CN113923876B - Half-plugging process and half-plugging jig - Google Patents
Half-plugging process and half-plugging jig Download PDFInfo
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- CN113923876B CN113923876B CN202111312302.9A CN202111312302A CN113923876B CN 113923876 B CN113923876 B CN 113923876B CN 202111312302 A CN202111312302 A CN 202111312302A CN 113923876 B CN113923876 B CN 113923876B
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- hole
- plugging
- pcb
- base plate
- printed board
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000004593 Epoxy Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 description 9
- RKUAZJIXKHPFRK-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=C(Cl)C=C1Cl RKUAZJIXKHPFRK-UHFFFAOYSA-N 0.000 description 8
- 230000000903 blocking effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a half-plugging process and a half-plugging jig. The semi-plugging process comprises the steps of filling resin and green oil into device through holes of a PCB to obtain a PCB with full plug holes; simultaneously extruding the upper end and the lower end of the device through hole to extrude redundant resin and green oil in the device through hole to form a PCB printed board with a half plug hole; and solidifying the PCB printed board of the semi-plugged hole. The semi-plugging jig comprises a bottom plate and a top plate positioned above the bottom plate, wherein a guide member is arranged on the bottom plate in the Z direction, the top plate moves on the guide member, an upper base plate is arranged on the lower end face of the top plate, a lower base plate and a plurality of limit posts are arranged on the upper end face of the bottom plate, a first plugging thimble is arranged on the upper base plate, and a second plugging thimble positioned below the first plugging thimble is arranged on the lower base plate. The invention can reduce the cost and process the PCB printed board which has simple structure and can block signals.
Description
Technical Field
The invention relates to the field of printed circuit board manufacturing, in particular to a half-plugging process and a half-plugging jig.
Background
The design of the current PCB printed board is higher and higher, on the basis of considering functions and usage space, two functional devices with different performances are required to be inserted into the upper and lower ends of the same device hole on the PCB printed board, because the current PCB processing technology cannot block signals between the two functional devices with different performances in the device hole, as shown in fig. 1, the PCB printed board in the prior art is designed into a layered structure with an upper layer and a lower layer being a PCB layer 101 and a middle being a soldering layer 102, and pins 104 of the two functional devices 103 with different performances are soldered at the upper and lower ends of the soldering layer 102 respectively, so as to realize the design effect. Therefore, it is needed to develop a half-plugging process and a half-plugging jig capable of processing a PCB printed board with a simple structure, reduced cost and signal blocking.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the prior art and providing a half-plugging process capable of processing a PCB printed board with simple structure, reduced cost and capability of blocking signals.
The invention also provides a semi-plugging jig capable of processing the PCB printed board with simple structure, reduced cost and capability of blocking signals.
The invention provides a half-plugging process, which comprises the following steps of:
filling resin and green oil in the device through holes of the PCB to obtain a full-hole PCB;
Simultaneously extruding the upper end and the lower end of the device through hole to extrude redundant resin and green oil in the device through hole to form a PCB printed board with a half plug hole;
And solidifying the PCB printed board of the semi-plugged hole.
Further, the step of extruding the upper end and the lower end of the device through hole simultaneously to extrude redundant resin and green oil in the device through hole and form a PCB printed board with a half plug hole comprises the following steps:
the upper end and the lower end of the device through hole are respectively inserted into two hole plugging ejector pins on the jig, redundant resin and green oil in the device through hole are extruded, and a PCB printed board with half hole plugging is formed.
Further, after the step of solidifying the PCB printed board with the half plug hole, the method further comprises the following steps:
and cleaning the through holes of the devices, and treating the residual resin and green oil in the through holes of the devices.
The invention also provides a semi-plugging jig, which comprises a bottom plate and a top plate positioned above the bottom plate, wherein a guide piece is vertically arranged on the bottom plate, the top plate moves up and down on the guide piece, an upper base plate is arranged on the lower end surface of the top plate, a lower base plate and a plurality of limit posts are arranged on the upper end surface of the bottom plate, a first plugging thimble is arranged on the upper base plate, and a second plugging thimble positioned below the first plugging thimble is arranged on the lower base plate.
Further, the number of the first plug hole thimble and the second plug hole thimble is two.
