CN106633914A - Muddy heat-conducting interface shimming material and preparation method thereof - Google Patents
Muddy heat-conducting interface shimming material and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a muddy heat-conducting interface shimming material. The muddy heat-conducting interface shimming material comprises the following components by weight percentage: 5%-10% of vinyl silicone oil, 1%-5% of methyl vinyl silicone, 0.2%-0.7% of hydrogen-containing silicone oil, 0.1%-0.5% of a catalyst, 0.5%-1.3% of a coupling agent, and the balance of heat-conducting filler. The muddy heat-conducting interface shimming material has the higher heat conductivity coefficient, is capable of satisfying the heat-conducting requirements for sensitive apparatuses, greatly absorbing the instant stress generated during the installation, realizing the function of protecting devices, reducing the labor demand, and effectively improving the production efficiency and material user factor.
Description
Technical field
The present invention relates to Heat Conduction Material technical field, more particularly to a kind of pureed for being applied to mount stress Sensitive Apparatus is led
Hot interface sealant and preparation method thereof.
Background technology
With the continuous complication of integrated circuit, the packing density of electronic integrated board increases, and the heating under unit area is close
Degree increases, and Functional Unit device miniaturization, more sensitive to mount stress, easily the excessive component damage or can of causing of stress
Decline by property, therefore conventional thermal conductive silica gel piece（Heat-conducting pad）Cannot meet now so that future growth requirement.Meanwhile, with
The raising of processing cost, current cost need can not have been met with labor-intensive as the heat-conducting pad of main mode of operation
Ask, the increase of cost of labor pressure.
The content of the invention
Present invention aims to the defect and deficiency of prior art, there is provided one kind is applied to mount stress sensor
Pureed thermally-conductive interface sealant of part and preparation method thereof, it has higher thermal conductivity factor, can both meet Sensitive Apparatus
Heat conduction demand, can also significantly absorb moment stress produced when mounted, reach the effect of protection device, and also can
Artificial demand is reduced, and effectively improves production efficiency and materials'use rate.
For achieving the above object, the present invention is employed the following technical solutions.
A kind of pureed thermally-conductive interface sealant, including following component and its weight percent content：
Vinyl silicone oil 5%-10%；
Methyl ethylene silica gel 1%-5%；
Containing hydrogen silicone oil 0.2%-0.7%；
Catalyst 0.1%-0.5%；
Coupling agent 0.5%-1.3%；
Heat filling surplus.
Further, the vinyl silicone oil is vinyl-terminated silicone fluid, and its viscosity is 200-700mPas, and vinyl contains
Measure as 1-2 mol%.
Further, the methyl ethylene silica gel be poly dimethyl methyl vinyl silicone, its molecular weight be 450,000-
700000, contents of ethylene is 0.1-0.3 mol%.
Further, the containing hydrogen silicone oil be Methyl Hydrogen Polysiloxane Fluid, and can at moderate temperatures with the vinyl silicone oil
Crosslinking, its viscosity is 10-50mm2/ s, hydrogen content >=1.5%.
Further, the catalyst is platinum catalyst, and its platinum content is 300-1000ppm.
Further, the coupling agent is the one kind or extremely in silane coupler, titanate coupling agent, aluminate coupling agent
Few two kinds mixture.
Further, the heat filling be aluminum oxide, zinc oxide, boron nitride, aluminium nitride, silica in one kind or
At least two mixture.
