CN101420835B - Low melting point alloy thermal interface material and radiating module applying same - Google Patents
Low melting point alloy thermal interface material and radiating module applying same Download PDFInfo
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Abstract
The invention relates to a low-melting-point indium alloy heat interface material having low-heat impedance characteristic, which is formed by indium element and one or several of bismuth, tin and zinc, and the melting temperature is between 55 and 85 DEG C, and the thickness of the material is not more than 0.04mm.
Description
Technical field
The invention relates to a kind of alloy foil sheet with low-melting point, and a kind of radiating module that utilizes this alloy foil sheet with low-melting point as thermal interfacial material.
Background technology
Structure dress microelectronic element, for example high brightness LED and central processing unit etc., because development is towards trend such as high power, high speed and/or miniaturizations, the high flux of heat that microelectronic element produces must remove, and makes it connect surface temperature and keeps and be lower than its safety operation temperature.Microelectronic element connect surface temperature in case when surpassing the safety operation temperature,, perhaps damage microelectronic element with the performance of deterioration microelectronic element, seriously influence the useful life and the reliability of electronic component.
Be accompanied by the radiating requirements of microelectronics and electronic component, stimulated the variation and the technological innovation of electronic radiation products such as heat dissipation element, material.The electronic radiation product mainly contains heat abstractor, for example cold drawing, radiator and fan etc., and thermal interfacial material (Thermal Interface Materials, TIM) two kinds.
The radiating module schematic diagram that is combined by aforementioned heat abstractor and thermal interfacial material is shown in Figure 1A, and this radiating module 10 comprises a radiator 11 and a thermal interfacial material 14.More shown a cooling system among Figure 1A, this cooling system comprises above-mentioned radiating module 10, structure dress microelectronic element 12 and a circuit board 13.Wherein, structure dress microelectronic element 12 is arranged on the circuit board 13, and radiator 11 is arranged at structure dress microelectronic element 12 tops, and thermal interfacial material 14 is arranged between structure dress microelectronic element 12 and the radiator 11.In detail, the two sides of thermal interfacial material 14 are contacted with the lower surface of radiator 11 and the upper surface of structure dress microelectronic element 12 respectively.
Thermal interfacial material 14 is to use interface, second rank outside in structure dress microelectronic structure and radiator, it utilizes and self can flow or the characteristic of pre-heat fusing is filled up the micropore at interface between aforementioned components, reduce the microelectronics heat transferred whereby to heat dissipation element or to the thermal resistance of radiator, to improve the microelectronics heat dispersion.
The performance index of thermal interfacial material mainly contain pyroconductivity and thermal impedance, and pyroconductivity refers to heat in the heat conducting ability of material internal, and thermal impedance refers to cross over the heat conducting benefit at different materials interface.In general, the pyroconductivity of thermal interfacial material is higher, (bond line thickness) is more little for interface thickness, and then the thermal impedance of thermal interfacial material is lower.
The second rank thermal interfacial material of structure dress microelectronics and radiator comprises thermal grease (thermal grease) and phase-transition material macromolecular compounds such as (phase change material), and low-melting alloy (lowmelting alloy).Wherein on room temperature is solid-state, interface, be heated can fusion low-melting alloy, by latent heat of fusion to absorb the characteristic of a large amount of heat energy, be proved and had the better heat dispersion of higher molecular compound, and can more effectively structure have been adorned microelectronic heat conduction to the microelectronics external environment condition.
Utilize low-melting alloy to see United States Patent (USP) the 4th as the idea head of thermal interfacial material, 384,610, " Simple Thermal Joint ", 1983, follow-up low-melting alloy is applied to the relevant patent of thermal interfacial material, as United States Patent (USP) the 6th, 281,573B1 number and the 6th, 343,647B2 number disclose.Yet overflow at the liquid phase such as the self-heating interface of the low-melting alloy thermal interfacial material of fusion, may make structure adorn microelectronic element and circuit board short circuit thereof, so general not as the macromolecule thermal interfacial material in the practical application.
