CN109401732A - Hypotonic oil heat conductive silica gel gasket and preparation method thereof - Google Patents
Hypotonic oil heat conductive silica gel gasket and preparation method thereof Download PDFInfo
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- CN109401732A CN109401732A CN201811284008.XA CN201811284008A CN109401732A CN 109401732 A CN109401732 A CN 109401732A CN 201811284008 A CN201811284008 A CN 201811284008A CN 109401732 A CN109401732 A CN 109401732A
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- silica gel
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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Abstract
The invention discloses a kind of hypotonic oily heat conductive silica gel gaskets, which includes following component based on parts by weight: 100 parts of vinyl silicone oil, 1~10 part of containing hydrogen silicone oil, 0.01~0.5 part of inhibitor, 0.1~0.5 part of catalyst, 700~1200 parts of aluminium oxide.The invention also discloses a kind of methods for preparing hypotonic oily heat conductive silica gel gasket.Heat conductive silica gel gasket produced by the present invention is low through burn-in test weight-loss ratio, does not occur permeability phenomenon, and heating conduction is stablized.
Description
[technical field]
The present invention relates to thermal interfacial materials to receive, the hypotonic oil low more particularly to a kind of permeability rate, heating conduction is stable
Heat conductive silica gel gasket and preparation method thereof.
[background technique]
In thermal interfacial material heat dissipation design, thermal contact resistance is generated due to insufficient contact between hot interface, leads to heat
It spreads and leads seriously hampered, to solve this problem, one layer of thermal interfacial material need to be padded between heater and radiator.It is common
Heat sink material have ceramics, heat-conducting silicone grease and heat conductive silica gel gasket, wherein ceramics have high thermal conductivity, but brittleness is big, it is difficult to fill out
The slight void between hot interface is filled, can not be used as boundary material.Heat-conducting silicone grease is led because very thin one layer can be smeared
Thermal effect is pretty good, but in operability, durability, is difficult to reach requirement in terms of meeting certain tolerance dimension.And thermal conductive silicon rubber mat
Under the premise of piece can guarantee insulation, machine-shaping and has good resilient characteristic at low temperature using macromolecule, fill it
Gap between full hot interface, drains and is present in hot interface due to the air inside the gap of uneven generation, while can also
The effects of playing insulation, damping, sealing, meets the design requirement of device miniaturization and ultrathin, and as main thermally conductive boundary
Plane materiel material is widely used in electric notor controller, power supply, computer, automobile power source power supply unit etc..However, existing thermally conductive
Often there is permeability phenomenon in the long-term use in silica gel pad, so that the heating conduction of heat conductive silica gel gasket is changed, sternly
Eyeglass, circuit etc. even are polluted when weight, influences the normal work of electronic device.
[summary of the invention]
Present invention seek to address that the above problem, and the hypotonic oily thermal conductive silicon that a kind of permeability rate is low, heating conduction is stable is provided
Glue gasket and preparation method thereof.
The present invention also provides a kind of methods for preparing above-mentioned hypotonic oily heat conductive silica gel gasket.
To achieve the purpose of the present invention, the present invention provides a kind of hypotonic oily heat conductive silica gel gasket, which includes
Following component based on parts by weight:
The weight percentage of the vinyl silicone oil medium vinyl is 0.1~0.4%, the viscosity of the vinyl silicone oil
For 1000-100000mPas.
The weight percentage of hydrogen is 0.1~0.5% in the containing hydrogen silicone oil.
The inhibitor is alkynes ketone inhibitors.
The catalyst is the platinum catalyst of ethylene polymerization of olefin using catalyst.
The aluminium oxide is that the aluminium oxide gradation for being 0.2~300 micron by particle diameter distribution forms.
The present invention also provides a kind of preparation methods of hypotonic oily heat conductive silica gel gasket, and this method comprises the following steps:
A, by by the vinyl silicone oil, containing hydrogen silicone oil and inhibitor of the parts by weight be placed in revolving speed be 60~120 turns/
It is stirred 10~50 minutes in the agitating device of minute；
B, the aluminium oxide of the parts by weight is added into agitating device, adjustment revolving speed is 30~60 revs/min, is continued
Stirring 0.5~2 hour, adds the catalyst of the parts by weight, is that 10~40 are stirred under 30~60 revs/min in revolving speed
Minute, it vacuumizes simultaneously, obtains heat conductive silica gel sizing material；
C, the heat conductive silica gel sizing material that step b is obtained is rolled into the sheet material with a thickness of 1~5 millimeter, and in temperature be 100~
Solidify 5~30 minutes at 150 DEG C, cuts into required size to get the hypotonic oily heat conductive silica gel gasket is arrived.
