portion 5 of the case 2 and covers the upper surface 10 a of the printed circuit board 10.

  As shown in FIG. 2D, the side portion 5 connected to the long side of the bottom portion 3 has a shorter distance from the resin injection hole 11 than the side portion 4, and therefore, when the resin filling of the internal space S is completed, that is, the print The resin 20 a has already reached the spacer member 6 when the resin is ejected from the gap between the end side of the substrate 10 and the side portion 4.

  However, as shown in FIG. 2D, since the resin 20a is blocked by the resin blocking portion 7 of the spacer member 6, it is possible to prevent the resin from adhering to the resin injection nozzle 50 (tip portion 51).

  The height of the resin damming portion 7 is higher than the height of the resin reaching the resin damming portion 7 in the resin 20a from the upper surface 10a of the printed circuit board 10 when the resin filling of the internal space S is completed. It is preferable to set it to be high. As a result, the resin damming portion 7 does not cross the resin damming portion 7 until at least the resin filling of the internal space S is completed, and can dampen the resin that presses from the end side of the printed circuit board 10. it can.

  After the resin filling of the internal space S is completed, as shown in FIG. 2E, the resin injection nozzle 50 is removed from the spacer member 6, and the resin is continuously poured out while maintaining a predetermined distance from the printed circuit board 10. The substrate 10 is embedded with resin.

  The resin injection may be performed until the spacer member 6 is completely embedded, or may be terminated when the resin damming portion 7 is partially exposed. In any case, the spacer member 6 is resin-sealed together with the printed circuit board 10 without being collected during the resin-sealing process. Thus, the spacer member 6 is not reused, and a new one is used for each electric device 1.

  The electric device 1 shown in FIGS. 3A and 3B is manufactured through the above steps. FIG. 3A shows a plan view of the electric apparatus 1, and FIG. 3B shows a cross-sectional view taken along the line AA of FIG. 3A.

  As shown in FIGS. 3A and 3B, the electrical apparatus 1 according to the present embodiment includes a case 2, a printed board 10, a spacer member 6, and a sealing resin 20.

  In the electric device 1, the case 2 has a bottom portion 3 and a plurality of side portions 4 and 5, and opens upward. The printed circuit board 10 is stored in the case 2 so that the lower surface 10 b faces the inner surface 3 a of the bottom portion 3. The spacer member 6 is disposed on the upper surface 10 a of the printed circuit board 10 so that a straight line passing through the cylindrical resin damming portion 7 in the height direction passes through the resin injection hole 11. The sealing resin 20 is formed by injecting resin into the internal space S through the spacer member 6 and the resin injection hole 11. The sealing resin 20 is filled in the internal space S, and the resin substrate 20a which is a part of the sealing resin 20 covers the upper surface 10a of the printed circuit board 10 so that the printed circuit board 10 is embedded.

  As described above, in the present embodiment, the spacer member 6 having the resin damming portion 7 is previously attached to the printed circuit board 10 before the resin sealing step, so that the resin is injected into the resin injection nozzle in the resin sealing step. 50 can be prevented from adhering. As a result, it is possible to prevent the resin injection nozzle 50 from being clogged and causing a failure, or the resin adhering to the resin injection nozzle 50 from falling and contaminating the appearance of the product.

  Furthermore, since it becomes possible to continue the press-fitting of the resin through the resin injection hole 11 until the resin filling of the internal space S is completed, even in the case where a resin having a high viscosity is used, the sealing resin 20 It is possible to prevent bubbles from being generated.

  In addition, since the periphery of the resin injection hole 11 of the printed circuit board 10 is reinforced by the spacer member 6, the amount of deflection of the printed circuit board 10 at the time of resin injection compared to the case where the resin injection nozzle 50 is directly inserted into the resin injection hole 11. Can be reduced. Therefore, it is possible to form a wiring pattern close to the resin injection hole 11 and increase the usable area of the printed circuit board 10.

  The inner diameter of the resin damming portion 7 of the spacer member 6 is preferably larger than the diameter of the resin injection hole 11 of the printed circuit board 10. Accordingly, the alignment accuracy between the resin injection nozzle 50 and the printed circuit board 10 when the tip 51 of the resin pouring nozzle 50 is inserted into the resin weir 7 can be relaxed.