Present corresponding fusion liquid phase is mainly installed an annular gasket in the periphery of low-melting alloy boundary material from the method for interface spill and leakage, also or the mode of so-called pre-burning.Wherein, annular solid is subjected to many factors and causes the resistance leakage effect of annular solid to be lost efficacy, and for example the liquid phase of fusion is overflowed after filling with the interior confined space of annular solid, or the pincers amount of pressure inequality of annular solid, makes annular solid not be close to joint interface, overflows and cause.
At foregoing problems, when the metal thermal interface material that is applied to structure dress microelectronics second rank fuses under the pressure of fastener of heat sink, the extrusion effect makes the fusion liquid phase flow toward free space, the periphery of metal thermal interface material normally, and make the interface reduced thickness of described low-melting-point metal; Fused solution is except filling up the hole between the interface, and other unnecessary liquid phase flows toward the lower metal thermal interface material outer peripheral areas of flow resistance naturally.The original thickness of low-melting alloy thermal interfacial material is thick more, and then the unnecessary liquid phase that flows toward outer peripheral areas is many more, and the pearl drop of formation is big more, and gravity impels the pearl drop high more from the possibility of interface spill and leakage.
In addition, the surface adsorption power of hot melt drop and periphery material also can influence flowing of liquid phase, and for example the low-melting alloy liquid phase is reacted with the different interfaces of copper and aluminium, makes liquid phase not allow to be easy to spill and leakage on the copper interface.Different again environments for use, may make that the influence of gravity is more remarkable, for example shown in Figure 1B, some radiating module the position is set for standing up, just turn 90 degrees the back and put (as: the CPU radiating module of main frame), this moment is as the gravity of hot melt drop during greater than the absorption affinity of molten drop and periphery material, just the hot melt drop can leak downwards.
In order to adapt to the harsh day by day radiating requirements of microelectronic element, and the liquid phase spill and leakage problem that effectively solves the low-melting alloy thermal interfacial material, a kind of have concurrently high heat radiation and high resistant leak characteristic alloy foil sheet with low-melting point thermal interfacial material and use the radiating module of described alloy foil sheet with low-melting point to be developed.
Summary of the invention
A purpose of the present invention is to prevent that the drop that the low-melting alloy thermal interfacial material is heated after liquefying from leaking.
Another object of the present invention is to utilize thickness to be not more than the thermal interfacial material of the alloy foil sheet with low-melting point of 0.04mm as radiating module, make radiating module have splendid radiating effect, and prevent that the liquid phase spill and leakage of fusion low-melting alloy thermal interfacial material from going out hot interface.
The invention provides a kind of with low thermal impedance characteristic and the low-melting alloy thermal interfacial material that suppresses fuse metal liquid phase spill and leakage, by the part of the indium (In) of necessity and bismuth (Bi), tin (Sn) and zinc elements such as (Zn) or all combine.This low-melting alloy thermal interfacial material melting temperature is between 55 ℃ to 85 ℃, and its thickness is not more than 0.04mm.Wherein, the preferred thickness range of described low-melting alloy thermal interfacial material is between between the 0.015mm to 0.03mm.
The invention provides a kind of radiating module of electronic component, comprise a radiator, an alloy foil sheet with low-melting point and an annular solid.Wherein, electronic component is arranged on the circuit board, and circuit is connected each other, and radiator is arranged at the electronic component top.Alloy foil sheet with low-melting point is arranged between electronic component and the radiator, and as the thermal interfacial material between electronic component and radiator.Annular solid is arranged between electronic component and the radiator, and is surrounded on the periphery of alloy foil sheet with low-melting point.
The function of annular solid mainly contains and keeps interface thickness, delays the oxidation rate after the alloy foil sheet with low-melting point fusion, but and the resistance leakage of reinforcing low melting temperature alloy hot melt drop between electronic component and radiator.
The present invention provides a kind of radiating module of electronic component in addition, comprises a radiator and an alloy foil sheet with low-melting point.Thickness by alloy foil sheet with low-melting point is not more than 0.04mm, liquid phase after the alloy foil sheet with low-melting point fusion is changed in right amount, and aforesaid liquid phase is except that filling up the micropore, interface, and remaining liquid phase quality is seldom changed, to suppress its flowability, to make to be not easy to produce the leakage situation.About the advantages and spirit of the present invention, and more detailed execution mode can be further understood by following execution mode and accompanying drawing.
