CN102222538B - 图形化的柔性透明导电薄膜及其制法 - Google Patents
图形化的柔性透明导电薄膜及其制法 Download PDFInfo
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- CN102222538B CN102222538B CN201110058431XA CN201110058431A CN102222538B CN 102222538 B CN102222538 B CN 102222538B CN 201110058431X A CN201110058431X A CN 201110058431XA CN 201110058431 A CN201110058431 A CN 201110058431A CN 102222538 B CN102222538 B CN 102222538B
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- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
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- G—PHYSICS
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- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
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- H05K2203/1344—Spraying small metal particles or droplets of molten metal
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- Engineering & Computer Science (AREA)
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Abstract
Description
Claims (6)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110058431XA CN102222538B (zh) | 2011-03-11 | 2011-03-11 | 图形化的柔性透明导电薄膜及其制法 |
JP2013555722A JP5714731B2 (ja) | 2011-03-11 | 2011-11-15 | パターン付けされた柔軟性の透明な導電性シート及びその製造方法 |
BR112013020827-9A BR112013020827A2 (pt) | 2011-03-11 | 2011-11-15 | chapa condutora transparente flexível estampada e método de fabricação da mesma |
KR1020137020424A KR20130122776A (ko) | 2011-03-11 | 2011-11-15 | 패턴화된 연성의 투명 전도성 시트 및 이의 제조 방법 |
EP11860782.9A EP2685463A4 (en) | 2011-03-11 | 2011-11-15 | FLEXIBLE, PATTERNED, TRANSPARENT, CONDUCTIVE FILM AND MANUFACTURING METHOD THEREFOR |
CA2826027A CA2826027C (en) | 2011-03-11 | 2011-11-15 | Patterned flexible transparent conductive sheet and manufacturing method thereof |
PCT/CN2011/001910 WO2012122690A1 (zh) | 2011-03-11 | 2011-11-15 | 图形化的柔性透明导电薄膜及其制法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110058431XA CN102222538B (zh) | 2011-03-11 | 2011-03-11 | 图形化的柔性透明导电薄膜及其制法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102222538A CN102222538A (zh) | 2011-10-19 |
CN102222538B true CN102222538B (zh) | 2012-12-05 |
Family
ID=44779067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110058431XA Active CN102222538B (zh) | 2011-03-11 | 2011-03-11 | 图形化的柔性透明导电薄膜及其制法 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2685463A4 (zh) |
JP (1) | JP5714731B2 (zh) |
KR (1) | KR20130122776A (zh) |
CN (1) | CN102222538B (zh) |
BR (1) | BR112013020827A2 (zh) |
CA (1) | CA2826027C (zh) |
WO (1) | WO2012122690A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103176650A (zh) * | 2013-03-01 | 2013-06-26 | 南昌欧菲光科技有限公司 | 导电玻璃基板及其制作方法 |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102222538B (zh) * | 2011-03-11 | 2012-12-05 | 苏州纳格光电科技有限公司 | 图形化的柔性透明导电薄膜及其制法 |
CN102722279A (zh) * | 2012-05-09 | 2012-10-10 | 崔铮 | 金属网格导电层及其具备该导电层的触摸面板 |
CN102708946B (zh) | 2012-05-09 | 2015-01-07 | 南昌欧菲光科技有限公司 | 双面图形化透明导电膜及其制备方法 |
KR20140001504A (ko) * | 2012-06-27 | 2014-01-07 | 엘지이노텍 주식회사 | 터치 패널의 전극 기판 및 그 제조 방법 |
CN102903423B (zh) * | 2012-10-25 | 2015-05-13 | 南昌欧菲光科技有限公司 | 透明导电膜中的导电结构、透明导电膜及制作方法 |
CN103972397B (zh) * | 2013-02-01 | 2017-03-15 | 中国科学院苏州纳米技术与纳米仿生研究所 | 复合电极及其制作方法、太阳能电池及其制作方法 |
CN103426500B (zh) * | 2013-02-04 | 2016-03-09 | 南昌欧菲光科技有限公司 | 双层透明导电膜及其制备方法 |
CN103456390B (zh) | 2013-02-05 | 2016-04-27 | 南昌欧菲光科技有限公司 | 导电膜及其制造方法 |
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US9392700B2 (en) | 2013-03-28 | 2016-07-12 | Nanchang O-Film Tech. Co., Ltd. | Transparent conductive film and preparation method thereof |
CN103164100B (zh) * | 2013-03-28 | 2014-08-06 | 南昌欧菲光科技有限公司 | 电容式触摸屏 |
