CN108838522B - Laser cutting head control system based on EtherCAT bus multi-axis synchronous motion - Google Patents
Laser cutting head control system based on EtherCAT bus multi-axis synchronous motion Download PDFInfo
- Publication number
- CN108838522B CN108838522B CN201810606944.1A CN201810606944A CN108838522B CN 108838522 B CN108838522 B CN 108838522B CN 201810606944 A CN201810606944 A CN 201810606944A CN 108838522 B CN108838522 B CN 108838522B
- Authority
- CN
- China
- Prior art keywords
- laser cutting
- cutting head
- control board
- main control
- ethercat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
- G05B19/0421—Multiprocessor system
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/20—Pc systems
- G05B2219/22—Pc multi processor system
- G05B2219/2214—Multicontrollers, multimicrocomputers, multiprocessing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of laser cutting, in particular to a laser cutting head control system based on EtherCAT bus multi-axis synchronous motion. The utility model provides a control system of laser cutting head based on EtherCAT bus multiaxis simultaneous movement which characterized in that: the signal end of the EtherCAT master station is bidirectionally connected with a laser cutting head motor driver, the signal output end of the PD controller is connected with the signal input end of the EtherCAT communication controller through a communication line, the EtherCAT communication controller is bidirectionally connected with a first main control board processor through a communication line, the first main control board processor is bidirectionally connected with a second main control board processor through a communication line, and the second main control board processor is respectively bidirectionally connected with a lens motor controller through a port; the first master control board processor is bi-directionally connected to the sensor control board through line port P18. Compared with the prior art, the EtherCAT bus technology is utilized to dynamically monitor the whole laser cutting process and collect corresponding process key parameters, no manual intervention is needed, and parameters such as the diameter size of a light spot and the position of a focus are automatically adjusted.
Description
Technical Field
The invention relates to the technical field of laser cutting, in particular to a laser cutting head control system based on EtherCAT bus multi-axis synchronous motion.
Background
The laser cutting is widely applied to processing of metal and nonmetal materials, and compared with the traditional processing mode, the laser cutting device can greatly reduce the processing time, reduce the processing cost and improve the quality of workpieces.
In recent years, with the gradual popularization of laser cutting, the requirements for efficient and high-quality cutting of different types of materials are more and more. At present, the development trend needs to improve the existing laser processing manufacturing process and technology so as to realize high-precision, high-efficiency and high-quality cutting of different types of materials with different thicknesses. In the current laser cutting process, in order to meet the high-quality processing requirements of workpieces with different materials and different thicknesses, final process parameters need to be accurately controlled. In order to meet the setting requirements for different workpiece parameters of laser processing, most of the prior measures are to manually reset the corresponding parameters by an operator after the equipment is shut down. However, this process flow not only depends on the corresponding operation experience of the corresponding operators on site, but also greatly increases the workpiece processing time and reduces the processing efficiency of the whole equipment.
Disclosure of Invention
The invention overcomes the defects of the prior art, provides a laser cutting head control system based on EtherCAT bus multi-axis synchronous motion, dynamically monitors the whole laser cutting process and collects corresponding process key parameters by using the EtherCAT bus technology, automatically adjusts parameters such as the diameter of a light spot, the position of a focus and the like without any manual intervention according to the characteristics of a cutting material, and can realize high-quality, high-efficiency and low-cost rapid processing of materials with different materials and different thicknesses.
For realizing above-mentioned purpose, design a control system of laser cutting head based on EtherCAT bus multiaxis synchronous motion, including EtherCAT main website, POE power supply control board, laser cutting head main control board, sensor control panel, digital capacitance collecting amplifier, laser cutting head motor drive, its characterized in that: the signal end of the EtherCAT master station is bidirectionally connected with a laser cutting head motor driver through a network port LAN1, the signal end of the laser cutting head motor driver is bidirectionally connected with a port P1 of a POE power supply control board through the network port, and the POE power supply control board is bidirectionally connected with a port P7 of a laser cutting head main control board through a port P4; the laser cutting head main control board internally comprises a PD controller, an EtherCAT communication controller, a first main control board processor, a second main control board processor, a lens motor controller and a signal receiving circuit, wherein the signal output end of the PD controller is connected with the signal input end of the EtherCAT communication controller through a communication line, the EtherCAT communication controller is bidirectionally connected with the first main control board processor through the communication line, the first main control board processor is bidirectionally connected with the second main control board processor through the communication line, and the second main control board processor is bidirectionally connected with the lens motor controller through ports P14, P15, P16 and P17 respectively; the first main control board processor is connected with the sensor control board in a bidirectional mode through an RS485 communication line port P18; and the signal output end of the laser cutting head motor driver is connected with a laser cutting head motor through a circuit.
The signal output end of the signal receiving circuit is connected with the signal input end P2 of the second main control board processor through a communication line, and the signal input end P2 of the signal receiving circuit is connected with the signal output end TP1 of the digital capacitance collecting amplifier.
And a signal amplification circuit and an LC resonance circuit are arranged in the digital capacitance acquisition amplifier.
The lens motor controller is connected with the lens motor driving mechanism in a bidirectional mode.
The sensor control panel is internally provided with a control panel processor which is connected with the air pressure sensor, the pollution sensor, the temperature and humidity sensor and the perforation sensor in a bidirectional way.
