CN110511728A - A kind of pureed two-component high thermal conductivity coefficient interface sealant and preparation method thereof - Google Patents
A kind of pureed two-component high thermal conductivity coefficient interface sealant and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
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- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2003/1034—Materials or components characterised by specific properties
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- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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Abstract
A kind of pureed two-component high thermal conductivity coefficient interface of the invention sealant, it is made of component A and B component, and component A is mixed with B component by the weight ratio of 1:1, component A includes following component and its weight percent content: vinyl silicone oil 3-5%, catalyst 0.01-0.05%, coupling agent 0.2-0.8%, heat filling surplus；B component includes following component and its weight percent content: vinyl silicone oil 3-5%, containing hydrogen silicone oil 0.2-0.7%, inhibitor 0.01-0.05%, coupling agent 0.2-0.8%, heat filling surplus.Bi-component pureed thermally-conductive interface sealant of the present invention; thermal coefficient with higher; both the high thermal conductivity demand of Sensitive Apparatus can have been met; generated moment stress during installation can also be absorbed significantly; have the function that protect device; and artificial demand can also be reduced, and effectively improves production efficiency and materials'use rate.
Description
Technical field
The invention belongs to Heat Conduction Material technical fields, and in particular to a kind of pureed two-component high thermal conductivity coefficient interface calking material
Material and preparation method thereof.
Background technique
With the continuous complication of integrated circuit, the packing density of electronic integrated board increases, and the fever under unit area is close
Degree increases, and Functional Unit device miniaturization, more sensitive to mount stress, and easily stress is excessive leads to component damage or can
Decline by property, therefore conventional thermal conductive silica gel piece (heat-conducting pad) has been unable to satisfy now or even following growth requirement, and tradition
Cooling requirements are not achieved in thermally conductive gel thermal coefficient.Meanwhile with the raising of processing cost, using labor-intensive as primary operational
The heat-conducting pad of mode has been unable to meet current cost needs, and cost of labor pressure increases.
Summary of the invention
Aiming at the problems existing in the prior art, what the present invention designed is designed to provide a kind of quick applied to mount stress
The pureed two-component high thermal conductivity coefficient interface sealant of inductor component.Its thermal coefficient with higher, can both meet sensor
The thermally conductive demand of part can also absorb generated moment stress during installation significantly, have the function that protect device, and also
Artificial demand can be reduced, and effectively improves production efficiency and materials'use rate.
The present invention is realized by the following technical programs:
A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that it is made of component A and B component,
And component A is mixed with B component by the weight ratio of 1:1,
The component A includes following component and its weight percent content: vinyl silicone oil 3-5%, catalyst 0.01-0.05%,
Coupling agent 0.2-0.8%, heat filling surplus；
The B component includes following component and its weight percent content: vinyl silicone oil 3-5%, containing hydrogen silicone oil 0.2-0.7%,
Inhibitor 0.01-0.05%, coupling agent 0.2-0.8%, heat filling surplus.
A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the vinyl silicone oil is
Vinyl-terminated silicone fluid, viscosity 50-100mPas, contents of ethylene are 1-2 mol%.
A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the containing hydrogen silicone oil is first
Base containing hydrogen silicone oil, viscosity 10-50mm2/ s, hydrogen content >=1.5%.
A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the catalyst is urged for platinum
Agent, platinum content 20000-30000ppm.
A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the coupling agent is silane
One of coupling agent, titanate coupling agent, aluminate coupling agent or more than one mixture.
A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the heat filling is oxygen
Change one of aluminium, zinc oxide, boron nitride, aluminium nitride, silica or more than one mixture.
A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the grain of the heat filling
Degree distribution are as follows: 0.1-1um particle size distribution powder weight ratio accounts for 15%-20%；5-15um particle size distribution powder weight ratio
Account for 20%-25%；50-90um particle size distribution powder weight ratio accounts for 10%-15%, 90-120um particle size distribution powder weight
Than accounting for 45%-50%.