Further, the size distribution of the heat filling is：0.1-1um particle size distribution powder weight ratios account for 3%-
7%, 5-10um particle size distribution powder weight ratio accounts for 15%-25%, and 35-45um particle size distribution powder weight ratios account for 68%-
82%。
A kind of preparation method of pureed thermally-conductive interface sealant, comprises the steps：
Step one, by coupling agent the dilution of 1%-4% concentration is made into, and heat filling and grain that granularity is 5-10um are sprayed at respectively
Spend the heat filling surface for 35-45um, and heat filling constantly stirred so as to uniform contact to coupling agent dilution, and
The drying and processing in 100-120 DEG C of baking oven, to pre-process to heat filling；
Step 2, successively adds vinyl silicone oil, methyl ethylene silica gel, containing hydrogen silicone oil and coupling agent to double planetary mixer
In, it is sufficiently stirred for, methyl ethylene silica gel is uniformly dissolved in vinyl silicone oil, form clear solution；
Step 3, granularity is added in mixture obtained in step 2 to locate in advance in the heat filling and step one of 0.1-1um
The heat filling of reason, carries out being sufficiently stirred for 30-50 minutes under vacuum conditions, adds the catalyst, and vacuum stirring 5-
10 minutes；
Step 4, obtained mixture in step 3 is put in 100-120 DEG C of baking oven carries out high-temperature cross-linking reaction, baking time
It is after cooling to room temperature, filling that the sealant is obtained for 30-60 minutes.
Further, it is distilled water or alcohol or the mixing of water alcohol that coupling agent dilution solvent for use is configured in the step one
Thing, and acetic acid is added as hydrolyst.
The invention has the advantages that.
Pureed thermally-conductive interface sealant of the present invention, with higher thermal conductivity factor, can both meet Sensitive Apparatus
Heat conduction demand, can also significantly absorb moment stress produced when mounted, reach the effect of protection device, and also can
Artificial demand is reduced, and effectively improves production efficiency and materials'use rate.
When the present invention pureed thermally-conductive interface sealant heat-conducting pad advantage is to install, material is to components and parts
Stress is less, can pass through the stress that deformation absorbs extraneous moment and produces, so as to protect components and parts, to avoid component damage；This
Invention is that heat-conducting cream is applied to " zero pair zero " contact gap of filling, it is impossible to fill larger between components and parts compared with heat-conducting cream advantage
Gap or gap, and pureed thermally-conductive interface sealant of the present invention, because it has excellent wetability to device surface, and
Inherent upright thixotropy, it is adaptable to all size gap, and sliding and overflow problem generation will not occur after use.
Collocation full cross-linked between organic matter matrix in the present invention, and coupling agent between so that final products have
Excellent unfailing performance, in 200 DEG C, in 1000 hours long-term aging tests, properties of product are unchanged, and do not occur it is dry and cracked,
Become the fail results such as powder.
Specific embodiment
The following is embodiments of the invention one.
A kind of preparation method of pureed thermally-conductive interface sealant, comprises the following steps：
Step one, takes silane coupler 2g, isopropanol 80g, acetic acid 0.2g, is prepared into coupling agent dilution, and coupling agent is dilute
It is 5um and 35um spherical alumina aluminium surfaces to release liquid and be uniformly sprayed to granularity respectively, wherein, 5um ball-aluminium oxides are 186.4g,
35um ball-aluminium oxides are 717.64g, and ball-aluminium oxide is constantly stirred during sprinkling, are allowed to abundant with coupling agent dilution
Contact, and place it in 110 DEG C of baking ovens and carry out drying operation, to pre-process to heat filling；
Step 2, successively by 50g vinyl-terminated silicone fluids, 10g poly dimethyl methyl vinyl silicones, 2g Methyl Hydrogen Polysiloxane Fluids and
3g titanate coupling agents are added into double planetary mixer, are sufficiently stirred for, and make poly dimethyl methyl vinyl silicone equal
It is even to be dissolved in vinyl-terminated silicone fluid, form clear solution；
Step 3, take 27.96g granularities be 0.3um ball-aluminium oxide, and successively by the 0.3um ball-aluminium oxides of 27.96g,
The 5um ball-aluminium oxides of 186.4g pretreatments and the 35um ball-aluminium oxides of 717.64g pretreatments are added to double planetary mixer
In, it is sufficiently mixed with mixture obtained in step 2, vacuum stirring 40 minutes, add 1g platinum catalysts, and 5 points of vacuum stirring
Clock；
Step 4, mixture obtained in step 3 is put in 120 DEG C of baking ovens carries out high-temperature cross-linking reaction, and baking time is 50 points
Clock, it is after cooling to room temperature, filling that pureed thermally-conductive interface sealant is obtained.
