CN103589996A - Mask plate - Google Patents
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- CN103589996A CN103589996A CN201310464805.7A CN201310464805A CN103589996A CN 103589996 A CN103589996 A CN 103589996A CN 201310464805 A CN201310464805 A CN 201310464805A CN 103589996 A CN103589996 A CN 103589996A
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- mask plate
- evaporation
- mask
- evaporation hole
- hole
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Abstract
The invention discloses a mask plate. The mask plate comprises a mask plate body and evaporation holes formed in the mask plate body, wherein the evaporation holes penetrate through the mask plate body; the mask plate comprises an evaporation surface and an ITO (Indium Tin Oxide) surface. The mask plate is characterized in that the evaporation holes are provided with a groove region on the ITO surface; the edge line of the evaporation holes in the evaporation surface is in an outwards-extending type trumpet shape on the section on which the central axis of each evaporation hole is positioned. With the adoption of the mask plate provided by the invention, the area of shielding on an evaporation material caused by the walls of the evaporation holes in the evaporation process can be reduced; the evaporation holes are provided with the groove region on the ITO surface so as to prevent the edge of the evaporation holes of the mask plate from being deformed to avoid scratching a deposited base plate.
Description
Technical field
The present invention relates to a kind of mask plate, be specifically related to the mask plate that a kind of OLED evaporation is used.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode; OLED) indicating meter has a series of advantages such as independently luminous, low-voltage direct-current drives, entirely solidifies, visual angle is wide, color is abundant, compare with liquid-crystal display, OLED indicating meter does not need backlight, visual angle is large, power is low, its response speed can reach 1000 times of liquid-crystal display, and its manufacturing cost is but lower than the liquid-crystal display of equal resolving power.Therefore, OLED displaying appliance has broad application prospects, and becomes gradually the following 20 years the fastest novel technique of display of growth.
The making of the organic layer material in OLED structure need to be used the mask plate that evaporation is used, and tradition is made mask plate by etch process, before evaporation, needs mask plate to draw in the net to be fixed on mask frame, and after drawing in the net to fix, mask plate has certain tension force.The schematic cross-section in mask plate evaporation hole as shown in Figure 1, 1 is the ito surface one side of substrate contacts (with) of mask plate, 2 is the evaporation face one side of vapor deposition source (towards) of mask plate, 11 is the evaporation hole of mask plate, the cross section in evaporation hole 11 is calabash shaped, because the edge in evaporation hole 11 is thinner, mask plate has the easy perk in edge in evaporation hole afterwards of certain tension force, as shown in the perk part 12 in Fig. 1, the part 12 of evaporation bore edges perk can scratch deposition substrate in evaporate process, thereby affect the quality of indicating meter, and the bad control of size in the mask plate evaporation hole making by etch process, especially when making undersized evaporation hole, be difficult to the size in evaporation hole to accomplish less.
The present invention proposes a kind of mask plate for above problem, solves preferably the above problem.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of mask plate, makes to reduce evaporation hole wall to the blocking of deposition material in evaporate process as far as possible, and can prevent that the perk of mask plate evaporation bore edges from scratching deposition substrate.
The invention provides a kind of mask plate, comprise mask plate body and be formed on the evaporation hole on described mask plate body, described mask plate body is run through in described evaporation hole, described mask plate comprises evaporation face and ito surface, it is characterized in that: described evaporation hole is provided with grooved area at described ito surface, on the cross section at the central axis place in described evaporation hole, it is horn-like that the edge line in the evaporation hole of described evaporation face is the formula of extending out.
Further, the hole wall in the evaporation hole of evaporation face and the plate face of mask plate body are 30～60 ° of angles.
Further, evaporation hole is arranged on mask plate in the mode of array, and the organic membrane deposition region of evaporation hole and deposition substrate adapts.
Further, the thickness of mask plate is 8～80 μ m.
Preferably, the thickness of mask plate is 25～50 μ m.
