CN103718308A - 太阳能电池设备及其制造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000000576 coating method Methods 0.000 claims description 74
- 239000011248 coating agent Substances 0.000 claims description 73
- 210000001142 back Anatomy 0.000 claims description 27
- 239000011701 zinc Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 19
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 18
- 229910052725 zinc Inorganic materials 0.000 claims description 12
- 239000011787 zinc oxide Substances 0.000 claims description 10
- 229910052717 sulfur Inorganic materials 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 239000005864 Sulphur Substances 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000010926 purge Methods 0.000 description 6
- 239000011669 selenium Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910001385 heavy metal Inorganic materials 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
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Abstract
根据实施例的一种太阳能电池设备包括:衬底;在所述衬底上的背电极层;在所述背电极层上的光吸收层;在所述光吸收层上的包括CdS的第一缓冲层;在所述第一缓冲层上的包括Zn的第二缓冲层;以及,在所述第二缓冲层上的窗口层。
Description
技术领域
实施例涉及一种太阳能电池设备及其制造方法。
背景技术
近来,由于能耗增大,开发了太阳能电池设备来将太阳能转换为电能。
具体地说,已经广泛使用了CIGS基太阳能电池设备,其为PN异质结设备,其具有:衬底结构,该衬底结构包括玻璃衬底;金属背电极层;P型CIGS基光吸收层;缓冲层;以及,N型窗口层。
在这样的太阳能电池设备中,已经进行了研究以改善太阳能电池设备的电特性,诸如低电阻和高透射率。
发明内容
技术问题
实施例提供了一种太阳能电池设备及其制造方法,可以通过形成包括具有薄厚度的Cd的缓冲层经由环境友好的方案来制造所述太阳能电池设备,并且所述太阳能电池设备可以改善光电转换效率。
技术解决方案
根据实施例的一种太阳能电池设备包括:衬底;在所述衬底上的背电极层;在所述背电极层上的光吸收层;在所述光吸收层上的包括CdS的第一缓冲层;在所述第一缓冲层上的包括Zn的第二缓冲层;以及,在所述第二缓冲层上的窗口层。
根据实施例的一种制造太阳能电池设备的方法包括步骤:在衬底上形成背电极层;在所述背电极层上形成光吸收层;在所述光吸收层上形成包括CdS的第一缓冲层;在所述第一缓冲层上形成包括Zn的第二缓冲层;以及,在所述第二缓冲层上形成窗口层。
有益效果
根据实施例的太阳能电池设备,在缓冲层中包括的CdS具有薄的厚度,因此,可以防止由作为有毒重金属的CdS引起的环境污染,并且太阳能电池设备可以具有热稳定性和优越的电特性。