Preferably, in step c, the heat conductive silica gel sizing material that step b is obtained is rolled into the sheet material with a thickness of 2 millimeters, and in
Temperature is to solidify 10 minutes at 120 DEG C, cuts into required size to get the hypotonic oily heat conductive silica gel gasket is arrived.
The invention has the benefit that the present invention regulates and controls sizing material crosslinking degree by adjusting suitable silicon hydrogen ratio, make glue
Material reaches abundant reaction, reduces because of the completely remaining reactant of unreacted, is prepared for the heat-conducting silicone grease gasket of hypotonic oil, obtained
Heat conductive silica gel gasket is low through burn-in test weight-loss ratio, does not occur permeability phenomenon, and heating conduction is stablized.
[specific embodiment]
The following example is that of the invention is explained further and being supplemented, and is not limited in any way to the present invention.
Embodiment 1
The stirring that revolving speed is 60 revs/min is added in 100 grams of vinyl silicone oils, 4 grams of containing hydrogen silicone oils and 0.01 gram of inhibitor
Stir 30 minutes in kettle, 700 grams of aluminium oxide be then added into stirred tank, be in revolving speed stirred 1 hour under 30 revs/min, then
0.2 gram of catalyst is added into stirred tank, is to be stirred 20 minutes under 60 revs/min in revolving speed, vacuumizes, obtain thermally conductive simultaneously
Silica gel sizing material.
Heat conductive silica gel sizing material obtained is rolled into the sheet material with a thickness of 2 millimeters, and is to solidify 10 points at 120 DEG C in temperature
Then clock cuts into target size, obtain hypotonic oily heat conductive silica gel gasket, then test heat conductive silica gel gasket by ASTM D5470
Thermal coefficient, and 240 hours test aging weight-loss ratios are used at 150 DEG C, test result is shown in Table 1.
Embodiment 2
Revolving speed is added in 100 grams of vinyl silicone oils, 8 grams of containing hydrogen silicone oils and 0.01 gram of inhibitor it is 120 revs/min and stirs
It mixes and is stirred in kettle 30 minutes, 900 grams of aluminium oxide are then added into stirred tank, be to be stirred 1 hour under 60 revs/min in revolving speed,
0.2 gram of catalyst is added into stirred tank again, is to be stirred 20 minutes under 30 revs/min in revolving speed, vacuumizes, led simultaneously
Hot silica gel sizing material.
Heat conductive silica gel sizing material obtained is rolled into the sheet material with a thickness of 2 millimeters, and is to solidify 10 points at 120 DEG C in temperature
Then clock cuts into target size, obtain hypotonic oily heat conductive silica gel gasket, then test heat conductive silica gel gasket by ASTM D5470
Thermal coefficient, and 240 hours test aging weight-loss ratios are used at 150 DEG C, test result is shown in Table 1.
Embodiment 3
Revolving speed is added in 100 grams of vinyl silicone oils, 10 grams of containing hydrogen silicone oils and 0.01 gram of inhibitor it is 100 revs/min and stirs
It mixes and is stirred in kettle 10 minutes, 1200 grams of aluminium oxide are then added into stirred tank, be that stirring 0.5 is small under 45 revs/min in revolving speed
When, then 0.1 gram of catalyst is added into stirred tank, it is to be stirred 40 minutes under 45 revs/min in revolving speed, vacuumizes, obtain simultaneously
Heat conductive silica gel sizing material.
Heat conductive silica gel sizing material obtained is rolled into the sheet material with a thickness of 2 millimeters, and is to solidify 5 points at 150 DEG C in temperature
Then clock cuts into target size, obtain hypotonic oily heat conductive silica gel gasket, then test thermal conductive silicon rubber mat by ASTM D5470
The thermal coefficient of piece, and 240 hours test aging weight-loss ratios are used at 150 DEG C, test result is shown in Table 1.
Embodiment 4
The stirring that revolving speed is 80 revs/min is added in 100 grams of vinyl silicone oils, 1 gram of containing hydrogen silicone oil and 0.01 gram of inhibitor
Stir 50 minutes in kettle, 700 grams of aluminium oxide be then added into stirred tank, be in revolving speed stirred 2 hours under 40 revs/min, then
0.1 gram of catalyst is added into stirred tank, is to be stirred 10 minutes under 40 revs/min in revolving speed, vacuumizes, obtain thermally conductive simultaneously
Silica gel sizing material.