Further preferably, the thickness of mask plate is 30 μ m.
Further, the degree of depth of grooved area is 3～30 μ m.
Preferably, the degree of depth of grooved area is 5～20 μ m.
Further, the material of mask plate is nickel-base alloy.
Further, mask plate is prepared by electroforming mode.
The present invention also provides a kind of mask assembly, comprises mask frame and mask plate described above, it is characterized in that, described mask plate is fixed on described mask frame.
Further, mask plate is fixed on mask frame by laser welding or bonding way.
Beneficial effect of the present invention is, on the cross section at the central axis place in evaporation hole, it is horn-like that the edge line in the evaporation hole of evaporation face is the formula of extending out, the hole wall in the evaporation hole of evaporation face and the plate face of mask plate body are 30～60 ° of angles, can reduce hole wall the blocking deposition material in evaporation hole, the grooved area of evaporation hole ito surface can play and prevent scratch deposition substrate simultaneously, thereby improves the quality of indicating meter.
The aspect that the present invention is additional and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become from the following description of the accompanying drawings of embodiments and obviously and easily understand, wherein:
Figure 1 shows that the schematic cross-section in traditional etching making mask plate evaporation hole;
Figure 2 shows that the two dimensional structure schematic diagram of mask plate ITOA face;
Figure 3 shows that in Fig. 2 the schematic cross-section along A-A direction;
Figure 4 shows that 30 part enlarged diagrams in Fig. 3;
Figure 5 shows that mask plate integral planar structural representation;
Fig. 6 and Figure 7 shows that 50 part enlarged diagrams in Fig. 5;
Figure 8 shows that mask assembly two dimensional structure schematic diagram;
Figure 9 shows that evaporation schematic cross-section;
Figure 10 shows that the schematic cross-section after core pad pasting;
Figure 11 shows that exposure schematic cross-section;
Figure 12 shows that the schematic cross-section after development;
Figure 13 shows that the schematic cross-section after electroforming;
Figure 14 shows that the schematic cross-section after the electroformed layer of electroforming is peeled off;
Figure 15 shows that the enlarged diagram of 140 parts in Figure 14.
In Fig. 1,1 is ito surface, and 2 is evaporation face, the 11 evaporation holes that are mask plate, and 12 is evaporation bore edges perk part;
In Fig. 2,20 is mask plate body, and 21 is evaporation hole, and 22 is mask plate, and A-A is for treating Anatomical observation direction;
In Fig. 3,3 is ito surface, and 4 is evaporation face, and 30 for waiting to amplify observation part;
In Fig. 4, θ is the hole wall in evaporation hole of evaporation face and the angle of the plate face of mask plate body, the thickness that t1 is mask plate, and t2 is the degree of depth of mask plate ito surface grooved area;
In Fig. 5,50 amplify observation part for waiting, 51 is mask pattern;
In Fig. 6, B-B is for treating Anatomical observation direction;
In Fig. 7, C-C is for treating Anatomical observation direction;
In Fig. 8,80 is mask frame;
In Fig. 9,91 is deposition substrate, and 92 is bracing frame, and 93 is vapor deposition source;
In Figure 10,100 is core, and 101 is film;
In Figure 11,110 is exposed film;
In Figure 12,120 is the core region of exposing;
In Figure 14,140 for waiting to amplify observation part;
Embodiment
Describe below with reference to accompanying drawings embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, only for explaining the present invention, and can not be interpreted as limitation of the present invention.
According to embodiments of the invention, shown in figure 2～Fig. 8, the invention provides a kind of mask plate, mask plate 22 comprises mask plate body 20 and is formed on the evaporation hole 21 on mask plate body, described mask plate body 20 is run through in described evaporation hole 21, described mask plate 22 comprises evaporation face and ito surface, it is characterized in that: described evaporation hole is provided with grooved area at described ito surface, on the cross section at 21 central axis places, described evaporation hole, it is horn-like that the edge line in the evaporation hole of described evaporation face is the formula of extending out.