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US9439302B2 (en) | 2013-05-30 | 2016-09-06 | Nanchang O-Film Tech Co., Ltd. | Transparent conductive film |
CN103294272B (zh) * | 2013-05-30 | 2016-04-13 | 南昌欧菲光科技有限公司 | 透明导电膜 |
CN103295671B (zh) * | 2013-05-30 | 2016-08-10 | 南昌欧菲光科技有限公司 | 透明导电膜 |
RU2540174C1 (ru) * | 2013-08-23 | 2015-02-10 | Общество С Ограниченной Ответственностью "Ласком" | Стеклоизделие с электрообогреваемой поверхностью и способ его изготовления |
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JP2015195004A (ja) * | 2014-03-28 | 2015-11-05 | 富士フイルム株式会社 | 導電性フィルム及びタッチパネルモジュール |
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CN106956530B (zh) * | 2015-01-18 | 2019-06-21 | 昇印光电(昆山)股份有限公司 | 一种印刷薄膜 |
JP2016164694A (ja) * | 2015-03-06 | 2016-09-08 | パナソニックIpマネジメント株式会社 | タッチセンサおよびタッチセンサの製造方法 |
CN104835555B (zh) * | 2015-05-13 | 2017-09-15 | 南京邮电大学 | 一种图案化金属透明导电薄膜的制备方法 |
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US10550490B2 (en) * | 2015-05-22 | 2020-02-04 | Versitech Limited | Transparent conductive films with embedded metal grids |
CN108012586A (zh) * | 2015-06-10 | 2018-05-08 | 吴铉锡 | 利用纳米结构物的电磁波屏蔽材料 |
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JP7172211B2 (ja) * | 2017-07-28 | 2022-11-16 | Tdk株式会社 | 導電性基板、電子装置及び表示装置 |
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CN114295255B (zh) * | 2021-12-29 | 2023-09-29 | 金陵科技学院 | 一种基于3d打印的柔性压力传感器 |
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JPH11266095A (ja) * | 1998-03-17 | 1999-09-28 | Dainippon Printing Co Ltd | 電磁波遮蔽板 |
JP2000277977A (ja) * | 1999-03-26 | 2000-10-06 | Dainippon Printing Co Ltd | 電磁波シールド部材とその製造方法、及び表示装置 |
JP2001284879A (ja) * | 2000-03-28 | 2001-10-12 | Hitachi Chem Co Ltd | 電磁波シールド材料、その製法およびその利用 |
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JP4156254B2 (ja) * | 2002-03-13 | 2008-09-24 | 大日本印刷株式会社 | 導電性シートの製造方法 |
EP1924416A2 (en) * | 2005-07-28 | 2008-05-28 | Velcro Industries B.V. (NL) | Forming conductive strips with loop-engageable touch fasteners |
CN101512682B (zh) * | 2006-09-28 | 2012-11-28 | 富士胶片株式会社 | 自发光显示装置、透明导电性薄膜及其制造方法、电致发光元件、透明电极 |
US20090218651A1 (en) * | 2008-02-28 | 2009-09-03 | Sunlight Photonics Inc. | Composite substrates for thin film electro-optical devices |
JP2012160291A (ja) * | 2011-01-31 | 2012-08-23 | Toray Ind Inc | 透明導電性基板 |
CN102222538B (zh) * | 2011-03-11 | 2012-12-05 | 苏州纳格光电科技有限公司 | 图形化的柔性透明导电薄膜及其制法 |
-
2011
- 2011-03-11 CN CN201110058431XA patent/CN102222538B/zh active Active
- 2011-11-15 CA CA2826027A patent/CA2826027C/en not_active Expired - Fee Related
- 2011-11-15 JP JP2013555722A patent/JP5714731B2/ja active Active
- 2011-11-15 EP EP11860782.9A patent/EP2685463A4/en not_active Withdrawn
- 2011-11-15 BR BR112013020827-9A patent/BR112013020827A2/pt not_active Application Discontinuation
- 2011-11-15 WO PCT/CN2011/001910 patent/WO2012122690A1/zh active Application Filing
- 2011-11-15 KR KR1020137020424A patent/KR20130122776A/ko not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103176650A (zh) * | 2013-03-01 | 2013-06-26 | 南昌欧菲光科技有限公司 | 导电玻璃基板及其制作方法 |
CN103176650B (zh) * | 2013-03-01 | 2016-09-28 | 南昌欧菲光科技有限公司 | 导电玻璃基板及其制作方法 |
Also Published As
Publication number | Publication date |
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EP2685463A1 (en) | 2014-01-15 |
CA2826027A1 (en) | 2012-09-20 |
JP2014511549A (ja) | 2014-05-15 |
CA2826027C (en) | 2016-03-29 |
CN102222538A (zh) | 2011-10-19 |
WO2012122690A1 (zh) | 2012-09-20 |
EP2685463A4 (en) | 2015-03-18 |
KR20130122776A (ko) | 2013-11-08 |
BR112013020827A2 (pt) | 2020-09-01 |
JP5714731B2 (ja) | 2015-05-07 |
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