Heat conductive silica gel sizing material obtained is rolled into the sheet material with a thickness of 2 millimeters, and is to solidify 30 points at 100 DEG C in temperature
Then clock cuts into target size, obtain hypotonic oily heat conductive silica gel gasket, then test thermal conductive silicon rubber mat by ASTM D5470
The thermal coefficient of piece, and 240 hours test aging weight-loss ratios are used at 150 DEG C, test result is shown in Table 1.
Comparative example 1
Revolving speed is added in 100 grams of vinyl silicone oils, 0.5 gram of containing hydrogen silicone oil and 0.01 gram of inhibitor it is 80 revs/min and stirs
It mixes and is stirred in kettle 50 minutes, 700 grams of aluminium oxide are then added into stirred tank, be to be stirred 2 hours under 40 revs/min in revolving speed,
0.1 gram of catalyst is added into stirred tank again, is to be stirred 10 minutes under 40 revs/min in revolving speed, vacuumizes, led simultaneously
Hot silica gel sizing material.
Heat conductive silica gel sizing material obtained is rolled into the sheet material with a thickness of 2 millimeters, and is to solidify 30 points at 100 DEG C in temperature
Then clock cuts into target size, obtain hypotonic oily heat conductive silica gel gasket, then test thermal conductive silicon rubber mat by ASTM D5470
The thermal coefficient of piece, and 240 hours test aging weight-loss ratios are used at 150 DEG C, test result is shown in Table 1.
The test result of the hypotonic oily heat conductive silica gel gasket of table 1
As known from Table 1, the measurement result of comparative example and comparative example is it can be found that hypotonic oily heat conductive silica gel of the invention
Gasket is small through thermal coefficient variation before and after burn-in test, and heating conduction is stablized, and weight-loss ratio is low, does not occur silicone oil exudation.
Although being disclosed by above embodiments to the present invention, scope of protection of the present invention is not limited thereto,
Under conditions of without departing from present inventive concept, several deductions, the replacement etc. done to the above components will fall into of the invention
In scope of the claims.
Claims (8)
1. a kind of hypotonic oily heat conductive silica gel gasket, which is characterized in that the silica gel pad includes following component based on parts by weight:
2. hypotonic oily heat conductive silica gel gasket as described in claim 1, which is characterized in that the vinyl silicone oil medium vinyl
Weight percentage is 0.1~0.4%, and the viscosity of the vinyl silicone oil is 1000-100000mPas.
3. hypotonic oily heat conductive silica gel gasket as described in claim 1, which is characterized in that the weight hundred of hydrogen in the containing hydrogen silicone oil
Dividing content is 0.1~0.5%.
4. hypotonic oily heat conductive silica gel gasket as described in claim 1, which is characterized in that the inhibitor is the inhibition of alkynol class
Agent.
5. hypotonic oily heat conductive silica gel gasket as described in claim 1, which is characterized in that the catalyst is ethylene polymerization of olefin using catalyst
Platinum catalyst.
6. hypotonic oily heat conductive silica gel gasket as described in claim 1, which is characterized in that the thermally conductive alumina packing is by grain
The aluminium oxide gradation that diameter is distributed as 0.2~300 micron forms.
7. a kind of preparation method of hypotonic oily heat conductive silica gel gasket as described in claim 1, which is characterized in that this method includes
Following steps:
A, the vinyl silicone oil, containing hydrogen silicone oil and inhibitor of the parts by weight are placed in revolving speed are 60~120 revs/min and stir
It mixes in device and stirs 10~50 minutes；
B, the aluminium oxide of the parts by weight is added into agitating device, adjustment revolving speed is 30~60 revs/min, continues to stir
0.5~2 hour, the catalyst of the parts by weight is added, is to be stirred 10~40 minutes under 30~60 revs/min in revolving speed,
It vacuumizes simultaneously, obtains heat conductive silica gel sizing material；
C, the heat conductive silica gel sizing material that step b is obtained is rolled into the sheet material with a thickness of 2 millimeters, and in temperature be at 100~150 DEG C
Solidification 5~30 minutes obtains the hypotonic oily heat conductive silica gel gasket after cut.
8. the method for claim 7, which is characterized in that in step c, the heat conductive silica gel sizing material that step b is obtained rolls
It is to solidify 10 minutes at 120 DEG C at the sheet material with a thickness of 2 millimeters, and in temperature, obtains the hypotonic oil after cut and lead
Hot silica gel pad.