附图说明
图1是示出根据实施例的太阳能电池设备的截面图;
图2是示出根据实施例的为形成第二缓冲层而注入的材料的曲线图;
图3是示出根据实施例的第二缓冲层的结构的视图;
图4是示出根据实施例的随太阳能电池设备的波长变化的量子效率的视图;以及
图5至图8是示出根据实施例的用于制造太阳能电池设备的方法的截面图。
具体实施方式
在实施例的说明中,可以明白,当衬底、层、膜或电极被称为在另一个衬底、另一个层、另一个膜或另一个电极之上或之下时,它可以直接或间接地在该另一个衬底、另一个层、另一个膜或另一个电极之上,或者,也可以存在一个或多个中间层。已经参考附图描述了这样的层的位置。在附图中所示的元件的大小可能为了说明的目的被夸大,并且可能未绝对地反映实际大小。
图1是示出根据实施例的太阳能电池设备的截面图。参见图1,太阳能电池板包括支撑衬底100、背电极层200、光吸收层300、包括第一和第二缓冲层410和420的缓冲层400,以及窗口层500。
支撑衬底100可以包括绝缘体。支撑衬底100可以是玻璃衬底、诸如聚合物的塑料衬底或金属衬底。同时,支撑衬底100可以包括包括氧化铝的陶瓷衬底、不锈钢(SUS)衬底或具有柔性的聚合物衬底。支撑衬底100可以是透明的、柔性的或硬的。
背电极层200被布置在支撑衬底100上。背电极层200是导电层。背电极层200允许从太阳能电池设备的光吸收层300产生的电荷的迁移,使得电流可以从太阳能电池设备流出。为此,背电极层200可以具有高的导电率和低的电阻率。
另外,背电极层200必须具有在硫(S)或硒(Se)气氛下执行热处理以形成CIGS化合物时的高温稳定性。另外,背电极层200可以具有相对于支撑衬底100的优越的粘结性质,使得背电极层200不会因为热膨胀系数的差别而从支撑衬底100脱层。
背电极层200可以包括Mo、Au、Al、Cr、W和Cu中的一种。在上述元素中,Mo可以表现出与支撑衬底100类似的热膨胀系数,因此,Mo具有相对于支撑衬底100的优越的粘结性质,由此防止背电极层200从支撑衬底100脱层。详细而言,Mo可以满足对于背电极层200所要求的上述性质。
背电极层200可以包括至少两层。在该情况下,可以通过使用相同的金属或不同的金属来形成至少两层。
在背电极层200上形成光吸收层300。光吸收层300可以包括P型半导体化合物。详细而言,光吸收层300可以包括I-III-VI族化合物。例如,光吸收层300可以包括Cu(In,Ga)Se2(CIGS)晶体结构、Cu(In)Se2晶体结构或Cu(Ga)Se2晶体结构。光吸收层300具有在约1.1eV至约1.8eV的范围中的能带隙。
在光吸收层300上布置缓冲层400。具有包括CIGS化合物的光吸收层300的太阳能电池设备可以在作为P型半导体的CIGS化合物层和作为N型半导体的窗口层500之间形成PN结。然而,因为在CIGS化合物层和窗口层500之间在晶格常数和带隙能量上存在大的差别,所以需要具有中间带隙的缓冲层400来形成期望的结。
缓冲层400包括第一缓冲层410和第二缓冲层420。通常,缓冲层包括CdS或ZnS。如果通过经由CBD方案沉积CdS来形成缓冲层,则在能量转换效率上有益。然而,因为CdS吸收具有比能带隙短的波长为500nm或500nm以下的光,所以可能不会使能量转换效率最大化。另外,CdS包括作为重金属的Cd,因此,已经积极地进行研究以替代CdS。
ZnS已经被用作用于CdS的替代品。然而,ZnS不稳定,并且在能量转换效率上不如CdS。ZnS具有比一般用于窗口层的ZnO大的能带隙,因此可以降低光损失。然而,在光吸收层中的Zn原子的扩散程度显著地大于Cd,因此,热稳定性可能变差。另外,导带的能带偏移导致不能获得期望的二极管特性。所述实施例提供了缓冲层,该缓冲层在最小化缺点并最大化太阳能电池设备的能量转换效率的同时保持CdS缓冲层的优点。
根据所述实施例,在光吸收层300上形成第一缓冲层410。第一缓冲层410可以包括CdS。第一缓冲层410可以具有20nm或20nm以下的厚度,优选的是10nm或10nm以下的厚度。因为包括CdS的第一缓冲层410具有薄的厚度,所以可以最小化在缓冲层中吸收的具有500nm或500nm以下的波长的光的量。