And a PSE controller is arranged in the POE power supply control board.
A control method of a laser cutting head based on EtherCAT bus multi-axis synchronous motion comprises the following specific control methods:
(1) the EtherCAT master station sends out an instruction according to the model of the processed product;
(2) the first main control board processor judges whether the environmental data is qualified or not, and if the environmental data is qualified, the first main control board processor continues to work; if not, alarming;
(3) the laser cutting head motor driver block and the second main control board processor respectively receive working instructions;
(4) the laser cutting head motor driver controls the laser cutting head motor to move so as to drive the laser cutting head to move up and down;
(5) acquiring the coordinate of the actual height of the laser cutting head by the digital capacitance acquisition amplifier, transmitting the coordinate data to an EtherCAT master station through a signal receiving circuit, judging whether the actual data conforms to the instruction data by the EtherCAT master station, if so, sending an instruction to a motor driver of the laser cutting head, controlling the height of the laser cutting head to be unchanged, and if not, continuing the step (4);
(6) the second main control board processor gives theoretical coordinate parameters of the lens according to the light spot, the focal point and the lens mapping table, and transmits the parameters to the lens motor controller;
(7) the lens motor controller controls a lens motor driving mechanism which drives the lens to move;
(8) the digital capacitance acquisition amplifier acquires the coordinate of the actual height of the lens, and transmits the coordinate data to the second main control board processor through the signal receiving circuit, the second main control board processor judges whether the actual data is consistent with the instruction data, if so, the height of the lens is kept unchanged, and if not, the step (6) is continued;
(9) and after the laser cutting head and the lens reach the instruction target position, the laser cutting head starts laser cutting work.
The first main control board processor judges the environmental data as follows:
(1) the air pressure sensor, the pollution sensor, the temperature and humidity sensor and the perforation sensor transmit the collected data to the control board processor;
(2) the control board processor receives all data for detection and transmits the data to the first main control board processor;
(3) the first main control board processor judges whether the detected data are qualified or not, and if the detected data are qualified, the first main control board processor continues to work; if the signal is not qualified, alarming and transmitting the signal to an EtherCAT main station;
(4) and the EtherCAT master station stops working after receiving the alarm signal.
Compared with the prior art, the invention dynamically monitors the whole laser cutting process and collects corresponding process key parameters by utilizing the EtherCAT bus technology, automatically adjusts parameters such as the diameter size of a light spot, the position of a focus and the like without any manual intervention according to the characteristics of a cutting material, and can realize the high-quality, high-efficiency and low-cost rapid processing of materials with different materials and different thicknesses.
Drawings
Fig. 1 is a block diagram of the working principle of the present invention.
Fig. 2 is a block flow diagram of the parallel control of the cutting head of the present invention.
Fig. 3 is a block diagram of the parallel signal processing flow of the cutting head of the present invention.
Fig. 4 is a schematic structural view of a laser cutting head.
Fig. 5 is a schematic view of the structure of a laser cutting head and a schematic view of the control state thereof according to embodiment 1.
Fig. 6 is a schematic view of the structure of a laser cutting head and a schematic view of the control state thereof according to embodiment 2.
Fig. 7 is a schematic view of the structure of a laser cutting head and a schematic view of the control state thereof according to embodiment 3.
Fig. 8 is a schematic view of the structure of a laser cutting head and the control state thereof according to embodiment 4.
Fig. 9 is a schematic view of the structure of a laser cutting head and the control state thereof according to embodiment 5.
Referring to fig. 4, 1 is an optical fiber assembly, 2 is an upper protective glass mechanism, 3 is an upper lens fixing mechanism, 4 is a lower lens fixing mechanism, 5 is a focusing optical element fixing mechanism, 6 is a lower protective glass mechanism, 7 is a side blowing gas path mechanism, 8 is an upper lens motor driving mechanism, 9 is a lower lens motor driving mechanism, 10 is a cutting gas path mechanism, 11 is a nozzle assembly, and 14 is a water purification and cooling mechanism.
Detailed Description
The invention is further illustrated below with reference to the accompanying drawings.
As shown in fig. 1, a signal end of the EtherCAT master station is bidirectionally connected to a laser cutting head motor driver through a network port LAN1, the signal end of the laser cutting head motor driver is bidirectionally connected to a port P1 of a POE power supply control board through a network port, and the POE power supply control board is bidirectionally connected to a port P7 of a laser cutting head main control board through a port P4; the laser cutting head main control board internally comprises a PD controller, an EtherCAT communication controller, a first main control board processor, a second main control board processor, a lens motor controller and a signal receiving circuit, wherein the signal output end of the PD controller is connected with the signal input end of the EtherCAT communication controller through a communication line, the EtherCAT communication controller is bidirectionally connected with the first main control board processor through the communication line, the first main control board processor is bidirectionally connected with the second main control board processor through the communication line, and the second main control board processor is bidirectionally connected with the lens motor controller through ports P14, P15, P16 and P17 respectively; the first main control board processor is connected with the sensor control board in a bidirectional mode through an RS485 communication line port P18; the signal output end of the laser cutting head motor driver is connected with the laser cutting head motor through a circuit.