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| CN201811284008.XA CN109401732B (en) | 2018-10-31 | 2018-10-31 | Low-oil-permeability heat-conducting silica gel gasket and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110982278A (en) * | 2019-12-24 | 2020-04-10 | 深圳德邦界面材料有限公司 | Low-volatilization heat-conducting gasket and preparation method thereof |
| CN114276688A (en) * | 2021-12-31 | 2022-04-05 | 四川天邑康和通信股份有限公司 | Flame-retardant high-elasticity heat-conducting gasket and preparation method thereof |
| CN114369369A (en) * | 2022-01-24 | 2022-04-19 | 福建美庆热传科技有限公司 | Low-volatility and low-oil-permeability heat conduction gasket and preparation method thereof |
| CN118256092A (en) * | 2024-05-30 | 2024-06-28 | 浙江三元电子科技有限公司 | Low-oil-seepage heat-conducting gasket and preparation method thereof |
Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050197448A1 (en) * | 2004-03-04 | 2005-09-08 | Snjezana Jarnjevic | Silicone pads for electronics thermal management |
| CN101407635A (en) * | 2008-11-14 | 2009-04-15 | 成都硅宝科技股份有限公司 | Addition type heat conducting silicon rubber and manufacturing method thereof |
| CN102675882A (en) * | 2012-05-18 | 2012-09-19 | 东莞兆舜有机硅新材料科技有限公司 | Addition type heat-conducting anti-settling silicon rubber and preparation method thereof |
| CN103059576A (en) * | 2012-12-30 | 2013-04-24 | 深圳市鸿富诚屏蔽材料有限公司 | High-heat-conductivity flexible silica gel gasket and preparation method thereof |
| CN103102689A (en) * | 2011-11-15 | 2013-05-15 | 佛山市金戈消防材料有限公司 | Organic-silicon pouring sealant composition with high thermal conductivity and application thereof |
| CN104403330A (en) * | 2014-11-24 | 2015-03-11 | 深圳德邦界面材料有限公司 | Low oil leakage type radiating silica gel pad and preparation method thereof |
| CN104448836A (en) * | 2014-11-24 | 2015-03-25 | 深圳德邦界面材料有限公司 | Puncture-resistant type heat radiation silica gel pad and preparation method thereof |
| CN105368052A (en) * | 2015-11-13 | 2016-03-02 | 深圳德邦界面材料有限公司 | Compound heat conduction silica gel pad and preparation method thereof |
| CN105504830A (en) * | 2015-12-29 | 2016-04-20 | 江苏创景科技有限公司 | Single-component addition type heat conduction organic silicon rubber and preparation method thereof |
| CN105566918A (en) * | 2014-10-30 | 2016-05-11 | 比亚迪股份有限公司 | Silicon sheet and preparation method thereof |
| CN105566920A (en) * | 2015-12-24 | 2016-05-11 | 平湖阿莱德实业有限公司 | Low-oil-permeability super-soft thermally-conductive silica gel composition and thermally-conductive silica gel gasket and preparation method thereof |
| CN105647191A (en) * | 2016-04-01 | 2016-06-08 | 平湖阿莱德实业有限公司 | Flexible heat conduction interface material with wave absorbing function and preparation method thereof |
| CN107057371A (en) * | 2017-05-19 | 2017-08-18 | 深圳市德镒盟电子有限公司 | A kind of low-density heat conductive silica gel pad and preparation method thereof |
| CN107304294A (en) * | 2016-04-19 | 2017-10-31 | 新纶科技（常州）有限公司 | A kind of organosilicon thermally conductive sheet and preparation method thereof |
| CN107987536A (en) * | 2018-01-04 | 2018-05-04 | 楼旭娟 | A kind of high heat conductive insulating silica gel piece and preparation method thereof |
| CN108034255A (en) * | 2017-10-31 | 2018-05-15 | 东莞市汉品电子有限公司 | High fire-retardance heat-conducting silica gel sheet and its manufacture method |
| CN108129838A (en) * | 2017-12-21 | 2018-06-08 | 广东乐图新材料有限公司 | Heat-conducting pad and preparation method thereof, electronic device |
| CN108219474A (en) * | 2017-12-21 | 2018-06-29 | 东莞市汉品电子有限公司 | A kind of glass-fiber-fabric enhances heat-conducting silica gel sheet |
| CN108395702A (en) * | 2017-02-08 | 2018-08-14 | 阙燕娣 | A kind of production method of heat-conducting silica gel sheet |
| CN108485277A (en) * | 2018-04-26 | 2018-09-04 | 南方科技大学 | Oriented high-thermal-conductivity interface material and preparation method thereof |
-
2018
- 2018-10-31 CN CN201811284008.XA patent/CN109401732B/en active Active