Further, a bottom groove is formed in the bottom plate, the lower base plate is arranged in the bottom groove in a matched mode, a top groove is formed in the top plate, and the upper base plate is arranged in the top groove in a matched mode.
Further, reset springs are arranged on the limiting columns.
Further, the guide piece comprises a plurality of guide posts, a first guide sleeve and a second guide sleeve are arranged on the guide posts, the first guide sleeve is arranged on the lower end face of the top plate, and the second guide sleeve is arranged on the upper end face of the bottom plate.
Further, the upper backing plate and the lower backing plate are both epoxy backing plates.
The beneficial effects of the invention are as follows:
Compared with the defects of the prior art, the half-jack PCB printed board can be processed through the half-jack process, and the resin and the green oil solidified in the device through holes of the half-jack PCB printed board can play a role of isolating signals, so that the produced half-jack PCB printed board can effectively isolate signals between two functional devices, and the PCB printed board processed through the half-jack process can realize the effect of isolating signals without being designed into a layered structure with an upper layer of PCB, a lower layer of PCB and a welding layer in the middle, and has the advantages of simple structure, low cost and capability of isolating signals.
The PCB printed board processed by the half-plug hole jig can realize the effect of blocking signals, and the processed PCB printed board has the advantages of simple structure, low cost and capability of blocking the signals, and the half-plug hole jig has the advantages of being capable of processing the PCB printed board with simple structure.
Drawings
FIG. 1 is a schematic plan view of a prior art;
FIG. 2 is a flow chart of a half-plugging process;
FIG. 3 is a flowchart of step S201 in a half-plugging process;
fig. 4 is a schematic plan view of a PCB printed board without holes;
fig. 5 is a schematic plan view of a full-jack PCB printed board;
fig. 6 is a schematic plan view of a PCB printed board of a half-via hole;
fig. 7 is a schematic plan view of the semi-plugging jig during production.
The reference numerals are as follows:
101. a PCB layer; 102. a welding layer; 103. a functional device; 104. pins of the functional device;
100. a PCB printed board; 105. a device via;
1. A bottom plate; 2. a top plate; 3. an upper backing plate; 5. a lower backing plate; 6. a first plug hole thimble; 7. a second plug hole thimble; 8. a limit column; 13. a guide post; 14. the first guide sleeve; 15. and the second guide sleeve.
Detailed Description
In this embodiment, the present invention provides a half-plugging process, which includes the following steps:
As shown in fig. 2,4 and 5, S1: filling resin and green oil in the device through holes 105 of the PCB 100 to obtain a full-plugged PCB 100; specifically, the PCB printed board 100 has two device through holes 105 thereon.
As shown in fig. 6, S2: simultaneously extruding the upper end and the lower end of the device through hole 105 to extrude redundant resin and green oil in the device through hole 105 to form a PCB printed board 100 with a half plug hole; specifically, by controlling the degree of extrusion to the upper and lower ends of the device through-holes 105, the blocking position and thickness of the resin and green oil in the device through-holes 105 of the PCB printed board 100 are controlled.
S3: the PCB printed board 100 of the half plug hole is cured. Specifically, the resin and green oil in the device through-hole 105 may be dried by a drying apparatus to form a cured product.
Compared with the defects of the prior art, in the embodiment of the invention, the PCB 100 with the half plug hole can be processed by the half plug hole process, and the cured resin and green oil in the device through holes 105 of the PCB 100 with the half plug hole can play a role of isolating signals, so that the produced PCB 100 with the half plug hole can effectively isolate signals between two functional devices, and the PCB 100 with the half plug hole can realize the effect of isolating signals without designing a layered structure with an upper layer of PCB, a lower layer of PCB and a welding layer in the middle, therefore, the PCB 100 processed by the half plug hole process has the advantages of simple structure and low production cost, and the PCB 100 processed by the half plug hole process has the advantages of being capable of processing the PCB with the simple structure, reducing the cost and being capable of isolating signals.
As shown in fig. 3, in this embodiment, the steps of simultaneously extruding the upper end and the lower end of the device through hole 105, extruding the excessive resin and green oil in the device through hole 105, and forming the PCB printed board 100 with half via holes include:
s201: the two hole plugging ejector pins on the jig are respectively inserted into the upper end and the lower end of the device through hole 105, and redundant resin and green oil in the device through hole 105 are extruded to form the PCB printed board 100 with half hole plugging.