The signal output end of the signal receiving circuit is connected with the signal input end P2 of the second main control board processor through a communication line, and the signal input end P2 of the signal receiving circuit is connected with the signal output end TP1 of the digital capacitance collecting amplifier.
The digital capacitance acquisition amplifier is internally provided with a signal amplification circuit and an LC resonance circuit.
The lens motor controller is connected with the lens motor driving mechanism in a bidirectional mode.
A control board processor is arranged in the sensor control board, and the control board processor is connected with the air pressure sensor, the pollution sensor, the temperature and humidity sensor and the perforation sensor in a bidirectional mode.
And a PSE controller is arranged in the POE power supply control board.
As shown in fig. 2 and 3, a control method of a laser cutting head based on EtherCAT bus multi-axis synchronous motion specifically comprises the following steps:
(1) the EtherCAT master station sends out an instruction according to the model of the processed product;
(2) the first main control board processor judges whether the environmental data is qualified or not, and if the environmental data is qualified, the first main control board processor continues to work; if not, alarming;
(3) the laser cutting head motor driver block and the second main control board processor respectively receive working instructions;
(4) the laser cutting head motor driver controls the laser cutting head motor to move so as to drive the laser cutting head to move up and down;
(5) acquiring the coordinate of the actual height of the laser cutting head by the digital capacitance acquisition amplifier, transmitting the coordinate data to an EtherCAT master station through a signal receiving circuit, judging whether the actual data conforms to the instruction data by the EtherCAT master station, if so, sending an instruction to a motor driver of the laser cutting head, controlling the height of the laser cutting head to be unchanged, and if not, continuing the step (4);
(6) the second main control board processor gives theoretical coordinate parameters of the lens according to the light spot, the focal point and the lens mapping table, and transmits the parameters to the lens motor controller;
(7) the lens motor controller controls a lens motor driving mechanism which drives the lens to move;
(8) the digital capacitance acquisition amplifier acquires the coordinate of the actual height of the lens, and transmits the coordinate data to the second main control board processor through the signal receiving circuit, the second main control board processor judges whether the actual data is consistent with the instruction data, if so, the height of the lens is kept unchanged, and if not, the step (6) is continued;
(9) and after the laser cutting head and the lens reach the instruction target position, the laser cutting head starts laser cutting work.
The first main control board processor judges the environmental data as follows:
(1) the air pressure sensor, the pollution sensor, the temperature and humidity sensor and the perforation sensor transmit the collected data to the control board processor;
(2) the control board processor receives all data for detection and transmits the data to the first main control board processor;
(3) the first main control board processor judges whether the detected data are qualified or not, and if the detected data are qualified, the first main control board processor continues to work; if the signal is not qualified, alarming and transmitting the signal to an EtherCAT main station;
(4) and the EtherCAT master station stops working after receiving the alarm signal.
As shown in fig. 4, in a conventional laser cutting head, an upper lens fixing mechanism 2 and a lower protective lens mechanism 6 are provided at upper and lower ends of the interior of the laser cutting head, respectively, an upper lens fixing mechanism 3 and a lower lens fixing mechanism 4 are provided between the upper lens fixing mechanism 2 and the lower protective lens mechanism 6, and the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 are driven by an upper lens motor driving mechanism 8 and a lower lens motor driving mechanism 9 on one side thereof, respectively.
In embodiment 1, as shown in fig. 5, a positive lens is provided in the upper lens fixing mechanism 3, a negative lens is provided in the lower lens fixing mechanism 4, and a positive lens is provided in the focusing optical element fixing mechanism 5, as required for processing the workpiece 101 and the workpiece 102.
When the workpiece 101 is machined, firstly, a sensor control board detects whether the working environment data is qualified; secondly, the EtherCAT master station calls the height data of the laser cutting head and the technological parameters of the light spot and focus data of the upper lens and the lower lens according to the workpiece 101 and respectively sends instructions to the laser cutting head motor control module and the laser cutting head main control board; then, the laser cutting head motor control module moves the position of the nozzle assembly 11 of the laser cutting head to a distance d from the upper surface of the workpiece 101 according to the process parameters11As shown in figure (a); meanwhile, the main control board of the laser cutting head adjusts the positions of the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 according to the technological parameters, adjusts the distance from the laser focusing spot to the upper surface of the workpiece 101 and the size of the focusing spot, and achieves the distance d required by the required technological parameters12And spot size, as shown in graph (b); finally, the laser cutting head begins to perform laser cutting work.
Similarly, when the workpiece 102 is machined, the EtherCAT master station calls the height data of the laser cutting head and the technological parameters of the light spot and the focus data of the upper lens and the lower lens according to the workpiece 102 and respectively sends instructions to the laser cutting headA cutting head motor control module and a laser cutting head main control board; then, the laser cutting head motor control module moves the position of the nozzle assembly 11 of the laser cutting head to a distance d from the upper surface of the workpiece 102 according to the process parameters110As shown in fig. (c); meanwhile, the main control board of the laser cutting head adjusts the positions of the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 according to the technological parameters, adjusts the distance from the laser focusing spot to the upper surface of the workpiece 102 and the size of the focusing spot, and achieves the distance d required by the required technological parameters120And spot size, as shown in graph (d); finally, the laser cutting head begins to perform laser cutting work.