Description of drawings
Figure 1A is the schematic diagram of existing radiating module;
Figure 1B is provided with the schematic diagram of kenel for existing radiating module;
Fig. 2 A is the schematic diagram of an embodiment of radiating module of the present invention;
Fig. 2 B is the alloy foil sheet with low-melting point schematic diagram of one embodiment of the invention;
Fig. 3 forms the thermal impedance of In-Bi32.5-Sn16.5 alloy foil sheet and the relation curve of its thickness for weight;
Fig. 4 A to Fig. 7 B be the paillon foil of different-thickness at the Al/Ni interface, 70 ℃ of overflow figure that hold temperature;
Fig. 8 for thickness 0.03mm paillon foil at the Cu/Ni interface, 70 ℃ hold 100 hours outside drawings of temperature;
Fig. 9 is the generalized section of another embodiment of radiating module of the present invention;
Figure 10 A is the schematic diagram of the embodiment that kenel is set of alloy foil sheet with low-melting point of the present invention and annular solid; And
Figure 10 B is the schematic diagram of another embodiment that kenel is set of alloy foil sheet with low-melting point of the present invention and annular solid.
Drawing reference numeral
10,20,30: radiating module 11,21,31: radiator
12: structure dress microelectronic element 22,32: electronic component
13,23,33: circuit board 14: thermal interfacial material
24,34: alloy foil sheet with low-melting point 35: annular solid
36: escape hole
Embodiment
About the advantages and spirit of the present invention, and more detailed execution mode can be further understood by following execution mode and accompanying drawing.
Please refer to Fig. 2 A, this figure is the schematic diagram of an embodiment of radiating module of the present invention.Radiating module 20 of the present invention, the heat energy that is produced in the time of can making an electronic component 22 runnings conducts to external environment fast, and radiating module 20 comprises a radiator 21 and an alloy foil sheet with low-melting point 24.As shown in the figure, radiator 21 is arranged at electronic component 22 tops, and alloy foil sheet with low-melting point 24 is arranged between electronic component 22 and the radiator 21, and as the thermal interfacial material of 21 in electronic component 22 and radiator.In addition, electronic component 22 is arranged on the circuit board 23, and circuit is connected each other.In detail, the two sides of alloy foil sheet with low-melting point 24 are contacted with the lower surface of radiator 21 and the upper surface of electronic component 22 respectively.Please refer to Fig. 2 B, this figure is the alloy foil sheet with low-melting point schematic diagram of one embodiment of the invention.
In another embodiment, for the hot melt liquid that prevents alloy foil sheet with low-melting point 24 more effectively flows and leaks on the circuit board 23, except the less alloy foil sheet with low-melting point 24 of used thickness, more can usable floor area less alloy foil sheet with low-melting point 24 is to radiating module of the present invention, also is to prevent the method for leaking.
Be the varied in thickness after the alloy foil sheet with low-melting point fusion of differentiating different-thickness, and the influence of thermal impedance numerical value.Make the alloy foil sheet of 60 ℃ of fusing points, weight composition In-Bi32.5-Sn16.5, the paillon foil length and width is 31mm, and thickness is respectively 0.1mm, 0.075mm, 0.05mm, 0.03mm and 0.015mm.The In-Bi32.5-Sn16.5 alloy foil sheet of aforementioned not equal thickness carries out thermal impedance in an improvement from the thermal impedance testing equipment of ASTM D5470 standard and measures, and test condition is respectively 48 watts of pressure with 3.1kg/cm2.
Test back is found not melt the pearl drop except the foil edge of thickness 0.03mm and 0.015mm, and the paillon foil of all the other thickness all overflows the pearl drop, and the size of pearl drop and quantity increase with the thickness of former paillon foil.