The test mode of the present embodiment is as follows：
（1）Thermal conductivity factor survey is carried out to embodiment using the TPS 2500S models heat conduction coefficient testers of HOT DISK AB companies
Examination, assesses its capacity of heat transmission；
（2）Using the hand-held point gluing equipment of the Performus V-types number of Nordson EFD companies embodiment is carried out to tell glue amount
Test, assesses its sizing efficiency；
（3）Test is compressed to embodiment using the MultiTest-2.5i model Fast Compression testing machines of Mecmesin companies
Test, assesses the relation of its deformation and power.
The present embodiment test result is as follows：
Thermal conductivity factor：4.55W/mK；
Tell glue amount：17g/min（Under 90psi air pressure）；
Pressure：27.3psi（Under 50% compression, compression speed 10mm/min）.
Test result explanation, contrasts the heat-conducting pad of equal thermal conductivity factor, under equal test condition, the heat-conducting pad pressure
50% pressure that contracts is 126psi.Prove from result, the present invention can substantially reduce meeting with stresses for device.
The following is embodiments of the invention two.
A kind of preparation method of pureed thermally-conductive interface sealant, comprises the following steps：
Step one, takes aluminate coupling agent 3g, distilled water 110g, acetic acid 0.1g, is prepared into coupling agent dilution, and by coupling agent
It is 10um and 40um spherical alumina zinc surfaces that dilution is uniformly sprayed to respectively granularity, wherein, 10um spherical alumina zinc is
161.64g, 40um spherical alumina zinc is 862.08g, and spherical alumina zinc is constantly stirred during sprinkling, is allowed to dilute with coupling agent
Release liquid to be fully contacted, and place it in 120 DEG C of baking ovens and carry out drying operation, to pre-process to heat filling；
Step 2, successively by 84g vinyl-terminated silicone fluids, 24g poly dimethyl methyl vinyl silicones, 3.6g Methyl Hydrogen Polysiloxane Fluids
Add into double planetary mixer with 5.4g aluminate coupling agents, be sufficiently stirred for, make poly dimethyl methyl ethylene silica
Alkane is uniformly dissolved in vinyl-terminated silicone fluid, forms clear solution；
Step 3, take 53.88g granularities be 0.6um ball-aluminium oxide, and successively by the 0.6um ball-aluminium oxides of 53.88g,
The 10um spherical aluminas zinc of 161.64g pretreatments and the 40um spherical alumina zinc of 862.08g pretreatments are added to double-planet stirring
In machine, it is sufficiently mixed with mixture obtained in step 2, vacuum stirring 35 minutes adds 2.4g platinum catalysts, and vacuum is stirred
Mix 7 minutes；
Step 4, mixture obtained in step 3 is put in 120 DEG C of baking ovens carries out high-temperature cross-linking reaction, and baking time is 45 points
Clock, it is after cooling to room temperature, filling that pureed thermally-conductive interface sealant is obtained.
The test mode of the present embodiment is as follows：
（1）Thermal conductivity factor survey is carried out to embodiment using the TPS 2500S models heat conduction coefficient testers of HOT DISK AB companies
Examination, assesses its capacity of heat transmission；
（2）Using the hand-held point gluing equipment of the Performus V-types number of Nordson EFD companies embodiment is carried out to tell glue amount
Test, assesses its sizing efficiency；
（3）Test is compressed to embodiment using the MultiTest-2.5i model Fast Compression testing machines of Mecmesin companies
Test, assesses the relation of its deformation and power.
The present embodiment test result is as follows：
Thermal conductivity factor：3.14W/mK；
Tell glue amount：44g/min（Under 90psi air pressure）；
Pressure：4.9psi（Under 50% compression, compression speed 10mm/min）.