在第一缓冲层410上形成第二缓冲层420。可以通过经由MOCVD方案或ALD(原子层沉积)方案来沉积Zn、S或氧离子而形成第二缓冲层420。
当通过MOCVD方案形成第二缓冲层420时,依序交替地形成ZnS和ZnO。例如,以在0.3nm至0.7nm的范围中的厚度来层叠ZnS,并且以3nm至7nm的范围中的厚度来层叠ZnO,其中,各个层可以多次层叠。第二缓冲层420可以具有在60nm至70nm的范围中的厚度。另外,可以形成In2Se3来替代ZnS。
当通过ALD方案形成第二缓冲层420时,交替地层叠包括Zn、S、Zn和O的原子层。下面参考图2和图3来详细描述用于形成第二缓冲层420的ALD方案。
在缓冲层400上布置窗口层500。窗口层500是透明导电层。另外,窗口层500具有比背电极层200的电阻高的电阻。
窗口层500包括氧化物。例如,窗口层500可以包括氧化锌、铟锡氧化物(ITO)或铟锌氧化物(IZO)。
另外,窗口层500可以包括掺杂Al的氧化锌(AZO)或掺杂Ga的氧化锌(GZO)。
根据实施例的太阳能电池设备,在缓冲层400中包括的CdS具有薄的厚度,因此,可以防止由作为有毒重金属的CdS引起的环境污染,并且太阳能电池设备可以具有热稳定性和优越的电特性。
图2是示出根据实施例的为形成第二缓冲层420而注入的材料的曲线图,并且图3是示出根据实施例的第二缓冲层420的结构的视图。
根据实施例,通过ALD方案来形成第二缓冲层420,但是实施例不限于此。如果通过ALD方案来形成第二缓冲层420,则将T-BuSH作为S的来源注入四秒,然后吹扫6秒。其后,将DMZn作为Zn的来源注入4秒,然后吹扫6秒。其后,将T-BuSH作为S的来源再一次注入4秒,然后吹扫6秒。其后,将DMZn作为Zn的来源再一次注入4秒,并且然后吹扫6秒。因此,如图3中所示,通过上面的工艺来沉积Zn和S原子层。
其后,将DMZn作为Zn的来源注入4秒,然后吹扫6秒。并且将H2O作为O的来源注入4秒,然后吹扫6秒。通过反复上面的工艺来沉积Zn和S原子层。
因此,依序层叠Zn、S、Zn和O元素,使得形成第二缓冲层420。此时,第二缓冲层420可以具有在60nm至70nm的范围中的厚度。
图4是示出根据实施例的随太阳能电池设备的波长变化的量子效率的视图。如图4中所示,在与仅通过使用CdS来在光吸收层300上形成缓冲层的情况作比较时,如果包括CdS的第一缓冲层410被形成为20nm或20nm以下的厚度并且在第一缓冲层410上形成具有依序形成的ZnS和ZnO的第二缓冲层420,则量子转换效率增大。
图5至图8是示出根据实施例的制造太阳能电池设备的方法的截面图。上面的关于太阳能电池设备的说明通过引用将基本上被包含在关于制造太阳能电池的方法的说明中。
参见图5和图6,在支撑衬底100上形成背电极层200。可以通过使用Mo来沉积背电极层200。可以通过PVD(物理气相沉积)工艺或电镀工艺来形成第一电极层210。
另外,可以在支撑衬底100和背电极层200之间形成诸如扩散阻挡层的额外层。
然后,在背电极层200上形成光吸收层300。例如,同时或独立地蒸发Cu、In、Ga和Se以形成CIGS基光吸收层300,或者可以在形成金属前体层之后通过硒化工艺来形成光吸收层300。
详细而言,通过使用Cu靶、In靶和Ga靶执行溅射工艺来在背电极层200上形成金属前体层。
然后,执行硒化工艺以形成CIGS基光吸收层300。
另外,可以同时执行使用Cu靶、In靶和Ga靶的溅射工艺和硒化工艺。
而且,可以通过硒化工艺和仅使用Cu和In靶或Cu和Ga靶的溅射工艺来形成CIS基或CIG基光吸收层300。
在形成光吸收层300的工艺期间,在阻挡层中包括的钠可以与阻挡层分离,并且可以扩散到光吸收层300内。因此,可以增大光吸收层300的电荷浓度,使得可以改善太阳能电池设备的光电转换效率。
