CN111992900A - Silicon wafer laser cutting management system and method - Google Patents
Silicon wafer laser cutting management system and method Download PDFInfo
- Publication number
- CN111992900A CN111992900A CN202010647481.0A CN202010647481A CN111992900A CN 111992900 A CN111992900 A CN 111992900A CN 202010647481 A CN202010647481 A CN 202010647481A CN 111992900 A CN111992900 A CN 111992900A
- Authority
- CN
- China
- Prior art keywords
- cutting
- subprogram
- data
- circuit
- equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to a silicon wafer laser cutting management system which comprises a data operation main program, an operation interface subprogram, an internal data communication subprogram, an external data communication subprogram, a data operation subprogram, an I/O communication port subprogram, a hardware driving subprogram, a data storage subprogram, a graph acceleration processing subprogram, an interrupt instruction-based data detection subprogram and an interrupt instruction-based data detection subprogram. The operation method comprises three steps of hardware system prefabrication, software system prefabrication, cutting operation and the like. On one hand, the invention can effectively save the data storage space and reduce the requirements of data processing on a hardware system, thereby greatly improving the universality and the use reliability of the system; on the other hand, when laser cutting is carried out, the laser focus always moves along with the cutting shaft, the consistency of the laser cutting depth is ensured, and the cutting error is automatically repaired, so that the working efficiency and the precision of cutting operation are greatly improved.
Description
Technical Field
The invention relates to a silicon wafer cutting system and silicon wafer cutting equipment, and belongs to the field of laser micromachining.
Background
At present, in the laser cutting processing preparation operation of silicon wafers, the adopted traditional laser cutting equipment system can only carry out single cutting at a specific power and a specific cutting height in the single cutting process or carry out multiple cutting processes, the material thickness of a single silicon wafer cannot be absolutely uniform, the hardware precision of the equipment cannot be absolutely parallel to a laser cutting point, the focus of laser cannot be guaranteed to be in an optimal position at each time, the cutting depth is inconsistent, the failure rate of cutting is high, the working efficiency, the processing quality and the yield of the current silicon wafer laser cutting are relatively low, the material loss is relatively serious, and the processing cost is relatively high.
Therefore, in view of the current situation, a new technology is needed to be developed to overcome the defects of the traditional technology and equipment in silicon wafer cutting, and improve the working efficiency and precision of silicon wafer processing operation.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a brand-new laser cutting management system and method for silicon wafers, so as to overcome the defects of the traditional process and equipment in cutting the silicon wafers and improve the working efficiency and precision of silicon wafer processing operation. In order to achieve the purpose, the invention is realized by the following technical scheme:
a silicon wafer laser cutting management system comprises a data operation main program, a control interface subprogram, an internal data communication subprogram, an external data communication subprogram, a data operation subprogram, an I/O communication port subprogram, a hardware drive subprogram, a data storage subprogram, a graph acceleration processing subprogram, a data detection subprogram based on an interrupt instruction and a data detection subprogram based on the interrupt instruction, wherein the data operation main program establishes data connection with the control interface subprogram, the external data communication subprogram, the data operation subprogram, the I/O communication port subprogram, the hardware drive subprogram, the data storage subprogram and the graph acceleration processing subprogram through the internal data communication subprogram, the data detection subprogram based on the interrupt instruction and the data detection subprogram based on the interrupt instruction establish data connection with the data operation main program and the data storage subprogram respectively, the I/O communication port subprogram and the hardware driving subprogram are respectively in data connection with a cutting equipment external circuit system, and the I/O communication port subprogram and the external data communication subprogram are in data connection with a cutting equipment data communication circuit.
Furthermore, the external circuit system of the cutting equipment comprises any one or more of a motor driving circuit, a laser cutting equipment driving circuit, a monitoring camera driving circuit, a sensor system operation circuit and an instrument circuit system.
Furthermore, the monitoring camera driving circuit comprises a CCD monitoring camera circuit and a 3D scanning camera circuit; the sensor system operation circuit comprises any one or more of a displacement sensor, a pressure sensor, a temperature sensor, an inclination angle sensor and a photosensitive sensor.
Furthermore, the cutting equipment data communication circuit is any one or two of a serial port communication circuit and an industrial Ethernet communication circuit.