As shown in Figure 4, on the cross section at 21 central axis places, evaporation hole, it is horn-like that the edge line in evaporation face evaporation hole is the formula of extending out, θ is the angle of the hole wall in evaporation hole 21 and the plate face of mask plate body 20, the scope at θ angle is 30 °～60 °, the thickness that t1 is mask plate, and t2 is the degree of depth of mask plate ito surface grooved area, evaporation hole 21 is arranged on mask plate body 20 in the mode of array, adapts with the organic membrane deposition region of deposition substrate.
According to one embodiment of present invention, with reference to figure 2～the Figure 4 shows that mask plate in large size evaporation hole, Figure 2 shows that the two dimensional structure schematic diagram of mask plate ito surface, 20 is mask plate body, and 21 is evaporation hole, and evaporation hole 21 is arranged on mask plate body 20 in the mode of array, Figure 3 shows that in Fig. 2 along A-A direction schematic cross-section, 3 is ito surface, and 4 is evaporation face, and 30 part enlarged diagrams as shown in Figure 4.
According to another embodiment of the invention, with reference to figure 5～the Figure 8 shows that mask plate in small size evaporation hole, Figure 5 shows that mask plate integral planar structural representation, mask pattern 51 is arranged on mask plate in the mode of array, evaporation hole 21 is arranged on the mask pattern 51 of mask plate 22 in the mode of array, and the evaporation region of evaporation hole and deposition substrate adapts.
Figure 6 shows that a kind of enlarged diagram of 50 part mask patterns in Fig. 5, in Fig. 6, evaporation hole 21 is arranged on mask plate for the mode of little opening with array, along the cross section enlarged diagram of B-B direction as shown in Figure 4.
Figure 7 shows that the enlarged diagram of the another kind of arrangement mode of mask pattern in Fig. 5, the opening that in Fig. 7, evaporation hole 21 is strip, along the cross section enlarged diagram of C-C direction as shown in Figure 4.
According to some embodiments of the present invention, the thickness of mask plate 22 is 8～80 μ m.
According to some embodiments of the present invention, the thickness of mask plate 22 is 25～50 μ m.
Preferably, the thickness of mask plate 22 is 30 μ m.
The thickness of mask plate 22 can also be set to 20 μ m or 25 μ m or 35 μ m or 40 μ m or 50 μ m or 65 μ m or 75 μ m.
According to some embodiments of the present invention, the degree of depth of mask plate ITO grooved area is 3～30 μ m.
Preferably, the degree of depth of mask plate ito surface grooved area is 5～20 μ m, and for example the degree of depth of mask plate ito surface grooved area is 5 μ m or 8 μ m or 10 μ m or 15 μ m or 20 μ m.
According to some embodiments of the present invention, mask plate is prepared by electroforming mode.
According to some embodiments of the present invention, the material of mask plate is nickel-base alloy.
According to some embodiments of the present invention, the material of mask plate is Rhometal, nickel cobalt (alloy), Perminvar.
The present invention also provides a kind of mask assembly, is illustrated in figure 8 the two dimensional structure schematic diagram of mask plate ito surface, and mask assembly comprises mask frame 80 and above-mentioned mask plate 22, and mask plate 22 is fixed on mask frame 80.
According to embodiments of the invention, mask plate is fixed on mask frame 80 by laser welding or bonding way.
With reference to figure 9, for evaporation schematic diagram, mask assembly is fixed on bracing frame 92, and the ito surface of mask plate is adjacent to deposition substrate 91, and the evaporation hole of the organic materials of vapor deposition source 93 transmitting by mask plate is deposited on the evaporation region of deposition substrate 91 and forms organic material layer.