参见图7,通过溅射工艺或CBD工艺在光吸收层上沉积CdS,以形成第一缓冲层410。此时,第一缓冲层410具有20nm或20nm以下、优选地10nm或10nm以下的厚度。
然后,在第一缓冲层410上形成第二缓冲层420。可以通过下述方式来形成第二缓冲层420:通过MOCVD方案来依序和反复地层叠Zn(S和O)层,或者通过ALD方案来交替地层叠Zn、S、Zn和O原子层。
另外,可以在第二缓冲层420上形成铟锌氧化物(IZO)。
参见图8,在缓冲层400上形成窗口层500。可以通过在缓冲层400上沉积透明材料来形成窗口层500。窗口层500可以包括ZnO,但是实施例不限于此。另外,窗口层500可以包括硼。
在本说明书中对于“一个实施例”、“实施例”、“示例实施例”等的任何引用表示结合所述实施例描述的特定特征、结构或特性被包括在本发明的至少一个实施例中。在本说明书中的各个位置中的这样的短语的出现不必然全部指的是同一实施例。而且,当结合任何实施例描述特定特征、结构或特性时,认为它在本领域内的技术人员的技术范围内来结合其他实施例实施这样的特征、结构或特性。
虽然已经参考其多个说明性实施例而描述了本发明,但是应当明白,本领域内的技术人员可以设计落在本公开的精神和原理范围内的多种其他修改和实施例。更具体地,在本公开、附图和所附的权利要求的范围内的主组合布置的部件部分和/或布置中,各种改变和修改是可能的。除了在部件部分和/或布置中的改变和修改之外,替代使用对于本领域内的技术人员也是显然的。
Claims (14)
1.一种太阳能电池设备,包括:
衬底;
在所述衬底上的背电极层;
在所述背电极层上的光吸收层;
在所述光吸收层上的包括CdS的第一缓冲层;
在所述第一缓冲层上的包括Zn的第二缓冲层;以及
在所述第二缓冲层上的窗口层。
2.根据权利要求1所述的太阳能电池设备,其中,所述第一缓冲层具有20nm或20nm以下的厚度。
3.根据权利要求1所述的太阳能电池设备,其中,所述第二缓冲层包括硫(S)和氧(O)。
4.根据权利要求3所述的太阳能电池设备,其中,所述第二缓冲层是通过反复地层叠ZnS和ZnO来形成的。
5.根据权利要求4所述的太阳能电池设备,其中,所述ZnS具有在0.3nm至0.7nm的范围中的厚度,并且所述ZnO具有在3nm至7nm的范围中的厚度。
6.根据权利要求3所述的太阳能电池设备,其中,所述第二缓冲层是通过反复地层叠Zn、S和O原子层来形成的。
7.根据权利要求1所述的太阳能电池设备,其中,所述第二缓冲层具有在60nm至70nm的范围中的厚度。
8.根据权利要求1所述的太阳能电池设备,其中,所述第二缓冲层包括In2Se3。
9.根据权利要求1所述的太阳能电池设备,其中,在所述第二缓冲层和所述窗口层之间形成铟锌氧化物。
10.根据权利要求1所述的太阳能电池设备,其中,所述窗口层包括ZnO。
11.根据权利要求10所述的太阳能电池设备,其中,所述窗口层包括硼。
12.一种制造太阳能电池设备的方法,所述方法包括:
在衬底上形成背电极层;
在所述背电极层上形成光吸收层;
在所述光吸收层上形成包括CdS的第一缓冲层;
在所述第一缓冲层上形成包括Zn的第二缓冲层;以及
在所述第二缓冲层上形成窗口层。
13.根据权利要求12所述的方法,其中,所述第一缓冲层具有10nm或10nm以下的厚度。
14.根据权利要求12所述的方法,其中,所述第二缓冲层是通过使用Zn、O和S经由ALD(原子层沉积)方案来形成的。
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CN110459630A (zh) * | 2019-06-18 | 2019-11-15 | 北京铂阳顶荣光伏科技有限公司 | 薄膜太阳能电池及其制备方法 |
CN115584483A (zh) * | 2022-09-23 | 2023-01-10 | 隆基绿能科技股份有限公司 | 二氧化锡薄膜及其制备方法和应用 |
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