An operation method of a silicon wafer laser cutting management system comprises the following steps:
s1, prefabricating a hardware system, firstly, operating a data operation main program through an operation interface subprogram, simultaneously driving an I/O communication port subprogram and a hardware driving subprogram to operate by the data operation main program, respectively acquiring hardware identification codes of each hardware circuit and each communication circuit of the cutting equipment, compiling mutually independent data communication addresses for each hardware equipment and each communication equipment of the cutting equipment according to the hardware identification codes, and simultaneously recording corresponding operation driving subprograms for each hardware equipment and each communication equipment of the cutting equipment;
s2, prefabricating a software system, after the step S1 is completed, manipulating the data operation main program through a manipulation interface subprogram, driving the data operation subprogram and the data storage subprogram to operate through the data operation main program, respectively recording a cutting quantity parameter supplementary operation function and a cutting operation execution program into the data operation subprogram and the data storage subprogram through a cutting equipment data communication circuit, and setting corresponding initial cutting parameters;
s3, cutting, namely, after the step S2 is finished, the cutting operation can be carried out after the blank is held and positioned, when the cutting operation is performed, the corresponding cutting operation execution program recorded in the step S2 is selected first, and then the cutting device performs the cutting operation according to the selected cutting operation execution program, in the cutting process, the I/O communication port subprogram collects the actual cutting parameters through a camera and a sensor of the cutting equipment and transmits the collected actual cutting parameters to the data operation subprogram, and then comparing the actual cutting parameters with the initial cutting parameters set in the step S2, and adjusting the operation parameters of the cutting tool of the cutting equipment according to the comparison operation result, so as to achieve the purpose of synchronously adjusting the cutting parameters according to the cutting conditions in the cutting process and improving the cutting operation precision.
Further, in the step S3, the actual cutting parameter collecting process includes:
detecting laser focus focusing parameters, and determining the position of a laser focus on the surface of the wafer by an automatic focusing instrument;
detecting a cutting depth curve, measuring the height of a cutting point by using point laser, forming a relation curve of the cutting speed and the cutting depth according to the speed of a cutting shaft, simultaneously carrying out whole-process video monitoring and three-dimensional coordinate parameter scanning on the cutting operation of a blank to be cut by using a 3D camera, and marking a scanned three-dimensional coordinate value on the relation curve of the cutting speed and the cutting depth;
detecting a cutting depth curve, measuring the height of a cutting point by using point laser, and forming a relation curve of the cutting speed and the cutting depth according to the speed of a cutting shaft;
the power of the external light path is controlled in real time, and the power is adjusted by controlling the motor to rotate and adjust the angle of the polished section during cutting according to the actual cutting process.
Further, in the step S3, in the normal operation of the cutting program, on one hand, the currently executed cutting program may be temporarily adjusted by the data detection subroutine based on the interrupt instruction; and on the other hand, the current cutting operation running state of the cutting equipment of the subprogram temporary terminal is detected through data based on the interrupt instruction.
On one hand, the system has good logical property and high data transmission and processing efficiency, can effectively save the data storage space and reduce the requirements of data processing on a hardware system, and greatly improves the universality and the use reliability of the system; on the other hand, when laser cutting is carried out, the laser focus always moves along with the cutting shaft, the consistency of the laser cutting depth is ensured, and automatic repair of cutting errors is realized, so that the working efficiency and the precision of cutting operation are greatly improved, the processing quality and the yield of silicon wafer products are effectively improved, and the processing cost and the material loss are effectively reduced.
Drawings
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
FIG. 1 is a schematic view of a hair washing structure according to the present invention;
FIG. 2 is a schematic flow chart of the method of the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in FIG. 1, a silicon wafer laser cutting management system comprises a main data operation program 1, a control interface subprogram 2, an internal data communication subprogram 3, an external data communication subprogram 4, a data operation subprogram 5, an I/O communication port subprogram 6, a hardware drive subprogram 7, a data storage subprogram 8, an accelerated graphics processing subprogram 9, a data detection subprogram 10 based on an interrupt instruction and a data detection subprogram 11 based on the interrupt instruction, wherein the main data operation program 1 respectively establishes data connection with the main control interface subprogram 2, the external data communication subprogram 4, the data operation subprogram 5, the I/O communication port subprogram 6, the hardware drive subprogram 7, the data storage subprogram 8 and the accelerated graphics processing subprogram 9 through the internal data communication subprogram 3, and the data detection subprogram 10 based on the interrupt instruction and the data detection subprogram 11 based on the interrupt instruction respectively connect with the main data operation program 1 And the data storage subprogram 8 establishes data connection, the I/O communication port subprogram 6 and the hardware driving subprogram 7 respectively establish data connection with the external circuit system 12 of the cutting equipment, and the I/O communication port subprogram 6 and the external data communication subprogram 4 establish data connection with the data communication circuit 13 of the cutting equipment.