  In addition, the inner diameter of the tubular portion 8 of the spacer member 6 is preferably equal to or larger than the diameter of the resin injection port of the resin injection nozzle 50. Thereby, for example, even when a resin having a high viscosity is pressed into the internal space S in the resin sealing step, the resin poured out from the resin spout fills the space in the spacer member 6 and fills the tip 51. Further, it can be prevented that the resin adheres or leaks out from the contact portion between the tip 51 and the spacer member 6 and adheres to the upper resin injection nozzle 50 from the contact portion.

  Moreover, it is preferable that the opening part of the resin damming part 7 is processed according to the shape of the front-end | tip part 51 of the resin injection | pouring nozzle 50. FIG. For example, it is preferable to reduce the angle formed by the end surface (upper end surface) of the resin damming portion 7 and the inner peripheral surface in accordance with the taper shape of the distal end portion 51 of the resin injection nozzle 50. Thereby, the work ease at the time of inserting the front-end | tip part 51 of the resin extraction nozzle 50 in the resin damming part 7 can be improved.

  The configuration of the spacer member 6 is not limited to the above, and may be, for example, spacer members 6A and 6B described below.

(First modification)
A spacer member 6A according to a first modification will be described with reference to FIGS. Similar to the spacer member 6, the spacer member 6 </ b> A according to this modification includes a cylindrical resin damming portion 7 and a tubular portion 8.

  The difference between the spacer member 6A and the spacer member 6 is that the spacer member 6A is provided with a plurality of convex portions 9 on the outer periphery of the tubular portion 8. Each protrusion 9 is a linear protrusion extending along the direction of the central axis L of the tubular portion 8.

  4A and 4B, four convex portions 9 are provided, but the number of convex portions 9 is not limited to this.

  When the spacer member 6 </ b> A according to this modification is used, the tubular portion 8 is press-fitted into the resin injection hole 11 due to the elastic deformation of the convex portion 9 in the above-described arrangement step.

  Thereby, even when the outer diameter of the tubular portion 8 is smaller than the diameter of the resin injection hole 11, the spacer member 6A can be firmly fixed to the printed circuit board 10, and when the resin injection nozzle 50 is removed from the spacer member 6A. It is possible to prevent the spacer member 6A from being detached from the printed board 10.

(Second modification)
Next, a spacer member 6B according to a second modification will be described with reference to FIGS. 5 (a), 5 (b) and FIG. Like the spacer member 6, the spacer member 6 </ b> B according to this modification has a cylindrical resin damming portion 7, but does not have a tubular portion 8.

  The difference between the spacer member 6B and the spacer member 6 is that the spacer member 6B is provided with a plurality of pins 18 instead of the tubular portion 8. Each pin 18 is provided on the end face (lower end face) of the resin damming portion 7 and extends along the central axis L of the resin damming portion 7.

  5A and 5B, two pins 18 are provided, but the number of pins 18 is not limited to this.

  When the spacer member 6B according to this modification is used, a plurality of pin insertion holes 14 are provided in the vicinity of the resin injection hole 11 of the printed board 10 as shown in FIG.

  In the above-described arrangement step, the spacer member 6B is mounted on the printed circuit board 10 so that each of the plurality of pins 18 is inserted into the pin insertion hole 14 as shown in FIG.

  Thereby, the spacer member 6B can be firmly fixed to the printed circuit board 10, and it is possible to prevent the spacer member 6B from being detached from the printed circuit board 10 when the resin injection nozzle 50 is removed from the spacer member 6B. .

  In addition, you may combine the 2nd modification with the spacer member 6 demonstrated initially, or the spacer member 6A demonstrated in the 1st modification. That is, the pin 18 may be provided on the spacer member 6 or the spacer member 6A. By doing so, the spacer member can be more firmly fixed to the printed circuit board 10.