The invention also discloses a kind of preparation method of mask plate, preparation process is:
S1, core step of membrane sticking: as shown in figure 10, film 101 is overlayed or is coated to the one side of core 100, before step of membrane sticking, core 100 also needs to carry out oil removing, pickling, sandblast step in the one side of pad pasting, to remove the oil stain impurity of mandrel surface, and surface finish is smooth;
S2, step of exposure: as shown in figure 11, the one side of core pad pasting is exposed by default exposing patterns, form exposed film region 110 and unexposed diaphragm area;
S3, development step: as shown in figure 12, remove the film of unexposed diaphragm area through development step, the core region 120 of corresponding unexposed diaphragm area is exposed, the film in exposed film region 110 continues to retain;
S4, electroforming step: as shown in figure 13, through electroforming step, in the described core region of exposing 120, form electroformed layer 20, in described exposed film region, 110 form through hole, and through hole comprises the evaporation hole 21 of mask plate;
S5, post-processing step: post-processing step comprises strip step, through described stripping process, electroformed layer 20 is stripped down from core 100, Figure 14 shows that the schematic cross-section (be the schematic cross-section of mask plate 22, its two dimensional structure schematic diagram is as shown in Fig. 2, Fig. 5～Fig. 7) of mask plate.Post-processing step also comprises cleaning step, and electroformed layer 20 is cleaned up.
According to embodiments of the invention, the thickness of the electroformed layer 20 that electroforming step forms is greater than the thickness of film 101 in described step of membrane sticking, as shown in figure 13.
In electroforming step (S4), the concentration parameter of electroforming solution is as follows:
Single nickel salt 220～260g/L
Boric acid 40～50 g/L
Ferrous sulfate 35～45g/L
Electroforming material is magnetic nickel or nickel-bass alloy material.Nickel-bass alloy material is a kind of in Rhometal, nickel cobalt (alloy), Perminvar.
The additive of electroforming solution comprises:
Stablizer 0.5～5ml/L
Wetting agent 0.5～5ml/L
Agent 0.5～5ml/L walks
By mask plate provided by the present invention, evaporation hole 21 is provided with grooved area at ito surface, on the cross section at the central axis place in evaporation hole, it is horn-like that the edge line in evaporation hole 21 is the formula of extending out, the hole wall in the evaporation hole of evaporation face and the plate face of mask plate body are 30～60 ° of angles, the hole wall that can reduce evaporation hole 21 blocks deposition material, and the grooved area of evaporation hole ito surface can play and prevent scratch substrate simultaneously, thereby improves the quality of indicating meter.
Although the specific embodiment of the present invention is described in detail with reference to a plurality of illustrative examples of the present invention, but it must be understood that, those skilled in the art can design multiple other improvement and embodiment, and these improve and within embodiment will drop on spirit and scope.Particularly, within the scope of aforementioned open, accompanying drawing and claim, can aspect the layout of component and/or subordinate composite configuration, make rational modification and improvement, and can not depart from spirit of the present invention.Except modification and the improvement of component and/or layout aspect, its scope is limited by claims and equivalent thereof.
Claims (10)
1. a mask plate, comprise mask plate body and be formed on the evaporation hole on described mask plate body, described mask plate body is run through in described evaporation hole, described mask plate comprises evaporation face and ito surface, it is characterized in that: described evaporation hole is provided with grooved area at described ito surface, on the cross section at the central axis place in described evaporation hole, it is horn-like that the edge line in the evaporation hole of described evaporation face is the formula of extending out.
2. mask plate according to claim 1, is characterized in that, the hole wall in the evaporation hole of described evaporation face and the plate face of described mask plate body are 30～60 ° of angles.
3. mask plate according to claim 1 and 2, is characterized in that, described evaporation hole is arranged on described mask plate in the mode of array, adapts with the organic membrane deposition region of deposition substrate.
4. mask plate according to claim 1, is characterized in that, the thickness of described mask plate is 8～80 μ m.
5. mask plate according to claim 1, is characterized in that, the thickness of described mask plate is 25～50 μ m.
6. mask plate according to claim 1, is characterized in that, the degree of depth of described grooved area is 3～30 μ m.