Wherein, the upper protective lens mechanism 2 can prevent dirt particles from entering the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4. The lower protective mirror mechanism 6 is used to protect the focusing optical element fixing mechanism 5 thereon from dust contamination in laser processing in laser cutting processing. The optical element fixed by the focusing optical element fixing mechanism 5 is a positive lens, and the laser light passing through the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 is focused at a specific position inside the workpiece at a specific spot.
In embodiment 2, as shown in fig. 6, a positive lens is provided in the upper lens fixing mechanism 3, a positive lens is provided in the lower lens fixing mechanism 4, and a positive lens is provided in the focusing optical element fixing mechanism 5, as required for processing the workpiece 201 and the workpiece 202.
When the workpiece 201 is machined, firstly, the sensor control board detects whether the working environment data is qualified; secondly, the EtherCAT master station calls the height data of the laser cutting head and the technological parameters of the light spot and focus data of the upper lens and the lower lens according to the workpiece 201, and respectively sends instructions to the laser cutting head motor control module and the laser cutting head main control board; then, the laser cutting head motor control module moves the position of the nozzle assembly 11 of the laser cutting head to a distance d from the upper surface of the workpiece 201 according to the process parameters21As shown in figure (a); meanwhile, the main control board of the laser cutting head adjusts the positions of the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 according to the technological parameters, and adjusts the distance from the laser focusing spot to the upper surface of the workpiece 201 and the focusing lightThe size of the spot is the distance d required by the required technological parameters22And spot size, as shown in graph (b); finally, the laser cutting head begins to perform laser cutting work.
Similarly, when the workpiece 202 is machined, the EtherCAT master station calls the height data of the laser cutting head and the technological parameters of the light spot and the focus data of the upper lens and the lower lens according to the workpiece 202 and respectively sends instructions to the laser cutting head motor control module and the laser cutting head main control board; then, the laser cutting head motor control module moves the position of the nozzle assembly 11 of the laser cutting head to a distance d from the upper surface of the workpiece 202 according to the process parameters210As shown in fig. (c); meanwhile, the main control board of the laser cutting head adjusts the positions of the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 according to the technological parameters, adjusts the distance from the laser focusing spot to the upper surface of the workpiece 202 and the size of the focusing spot, and achieves the distance d required by the required technological parameters220And spot size, as shown in graph (d); finally, the laser cutting head begins to perform laser cutting work.
Wherein, the upper protective lens mechanism 2 can prevent dirt particles from entering the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4. The lower protective mirror mechanism 6 is used to protect the focusing optical element fixing mechanism 5 thereon from dust contamination in laser processing in laser cutting processing. The optical element fixed by the focusing optical element fixing mechanism 5 is a positive lens, and the laser light passing through the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 is focused at a specific position inside the workpiece at a specific spot.
In embodiment 3, as shown in fig. 7, according to the requirements of processing a workpiece 301 and a workpiece 302, a positive lens is arranged in the upper lens fixing mechanism 3, a positive lens is arranged in the lower lens fixing mechanism 4, a negative lens 33 is additionally arranged between the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4, the position of the negative lens 33 is fixed and immovable, and a positive lens is arranged in the focusing optical element fixing mechanism 5.
When the workpiece 301 is machined, firstly, the sensor control board detects whether the working environment data is qualified; secondly, the EtherCAT main station calls the height data and the upper and lower parts of the laser cutting head according to the workpiece 301The technical parameters of the facula and focus data of the lens respectively send instructions to a laser cutting head motor control module and a laser cutting head main control board; then, the laser cutting head motor control module moves the position of the nozzle assembly 11 of the laser cutting head to a distance d from the upper surface of the workpiece 301 according to the process parameters31As shown in figure (a); meanwhile, the main control board of the laser cutting head adjusts the positions of the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 according to the technological parameters, adjusts the distance from the laser focusing spot to the upper surface of the workpiece 301 and the size of the focusing spot, and achieves the distance d required by the required technological parameters32And spot size, as shown in graph (b); finally, the laser cutting head begins to perform laser cutting work.
Similarly, when the workpiece 302 is machined, the EtherCAT master station calls the height data of the laser cutting head and the technological parameters of the light spot and the focus data of the upper lens and the lower lens according to the workpiece 302 and respectively sends instructions to the laser cutting head motor control module and the laser cutting head main control board; the laser cutting head motor control module then moves the position of the laser cutting head nozzle assembly 11 to a distance d from the upper surface of the workpiece 302 based on the process parameters310As shown in fig. (c); meanwhile, the main control board of the laser cutting head adjusts the positions of the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 according to the technological parameters, adjusts the distance from the laser focusing spot to the upper surface of the workpiece 302 and the size of the focusing spot, and achieves the distance d required by the required technological parameters320And spot size, as shown in graph (d); finally, the laser cutting head begins to perform laser cutting work.
Wherein, the upper protective lens mechanism 2 can prevent dirt particles from entering the upper lens fixing mechanism 3, the negative lens 33 and the lower lens fixing mechanism 4. The lower protective mirror mechanism 6 is used to protect the focusing optical element fixing mechanism 5 thereon from dust contamination in laser processing in laser cutting processing. The optical element fixed by the focusing optical element fixing mechanism 5 is a positive lens, and the laser light passing through the upper lens fixing mechanism 3, the negative lens 33 and the lower lens fixing mechanism 4 is focused at a specific position inside the workpiece at a specific spot.