As shown in fig. 2, in this embodiment, after the step of curing the PCB board 100 with a half-via hole, the method further includes the following steps:
S4: the device through-hole 105 is cleaned, and the resin and green oil remaining in the device through-hole 105 are cleaned. Specifically, the cleaning can be performed by a cleaning method corresponding to the resin and the green oil, which are conventional techniques in the art and are not described herein.
As shown in fig. 7, the invention further provides a half-plugging jig, which comprises a bottom plate 1 and a top plate 2 positioned above the bottom plate 1, wherein a guide piece is vertically arranged on the bottom plate 1, the top plate 2 moves up and down on the guide piece, an upper base plate 3 is arranged on the lower end surface of the top plate 2, a lower base plate 5 and a plurality of limit posts 8 are arranged on the upper end surface of the bottom plate 1, a first plugging thimble 6 is arranged on the upper base plate 3, a second plugging thimble 7 positioned below the first plugging thimble 6 is arranged on the lower base plate 5, and a processing station is formed between the upper base plate 3 and the lower base plate 5. The upper backing plate 3 is provided with a first mounting hole, the first plug hole thimble 6 is matched with the first mounting hole, the lower backing plate 5 is provided with a second mounting hole, and the second plug hole thimble 7 is matched with the second mounting hole.
It should be noted that, in the half-plugging process, the half-plugging jig may be used to produce a half-plugged PCB printed board, as shown in fig. 4 to 6, in the production process, resin and green oil are filled in the device through holes 105 on the PCB printed board 100, so as to obtain a full-plugged PCB printed board 100, the full-plugged PCB printed board 100 is positioned on the processing station, at this time, the first plug pins 6 are located above the device through holes 105 of the PCB printed board 100, and the second plug pins 7 are inserted into the lower ends of the device through holes 105 of the PCB printed board 100, further the top plate 2 drives the first plug pins 6 to press down, so that the first plug pins 6 and the second plug pins 7 can squeeze out the redundant resin and green oil in the device through holes 105 of the PCB printed board 100, form the half-plugged PCB printed board 100, further take out the PCB printed board 100 to finish the half-plugged PCB printed board, form a cured product, clean the residual resin and green oil in the device through holes 105, and dry the residual resin and green oil.
In the use process of the half-jack jig, the guide member can avoid the situation that the first jack thimble 6 is shifted in the device through hole 105 inserted into the PCB printed board 100, so as to avoid inaccurate alignment, and the limit post 8 is configured to limit the pressing stroke of the top plate 2 and the first jack thimble 6, so as to control the blocking position and thickness of the jack material in the device through hole 105 of the PCB printed board 100.
Because the cured resin and green oil in the device through holes 105 of the PCB printed board 100 with the half plug holes can play a role in isolating signals, the produced PCB printed board 100 with the half plug holes can effectively isolate signals between two functional devices, therefore, the PCB printed board 100 processed by the half plug hole jig can realize the effect of isolating signals, and the processed PCB printed board 100 has the advantages of simple structure and low production cost, and the half plug hole jig has the advantages of being capable of processing the PCB printed board with the simple structure, reducing the cost and isolating signals.
In this embodiment, the number of the first hole plugging pins 6 and the second hole plugging pins 7 is two.
In this embodiment, a bottom groove is formed in the bottom plate 1, the lower pad 5 is cooperatively disposed in the bottom groove, a top groove is formed in the top plate 2, and the upper pad 3 is cooperatively disposed in the top groove. The bottom groove and the top groove can fix the lower pad 5 and the upper pad 3, respectively.
In this embodiment, return springs are disposed on the plurality of limiting posts 8. The setting of the return spring can be convenient for the roof 2 resets.
In this embodiment, the guide member includes a plurality of guide posts 13, a first guide sleeve 14 and a second guide sleeve 15 are disposed on the guide posts 13, the first guide sleeve 14 is disposed on the lower end surface of the top plate 2, and the second guide sleeve 15 is disposed on the upper end surface of the bottom plate 1.
In this embodiment, the upper pad 3 and the lower pad 5 are both epoxy pads.