7. mask plate according to claim 1, is characterized in that, the material of described mask plate is nickel-base alloy.
8. mask plate according to claim 1, is characterized in that, described mask plate is prepared by electroforming mode.
9. a mask assembly, comprises the mask plate described in mask frame and claim 1～8 any one claim, it is characterized in that, described mask plate is fixed on described mask frame.
10. mask assembly according to claim 9, is characterized in that, described mask plate is fixed on described mask frame by laser welding or bonding way.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310464805.7A CN103589996A (en) | 2013-10-09 | 2013-10-09 | Mask plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310464805.7A CN103589996A (en) | 2013-10-09 | 2013-10-09 | Mask plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103589996A true CN103589996A (en) | 2014-02-19 |
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ID=50080305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310464805.7A Pending CN103589996A (en) | 2013-10-09 | 2013-10-09 | Mask plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN103589996A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104062842A (en) * | 2014-06-30 | 2014-09-24 | 上海天马有机发光显示技术有限公司 | Mask plate, manufacturing method thereof and process device |
| CN107250033A (en) * | 2015-02-20 | 2017-10-13 | 斯维尔系统 | The selective stepcoverage of micro Process structure |
| TWI690107B (en) * | 2018-05-14 | 2020-04-01 | 大陸商昆山國顯光電有限公司 | Mask plate and mask element |
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| JP2003045657A (en) * | 2001-05-24 | 2003-02-14 | Kyushu Hitachi Maxell Ltd | Deposition mask for organic el element and its manufacturing method |
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| JP2009041054A (en) * | 2007-08-07 | 2009-02-26 | Sony Corp | Mask for vapor deposition, its manufacturing method, and manufacturing method of display device |
| CN202585543U (en) * | 2012-01-16 | 2012-12-05 | 昆山允升吉光电科技有限公司 | An electroforming mask plate |
| CN202576545U (en) * | 2012-01-16 | 2012-12-05 | 昆山允升吉光电科技有限公司 | Grooved mask plate for evaporation |
| CN103205704A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Vapor deposition mask |
| CN103205686A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Long-narrow trench mask plate for vapor plating |
| CN103205712A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Trench mask plate for vapor plating |
| CN203159698U (en) * | 2013-03-19 | 2013-08-28 | 昆山允升吉光电科技有限公司 | Mask plate for manufacturing organic light-emitting display |
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2013
- 2013-10-09 CN CN201310464805.7A patent/CN103589996A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003045657A (en) * | 2001-05-24 | 2003-02-14 | Kyushu Hitachi Maxell Ltd | Deposition mask for organic el element and its manufacturing method |
| CN1551687A (en) * | 2003-05-06 | 2004-12-01 | Lg | Shadow mask for fabricating organic electroluminescent device |
| JP2009041054A (en) * | 2007-08-07 | 2009-02-26 | Sony Corp | Mask for vapor deposition, its manufacturing method, and manufacturing method of display device |
| CN202585543U (en) * | 2012-01-16 | 2012-12-05 | 昆山允升吉光电科技有限公司 | An electroforming mask plate |
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| CN103205704A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Vapor deposition mask |
| CN103205686A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Long-narrow trench mask plate for vapor plating |
| CN103205712A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Trench mask plate for vapor plating |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104062842A (en) * | 2014-06-30 | 2014-09-24 | 上海天马有机发光显示技术有限公司 | Mask plate, manufacturing method thereof and process device |
| CN107250033A (en) * | 2015-02-20 | 2017-10-13 | 斯维尔系统 | The selective stepcoverage of micro Process structure |
| CN107250033B (en) * | 2015-02-20 | 2020-10-09 | 斯维尔系统 | Selective step coverage of micromachined structures |
| TWI690107B (en) * | 2018-05-14 | 2020-04-01 | 大陸商昆山國顯光電有限公司 | Mask plate and mask element |
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Application publication date: 20140219 |
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