In embodiment 4, as shown in fig. 8, according to the need of processing a workpiece 401 and a workpiece 402, a negative lens is provided in the upper lens fixing mechanism 3, a negative lens is provided in the lower lens fixing mechanism 4, a positive lens 44 is added between the upper lens fixing mechanism 3 and the upper protective lens mechanism 2, another positive lens 45 is added between the lower lens fixing mechanism 4 and the focusing optical element fixing mechanism 5, the positions of the positive lens 44 and the other positive lens 45 are fixed and immovable, and a positive lens is provided in the focusing optical element fixing mechanism 5.
When the workpiece 401 is machined, firstly, a sensor control board detects whether the working environment data is qualified; secondly, the EtherCAT master station calls the height data of the laser cutting head and the technological parameters of the light spot and focus data of the upper and lower lenses according to the workpiece 401, and respectively sends instructions to the laser cutting head motor control module and the laser cutting head main control board; then, the laser cutting head motor control module moves the position of the nozzle assembly 11 of the laser cutting head to a distance d from the upper surface of the workpiece 401 according to the process parameters41As shown in figure (a); meanwhile, the main control board of the laser cutting head adjusts the positions of the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 according to the technological parameters, adjusts the distance from the laser focusing spot to the upper surface of the workpiece 401 and the size of the focusing spot, and achieves the distance d required by the required technological parameters42And spot size, as shown in graph (b); finally, the laser cutting head begins to perform laser cutting work.
Similarly, when the workpiece 402 is machined, the EtherCAT master station calls the height data of the laser cutting head and the technological parameters of the light spot and the focus data of the upper lens and the lower lens according to the workpiece 402 and respectively sends instructions to the laser cutting head motor control module and the laser cutting head main control board; the laser cutting head motor control module then moves the position of the laser cutting head nozzle assembly 11 to a distance d from the upper surface of the workpiece 402 based on the process parameters410As shown in fig. (c); meanwhile, the main control board of the laser cutting head adjusts the positions of the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 according to the technological parameters, adjusts the distance from the laser focusing spot to the upper surface of the workpiece 402 and the size of the focusing spot, and achieves the distance d required by the required technological parameters420And spot size, as shown in graph (d); finally, the laser cutting head begins to perform laser cutting work.
The upper protective lens mechanism 2 can prevent dirt particles from entering the upper lens fixing mechanism 3, the positive lens 44, the lower lens fixing mechanism 4 and the other positive lens 45. The lower protective mirror mechanism 6 is used to protect the focusing optical element fixing mechanism 5 thereon from dust contamination in laser processing in laser cutting processing. The optical element fixed by the focusing optical element fixing mechanism 5 is a positive lens, and the laser light passing through the upper lens fixing mechanism 3, the positive lens 44, the lower lens fixing mechanism 4 and the other positive lens 45 is focused at a specific position inside the workpiece at a specific spot.
In embodiment 5, as shown in fig. 9, according to the need of processing a workpiece 501 and a workpiece 502, a negative lens is provided in the upper lens fixing mechanism 3, a positive lens is provided in the lower lens fixing mechanism 4, a positive lens 55 is added between the upper lens fixing mechanism 3 and the upper protective lens mechanism 2, the position of the positive lens 55 is fixed and immovable, and two positive and negative lenses are provided in the focusing optical element fixing mechanism 5.
When the workpiece 501 is machined, firstly, the sensor control board detects whether the working environment data is qualified; secondly, the EtherCAT master station calls the height data of the laser cutting head and the technological parameters of the light spot and focus data of the upper lens and the lower lens according to the workpiece 501, and respectively sends instructions to the laser cutting head motor control module and the laser cutting head main control board; the laser cutting head motor control module then moves the position of the laser cutting head nozzle assembly 11 to a distance d from the upper surface of the workpiece 501 based on the process parameters51As shown in figure (a); meanwhile, the main control board of the laser cutting head adjusts the positions of the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 according to the technological parameters, adjusts the distance from the laser focusing spot to the upper surface of the workpiece 501 and the size of the focusing spot, and achieves the distance d required by the required technological parameters52And spot size, as shown in graph (b); finally, the laser cutting head begins to perform laser cutting work.
Similarly, when machining the workpiece 502, the EtherCAT master station retrieves the laser cutting head from the workpiece 502The height data and the technological parameters of the facula and the focus data of the upper and lower lenses respectively send instructions to a laser cutting head motor control module and a laser cutting head main control board; the laser cutting head motor control module then moves the position of the laser cutting head nozzle assembly 11 to a distance d from the upper surface of the workpiece 502 based on the process parameters510As shown in fig. (c); meanwhile, the main control board of the laser cutting head adjusts the positions of the upper lens fixing mechanism 3 and the lower lens fixing mechanism 4 according to the technological parameters, adjusts the distance from the laser focusing spot to the upper surface of the workpiece 502 and the size of the focusing spot, and achieves the distance d required by the required technological parameters520And spot size, as shown in graph (d); finally, the laser cutting head begins to perform laser cutting work.