A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the preparation of component A includes
Following steps:
1) coupling agent is made into the dilution of 1%-4% concentration, being sprayed at heat filling, granularity that granularity is 5-15um respectively is
The heat filling and granularity of 50-90um is the heat filling surface of 90-120um, and constantly stirs to heat filling, makes it uniformly
Coupling agent dilution, and the drying and processing in 100-120 DEG C of baking oven are touched, pretreatment heat filling is obtained；
2) successively vinyl silicone oil, catalyst, coupling agent are added into double kneaders, are sufficiently stirred, mix three
Uniformly, mixed solution is obtained；
3) it is added into mixed solution made from step 2 pretreated in the heat filling and step 1 that granularity is 0.1-1um
Heat filling carries out being sufficiently stirred 30-50 minutes under vacuum conditions, and component A is made.
A kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that the preparation of B component includes
Following steps:
1) coupling agent is made into the dilution of 1%-4% concentration, being sprayed at heat filling, granularity that granularity is 5-15um respectively is
The heat filling and granularity of 50-90um is the heat filling surface of 90-120um, and constantly stirs to heat filling, makes it uniformly
Coupling agent dilution, and the drying and processing in 100-120 DEG C of baking oven are touched, pretreatment heat filling is obtained；
2) successively vinyl silicone oil, containing hydrogen silicone oil, inhibitor, coupling agent are added into double kneaders, are sufficiently stirred, mixed
Close uniform mixed solution；
3) it is added into mixed solution made from step 2 pretreated in the heat filling and step 1) that granularity is 0.1-1um
Heat filling carries out being sufficiently stirred 30-50 minutes under vacuum conditions, and B component is made.
Bi-component pureed thermally-conductive interface sealant of the present invention, thermal coefficient with higher can both meet sensitivity
The high thermal conductivity demand of device can also absorb generated moment stress during installation significantly, have the function that protect device, and
And artificial demand can also be reduced, and effectively improve production efficiency and materials'use rate.It is used thermally conductive on the market at present
All there is certain integrity problem in gel, but bi-component pureed thermally-conductive interface sealant of the present invention is installed in sizing
Cheng Houke is solidified by specific temperature, guarantees its environmental reliability.
When the present invention pureed thermally-conductive interface sealant heat-conducting pad advantage is to install, material is to component
Stress is smaller, the stress of extraneous moment generation can be absorbed by deformation, so that component is protected, to avoid component damage；This
Invention is compared with heat-conducting cream advantage, and heat-conducting cream is suitable for " zero pair zero " contact gap of filling, can not fill biggish between component
Gap or gap, and pureed thermally-conductive interface sealant of the present invention, because it has excellent wetability to device surface, and
Inherent upright thixotropy is suitable for various specifications gap；The present invention is compared with one-component thermally conductive gel advantage, will not after use
Sliding occurs and overflow problem occurs.
The full cross-linked collocation between coupling agent in the present invention between organic matter matrix, so that final products have
Excellent unfailing performance, in 150 DEG C, in 1000 hours long-term aging tests, properties of product are unchanged, and do not occur it is dry and cracked,
Become the fail results such as powder.
Specific embodiment
Below in conjunction with specific embodiment, the invention will be described in further detail.