The external circuit 12 system of the cutting device comprises any one or more of a motor driving circuit, a laser cutting device driving circuit, a monitoring camera driving circuit, a sensor system operating circuit and an instrument circuit system.
Further preferably, the monitoring camera driving circuit comprises a CCD monitoring camera circuit and a 3D scanning camera circuit; the sensor system operation circuit comprises any one or more of a displacement sensor, a pressure sensor, a temperature sensor, an inclination angle sensor and a photosensitive sensor.
In addition, the cutting device data communication circuit 13 is any one or two of a serial port communication circuit and an industrial ethernet communication circuit.
As shown in fig. 2, an operation method of a silicon wafer laser cutting management system includes the following steps:
s1, prefabricating a hardware system, firstly, operating a data operation main program through an operation interface subprogram, simultaneously driving an I/O communication port subprogram and a hardware driving subprogram to operate by the data operation main program, respectively acquiring hardware identification codes of each hardware circuit and each communication circuit of the cutting equipment, compiling mutually independent data communication addresses for each hardware equipment and each communication equipment of the cutting equipment according to the hardware identification codes, and simultaneously recording corresponding operation driving subprograms for each hardware equipment and each communication equipment of the cutting equipment;
s2, prefabricating a software system, after the step S1 is completed, manipulating the data operation main program through a manipulation interface subprogram, driving the data operation subprogram and the data storage subprogram to operate through the data operation main program, respectively recording a cutting quantity parameter supplementary operation function and a cutting operation execution program into the data operation subprogram and the data storage subprogram through a cutting equipment data communication circuit, and setting corresponding initial cutting parameters;
s3, cutting, namely, after the step S2 is finished, the cutting operation can be carried out after the blank is held and positioned, when the cutting operation is performed, the corresponding cutting operation execution program recorded in the step S2 is selected first, and then the cutting device performs the cutting operation according to the selected cutting operation execution program, in the cutting process, the I/O communication port subprogram collects the actual cutting parameters through a camera and a sensor of the cutting equipment and transmits the collected actual cutting parameters to the data operation subprogram, and then comparing the actual cutting parameters with the initial cutting parameters set in the step S2, and adjusting the operation parameters of the cutting tool of the cutting equipment according to the comparison operation result, so as to achieve the purpose of synchronously adjusting the cutting parameters according to the cutting conditions in the cutting process and improving the cutting operation precision.
It is to be noted that, in the step S3, the actual cutting parameter acquisition process includes:
detecting laser focus focusing parameters, and determining the position of a laser focus on the surface of the wafer by an automatic focusing instrument;
detecting a cutting depth curve, measuring the height of a cutting point by using point laser, forming a relation curve of the cutting speed and the cutting depth according to the speed of a cutting shaft, simultaneously carrying out whole-process video monitoring and three-dimensional coordinate parameter scanning on the cutting operation of a blank to be cut by using a 3D camera, and marking a scanned three-dimensional coordinate value on the relation curve of the cutting speed and the cutting depth;
detecting a cutting depth curve, measuring the height of a cutting point by using point laser, and forming a relation curve of the cutting speed and the cutting depth according to the speed of a cutting shaft;
the power of the external light path is controlled in real time, and the power is adjusted by controlling the motor to rotate and adjust the angle of the polished section during cutting according to the actual cutting process.
Preferably, in the step S3, in the normal operation of the cutting program, on one hand, the currently executed cutting program may be temporarily adjusted by the data detection subroutine based on the interrupt instruction; and on the other hand, the current cutting operation running state of the cutting equipment of the subprogram temporary terminal is detected through data based on the interrupt instruction.