Wherein, the upper protective lens mechanism 2 can prevent dirt particles from entering the upper lens fixing mechanism 3, the positive lens 55 and the lower lens fixing mechanism 4. The lower protective mirror mechanism 6 is used to protect the focusing optical element fixing mechanism 5 thereon from dust contamination in laser processing in laser cutting processing. The optical elements fixed by the focusing optical element fixing mechanism 5 are a positive lens and a negative lens, and the laser passing through the upper lens fixing mechanism 3, the positive lens 55 and the lower lens fixing mechanism 4 is focused at a specific position in the workpiece by a specific spot.
According to the control method, the height of the laser cutting head, the positions of the light spot and the focus can be automatically controlled by using the existing laser cutting head, the whole laser cutting process is dynamically monitored and corresponding process key parameters are collected by using the EtherCAT bus technology, the parameters such as the diameter size of the light spot, the position of the focus and the like are automatically adjusted without any manual intervention according to the characteristics of cutting materials, and high-quality, high-efficiency and low-cost rapid processing on materials with different materials and different thicknesses can be realized.
Claims (8)
1. The utility model provides a control system of laser cutting head based on EtherCAT bus multiaxis synchronous motion, includes EtherCAT main website, POE power supply control panel, laser cutting head main control board, sensor control panel, digital capacitance collecting amplifier, laser cutting head motor drive, its characterized in that: the signal end of the EtherCAT master station is bidirectionally connected with a laser cutting head motor driver through a network port LAN1, the signal end of the laser cutting head motor driver is bidirectionally connected with a port P1 of a POE power supply control board through the network port, and the POE power supply control board is bidirectionally connected with a port P7 of a laser cutting head main control board through a port P4; the laser cutting head main control board internally comprises a PD controller, an EtherCAT communication controller, a first main control board processor, a second main control board processor, a lens motor controller and a signal receiving circuit, wherein the signal output end of the PD controller is connected with the signal input end of the EtherCAT communication controller through a communication line, the EtherCAT communication controller is bidirectionally connected with the first main control board processor through the communication line, the first main control board processor is bidirectionally connected with the second main control board processor through the communication line, and the second main control board processor is bidirectionally connected with the lens motor controller through ports P14, P15, P16 and P17 respectively; the first main control board processor is connected with the sensor control board in a bidirectional mode through an RS485 communication line port P18; and the signal output end of the laser cutting head motor driver is connected with a laser cutting head motor through a circuit.
2. The control system of the laser cutting head based on EtherCAT bus multiaxis synchronous motion of claim 1, characterized in that: the signal output end of the signal receiving circuit is connected with the signal input end P2 of the second main control board processor through a communication line, and the signal input end P2 of the signal receiving circuit is connected with the signal output end TP1 of the digital capacitance collecting amplifier.
3. The control system of the laser cutting head based on EtherCAT bus multiaxis synchronous motion of claim 2, characterized in that: and a signal amplification circuit and an LC resonance circuit are arranged in the digital capacitance acquisition amplifier.
4. The control system of the laser cutting head based on EtherCAT bus multiaxis synchronous motion of claim 1, characterized in that: the lens motor controller is connected with the lens motor driving mechanism in a bidirectional mode.
5. The control system of the laser cutting head based on EtherCAT bus multiaxis synchronous motion of claim 1, characterized in that: the sensor control panel is internally provided with a control panel processor which is connected with the air pressure sensor, the pollution sensor, the temperature and humidity sensor and the perforation sensor in a bidirectional way.
6. The control system of the laser cutting head based on EtherCAT bus multiaxis synchronous motion of claim 1, characterized in that: and a PSE controller is arranged in the POE power supply control board.
7. The control system of the laser cutting head based on EtherCAT bus multiaxis synchronous motion of claim 1, characterized in that: the specific control method comprises the following steps:
(1) the EtherCAT master station sends out an instruction according to the model of the processed product;
(2) the first main control board processor judges whether the environmental data is qualified or not, and if the environmental data is qualified, the first main control board processor continues to work; if not, alarming;
(3) the laser cutting head motor driver and the second main control board processor respectively receive working instructions;
(4) the laser cutting head motor driver controls the laser cutting head motor to move so as to drive the laser cutting head to move up and down;
(5) acquiring the coordinate of the actual height of the laser cutting head by the digital capacitance acquisition amplifier, transmitting the coordinate data to an EtherCAT master station through a signal receiving circuit, judging whether the actual data conforms to the instruction data by the EtherCAT master station, if so, sending an instruction to a motor driver of the laser cutting head, controlling the height of the laser cutting head to be unchanged, and if not, continuing the step (4);
(6) the second main control board processor gives theoretical coordinate parameters of the lens according to the light spot, the focal point and the lens mapping table, and transmits the parameters to the lens motor controller;
(7) the lens motor controller controls a lens motor driving mechanism which drives the lens to move;
(8) the digital capacitance acquisition amplifier acquires the coordinate of the actual height of the lens, and transmits the coordinate data to the second main control board processor through the signal receiving circuit, the second main control board processor judges whether the actual data is consistent with the instruction data, if so, the height of the lens is kept unchanged, and if not, the step (6) is continued;
(9) and after the laser cutting head and the lens reach the instruction target position, the laser cutting head starts laser cutting work.