Embodiment 1
A kind of pureed bi-component high thermal conductivity coefficient interface sealant, preparation method includes the following steps:
Component A: step 1 takes silane coupling agent 2g, isopropanol 80g, acetic acid 0.2g, is prepared into coupling agent dilution, and will be even
It is 10um, 70um and 120um ball-aluminium oxide surface that connection dilution agent liquid is uniformly sprayed to granularity respectively, wherein 10um spherical shape oxygen
Change aluminium is 213.5g, and 70um ball-aluminium oxide is 112g, and 120um ball-aluminium oxide is to aoxidize during 448.7g sprays to spherical shape
Aluminium is constantly stirred, and is allowed to come into full contact with coupling agent dilution, and is placed it in 110 DEG C of baking ovens and carried out drying operation, with
Heat filling is pre-processed；
29.9g vinyl-terminated silicone fluid, 7.9g poly dimethyl methyl vinyl silicone and 2g titanate esters are successively coupled by step 2
Agent is added into kneader, is sufficiently stirred, and clear solution is formed；
Step 3, it is successively that the 0.5um ball-aluminium oxide of 48g, 138g granularity is pretreated for aluminium nitride, the 213.5g of 1um
10um ball-aluminium oxide and the pretreated 70um ball-aluminium oxide of 112.2g are added into kneader, mix with made from step 2
Solution is sufficiently mixed, and is stirred under vacuum 40 minutes, adds 0.1g platinum catalyst, and be stirred under vacuum 5 minutes, then 448.7g is located in advance
The 120um ball-aluminium oxide of reason is added into kneader, is stirred under vacuum 30 minutes.It is filling that pureed thermally-conductive interface calking can be obtained
Material component A.
B component: step 1 takes silane coupling agent 2g, isopropanol 80g, acetic acid 0.2g, is prepared into coupling agent dilution, and
It is 10um, 70um and 120um ball-aluminium oxide surface that coupling agent dilution is uniformly sprayed to granularity respectively, wherein 10um ball
Shape aluminium oxide is 213.5g, and 70um ball-aluminium oxide is 112g, and 120um ball-aluminium oxide is during 448.7g sprays to ball
Shape aluminium oxide is constantly stirred, and is allowed to come into full contact with coupling agent dilution, and is placed it in 110 DEG C of baking ovens and carried out drying work
Industry, to be pre-processed to heat filling；
Step 2, successively by 27.9g vinyl-terminated silicone fluid, 6.9g poly dimethyl methyl vinyl silicone, 3g methyl hydrogen silicon
Oil, 2g titanate coupling agent and 0.1g inhibitor are added into kneader, are sufficiently stirred, and form clear solution；
Step 3, it is successively that the 0.5um ball-aluminium oxide of 48g, 138g granularity is pretreated for aluminium nitride, the 213.5g of 1um
The pretreated 70um ball-aluminium oxide of 10um ball-aluminium oxide, 112.2g and the pretreated 120um ball-aluminium oxide of 448.7g add
Enter into kneader, be sufficiently mixed with mixed solution made from step 2, is stirred under vacuum 40 minutes.The filling pureed that can be obtained is led
Hot interface sealant component B.
It is tested after A, B component are mixed with mass ratio 1:1
The test mode of the present embodiment is as follows:
(1) thermal coefficient survey is carried out to embodiment using the TPS 2500S model heat conduction coefficient tester of HOT DISK AB company
Examination, assesses its capacity of heat transmission；
(2) embodiment is carried out to spit glue amount using the hand-held point gluing equipment of the Performus V-type number of Nordson EFD company
Test, assesses its sizing efficiency；
Test result is as follows for the present embodiment:
Thermal coefficient: 9.65W/mK；
Spit glue amount: under 5.5g/min(90psi air pressure).
