CN107645827B

CN107645827B - High heat dissipation level progressive metal layer structure

Info

Publication number: CN107645827B
Application number: CN201710853265.XA
Authority: CN
Inventors: 王李剑; 蒋三一
Original assignee: Suzhou 31 Heating And Cooling Engineering Co Ltd
Current assignee: TAICANG ZHONGXIANG PRECISION HARDWARE Co.,Ltd.
Priority date: 2017-09-20
Filing date: 2017-09-20
Publication date: 2019-12-10
Anticipated expiration: 2037-09-20
Also published as: CN107645827A

Abstract

The invention discloses a high-heat-dissipation hierarchical progressive metal layer structure which sequentially comprises a substrate, a copper-clad plate, a first aluminum-copper alloy layer, a second aluminum-copper alloy layer, a cast aluminum layer and a heat-dissipation aluminum plate from bottom to top, wherein the copper content of the first aluminum-copper alloy layer is higher than that of the second aluminum-copper alloy layer, the substrate is fused with the copper-clad plate, the first aluminum-copper alloy layer, the second aluminum-copper alloy layer and the cast aluminum layer are connected in a fusion mode, and the heat-dissipation aluminum plate is vertically welded with the cast aluminum layer. The invention is particularly suitable for the heat dissipation of the copper-clad plate with the ceramic substrate, combines the advantages of rapid heat transfer of copper and rapid heat dissipation of aluminum, weakens the mutual interfaces and provides new value for the upgrade of the heat dissipation mode.

Description

high heat dissipation level progressive metal layer structure

Technical Field

The invention relates to the field of heat dissipation devices and materials, in particular to a high-heat-dissipation-level progressive metal layer structure.

Background

The heat dissipation is applied to industries such as electronics, heat engines, chemical engineering and the like. The early heat dissipation adopts active heat dissipation, such as a fan, which is eliminated due to larger volume; the existing main method is to adopt heat-conducting glue and heat-conducting grease to conduct heat to external metal, but because the heat conductivity of the heat-conducting glue is low (less than 5W/mK) and the metal is far away from a heating point, the heat dissipation function cannot be well realized. In the electronic field, a semiconductor copper-clad module has high heat conduction efficiency, is a heat dissipation module widely applied to the electronic field, and is generally based on a ceramic substrate. However, no matter the contact between layers is good, an interface always exists, and a hot laminar layer exists between the interfaces, so that a temperature gradient exists, and the heat transfer efficiency is influenced; the heat-conducting silicone grease has a service life, needs to be replaced after long-term use, and otherwise the heat conductivity is remarkably reduced. In addition, the chip and the copper-clad heat dissipation substrate are made of materials with different thermal expansion coefficients, and the copper-clad ceramic heat dissipation substrate is stressed and can be bent and deformed due to different thermal expansion coefficients in the cooling process after high-temperature welding.

therefore, a heat dissipation structure that solves the heat dissipation resistance once and for all is very important.

Disclosure of Invention

the invention aims to provide a high-heat-dissipation-level progressive metal layer structure which can dissipate heat with high energy and lasting time, is better and faster than the existing heat dissipation layer, and overcomes the problems in the prior art.

In order to achieve the above purpose, the technical scheme of the invention is as follows:

The utility model provides a high heat dissipation level metal level structure that advances, from the bottom up includes base plate, copper-clad plate, first aluminium copper alloy layer, second aluminium copper alloy layer, casts aluminium lamination, heat dissipation aluminum plate in proper order, the copper content on first aluminium copper alloy layer is higher than the copper content on second aluminium copper alloy layer, the base plate fuses with the copper-clad plate, the arbitrary adjacent connected mode between two-layer of copper-clad plate, first aluminium copper alloy layer, second aluminium copper alloy layer, cast aluminium lamination is for fusing, heat dissipation aluminum plate and the vertical welding of cast aluminium lamination.

Preferably, the copper-clad plate is red copper, and the thickness of the copper-clad plate is 0.25-0.4 mm. The thickness of the copper clad laminate can save materials and obtain high heat conduction.

Preferably, the substrate and the copper-clad plate are fused in a mode of laminating and sintering after matching with glue solution. After the glue solution is matched, the degree of overlapping and sintering fusion is good, a solidification interface is fuzzy after the metal is melted, and the thermal laminar flow layer effect is reduced.

Further, the sintering temperature is 850-. The sintering temperature ensures the sintering quality to eliminate the interface.

Preferably, the relative roughness Ra value of the upper surface of the substrate is less than 0.025. The roughness of the surface of the substrate enables the substrate to be tightly combined with the copper-clad plate, and the substrate has the advantages of rapid heat transfer and good fusion.