  Based on the above description, those skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the individual embodiments described above. . You may combine suitably the component covering different embodiment. Various additions, modifications, and partial deletions can be made without departing from the concept and spirit of the present invention derived from the contents defined in the claims and equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Electric equipment 2 Case 3 Bottom part 3a Inner surface 4,5 Side part 6,6A, 6B Spacer member 7 Resin damming part 8 Tubular part 9 Convex part 10 Printed circuit board 10a Upper surface 10b Lower surface 11 Resin injection hole 12, 13 Electronic component 14 Pin Insertion hole 18 Pin 20 Sealing resin 20a Resin 50 (on printed circuit board) Resin pouring nozzle 51 Tip L Center axis S Internal space

Claims (10)

A case having a bottom portion and a plurality of side portions and opened upward; a printed circuit board provided with a resin injection hole penetrating in a thickness direction; and a spacer member having a cylindrical resin damming portion of a predetermined height; A method for manufacturing an electrical device comprising:
An arrangement step of arranging the cylindrical resin damming portion of the spacer member on the upper surface of the printed circuit board so that a straight line passing through the cylindrical resin damming portion in the height direction passes through the resin injection hole; ,
Installing the printed circuit board in the case such that the lower surface of the printed circuit board faces the inner surface of the bottom of the case;
The tip of the resin pouring nozzle is inserted into the cylindrical resin damming portion, and the resin poured out from the resin pouring nozzle is inserted into the case and the printed board through the spacer member and the resin injection hole. Injecting into the internal space defined by
The manufacturing method of the electric equipment characterized by the above-mentioned.   At the time when the resin filling portion is filled with the resin in the internal space, the resin reaching the resin blocking portion out of the resin that has circulated from the internal space to the upper surface side of the printed circuit board, The method for manufacturing an electrical device according to claim 1, wherein the spacer member is set to be higher than a height from an upper surface of the printed board.   When the filling of the resin in the internal space is completed, the resin injection nozzle is removed from the spacer member, and the resin is continuously poured out with the predetermined distance from the printed board, and the printed board is embedded with the resin. The manufacturing method of the electric equipment according to claim 1 or 2 characterized by things. The spacer member further has a tubular portion communicating with the cylindrical resin damming portion and having an outer diameter equal to or smaller than the diameter of the resin injection hole,
The method for manufacturing an electric device according to any one of claims 1 to 3, wherein in the arranging step, the tubular portion is inserted into the resin injection hole. The spacer member communicates with the tubular resin weir and has a tubular portion with an outer diameter equal to or less than the diameter of the resin injection hole;
On the outer periphery of the tubular portion, a linear convex portion extending along the central axis direction of the tubular portion is provided,
The method for manufacturing an electrical device according to any one of claims 1 to 3, wherein, in the arranging step, the tubular portion is press-fitted into the resin injection hole by elastic deformation of the convex portion.   The method for manufacturing an electrical device according to claim 4 or 5, wherein an inner diameter of the tubular portion is equal to or larger than a diameter of a resin outlet of the resin injection nozzle. The spacer member is provided on an end surface of the cylindrical resin damming portion, and has a plurality of pins extending along a central axis of the cylindrical resin damming portion,
The said arrangement | positioning process WHEREIN: These pins are each inserted in the pin insertion hole formed in multiple numbers in the vicinity of the said resin injection hole of the said printed circuit board, The one in any one of Claims 1-6 characterized by the above-mentioned. Manufacturing method of electrical equipment.   The said arrangement | positioning process WHEREIN: The said resin damming part is arrange | positioned in the said printed circuit board so that the center axis | shaft of the said cylindrical resin damming part may be orthogonal to the upper surface of the said printed circuit board. The manufacturing method of the electric equipment in any one.   The method for manufacturing an electrical device according to claim 1, wherein the spacer member is made of resin or rubber. A case having a bottom and a plurality of sides and opening upward;
A printed circuit board that is provided in the case so that a resin injection hole penetrating in the thickness direction is provided, and a lower surface thereof is opposed to an inner surface of the bottom;
A spacer member having a cylindrical resin damming portion having a predetermined height, and an upper surface of the printed circuit board so that a straight line passing through the cylindrical resin damming portion in the height direction passes through the resin injection hole. A spacer member disposed in
Sealing resin formed by injecting resin into the internal space defined by the case and the printed circuit board through the spacer member and the resin injection hole, and filling the internal space, A sealing resin for embedding a printed circuit board;
An electrical apparatus comprising:

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