Embodiment 2
A kind of pureed bi-component high thermal conductivity coefficient interface sealant, preparation method includes the following steps:
Component A: step 1 takes aluminate coupling agent 3g, distilled water 110g, acetic acid 0.1g, is prepared into coupling agent dilution, and will
It is 10um, 40um and 120um ball-aluminium oxide surface that coupling agent dilution is uniformly sprayed to granularity respectively, wherein 10um is spherical
Aluminium oxide is 221.3g, and 40um ball-aluminium oxide is 110.6g, and 120um ball-aluminium oxide is during 442.5g sprays to spherical shape
Aluminium oxide is constantly stirred, and is allowed to come into full contact with coupling agent dilution, and is placed it in 110 DEG C of baking ovens and carried out drying work
Industry, to be pre-processed to heat filling；
29.4g vinyl-terminated silicone fluid, 8.4g poly dimethyl methyl vinyl silicone and 2g Aluminate are successively coupled by step 2
Agent is added into double kneaders, is sufficiently stirred, and clear solution is formed；
Step 3, taking 48g granularity is the ball-aluminium oxide of 0.5um, and 138g granularity is the aluminium nitride of 1um, and successively by 48g's
0.5um ball-aluminium oxide, the pretreated 10um ball-aluminium oxide of aluminium nitride, 221.3g that 138g granularity is 1um and 110.6g are pre-
The 40um ball-aluminium oxide of processing is added into kneader, is sufficiently mixed with mixture made from step 2, is stirred under vacuum 40 points
Clock, adds 0.1g platinum catalyst, and is stirred under vacuum 5 minutes, then by the pretreated 120um ball-aluminium oxide of 442.5g be added to
In kneader, it is stirred under vacuum 30 minutes.It is filling that pureed thermally-conductive interface sealant component A can be obtained.
B component: step 1 takes aluminate coupling agent 3g, distilled water 110g, and acetic acid 0.1g is prepared into coupling agent dilution,
And it is 10um, 40um and 120um ball-aluminium oxide surface that coupling agent dilution is uniformly sprayed to granularity respectively, wherein 10um
Ball-aluminium oxide is 221.3g, and 40um ball-aluminium oxide is 110.6g, and 120um ball-aluminium oxide is during 442.5g sprays
It constantly stirs to ball-aluminium oxide, is allowed to come into full contact with coupling agent dilution, and place it in 110 DEG C of baking ovens and dried
Dry operation, to be pre-processed to heat filling；
Step 2, successively by 27g vinyl-terminated silicone fluid, 7.8g poly dimethyl methyl vinyl silicone, 3g Methyl Hydrogen Polysiloxane Fluid,
2g aluminate coupling agent and 0.1g inhibitor are added into kneader, are sufficiently stirred, and form clear solution；
Step 3, taking 48g granularity is the ball-aluminium oxide of 0.5um, and 138g granularity is the aluminium nitride of 1um, and successively by 48g's
0.5um ball-aluminium oxide, the pretreated 10um ball-aluminium oxide of aluminium nitride, 221.3g, the 110.6g that 138g granularity is 1um locate in advance
The pretreated 120um ball-aluminium oxide of the 40um ball-aluminium oxide and 442.5g of reason is added into kneader, is made with step 2
Mixed solution be sufficiently mixed, be stirred under vacuum 40 minutes.It is filling that pureed thermally-conductive interface sealant component B can be obtained.
It is tested after A, B component are mixed with mass ratio 1:1
The test mode of the present embodiment is as follows:
(1) thermal coefficient survey is carried out to embodiment using the TPS 2500S model heat conduction coefficient tester of HOT DISK AB company
Examination, assesses its capacity of heat transmission；
(2) embodiment is carried out to spit glue amount using the hand-held point gluing equipment of the Performus V-type number of Nordson EFD company
Test, assesses its sizing efficiency；
Test result is as follows for the present embodiment:
Thermal coefficient: 9.33W/mK；
Spit glue amount: under 5.2g/min(90psi air pressure).
