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CN100536100C - 电子元件的树脂密封成形装置 - Google Patents

电子元件的树脂密封成形装置 Download PDF

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Publication number
CN100536100C
CN100536100C CNB2007101485207A CN200710148520A CN100536100C CN 100536100 C CN100536100 C CN 100536100C CN B2007101485207 A CNB2007101485207 A CN B2007101485207A CN 200710148520 A CN200710148520 A CN 200710148520A CN 100536100 C CN100536100 C CN 100536100C
Authority
CN
China
Prior art keywords
chamber
resin
heating panel
electronic component
mould
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2007101485207A
Other languages
English (en)
Chinese (zh)
Other versions
CN101131946A (zh
Inventor
冈本裕贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of CN101131946A publication Critical patent/CN101131946A/zh
Application granted granted Critical
Publication of CN100536100C publication Critical patent/CN100536100C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
CNB2007101485207A 2006-08-25 2007-08-22 电子元件的树脂密封成形装置 Expired - Fee Related CN100536100C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006228941A JP5128095B2 (ja) 2006-08-25 2006-08-25 電子部品の樹脂封止成形装置
JP2006228941 2006-08-25

Publications (2)

Publication Number Publication Date
CN101131946A CN101131946A (zh) 2008-02-27
CN100536100C true CN100536100C (zh) 2009-09-02

Family

ID=39129145

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2007101485207A Expired - Fee Related CN100536100C (zh) 2006-08-25 2007-08-22 电子元件的树脂密封成形装置

Country Status (4)

Country Link
JP (1) JP5128095B2 (ja)
KR (1) KR100848746B1 (ja)
CN (1) CN100536100C (ja)
TW (1) TW200811968A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105269744A (zh) * 2014-06-09 2016-01-27 东和株式会社 树脂封装装置及树脂封装方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6027569B2 (ja) * 2014-03-26 2016-11-16 エムテックスマツムラ株式会社 中空パッケージの製造方法および中空パッケージ
JP6549531B2 (ja) * 2016-06-30 2019-07-24 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
EP4181185A4 (en) 2020-07-28 2023-09-13 Huawei Technologies Co., Ltd. POWER MODULE AND PRODUCTION FORM AND DEVICE

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3304513B2 (ja) * 1993-06-29 2002-07-22 アピックヤマダ株式会社 放熱体付半導体装置及びその製造方法
SG50009A1 (en) * 1996-03-14 1998-06-15 Towa Corp Method of sealing electronic component with molded resin
JPH11274196A (ja) 1998-03-26 1999-10-08 Seiko Epson Corp 半導体装置の製造方法およびモールドシステム並びに半導体装置
JP4273592B2 (ja) 1999-10-08 2009-06-03 株式会社デンソー 樹脂封止型半導体装置の製造方法
JP2003197664A (ja) * 2001-12-28 2003-07-11 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105269744A (zh) * 2014-06-09 2016-01-27 东和株式会社 树脂封装装置及树脂封装方法
CN105269744B (zh) * 2014-06-09 2018-04-20 东和株式会社 树脂封装装置及树脂封装方法

Also Published As

Publication number Publication date
JP2008053509A (ja) 2008-03-06
TWI338342B (ja) 2011-03-01
TW200811968A (en) 2008-03-01
KR100848746B1 (ko) 2008-07-25
JP5128095B2 (ja) 2013-01-23
KR20080018791A (ko) 2008-02-28
CN101131946A (zh) 2008-02-27

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090902

Termination date: 20100822