While the embodiments of this invention have been described in terms of practical aspects, they are not to be construed as limiting the meaning of this invention, and modifications to the embodiments and combinations with other aspects thereof will be apparent to those skilled in the art from this description.
Claims (6)
1. A semi-plugging process is characterized in that: which comprises the following steps:
Filling resin and green oil in a device through hole (105) of the PCB (100) to obtain a PCB (100) with a full plug hole;
simultaneously extruding the upper end and the lower end of the device through hole (105) to extrude redundant resin and green oil in the device through hole (105) to form a PCB (100) with a half-plugging hole;
Solidifying the PCB printed board (100) of the semi-plugged hole;
The step of extruding the upper end and the lower end of the device through hole (105) simultaneously to extrude redundant resin and green oil in the device through hole (105) and form a PCB (100) with a half-plugging hole comprises the following steps:
the two hole plugging ejector pins on the jig are respectively inserted into the upper end and the lower end of the device through hole (105), and redundant resin and green oil in the device through hole (105) are extruded to form the PCB (100) with half hole plugging.
2. The half-plugging process according to claim 1, wherein: after the step of solidifying the PCB printed board (100) of the half plug hole, the method further comprises the following steps:
The device through hole (105) is cleaned, and the resin and green oil remained in the device through hole (105) are cleaned.
3. A semi-plugging jig is characterized in that: the novel plug hole lifting device comprises a bottom plate (1) and a top plate (2) arranged above the bottom plate (1), wherein a guide piece is vertically arranged on the bottom plate (1), the top plate (2) moves up and down on the guide piece, an upper base plate (3) is arranged on the lower end face of the top plate (2), a lower base plate (5) and a plurality of limit posts (8) are arranged on the upper end face of the bottom plate (1), a first plug hole ejector pin (6) is arranged on the upper base plate (3), and a second plug hole ejector pin (7) arranged below the first plug hole ejector pin (6) is arranged on the lower base plate (5); the bottom plate (1) is provided with a bottom groove, the lower base plate (5) is arranged in the bottom groove in a matching way, the top plate (2) is provided with a top groove, and the upper base plate (3) is arranged in the top groove in a matching way; and the limiting posts (8) are provided with return springs.
4. A half-plugging jig according to claim 3, wherein: the number of the first hole plugging thimble (6) and the number of the second hole plugging thimble (7) are two.
5. A half-plugging jig according to claim 3, wherein: the guide piece comprises a plurality of guide posts (13), a first guide sleeve (14) and a second guide sleeve (15) are arranged on the guide posts (13), the first guide sleeve (14) is arranged on the lower end face of the top plate (2), and the second guide sleeve (15) is arranged on the upper end face of the bottom plate (1).
6. The half-plugging jig according to any one of claims 3 to 5, wherein: the upper base plate (3) and the lower base plate (5) are all epoxy base plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111312302.9A CN113923876B (en) | 2021-11-08 | 2021-11-08 | Half-plugging process and half-plugging jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111312302.9A CN113923876B (en) | 2021-11-08 | 2021-11-08 | Half-plugging process and half-plugging jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113923876A CN113923876A (en) | 2022-01-11 |
| CN113923876B true CN113923876B (en) | 2024-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111312302.9A Active CN113923876B (en) | 2021-11-08 | 2021-11-08 | Half-plugging process and half-plugging jig |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN216291629U (en) * | 2021-11-08 | 2022-04-12 | 珠海杰赛科技有限公司 | Semi-plug hole jig |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120045072A (en) * | 2010-10-07 | 2012-05-09 | (주)창성 | Low temperature sintering type silver ink composite for plugging via hole for pcb |
| CN103763869A (en) * | 2013-12-20 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | Method for preparing immersion gold printed circuit board |
| CN205902211U (en) * | 2016-08-06 | 2017-01-18 | 汕头市森胜电子实业有限公司 | Printed circuit board's consent structure |
| CN210928173U (en) * | 2019-08-14 | 2020-07-03 | 临安盛浙电子有限公司 | PCB resin hole plugging device |
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- 2021-11-08 CN CN202111312302.9A patent/CN113923876B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN216291629U (en) * | 2021-11-08 | 2022-04-12 | 珠海杰赛科技有限公司 | Semi-plug hole jig |
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| CN113923876A (en) | 2022-01-11 |
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