8. The control system of the laser cutting head based on EtherCAT bus multiaxis synchronous motion of claim 7, characterized in that: the first main control board processor judges the environmental data as follows:
(1) the air pressure sensor, the pollution sensor, the temperature and humidity sensor and the perforation sensor transmit the collected data to the control board processor;
(2) the control board processor receives all data for detection and transmits the data to the first main control board processor;
(3) the first main control board processor judges whether the detected data are qualified or not, and if the detected data are qualified, the first main control board processor continues to work; if the signal is not qualified, alarming and transmitting the signal to an EtherCAT main station;
(4) and the EtherCAT master station stops working after receiving the alarm signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810606944.1A CN108838522B (en) | 2018-06-13 | 2018-06-13 | Laser cutting head control system based on EtherCAT bus multi-axis synchronous motion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810606944.1A CN108838522B (en) | 2018-06-13 | 2018-06-13 | Laser cutting head control system based on EtherCAT bus multi-axis synchronous motion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108838522A CN108838522A (en) | 2018-11-20 |
| CN108838522B true CN108838522B (en) | 2020-07-03 |
Family
ID=64210981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810606944.1A Active CN108838522B (en) | 2018-06-13 | 2018-06-13 | Laser cutting head control system based on EtherCAT bus multi-axis synchronous motion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108838522B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111992900A (en) * | 2020-07-07 | 2020-11-27 | 河南通用智能装备有限公司 | Silicon wafer laser cutting management system and method |
| CN112346416B (en) * | 2020-10-19 | 2022-09-20 | 苏州创鑫激光科技有限公司 | Laser device based on EtherCAT bus and control device and system thereof |
| CN112817272A (en) * | 2021-01-05 | 2021-05-18 | 新代科技(苏州)有限公司 | Bus stepping driving and controlling integrated laser welding control equipment |
| CN113953684B (en) * | 2021-11-18 | 2024-06-21 | 上海维宏智能技术有限公司 | System, method, device, processor and computer readable storage medium for realizing laser cutting position synchronous control |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101774083A (en) * | 2010-02-08 | 2010-07-14 | 重庆斯沃德光电设备设计制造有限公司 | Multifunctional laser digital-control processing system |
| CN201979219U (en) * | 2010-12-30 | 2011-09-21 | 杭州中科新松光电有限公司 | Laser welding machine tool |
| CN102528288A (en) * | 2012-02-17 | 2012-07-04 | 上海柏楚电子科技有限公司 | Method for digital closed-loop control capacitance raising system |
| CN202583811U (en) * | 2012-04-21 | 2012-12-05 | 中国电子科技集团公司第四十八研究所 | Multi-shaft synchronous-motion control system based on Ether CAT bus technology |
| CN202845981U (en) * | 2012-09-26 | 2013-04-03 | 武汉法利莱切割系统工程有限责任公司 | White body roof laser brazing technique control device |
| CN102306009B (en) * | 2011-04-21 | 2013-04-24 | 中国电子科技集团公司第十四研究所 | Fitting incremental forming control system and method |
| CN203658796U (en) * | 2013-09-30 | 2014-06-18 | 天津市中环电子计算机有限公司 | Multi-axis movement control system development platform |
| CN203751530U (en) * | 2013-12-25 | 2014-08-06 | 武汉高能激光设备制造有限公司 | Laser cutting assembly capable of automatically following focus |
| CN104759736A (en) * | 2014-01-07 | 2015-07-08 | 中国国际海运集装箱(集团)股份有限公司 | Container corrugated plate welding robot and visual servo control system thereof |
| CN105137916A (en) * | 2015-09-09 | 2015-12-09 | 华中科技大学 | Vibrating mirror type laser scanning large-format material forming processing control system |
| CN204925765U (en) * | 2015-09-09 | 2015-12-30 | 华中科技大学 | Mirror of shaking laser scanning is flooring forming work control system by a wide margin |
| US9321128B2 (en) * | 2009-07-28 | 2016-04-26 | The United States Of America As Represented By The Secretary Of The Navy | High power laser system |
| CN105700465A (en) * | 2014-11-26 | 2016-06-22 | 中国科学院沈阳自动化研究所 | Robot compliance control system and method based on EtherCAT bus |
| CN205543668U (en) * | 2015-12-30 | 2016-08-31 | 常州天正工业发展有限公司 | Laser device control system |
| CN105988409A (en) * | 2015-02-11 | 2016-10-05 | 广东顺德华焯机械科技有限公司 | Numerical control system based on EtherCat bus communication and soft PLC platform |
| CN106502212A (en) * | 2016-10-20 | 2017-03-15 | 大族激光科技产业集团股份有限公司 | A kind of integrated numerical-control system of laser Digit Control Machine Tool |
| CN106873604A (en) * | 2017-04-18 | 2017-06-20 | 中国科学院重庆绿色智能技术研究院 | Intelligent multi-robot control system based on wireless telecommunications |
| CN107677205A (en) * | 2017-09-29 | 2018-02-09 | 桂林电子科技大学 | A kind of laser measurement system and method based on industrial robot |
-
2018
- 2018-06-13 CN CN201810606944.1A patent/CN108838522B/en active Active
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9321128B2 (en) * | 2009-07-28 | 2016-04-26 | The United States Of America As Represented By The Secretary Of The Navy | High power laser system |