Fig. 3 is the thermal impedance numerical curve of different-thickness In-Bi32.5-Sn16.5 alloy foil sheet, the thermal impedance numerical value of the alloy foil sheet of different-thickness reduces along with successively decreasing of thickness, turnover appears in the paillon foil test number up to thickness 0.015mm, and wherein the thermal impedance numerical value of thickness 0.015mm paillon foil is a little more than the numerical value of thickness 0.03mm paillon foil.As if to be not enough to fill up the micropore, interface relevant with the fusion liquid phase of thickness 0.015mm paillon foil for the turnover reason of aforementioned hot impedance value.
The forward and backward varied in thickness of different-thickness paillon foil test presents a visible trend, and the thickness of alloy foil sheet is big more before the test, and the amounts of thickness variation after the test is big more; In addition, except the forward and backward thickness of 0.015mm paillon foil test does not almost have significant change, test the paillon foil of preceding other different-thickness, comprise the paillon foil of 0.03mm thickness, the thickness after test is all between between the 0.02mm to 0.03mm.
The paillon foil of aforementioned In-Bi32.5-Sn16.5 alloy, thickness 0.07mm, 0.05mm, 0.04mm and 0.03mm is placed in respectively between aluminium block material (Al), the nickel plating bulk (Ni), and between the copper billet material (Cu), copper billet material (Cu), vertical placement also is heated to 70 ℃ and kept 100 hours, be cooled to room temperature then, disassemble aforesaid bulk, inspect the flow situation that aforementioned alloy foil sheet heat is melted liquid phase.
Fig. 4 A to Fig. 7 B be respectively the paillon foil of thickness 0.07,0.05,0.04 and 0.03mm thickness at the Al/Ni interface 70 ℃ of overflow pictures of holding temperature.Relatively each figure back shows that the paillon foil of thickness 0.03mm is kept original rectangular appearance, and the paillon foil of all the other thickness all changes its shape because of liquid phase flow.
And the alloy foil sheet of aforementioned not equal thickness is in the flow results at Cu/Cu interface, and the paillon foil of thickness 0.03,0.04mm is kept original rectangular appearance, and the paillon foil of all the other thickness all changes its shape because of liquid phase flow.Fig. 8 be thickness 0.03mm paillon foil at the Cu/Ni interface, 70 ℃ hold 100 hours outward appearances of temperature, same leakproof, wherein hot melt liquid phase and Cu piece formation interfacial reaction is torn paillon foil when disassembling the Cu piece.
In addition, the paillon foil that In-Bi32.5-Sn16.5 alloy, thickness 0.02mm to 0.13mm do not wait is placed in respectively on the thermo-resistance measurement base station, the base plate of radiator of pincers blocking sheet is an aluminium alloy, provide one fixedly heating power make the test microscope carrier be warming up to 70 ℃, impel the paillon foil fusion, lower the temperature then and check that the thickness and the weight change of paillon foil, table one are the forward and backward related datas of test.
| Numbering | Original weight (g) before the heating | Overflow preceding original thickness (mm) | Spill-out (g) | Overflow back residuals weight (g) | Overflow back residual thickness (mm) |
| 1 | 0.13 | 0.02-0.03 | 0 | 0.13 | 0.02～0.03 |
| 2 | 0.17 | 0.03 | 0.04 | 0.13 | 0.02-0.03 |
| 3 | 0.24 | 0.04 | 0.11 | 0.13 | 0.02-0.03 |
| 4 | 0.31 | 0.05 | 0.17 | 0.14 | 0.02-0.03 |
| 5 | 0.37 | 0.06 | 0.24 | 0.13 | 0.02-0.03 |
| 6 | 0.42 | 0.07 | 0.28 | 0.14 | 0.02～0.03 |
| 7 | 0.51 | 0.08 | 0.38 | 0.13 | 0.02-0.03 |
| 8 | 0.58 | 0.08～0.09 | 0.44 | 0.14 | 0.02～0.03 |
| 9 | 0.68 | 0.11 | 0.54 | 0.14 | 0.02～0.03 |
| 10 | 0.76 | 0.12 | 0.63 | 0.13 | 0.02～0.03 |
| 11 | 0.82 | 0.13 | 0.68 | 0.14 | 0.02～0.03 |
The varied in thickness of the paillon foil of table one different-thickness after the Cu/Al microscope carrier heats 70 ℃
Learnt that by above test result the thickness of alloy foil sheet with low-melting point is thinner, then the hot melt liquid phase flow of paillon foil more is difficult for taking place; In addition, the composition of periphery material can influence flowing of fusion liquid phase.And, the microscope carrier of no matter testing the position is set for keeping flat or stand up (turning 90 degrees setting), when the thickness of alloy foil sheet with low-melting point is lower than a critical thickness, flow to be difficult for the taking place of hot melt liquid phase.Above result shows that the absorption affinity of hot melt liquid phase and periphery material can impel its strength that flows source, for example gravity or pincers amount of pressure greater than it.Via the previous experiments result, the critical thickness of aforementioned alloy foil sheet with low-melting point should be not more than 0.04mm.