Test result explanation, contrasts the heat-conducting pad of equal thermal conductivity factor, under equal test condition, the heat-conducting pad pressure
50% pressure that contracts is 81psi.Prove from result, the present invention can substantially reduce meeting with stresses for device.
The following is embodiments of the invention three.
A kind of preparation method of pureed thermally-conductive interface sealant, comprises the following steps：
Step one, takes titanate coupling agent 2g, ethanol 100g, acetic acid 0.1g, is prepared into coupling agent dilution, and coupling agent is dilute
It is 5um and 40um spherical alumina aluminium surfaces to release liquid and be uniformly sprayed to granularity respectively, wherein, 5um ball-aluminium oxides are 174.61g,
40um ball-aluminium oxides are 656.07g, and ball-aluminium oxide is constantly stirred during sprinkling, are allowed to abundant with coupling agent dilution
Contact, and place it in 100 DEG C of baking ovens and carry out drying operation, to pre-process to heat filling；
Step 2, successively by 82g vinyl-terminated silicone fluids, 28g poly dimethyl methyl vinyl silicones, 5g Methyl Hydrogen Polysiloxane Fluids and
7g titanate coupling agents are added into double planetary mixer, are sufficiently stirred for, and make poly dimethyl methyl vinyl silicone equal
It is even to be dissolved in vinyl-terminated silicone fluid, form clear solution；
Step 3, take 43.32g granularities be 0.5um ball-aluminium oxide, and successively by the 0.5um ball-aluminium oxides of 43.32g,
The 5um ball-aluminium oxides of 174.61g pretreatments and the 40um ball-aluminium oxides of 656.07g pretreatments are added to double planetary mixer
In, it is sufficiently mixed with mixture obtained in step 2, vacuum stirring 40 minutes, add 4g platinum catalysts, and 5 points of vacuum stirring
Clock；
Step 4, mixture obtained in step 3 is put in 120 DEG C of baking ovens carries out high-temperature cross-linking reaction, and baking time is 40 points
Clock, it is after cooling to room temperature, filling that pureed thermally-conductive interface sealant is obtained.
The test mode of the present embodiment is as follows：
（1）Thermal conductivity factor survey is carried out to embodiment using the TPS 2500S models heat conduction coefficient testers of HOT DISK AB companies
Examination, assesses its capacity of heat transmission；
（2）Using the hand-held point gluing equipment of the Performus V-types number of Nordson EFD companies embodiment is carried out to tell glue amount
Test, assesses its sizing efficiency；
（3）Test is compressed to embodiment using the MultiTest-2.5i model Fast Compression testing machines of Mecmesin companies
Test, assesses the relation of its deformation and power.
The present embodiment test result is as follows：
Thermal conductivity factor：3.62W/mK；
Tell glue amount：53g/min（Under 90psi air pressure）；
Pressure：2.6psi（Under 50% compression, compression speed 10mm/min）.
Test result explanation, contrasts the heat-conducting pad of equal thermal conductivity factor, under equal test condition, the heat-conducting pad pressure
50% pressure that contracts is 87psi.Prove from result, the present invention can substantially reduce meeting with stresses for device.
The following is embodiments of the invention four.
A kind of preparation method of pureed thermally-conductive interface sealant, comprises the following steps：
Step one, takes silane coupler 6g, distilled water 180g, acetic acid 0.3g, is prepared into coupling agent dilution, and coupling agent is dilute
Release liquid and be uniformly sprayed to granularity respectively for 7um ball-aluminium oxides and the spherical agglomerated nitridation boron surfaces of 45um, wherein, the spherical oxygen of 7um
Change aluminium is 375.54g, and the spherical agglomerated boron nitride of 45um is 1229.04g, and heat filling is constantly stirred during sprinkling, is allowed to
It is fully contacted with coupling agent dilution, and places it in 100 DEG C of baking ovens and carry out drying operation, it is pre- to carry out to heat filling
Process；
Step 2, successively by 180g vinyl-terminated silicone fluids, 70g poly dimethyl methyl vinyl silicones, 12g Methyl Hydrogen Polysiloxane Fluids
Add into double planetary mixer with 16g silane couplers, be sufficiently stirred for, make poly dimethyl methyl vinyl silicone equal
It is even to be dissolved in vinyl-terminated silicone fluid, form clear solution；
Step 3, take 102.42g granularities be 0.6um ball-aluminium oxide, and successively by the 0.8um ball-aluminium oxides of 102.42g,
The 7um ball-aluminium oxides of 375.54g pretreatments and the spherical agglomerated boron nitride of 45um of 1229.04g pretreatments are added to double-planet
In mixer, it is sufficiently mixed with mixture obtained in step 2, vacuum stirring 30 minutes adds 9g platinum catalysts, and vacuum
Stirring 7 minutes；
Step 4, mixture obtained in step 3 is put in 120 DEG C of baking ovens carries out high-temperature cross-linking reaction, and baking time is 30 points
Clock, it is after cooling to room temperature, filling that pureed thermally-conductive interface sealant is obtained.
The test mode of the present embodiment is as follows：
（1）Thermal conductivity factor survey is carried out to embodiment using the TPS 2500S models heat conduction coefficient testers of HOT DISK AB companies
Examination, assesses its capacity of heat transmission；
（2）Using the hand-held point gluing equipment of the Performus V-types number of Nordson EFD companies embodiment is carried out to tell glue amount
Test, assesses its sizing efficiency；
（3）Test is compressed to embodiment using the MultiTest-2.5i model Fast Compression testing machines of Mecmesin companies
Test, assesses the relation of its deformation and power.
The present embodiment test result is as follows：
Thermal conductivity factor：3.87W/mK；
Tell glue amount：15g/min（Under 90psi air pressure）；
Pressure：15.7psi（Under 50% compression, compression speed 10mm/min）.
Test result explanation, contrasts the heat-conducting pad of equal thermal conductivity factor, under equal test condition, the heat-conducting pad pressure
50% pressure that contracts is 105psi.Prove from result, the present invention can substantially reduce meeting with stresses for device.
The following is embodiments of the invention five.
A kind of preparation method of pureed thermally-conductive interface sealant, comprises the following steps：
Step one, takes silane coupler 3.1g, absolute ethyl alcohol 250g, acetic acid 0.4g, is prepared into coupling agent dilution, and will be coupled
Dilution agent liquid is uniformly sprayed to respectively granularity for 5um resistant to hydrolysis aluminium nitride and 45um spherical aluminum nitrides surface, wherein, 5um water resistants
Solution aluminium nitride be 217.8g, 45um spherical aluminum nitrides be 653.4g, spherical aluminum nitride is constantly stirred during sprinkling, be allowed to
Coupling agent dilution is fully contacted, and places it in 100 DEG C of baking ovens and carry out drying operation, to carry out pre- place to heat filling
Reason；
Step 2, successively by 110g vinyl-terminated silicone fluids, 55g poly dimethyl methyl vinyl silicones, 7.7g methyl hydrogen silicon
Oil and 11.2g silane couplers are added into double planetary mixer, are sufficiently stirred for, and make poly dimethyl methyl ethylene silica
Alkane is uniformly dissolved in vinyl-terminated silicone fluid, forms clear solution；
Step 3, take 36.3g granularities be 1um aluminium nitride, and successively by the 1um aluminium nitride of 36.3g, 217.8g pre-process
5um resistant to hydrolysis aluminium nitride and the 45um spherical aluminum nitrides of 653.4g pretreatments are added into double planetary mixer, with step 2 system
Mixture be sufficiently mixed, vacuum stirring 40 minutes adds 5.5g platinum catalysts, and vacuum stirring 7 minutes；
Step 4, mixture obtained in step 3 is put in 110 DEG C of baking ovens carries out high-temperature cross-linking reaction, and baking time is 30 points
Clock, it is after cooling to room temperature, filling that pureed thermally-conductive interface sealant is obtained.