On one hand, the system has good logical property and high data transmission and processing efficiency, can effectively save the data storage space and reduce the requirements of data processing on a hardware system, and greatly improves the universality and the use reliability of the system; on the other hand, when laser cutting is carried out, the laser focus always moves along with the cutting shaft, the consistency of the laser cutting depth is ensured, and automatic repair of cutting errors is realized, so that the working efficiency and the precision of cutting operation are greatly improved, the processing quality and the yield of silicon wafer products are effectively improved, and the processing cost and the material loss are effectively reduced.
It will be appreciated by persons skilled in the art that the present invention is not limited by the embodiments described above. The foregoing embodiments and description have been presented only to illustrate the principles of the invention. Various changes and modifications can be made without departing from the spirit and scope of the invention. Such variations and modifications are intended to be within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A silicon wafer laser cutting management system is characterized in that: the silicon wafer laser cutting management system comprises a data operation main program, a control interface subprogram, an internal data communication subprogram, an external data communication subprogram, a data operation subprogram, an I/O communication port subprogram, a hardware driving subprogram, a data storage subprogram, a graph acceleration processing subprogram, a data detection subprogram based on an interrupt instruction and a data detection subprogram based on the interrupt instruction, wherein the data operation main program establishes data connection with the control interface subprogram, the external data communication subprogram, the data operation subprogram, the I/O communication port subprogram, the hardware driving subprogram, the data storage subprogram and the graph acceleration processing subprogram through the internal data communication subprogram, the data detection subprogram based on the interrupt instruction and the data detection subprogram based on the interrupt instruction establish data connection with the data operation main program and the data storage subprogram respectively, the I/O communication port subprogram and the hardware driving subprogram are respectively in data connection with an external circuit system of the cutting equipment, and the I/O communication port subprogram and the external data communication subprogram are in data connection with a data communication circuit of the cutting equipment.
2. The laser stealth process of claim 1, wherein: the external circuit system of the cutting equipment comprises any one or more of a motor driving circuit, a laser cutting equipment driving circuit, a monitoring camera driving circuit, a sensor system operating circuit and an instrument circuit system.
3. The laser stealth process of claim 2, wherein: the monitoring camera driving circuit comprises a CCD monitoring camera circuit and a 3D scanning camera circuit; the sensor system operation circuit comprises any one or more of a displacement sensor, a pressure sensor, a temperature sensor, an inclination angle sensor and a photosensitive sensor.
4. The laser stealth process of claim 1, wherein: the cutting equipment data communication circuit is any one or two of a serial port communication circuit and an industrial Ethernet communication circuit.
5. An operation method of a silicon wafer laser cutting management system is characterized in that: the operation method of the silicon wafer laser cutting management system comprises the following steps:
s1, prefabricating a hardware system, firstly, operating a data operation main program through an operation interface subprogram, simultaneously driving an I/O communication port subprogram and a hardware driving subprogram to operate by the data operation main program, respectively acquiring hardware identification codes of each hardware circuit and each communication circuit of the cutting equipment, compiling mutually independent data communication addresses for each hardware equipment and each communication equipment of the cutting equipment according to the hardware identification codes, and simultaneously recording corresponding operation driving subprograms for each hardware equipment and each communication equipment of the cutting equipment;
s2, prefabricating a software system, after the step S1 is completed, manipulating the data operation main program through a manipulation interface subprogram, driving the data operation subprogram and the data storage subprogram to operate through the data operation main program, respectively recording a cutting quantity parameter supplementary operation function and a cutting operation execution program into the data operation subprogram and the data storage subprogram through a cutting equipment data communication circuit, and setting corresponding initial cutting parameters;
s3, cutting, namely, after the step S2 is finished, the cutting operation can be carried out after the blank is held and positioned, when the cutting operation is performed, the corresponding cutting operation execution program recorded in the step S2 is selected first, and then the cutting device performs the cutting operation according to the selected cutting operation execution program, in the cutting process, the I/O communication port subprogram collects the actual cutting parameters through a camera and a sensor of the cutting equipment and transmits the collected actual cutting parameters to the data operation subprogram, and then comparing the actual cutting parameters with the initial cutting parameters set in the step S2, and adjusting the operation parameters of the cutting tool of the cutting equipment according to the comparison operation result, so as to achieve the purpose of synchronously adjusting the cutting parameters according to the cutting conditions in the cutting process and improving the cutting operation precision.