Based on aforesaid test result, when the thickness of alloy foil sheet with low-melting point 24 of the present invention during near critical thickness, the hot melt liquid phase of alloy foil sheet with low-melting point 24 just quite is difficult for flowing, and then is difficult for producing the situation of leaking.
Therefore, in the radiating module 20 of present embodiment, the thickness t of alloy foil sheet with low-melting point 24 is not more than 0.04mm, and in preferred embodiment thickness between between the 0.015mm to 0.03mm.
It should be noted that alloy foil sheet with low-melting point 24 of the present invention is a kind of alloy, its main component can be In-Bi-Sn, In-Bi-Sn-Zn or In-B.In addition, aforementioned main component alloy more can comprise at least a non-murder by poisoning environmental element, for example elements such as silver, copper, titanium, germanium, aluminium, cerium, lanthanum or silicon.And alloy foil sheet with low-melting point 24 can have 55 ℃ to 85 ℃ unequal melting points to change according to the difference of above-mentioned component.Please refer to table two, this table mainly is to be used for illustrating embodiments of the present invention, rather than is used for limiting composition content wherein for different component alloys and fusing point thereof.
| Alloy composition | Indium | Bismuth | Tin | Zinc | Fusing point |
| (wt％) | (℃) | ||||
| 47 | 36.1 | 15.9 | 1.0 | 57 | |
| 51 | 32.5 | 16.5 | 60 | ||
| 64.4 | 33.1 | 2.1 | 0.5 | 70 | |
| 66 | 34 | 72 | |||
| 26 | 57 | 17 | 79 | ||
| 29.7 | 54.0 | 16.3 | 81 | ||
Different component alloys of table two and fusing point thereof
In the process of electronic component 22 runnings, electronic component 22 produces higher heat sometimes and makes alloy foil sheet with low-melting point 24 melted by heating.In general, the fusing point of alloy foil sheet with low-melting point 24 is near the working temperature of electronic component 22.That is to say, be the alloy foil sheet with low-melting point 24 of selecting different melting points according to the working temperature of different electronic components 22 for use in the use.Whereby, when electronic component 22 produced higher working temperature, alloy foil sheet with low-melting point 24 just can be heated and fusion.
Please refer to Fig. 9, this figure is the generalized section of another embodiment of radiating module of the present invention.As shown in the figure, the radiating module 30 of present embodiment, the heat energy that is produced in the time of also can making an electronic component 32 runnings conducts to external environment fast, and radiating module 30 comprises a radiator 31, an alloy foil sheet with low-melting point 34 and an annular solid 35.
Wherein, the effect of annular solid 35 mainly contains the speed of keeping interface thickness, delaying alloy foil sheet with low-melting point 34 hot melt oxidations, the heat dissipation that makes alloy foil sheet with low-melting point 34 is reason over oxidation and deterioration not, and in addition, the resistance that also can be used to reinforcing low melting temperature alloy foil sheet 34 hot melt liquid phases is leaked.
Alloy foil sheet with low-melting point 34 of the present invention is provided with kenel shown in Figure 10 A with annular solid 35.Annular solid 35 is arranged between electronic component 32 and the radiator 31, and is surrounded on the periphery of alloy foil sheet with low-melting point 34.Wherein, annular solid 35 can contact with the periphery of alloy foil sheet with low-melting point 34, perhaps also can have space slightly with the periphery of alloy foil sheet with low-melting point 34.When the design of annular solid 35 can make the liquefaction of alloy foil sheet with low-melting point 34 melted by heating, the hot melt liquid phase is more difficult to let out between electronic component 32 and radiator 31.