| CN101774083A (en) * | 2010-02-08 | 2010-07-14 | 重庆斯沃德光电设备设计制造有限公司 | Multifunctional laser digital-control processing system |
| CN201979219U (en) * | 2010-12-30 | 2011-09-21 | 杭州中科新松光电有限公司 | Laser welding machine tool |
| CN102306009B (en) * | 2011-04-21 | 2013-04-24 | 中国电子科技集团公司第十四研究所 | Fitting incremental forming control system and method |
| CN102528288A (en) * | 2012-02-17 | 2012-07-04 | 上海柏楚电子科技有限公司 | Method for digital closed-loop control capacitance raising system |
| CN202583811U (en) * | 2012-04-21 | 2012-12-05 | 中国电子科技集团公司第四十八研究所 | Multi-shaft synchronous-motion control system based on Ether CAT bus technology |
| CN202845981U (en) * | 2012-09-26 | 2013-04-03 | 武汉法利莱切割系统工程有限责任公司 | White body roof laser brazing technique control device |
| CN203658796U (en) * | 2013-09-30 | 2014-06-18 | 天津市中环电子计算机有限公司 | Multi-axis movement control system development platform |
| CN203751530U (en) * | 2013-12-25 | 2014-08-06 | 武汉高能激光设备制造有限公司 | Laser cutting assembly capable of automatically following focus |
| CN104759736A (en) * | 2014-01-07 | 2015-07-08 | 中国国际海运集装箱(集团)股份有限公司 | Container corrugated plate welding robot and visual servo control system thereof |
| CN105700465A (en) * | 2014-11-26 | 2016-06-22 | 中国科学院沈阳自动化研究所 | Robot compliance control system and method based on EtherCAT bus |
| CN105988409A (en) * | 2015-02-11 | 2016-10-05 | 广东顺德华焯机械科技有限公司 | Numerical control system based on EtherCat bus communication and soft PLC platform |
| CN204925765U (en) * | 2015-09-09 | 2015-12-30 | 华中科技大学 | Mirror of shaking laser scanning is flooring forming work control system by a wide margin |
| CN105137916A (en) * | 2015-09-09 | 2015-12-09 | 华中科技大学 | Vibrating mirror type laser scanning large-format material forming processing control system |
| CN205543668U (en) * | 2015-12-30 | 2016-08-31 | 常州天正工业发展有限公司 | Laser device control system |
| CN106502212A (en) * | 2016-10-20 | 2017-03-15 | 大族激光科技产业集团股份有限公司 | A kind of integrated numerical-control system of laser Digit Control Machine Tool |
| CN106873604A (en) * | 2017-04-18 | 2017-06-20 | 中国科学院重庆绿色智能技术研究院 | Intelligent multi-robot control system based on wireless telecommunications |
| CN107677205A (en) * | 2017-09-29 | 2018-02-09 | 桂林电子科技大学 | A kind of laser measurement system and method based on industrial robot |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108838522A (en) | 2018-11-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108838522B (en) | Laser cutting head control system based on EtherCAT bus multi-axis synchronous motion | |
| CN107030352B (en) | Welding seam tracking visual sensor based on laser structured light | |
| CN110834145B (en) | Control system for realizing full-closed-loop focusing of high-power laser cutting head | |
| CN110976436A (en) | Laser cleaning equipment is tracked to distance | |
| CN105798911A (en) | Mechanical arm moving control system for automatic lathe | |
| CN211028836U (en) | Automatic assembly system of six-axis industrial robot | |
| CN109807472B (en) | Laser cutting equipment capable of being controlled remotely | |
| CN106735878A (en) | The laser process equipment and its method of cell phone rear cover and frame | |
| CN208929789U (en) | Automatic tool changer structure | |
| CN104669064A (en) | CNC vision aided machining system and method | |
| CN101898253B (en) | Numerical control machine | |
| CN106425115B (en) | A kind of laser process equipment and its device for detecting laser beam perforation | |
| CN106932410A (en) | A kind of high accuracy minute surface automatic checkout equipment and its method of work | |
| CN202517193U (en) | Multi-vibration-lens laser etching machine | |
| CN211589356U (en) | Orthogonal linear motor platform | |
| CN204771142U (en) | Laser machine ware people | |
| CN106670652A (en) | Laser coaxial processing device and method | |
| CN211804387U (en) | Control system for realizing full closed-loop focusing of high-power laser cutting head | |
| KR101936410B1 (en) | Part process method and part process system with remote monitoring and remote control | |
| CN113514476B (en) | Automatic monitoring device for pollution of vibrating mirror protection lens | |
| CN206609796U (en) | A kind of high cleanliness minute surface automatic checkout equipment | |
| CN114406510A (en) | Laser head focusing control device and system | |
| CN113953850A (en) | Processing equipment for fixed-diameter circular ring workpieces | |
| CN105171247A (en) | Cage type structure fully-sealed laser three-dimensional cutting head suitable for manipulator | |
| CN105159157A (en) | Video-assisted system for industrial manipulator remote control |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 200241 No. 1000, Lanxiang Hunan Road, Minhang District, Shanghai Patentee after: SHANGHAI FRIENDESS ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 200240 No. 953 lane, Jianchuan Road, Minhang District, Shanghai 322 Patentee before: SHANGHAI FRIENDESS ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |