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CN109778124A - 成膜装置及埋入处理装置 - Google Patents

成膜装置及埋入处理装置 Download PDF

Info

Publication number
CN109778124A
CN109778124A CN201811344888.5A CN201811344888A CN109778124A CN 109778124 A CN109778124 A CN 109778124A CN 201811344888 A CN201811344888 A CN 201811344888A CN 109778124 A CN109778124 A CN 109778124A
Authority
CN
China
Prior art keywords
screening glass
electronic component
flat surface
coldplate
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811344888.5A
Other languages
English (en)
Chinese (zh)
Inventor
西垣寿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN109778124A publication Critical patent/CN109778124A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201811344888.5A 2017-11-15 2018-11-13 成膜装置及埋入处理装置 Pending CN109778124A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-220507 2017-11-15
JP2017220507A JP7051379B2 (ja) 2017-11-15 2017-11-15 成膜装置及び埋込処理装置

Publications (1)

Publication Number Publication Date
CN109778124A true CN109778124A (zh) 2019-05-21

Family

ID=66496402

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811344888.5A Pending CN109778124A (zh) 2017-11-15 2018-11-13 成膜装置及埋入处理装置

Country Status (4)

Country Link
JP (1) JP7051379B2 (ja)
KR (1) KR102215221B1 (ja)
CN (1) CN109778124A (ja)
TW (1) TWI669406B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111459328A (zh) * 2020-03-30 2020-07-28 深圳市华星光电半导体显示技术有限公司 盖板贴合系统、盖板贴合方法以及触控显示面板
CN112575297A (zh) * 2019-09-27 2021-03-30 芝浦机械电子装置株式会社 成膜装置及埋入处理装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112447475B (zh) * 2019-09-05 2023-09-29 中微半导体设备(上海)股份有限公司 一种具有柔性电介质薄片的等离子体处理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102005395A (zh) * 2009-08-31 2011-04-06 日立设备工程股份有限公司 真空贴装方法及装置
JP2017054891A (ja) * 2015-09-08 2017-03-16 三井化学東セロ株式会社 電子部品製造用フィルム並びに電子部品及びその製造方法
CN109763105A (zh) * 2017-11-10 2019-05-17 芝浦机械电子装置株式会社 成膜装置及零件剥离装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697268A (ja) 1992-09-11 1994-04-08 Nitto Denko Corp ウエハへの粘着テープ貼付け装置
JP4559122B2 (ja) 2004-05-25 2010-10-06 有限会社都波岐精工 テープ接着装置およびテープ接着方法
JP4841355B2 (ja) * 2006-08-08 2011-12-21 日東電工株式会社 半導体ウエハの保持方法
JP4733069B2 (ja) * 2007-05-22 2011-07-27 リンテック株式会社 シート貼付装置及び貼付方法
JP4723614B2 (ja) * 2008-06-06 2011-07-13 リンテック株式会社 シート貼付装置及び貼付方法
US8724288B2 (en) * 2008-08-27 2014-05-13 Ulvac, Inc. Electrostatic chuck and vacuum processing apparatus
JP2011071472A (ja) * 2009-08-31 2011-04-07 Hitachi Setsubi Eng Co Ltd 真空貼付け方法及び装置
KR101692126B1 (ko) * 2009-12-18 2017-01-02 미쓰비시 타나베 파마 코퍼레이션 신규 항혈소판약
JP2013035819A (ja) 2011-08-09 2013-02-21 Norimichi Kawashima 薬剤およびその使用方法
WO2017038466A1 (ja) * 2015-09-02 2017-03-09 株式会社アルバック ワーク保持体および成膜装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102005395A (zh) * 2009-08-31 2011-04-06 日立设备工程股份有限公司 真空贴装方法及装置
JP2017054891A (ja) * 2015-09-08 2017-03-16 三井化学東セロ株式会社 電子部品製造用フィルム並びに電子部品及びその製造方法
CN109763105A (zh) * 2017-11-10 2019-05-17 芝浦机械电子装置株式会社 成膜装置及零件剥离装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112575297A (zh) * 2019-09-27 2021-03-30 芝浦机械电子装置株式会社 成膜装置及埋入处理装置
CN112575297B (zh) * 2019-09-27 2023-02-24 芝浦机械电子装置株式会社 成膜装置及埋入处理装置
CN111459328A (zh) * 2020-03-30 2020-07-28 深圳市华星光电半导体显示技术有限公司 盖板贴合系统、盖板贴合方法以及触控显示面板

Also Published As

Publication number Publication date
KR20190055743A (ko) 2019-05-23
JP7051379B2 (ja) 2022-04-11
JP2019091828A (ja) 2019-06-13
TW201923124A (zh) 2019-06-16
TWI669406B (zh) 2019-08-21
KR102215221B1 (ko) 2021-02-16

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Application publication date: 20190521

WD01 Invention patent application deemed withdrawn after publication