The test mode of the present embodiment is as follows：
（1）Thermal conductivity factor survey is carried out to embodiment using the TPS 2500S models heat conduction coefficient testers of HOT DISK AB companies
Examination, assesses its capacity of heat transmission；
（2）Using the hand-held point gluing equipment of the Performus V-types number of Nordson EFD companies embodiment is carried out to tell glue amount
Test, assesses its sizing efficiency；
（3）Test is compressed to embodiment using the MultiTest-2.5i model Fast Compression testing machines of Mecmesin companies
Test, assesses the relation of its deformation and power.
The present embodiment test result is as follows：
Thermal conductivity factor：4.13W/mK；
Tell glue amount：39g/min（Under 90psi air pressure）；
Pressure：19.1psi（Under 50% compression, compression speed 10mm/min）.
Test result explanation, contrasts the heat-conducting pad of equal thermal conductivity factor, under equal test condition, the heat-conducting pad pressure
50% pressure that contracts is 109psi.Prove from result, the present invention can substantially reduce meeting with stresses for device.
Claims (10)
1. a kind of pureed thermally-conductive interface sealant, it is characterised in that including following component and its weight percent content：
Vinyl silicone oil 5%-10%；
Methyl ethylene silica gel 1%-5%；
Containing hydrogen silicone oil 0.2%-0.7%；
Catalyst 0.1%-0.5%；
Coupling agent 0.5%-1.3%；
Heat filling surplus.
2. pureed thermally-conductive interface sealant according to claim 1, it is characterised in that the vinyl silicone oil is end second
Thiazolinyl silicone oil, its viscosity is 200-700mPas, and contents of ethylene is 1-2 mol%.
3. pureed thermally-conductive interface sealant according to claim 1, it is characterised in that the methyl ethylene silica gel is
Poly dimethyl methyl vinyl silicone, its molecular weight is 450,000-70 ten thousand, and contents of ethylene is 0.1-0.3 mol%.
4. pureed thermally-conductive interface sealant according to claim 1, it is characterised in that the containing hydrogen silicone oil contains for methyl
Hydrogen silicone oil, and can be crosslinked with the vinyl silicone oil at moderate temperatures, its viscosity is 10-50mm2/ s, hydrogen content >=1.5%.
5. pureed thermally-conductive interface sealant according to claim 1, it is characterised in that the catalyst is platinum catalysis
Agent, its platinum content is 300-1000ppm.
6. pureed thermally-conductive interface sealant according to claim 1, it is characterised in that the coupling agent is silane coupled
One kind or at least two mixture in agent, titanate coupling agent, aluminate coupling agent.
7. pureed thermally-conductive interface sealant according to claim 1, it is characterised in that the heat filling is oxidation
One kind or at least two mixture in aluminium, zinc oxide, boron nitride, aluminium nitride, silica.
8. the pureed thermally-conductive interface sealant according to claim 1 or 7, it is characterised in that the grain of the heat filling
Degree is distributed as：0.1-1um particle size distribution powder weight ratios account for 3%-7%, and 5-10um particle size distribution powder weight ratios are accounted for
15%-25%, 35-45um particle size distribution powder weight ratio accounts for 68%-82%.
9. a kind of preparation method of pureed thermally-conductive interface sealant as claimed in claim 1, it is characterised in that including as follows
Step：
Step one, by coupling agent the dilution of 1%-4% concentration is made into, and heat filling and grain that granularity is 5-10um are sprayed at respectively
Spend the heat filling surface for 35-45um, and heat filling constantly stirred so as to uniform contact to coupling agent dilution, and
The drying and processing in 100-120 DEG C of baking oven, to pre-process to heat filling；
Step 2, successively adds vinyl silicone oil, methyl ethylene silica gel, containing hydrogen silicone oil and coupling agent to double planetary mixer
In, it is sufficiently stirred for, methyl ethylene silica gel is uniformly dissolved in vinyl silicone oil, form clear solution；
Step 3, granularity is added in mixture obtained in step 2 to locate in advance in the heat filling and step one of 0.1-1um
The heat filling of reason, carries out being sufficiently stirred for 30-50 minutes under vacuum conditions, adds the catalyst, and vacuum stirring 5-
10 minutes；
Step 4, obtained mixture in step 3 is put in 100-120 DEG C of baking oven carries out high-temperature cross-linking reaction, baking time
It is after cooling to room temperature, filling that the sealant is obtained for 30-60 minutes.