6. The method of claim 5, wherein the method further comprises the steps of: in the step S3, the actual cutting parameter acquisition process includes:
detecting laser focus focusing parameters, and determining the position of a laser focus on the surface of the wafer by an automatic focusing instrument;
detecting a cutting depth curve, measuring the height of a cutting point by using point laser, forming a relation curve of the cutting speed and the cutting depth according to the speed of a cutting shaft, simultaneously carrying out whole-process video monitoring and three-dimensional coordinate parameter scanning on the cutting operation of a blank to be cut by using a 3D camera, and marking a scanned three-dimensional coordinate value on the relation curve of the cutting speed and the cutting depth;
detecting a cutting depth curve, measuring the height of a cutting point by using point laser, and forming a relation curve of the cutting speed and the cutting depth according to the speed of a cutting shaft;
the power of the external light path is controlled in real time, and the power is adjusted by controlling the motor to rotate and adjust the angle of the polished section during cutting according to the actual cutting process.
7. The method of claim 5, wherein the method further comprises the steps of: in the step S3, in the normal operation of the cutting program, on one hand, the currently executed cutting program may be temporarily adjusted by the data detection subroutine based on the interrupt instruction; and on the other hand, the current cutting operation running state of the cutting equipment of the subprogram temporary terminal is detected through data based on the interrupt instruction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010647481.0A CN111992900A (en) | 2020-07-07 | 2020-07-07 | Silicon wafer laser cutting management system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010647481.0A CN111992900A (en) | 2020-07-07 | 2020-07-07 | Silicon wafer laser cutting management system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111992900A true CN111992900A (en) | 2020-11-27 |
Family
ID=73466815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010647481.0A Withdrawn CN111992900A (en) | 2020-07-07 | 2020-07-07 | Silicon wafer laser cutting management system and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111992900A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116494402A (en) * | 2023-06-27 | 2023-07-28 | 江苏京创先进电子科技有限公司 | Wafer circular cutting method and system |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007021558A (en) * | 2005-07-20 | 2007-02-01 | Seiko Epson Corp | Laser beam irradiation apparatus and laser beam scribing method |
| CN102773613A (en) * | 2012-08-28 | 2012-11-14 | 扬州兆喆机电科技有限公司 | Laser cutting numerical control system |
| CN106041335A (en) * | 2016-07-22 | 2016-10-26 | 深圳市德堡数控技术有限公司 | Laser cutting machine and energy control system of laser cutting multilayer composite material |
| CN205888369U (en) * | 2016-07-31 | 2017-01-18 | 秦刚 | But remote control's laser cutting machine |
| CN106746557A (en) * | 2016-12-23 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of diced system and cutting method |
| CN106853554A (en) * | 2015-12-04 | 2017-06-16 | 彭翔 | Intelligent laser system of processing and its processing method |
| CN107491041A (en) * | 2016-06-13 | 2017-12-19 | 陈玉梅 | A kind of YAG Solid State Lasers machining tool control system |
| CN108453373A (en) * | 2016-11-08 | 2018-08-28 | 中国人民解放军空军工程大学航空机务士官学校 | It is cut by laser following control system |
| CN207787994U (en) * | 2017-11-23 | 2018-08-31 | 佛山科学技术学院 | One kind being based on broad band laser frequency domain Three dimensional slots device |
| CN108838522A (en) * | 2018-06-13 | 2018-11-20 | 上海柏楚电子科技股份有限公司 | The control system of laser cutting head based on the movement of EtherCAT bus multi-axial Simultaneous |
| CN110919212A (en) * | 2019-12-12 | 2020-03-27 | 佛山市宏石激光技术有限公司 | Power control method and system of laser cutting machine |
-
2020
- 2020-07-07 CN CN202010647481.0A patent/CN111992900A/en not_active Withdrawn
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007021558A (en) * | 2005-07-20 | 2007-02-01 | Seiko Epson Corp | Laser beam irradiation apparatus and laser beam scribing method |
| CN102773613A (en) * | 2012-08-28 | 2012-11-14 | 扬州兆喆机电科技有限公司 | Laser cutting numerical control system |
| CN106853554A (en) * | 2015-12-04 | 2017-06-16 | 彭翔 | Intelligent laser system of processing and its processing method |
| CN107491041A (en) * | 2016-06-13 | 2017-12-19 | 陈玉梅 | A kind of YAG Solid State Lasers machining tool control system |
| CN106041335A (en) * | 2016-07-22 | 2016-10-26 | 深圳市德堡数控技术有限公司 | Laser cutting machine and energy control system of laser cutting multilayer composite material |
| CN205888369U (en) * | 2016-07-31 | 2017-01-18 | 秦刚 | But remote control's laser cutting machine |
| CN108453373A (en) * | 2016-11-08 | 2018-08-28 | 中国人民解放军空军工程大学航空机务士官学校 | It is cut by laser following control system |
| CN106746557A (en) * | 2016-12-23 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of diced system and cutting method |
| CN207787994U (en) * | 2017-11-23 | 2018-08-31 | 佛山科学技术学院 | One kind being based on broad band laser frequency domain Three dimensional slots device |
| CN108838522A (en) * | 2018-06-13 | 2018-11-20 | 上海柏楚电子科技股份有限公司 | The control system of laser cutting head based on the movement of EtherCAT bus multi-axial Simultaneous |
| CN110919212A (en) * | 2019-12-12 | 2020-03-27 | 佛山市宏石激光技术有限公司 | Power control method and system of laser cutting machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116494402A (en) * | 2023-06-27 | 2023-07-28 | 江苏京创先进电子科技有限公司 | Wafer circular cutting method and system |
| CN116494402B (en) * | 2023-06-27 | 2024-02-02 | 江苏京创先进电子科技有限公司 | Wafer circular cutting method and system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110434671B (en) | Cast member surface machining track calibration method based on characteristic measurement | |
| WO2022022232A1 (en) | Rotating cutter failure state onboard monitoring system and detection method therefor | |
| CN105806251A (en) | Four-axis measuring system based on line laser sensor and measuring method thereof | |
| CN112013787B (en) | Blade three-dimensional contour reconstruction method based on blade self-characteristics | |
| US9043011B2 (en) | Robotic machining apparatus method and system for turbine buckets | |
| CN105081883A (en) | Machining center provided with on-machine detection device and using method of machining center | |
| CN206415478U (en) | A kind of Sepecial holes type spinneret plate perforating press | |
| CN113686268A (en) | Automatic measuring system and method for exhaust area of turbine guider | |
| CN114769988B (en) | Welding control method, system, welding equipment and storage medium | |
| CN114273976B (en) | On-line monitoring intelligent regulation management cloud system of numerical control machining center | |
| CN111338290A (en) | Multi-vision-based five-axis numerical control machine tool multifunctional detection method | |
| CN111992900A (en) | Silicon wafer laser cutting management system and method | |
| JP6868147B1 (en) | Machine tools, detection methods, and detection programs | |
| CN102419157B (en) | Micro-depth-dimension automatic image measuring system | |
| US12013227B2 (en) | System and method for automatically measuring exhaust area of turbine guide vane | |
| CN118386236A (en) | Teaching-free robot autonomous welding polishing method based on combination of line laser scanning and stereoscopic vision | |
| CN111857042A (en) | PMAC-based five-axis high-precision positioning control system and working method | |
| CN116276099A (en) | Intelligent cooperative machining system and method for double robots of large cast part | |
| CN212873274U (en) | Five-axis high-precision positioning control system based on PMAC | |
| CN116000701A (en) | Tool detection device and method capable of being integrated on tool magazine | |
| CN112405115B (en) | Photographing type three-dimensional scanning device and method based on measurement of in-situ position of large part | |
| CN112729182A (en) | Method for establishing coordinate system in three-coordinate measuring electrode | |
| CN221081140U (en) | High-precision motor rotor concentricity adjusting device | |
| JP2004069511A (en) | Method and apparatus for automatically measuring tool | |
| CN110247148B (en) | Screw depth parameter debugging system and method of filter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20201127 |
|
| WW01 | Invention patent application withdrawn after publication |