Preferably, the first aluminum-copper alloy layer and the second aluminum-copper alloy layer have a thickness of 0.2-0.35mm, and the cast aluminum layer has a thickness smaller than the first aluminum-copper alloy layer and the second aluminum-copper alloy layer. The thickness of the two Al-Cu alloy layers ensures smooth transition and serves as the main heat transfer layer.

Preferably, the first aluminum-copper alloy layer is aluminum bronze, the copper content is more than 90%, and the second aluminum-copper alloy layer is aluminum alloy, and the copper content is less than 12%. The aluminum bronze and the copper-containing aluminum alloy have obvious transition and can gradually change the heat transfer coefficient and the interface.

The invention has the beneficial effects that: the high-heat-dissipation progressive metal layer structure is distinct in level and high in heat conduction efficiency. The substrate, the copper-clad plate, the first aluminum-copper alloy layer, the second aluminum-copper alloy layer, the cast aluminum layer and the heat dissipation aluminum plate are tightly matched, and the fusion operation between adjacent layers enables the interface to disappear, so that the temperature gradient of a hot laminar flow layer of the interface is weakened, and the heat conduction is smoother; and the connection of each layer from red copper to aluminum is natural, the fusion process has good reliability, and the heat conduction of the whole heat conduction system can be smoothly carried out. The invention is particularly suitable for the heat dissipation of the copper-clad plate with the ceramic substrate, combines the advantages of rapid heat transfer of copper and rapid heat dissipation of aluminum, weakens the mutual interfaces and provides new value for the upgrade of the heat dissipation mode.

Drawings

FIG. 1 is a schematic diagram of a hierarchical structure according to an embodiment of the present invention.

In the figure: 1-.

Detailed Description

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the embodiments.

As shown in fig. 1, a high heat dissipation level progressive metal layer structure sequentially comprises, from bottom to top, a substrate 1, a copper clad laminate 2, a first aluminum copper alloy layer 3, a second aluminum copper alloy layer 4, a cast aluminum layer 5, and a heat dissipation aluminum plate 6, wherein the substrate 1 is made of a ceramic material, preferably one of AlSiC ceramic, aluminosilicate ceramic, and zirconia ceramic, the relative roughness Ra value of the upper surface of the substrate 1 is less than 0.025, the copper clad laminate 2 is made of red copper, the thicknesses of the first aluminum copper alloy layer 3 and the second aluminum copper alloy layer 4 are 0.2-0.35mm, the thickness of the cast aluminum layer 5 is less than that of the first aluminum copper alloy layer 3 and the second aluminum copper alloy layer 4, the thickness is 0.25-0.4mm, the first aluminum copper alloy layer 3 is made of aluminum bronze, the copper content is greater than 90%, the second aluminum copper alloy layer 4 is made of aluminum alloy, the copper content is less than 12%, the substrate 1 and the copper clad laminate 2 are fused together by using glue solution, laminating and sintering, wherein the sintering temperature is 850-980 ℃;

The copper-clad plate 2, the first aluminum-copper alloy layer 3, the second aluminum-copper alloy layer 4 and the cast aluminum layer 5 are connected in a fusion mode, and the heat dissipation aluminum plate 6 is vertically welded with the cast aluminum layer 5.

The above embodiments are only intended to illustrate the preferred embodiments of the present invention, and it should be noted that, for those skilled in the art, various modifications and equivalent substitutions can be made without departing from the principle of the present invention, and the scope of the present invention is still covered by the claims.

Claims

1. A high heat dissipation level progressive metal layer structure is characterized by sequentially comprising a substrate, a copper-clad plate, a first aluminum-copper alloy layer, a second aluminum-copper alloy layer, a cast aluminum layer and a heat dissipation aluminum plate from bottom to top, wherein the copper content of the first aluminum-copper alloy layer is higher than that of the second aluminum-copper alloy layer, the substrate is fused with the copper-clad plate, the first aluminum-copper alloy layer, the second aluminum-copper alloy layer and the cast aluminum layer are connected in a fusion mode, and the heat dissipation aluminum plate is vertically welded with the cast aluminum layer;

The copper-clad plate is red copper, and the thickness of the copper-clad plate is 0.25-0.4 mm;

The fusion mode of the substrate and the copper-clad plate is to perform overlapping and sintering after matching with glue solution;

The sintering temperature is 850-980 ℃;

The relative roughness Ra value of the upper surface of the substrate is less than 0.025;

the thicknesses of the first aluminum-copper alloy layer and the second aluminum-copper alloy layer are 0.2-0.35mm, and the thickness of the cast aluminum layer is smaller than that of the first aluminum-copper alloy layer and the second aluminum-copper alloy layer;

The first aluminum-copper alloy layer is aluminum bronze, the copper content is more than 90%, the second aluminum-copper alloy layer is aluminum alloy, and the copper content is less than 12%.