Present embodiment also can just be reduced to the thickness of alloy foil sheet with low-melting point 34 below the 0.04mm in conjunction with a last embodiment, leaks effect and reach better resistance.
It should be noted that because the two sides of alloy foil sheet with low-melting point 34 must be contacted with the lower surface of radiator 31 and the upper surface of electronic component 32 respectively, could efficiently radiates heat.So, in the present embodiment, when radiator 31 is pressure bonded to alloy foil sheet with low-melting point 34 upper surfaces, also touch the upper surface of annular solid 35 simultaneously, that is to say that this moment, fusing point alloy foil sheet 34 had identical thickness with annular solid 35.In addition, when the thickness of annular solid 35 was slightly less than the thickness of alloy foil sheet with low-melting point 34, annular solid 35 also had good resistance and leaks effect.
Aspect annular solid 35 selected for use, annular solid 35 can be viscoplasticity pad, thermal grease (thermal grease) or phase change heat radiation paster (phase change thermal pad) and waits and have heat dissipating and force-applied and material that be out of shape constitutes concurrently.
In addition, shown in Figure 10 B, in a preferred embodiment, annular solid 35 has a plurality of escape holes 36, and whereby, the formed bubble in alloy foil sheet with low-melting point 34 fusions liquefaction back can be overflowed by escape hole 36.
It should be noted that, technical characterictic of the present invention is applied to the radiating module of electronic component, except can be applicable to radiating module, more can be applied to any radiating module with heater element such as microelectronic elements such as central processing units such as computer, game machine and painting processors.That is to say that the electronic component in the various embodiments described above can be a structure dress microelectronic element, perhaps any heater element, for example: be used for being provided with the LED lamp metal core substrate (Metal Core PCB, MCPCB).
In sum, radiating module of the present invention has following advantages:
One, the function of annular solid mainly contains and keeps the junction bond thickness, delays the alloy foil sheet with low-melting point oxidation of melting, in addition with the Drain Resistance effect of strengthening the thermosol drop.
When two, the thickness alloy foil sheet with low-melting point that is not more than 0.04mm is applied to radiating module, can suppresses the flowability that alloy foil sheet with low-melting point is subjected to heat fusing, and reduce the problem that drop leaks.
Three, the thickness alloy foil sheet with low-melting point that is not more than 0.04mm has minimum thermal impedance (R), when therefore being applied to radiating module, can bring into play splendid radiating effect.
Though the present invention illustrates as above with preferred embodiments, so it is not to limit the present invention's spirit and invention entity. To the person that is familiar with the technique, can understand easily and utilize other element or mode to produce identical effect. Therefore, the modification of doing in not breaking away from spirit of the present invention and scope all should be included in the claim scope of the present invention.
Claims (4)
1. low melting point indium alloy paillon foil thermal interfacial material with low thermal impedance characteristic, it is characterized in that, described low melting point indium alloy paillon foil thermal interfacial material indium, and wherein a kind of or any several combining of bismuth, tin and zinc, and melting temperature is between 55 ℃ to 85 ℃, and the thickness of described low melting point indium alloy paillon foil thermal interfacial material is not more than 0.04mm.
2. low melting point indium alloy paillon foil thermal interfacial material as claimed in claim 1, the thickness range of wherein said low melting point indium alloy paillon foil thermal interfacial material is between between the 0.015mm to 0.03mm.
3. low melting point indium alloy paillon foil thermal interfacial material as claimed in claim 1, wherein said low melting point indium alloy paillon foil thermal interfacial material is an In-Bi-Sn alloy or In-Bi-Sn-Zn alloy or In-Bi alloy.
4. low melting point indium alloy paillon foil thermal interfacial material as claimed in claim 1, the composition of wherein said low melting point indium alloy paillon foil thermal interfacial material more can comprise at least a non-murder by poisoning environmental element, and described non-murder by poisoning environmental element comprises: silver, copper, titanium, germanium, aluminium, cerium, lanthanum or silicon.
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