Embodiment 3
A kind of pureed bi-component high thermal conductivity coefficient interface sealant, preparation method includes the following steps:
Component A: step 1 takes titanate coupling agent 2g, ethyl alcohol 100g, acetic acid 0.1g, is prepared into coupling agent dilution, and will be even
It is 5um, 40um and 90um ball-aluminium oxide surface that connection dilution agent liquid is uniformly sprayed to granularity respectively, wherein 5um ball-aluminium oxide
For 213.5g, 40um ball-aluminium oxide is 112g, 90um ball-aluminium oxide be during 448.7g sprinkling to ball-aluminium oxide not
It is disconnected to stir, it is allowed to come into full contact with coupling agent dilution, and place it in 110 DEG C of baking ovens and carry out drying operation, with to leading
Hot filler is pre-processed；
29.4g vinyl-terminated silicone fluid, 8.4g poly dimethyl methyl vinyl silicone and 2g Aluminate are successively coupled by step 2
Agent is added into kneader, is sufficiently stirred, and clear solution is formed；
Step 3, taking 48g granularity is the ball-aluminium oxide of 0.5um, and 138g granularity is the aluminium nitride of 1um, and successively by 48g's
0.5um ball-aluminium oxide, the pretreated 5um ball-aluminium oxide of aluminium nitride, 213.5g that 138g granularity is 1um and 112.2g locate in advance
The 40um ball-aluminium oxide of reason is added into kneader, is sufficiently mixed with mixed solution made from step 2, is stirred under vacuum 40 points
Clock, adds 0.1g platinum catalyst, and is stirred under vacuum 5 minutes, then by the pretreated 90um ball-aluminium oxide of 448.7g be added to
In kneader, it is stirred under vacuum 30 minutes.It is filling that pureed thermally-conductive interface sealant component A can be obtained.
B component: step 1 takes titanate coupling agent 2g, ethyl alcohol 100g, acetic acid 0.1g, is prepared into coupling agent dilution, and
It is 5um, 40um and 90um ball-aluminium oxide surface that coupling agent dilution is uniformly sprayed to granularity respectively, wherein 5um spherical shape oxygen
Change aluminium is 213.5g, and 40um ball-aluminium oxide is 112g, and 90um ball-aluminium oxide is to aoxidize during 448.7g sprays to spherical shape
Aluminium is constantly stirred, and is allowed to come into full contact with coupling agent dilution, and is placed it in 110 DEG C of baking ovens and carried out drying operation, with
Heat filling is pre-processed；
Step 2, successively by 27g vinyl-terminated silicone fluid, 7.8g poly dimethyl methyl vinyl silicone, 3g Methyl Hydrogen Polysiloxane Fluid,
2g aluminate coupling agent and 0.1g inhibitor are added into kneader, are sufficiently stirred, and form clear solution；
Step 3, taking 48g granularity is the ball-aluminium oxide of 0.5um, and 138g granularity is the aluminium nitride of 1um, and successively by 48g's
0.5um ball-aluminium oxide, the pretreated 5um ball-aluminium oxide of aluminium nitride, 213.5g, the 112.2g that 138g granularity is 1um locate in advance
The pretreated 90um ball-aluminium oxide of the 40um ball-aluminium oxide and 448.7g of reason is added into kneader, and made from step 2
Mixed solution is sufficiently mixed, and is stirred under vacuum 40 minutes.It is filling that pureed thermally-conductive interface sealant component B can be obtained.
It is tested after AB component is mixed with mass ratio 1:1
The test mode of the present embodiment is as follows:
(1) thermal coefficient survey is carried out to embodiment using the TPS 2500S model heat conduction coefficient tester of HOT DISK AB company
Examination, assesses its capacity of heat transmission；
(2) embodiment is carried out to spit glue amount using the hand-held point gluing equipment of the Performus V-type number of Nordson EFD company
Test, assesses its sizing efficiency；
Test result is as follows for the present embodiment:
Thermal coefficient: 9.06W/mK；
Spit glue amount: under 4.8g/min(90psi air pressure).
Claims (9)
1. a kind of pureed two-component high thermal conductivity coefficient interface sealant, it is characterised in that be made of component A and B component, and A group
Part is mixed with B component by the weight ratio of 1:1,
The component A includes following component and its weight percent content: vinyl silicone oil 3-5%, catalyst 0.01-0.05%,
Coupling agent 0.2-0.8%, heat filling surplus；
The B component includes following component and its weight percent content: vinyl silicone oil 3-5%, containing hydrogen silicone oil 0.2-0.7%,
Inhibitor 0.01-0.05%, coupling agent 0.2-0.8%, heat filling surplus.
2. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that the second
Alkenyl silicone oil is vinyl-terminated silicone fluid, and viscosity 50-100mPas, contents of ethylene is 1-2 mol%.
3. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that described to contain
Hydrogen silicone oil is Methyl Hydrogen Polysiloxane Fluid, viscosity 10-50mm2/ s, hydrogen content >=1.5%.
4. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that described to urge
Agent is platinum catalyst, platinum content 20000-30000ppm.
5. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that the idol
Connection agent is one of silane coupling agent, titanate coupling agent, aluminate coupling agent or more than one mixture.
6. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that described to lead
Hot filler is one of aluminium oxide, zinc oxide, boron nitride, aluminium nitride, silica or more than one mixture.
7. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that described to lead
The size distribution of hot filler are as follows: 0.1-1um particle size distribution powder weight ratio accounts for 15%-20%；5-15um particle size distribution
Powder weight ratio accounts for 20%-25%；50-90um particle size distribution powder weight ratio accounts for 10%-15%, 90-120um size distribution model
It encloses powder weight ratio and accounts for 45%-50%.
8. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that component A
Preparation the following steps are included:
1) coupling agent is made into the dilution of 1%-4% concentration, being sprayed at heat filling, granularity that granularity is 5-15um respectively is
The heat filling and granularity of 50-90um is the heat filling surface of 90-120um, and constantly stirs to heat filling, makes it uniformly
Coupling agent dilution, and the drying and processing in 100-120 DEG C of baking oven are touched, pretreatment heat filling is obtained；
2) successively vinyl silicone oil, catalyst, coupling agent are added into double kneaders, are sufficiently stirred, mix three
Uniformly, mixed solution is obtained；
3) it is added into mixed solution made from step 2 pretreated in the heat filling and step 1 that granularity is 0.1-1um
Heat filling carries out being sufficiently stirred 30-50 minutes under vacuum conditions, and component A is made.
9. a kind of pureed two-component high thermal conductivity coefficient interface as described in claim 1 sealant, it is characterised in that B component
Preparation the following steps are included:
1) coupling agent is made into the dilution of 1%-4% concentration, being sprayed at heat filling, granularity that granularity is 5-15um respectively is
The heat filling and granularity of 50-90um is the heat filling surface of 90-120um, and constantly stirs to heat filling, makes it uniformly
Coupling agent dilution, and the drying and processing in 100-120 DEG C of baking oven are touched, pretreatment heat filling is obtained；
2) successively vinyl silicone oil, containing hydrogen silicone oil, inhibitor, coupling agent are added into double kneaders, are sufficiently stirred, mixed
Close uniform mixed solution；
3) it is added into mixed solution made from step 2 pretreated in the heat filling and step 1) that granularity is 0.1-1um
Heat filling carries out being sufficiently stirred 30-50 minutes under vacuum conditions, and B component is made.
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| CN111286307A (en) * | 2020-03-06 | 2020-06-16 | 平湖阿莱德实业有限公司 | Curable two-component heat-conducting heat-storing silicone gel |
| CN112358732A (en) * | 2020-12-07 | 2021-02-12 | 上海阿莱德实业股份有限公司 | Heat-conducting interface material with high filling amount and high heat conductivity coefficient |
| CN112552882A (en) * | 2020-12-02 | 2021-03-26 | 上海阿莱德实业股份有限公司 | Single-component muddy interface heat conduction material and application thereof |
| CN112625450A (en) * | 2020-12-07 | 2021-04-09 | 上海阿莱德实业股份有限公司 | Heat-conducting interface material |
| CN113913162A (en) * | 2021-09-27 | 2022-01-11 | 平湖阿莱德实业有限公司 | High-thermal-conductivity insulating silicon-free heat-conducting grease and preparation method thereof |
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