10. the preparation method of pureed thermally-conductive interface sealant according to claim 9, it is characterised in that the step
It is distilled water or alcohol or water-alcohol mixture that coupling agent dilution solvent for use is configured in one, and adds acetic acid as hydrolyzation catalysis
Agent.
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107189767A (en) * | 2017-05-27 | 2017-09-22 | 广州中科检测技术服务有限公司 | A kind of high interface heat transfer effect, interface heat transfer material plastic, without pickup and preparation method thereof |
| CN107501936A (en) * | 2017-06-28 | 2017-12-22 | 上海阿莱德实业股份有限公司 | Cooling electronic component heat conductivity gap filling material and preparation method thereof |
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| CN107189767B (en) * | 2017-05-27 | 2020-11-27 | 广州中科检测技术服务有限公司 | Plastic and non-fouling interface heat transfer material with high interface heat transfer effect and preparation method thereof |
| CN107189767A (en) * | 2017-05-27 | 2017-09-22 | 广州中科检测技术服务有限公司 | A kind of high interface heat transfer effect, interface heat transfer material plastic, without pickup and preparation method thereof |
| CN107501936A (en) * | 2017-06-28 | 2017-12-22 | 上海阿莱德实业股份有限公司 | Cooling electronic component heat conductivity gap filling material and preparation method thereof |
| CN107690270A (en) * | 2017-07-31 | 2018-02-13 | 广州金南磁性材料有限公司 | Ripple electromagnetic material and preparation method thereof is inhaled in a kind of paste heat conduction |
| CN109054393A (en) * | 2018-05-31 | 2018-12-21 | 镇江高美新材料有限公司 | A kind of thermally conductive silicone rubber composition |
| CN110128830A (en) * | 2019-03-22 | 2019-08-16 | 中国科学院工程热物理研究所 | A kind of high heat conductance heat conductive silica gel gasket and preparation method thereof |
| CN110172250A (en) * | 2019-05-22 | 2019-08-27 | 平湖阿莱德实业有限公司 | A kind of new-energy automobile extremely-low density high thermal conductivity calking boundary material and preparation method thereof |
| CN110511728A (en) * | 2019-07-17 | 2019-11-29 | 平湖阿莱德实业有限公司 | A kind of pureed two-component high thermal conductivity coefficient interface sealant and preparation method thereof |
| CN110591374A (en) * | 2019-09-05 | 2019-12-20 | 上海阿莱德实业股份有限公司 | Silicone rubber heat conduction material and preparation method thereof |
| CN110724381A (en) * | 2019-09-25 | 2020-01-24 | 无锡易佳美电子科技有限公司 | Preparation method of heat conduction grease capable of preventing pumping in cold and hot impact environment |
| CN111019357A (en) * | 2019-12-27 | 2020-04-17 | 广州市白云化工实业有限公司 | High-performance silicon-based heat-conducting mud and preparation method thereof |
| CN111019357B (en) * | 2019-12-27 | 2021-06-22 | 广州市白云化工实业有限公司 | High-performance silicon-based heat-conducting mud and preparation method thereof |
| CN112552882A (en) * | 2020-12-02 | 2021-03-26 | 上海阿莱德实业股份有限公司 | Single-component muddy interface heat conduction material and application thereof |
| CN112608722A (en) * | 2020-12-16 | 2021-04-06 | 上海阿莱德实业股份有限公司 | Muddy interface heat conduction material and application thereof |
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