Patent Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050197448A1 (en) * | 2004-03-04 | 2005-09-08 | Snjezana Jarnjevic | Silicone pads for electronics thermal management |
| US7119143B2 (en) * | 2004-03-04 | 2006-10-10 | Laird Technologies, Inc. | Silicone pads for electronics thermal management |
| CN101407635A (en) * | 2008-11-14 | 2009-04-15 | 成都硅宝科技股份有限公司 | Addition type heat conducting silicon rubber and manufacturing method thereof |
| CN103102689A (en) * | 2011-11-15 | 2013-05-15 | 佛山市金戈消防材料有限公司 | Organic-silicon pouring sealant composition with high thermal conductivity and application thereof |
| CN102675882A (en) * | 2012-05-18 | 2012-09-19 | 东莞兆舜有机硅新材料科技有限公司 | Addition type heat-conducting anti-settling silicon rubber and preparation method thereof |
| CN103059576A (en) * | 2012-12-30 | 2013-04-24 | 深圳市鸿富诚屏蔽材料有限公司 | High-heat-conductivity flexible silica gel gasket and preparation method thereof |
| CN105566918A (en) * | 2014-10-30 | 2016-05-11 | 比亚迪股份有限公司 | Silicon sheet and preparation method thereof |
| CN104403330A (en) * | 2014-11-24 | 2015-03-11 | 深圳德邦界面材料有限公司 | Low oil leakage type radiating silica gel pad and preparation method thereof |
| CN104448836A (en) * | 2014-11-24 | 2015-03-25 | 深圳德邦界面材料有限公司 | Puncture-resistant type heat radiation silica gel pad and preparation method thereof |
| CN105368052A (en) * | 2015-11-13 | 2016-03-02 | 深圳德邦界面材料有限公司 | Compound heat conduction silica gel pad and preparation method thereof |
| CN105566920A (en) * | 2015-12-24 | 2016-05-11 | 平湖阿莱德实业有限公司 | Low-oil-permeability super-soft thermally-conductive silica gel composition and thermally-conductive silica gel gasket and preparation method thereof |
| CN105504830A (en) * | 2015-12-29 | 2016-04-20 | 江苏创景科技有限公司 | Single-component addition type heat conduction organic silicon rubber and preparation method thereof |
| CN105647191A (en) * | 2016-04-01 | 2016-06-08 | 平湖阿莱德实业有限公司 | Flexible heat conduction interface material with wave absorbing function and preparation method thereof |
| CN107304294A (en) * | 2016-04-19 | 2017-10-31 | 新纶科技（常州）有限公司 | A kind of organosilicon thermally conductive sheet and preparation method thereof |
| CN108395702A (en) * | 2017-02-08 | 2018-08-14 | 阙燕娣 | A kind of production method of heat-conducting silica gel sheet |
| CN107057371A (en) * | 2017-05-19 | 2017-08-18 | 深圳市德镒盟电子有限公司 | A kind of low-density heat conductive silica gel pad and preparation method thereof |
| CN108034255A (en) * | 2017-10-31 | 2018-05-15 | 东莞市汉品电子有限公司 | High fire-retardance heat-conducting silica gel sheet and its manufacture method |
| CN108129838A (en) * | 2017-12-21 | 2018-06-08 | 广东乐图新材料有限公司 | Heat-conducting pad and preparation method thereof, electronic device |
| CN108219474A (en) * | 2017-12-21 | 2018-06-29 | 东莞市汉品电子有限公司 | A kind of glass-fiber-fabric enhances heat-conducting silica gel sheet |
| CN107987536A (en) * | 2018-01-04 | 2018-05-04 | 楼旭娟 | A kind of high heat conductive insulating silica gel piece and preparation method thereof |
| CN108485277A (en) * | 2018-04-26 | 2018-09-04 | 南方科技大学 | Oriented high-thermal-conductivity interface material and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 周文英等: "《导热高分子材料》", 30 April 2014 * |
| 李红强: "《胶粘原理、技术及应用》", 31 January 2014, 华南理工大学出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110982278A (en) * | 2019-12-24 | 2020-04-10 | 深圳德邦界面材料有限公司 | Low-volatilization heat-conducting gasket and preparation method thereof |
| CN114276688A (en) * | 2021-12-31 | 2022-04-05 | 四川天邑康和通信股份有限公司 | Flame-retardant high-elasticity heat-conducting gasket and preparation method thereof |
| CN114369369A (en) * | 2022-01-24 | 2022-04-19 | 福建美庆热传科技有限公司 | Low-volatility and low-oil-permeability heat conduction gasket and preparation method thereof |
| CN118256092A (en) * | 2024-05-30 | 2024-06-28 | 浙江三元电子科技有限公司 | Low-oil-seepage heat-conducting gasket and preparation method thereof |
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| CN109401732B (en) | 2021-12-28 |
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