CN108717935A - Semiconductor packaging device - Google Patents
Semiconductor packaging device Download PDFInfo
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- CN108717935A CN108717935A CN201810511315.0A CN201810511315A CN108717935A CN 108717935 A CN108717935 A CN 108717935A CN 201810511315 A CN201810511315 A CN 201810511315A CN 108717935 A CN108717935 A CN 108717935A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 94
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 93
- 238000012856 packing Methods 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims description 44
- 238000009434 installation Methods 0.000 claims description 24
- 230000033001 locomotion Effects 0.000 claims description 16
- 238000007789 sealing Methods 0.000 abstract description 35
- 238000003754 machining Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 230000035611 feeding Effects 0.000 description 55
- 238000010586 diagram Methods 0.000 description 16
- 230000005540 biological transmission Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 3
- 239000012774 insulation material Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 210000001364 upper extremity Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The present invention relates to technical field of semiconductors.Semiconductor packaging device, including rack components and semiconductor feeding equipment, semiconductor positioning device, conveying robot unit and automatic packing apparatus thereon；Semiconductor positioning device is mutually connected with semiconductor feeding equipment, and automatic packing apparatus is mutually connected with semiconductor positioning device.The advantages of semiconductor packaging device is the encapsulation that can be automatically finished the feeding of semiconductor element device, material cup and heat-sealing film, and complete semiconductor element device, high in machining efficiency.
Description
Technical field
The present invention relates to the production equipments of technical field of semiconductors, especially semiconductor components and devices.
Background technology
It is necessary to which semiconductor components and devices is right in insulation material cup by being put into after semiconductor components and devices production and detection completion
It is sealed afterwards with heat-sealing film.Existing packaged type is as follows：It is moved by manipulator, semiconductor components and devices is put into position one by one and is consolidated
In the feeding chamber of fixed insulation material cup, material cup is regularly arranged multiple, and the insulate feeding chamber of material cup of a row piles semiconductor element
After device, insulation material cup is moved to below hot pressing film device, hot pressing film closes feeding chamber, completes the envelope of semiconductor components and devices
Dress.Deficiency existing for existing semiconductor components and devices sealed in unit is that processing efficiency is low.
Invention content
The object of the present invention is to provide a kind of full-automatic semiconductor packaging devices high in machining efficiency.
To achieve the goals above, the technical solution used in the present invention is：Semiconductor packaging device, including rack components
And semiconductor feeding equipment, semiconductor positioning device, conveying robot unit and automatic packing apparatus thereon；Semiconductor positions
Device is mutually connected with semiconductor feeding equipment, and automatic packing apparatus is mutually connected with semiconductor positioning device；
Semiconductor feeding equipment includes mounting bracket, first motor, gear set and endless apron mechanism and guide wheel tension assembly；Peace
It shelves including two pieces of installation risers and connecting rod, two pieces of installation risers are fixed by the connecting rod connection；Gear set includes that engagement connects
The first gear and second gear connect；Installation riser is fixed in rack components, and first motor is defeated by gear set connection cycle
Tape-feed；Endless apron mechanism and guide wheel tension assembly are mounted on mounting bracket, and guide wheel tension assembly connects circulation conveying
Band mechanism；Endless apron mechanism includes the first drive roll, the second drive roll, first conveyer belt, the second conveyer belt, blanking
Slope, side shield, end baffle, end fixed block, entrance shrink slanted bar, entrance positioning strip and material folding channel parts；First actively
Roller and the second drive roll are mounted on by bearing in installation riser；
Material folding channel parts are in the top of second conveyer belt one end, and end baffle is in the top of the second conveyer belt other end, falls
Expect that the top of slope first conveyer belt one end, end baffle are in the top of the first conveyer belt other end, blanking slope is in folder
The lower section of hopper component；First gear connects the first drive roll, and second gear connects the second drive roll；First conveyer belt twines
It is wound on the first drive roll, the second conveyer belt is wrapped on the second drive roll, the fortune of first conveyer belt and the second conveyer belt
Dynamic direction is opposite；
Blanking slope is mounted between two pieces of installation risers, and blanking slope is located above the second conveyer belt, and blanking slope is for holding
Connect the workpiece fallen from first conveyer belt；Side shield is fixed in installation riser, the position of side shield and the second conveying
Band matching, side shield is for the workpiece on regular second conveyer belt；End baffle is fixed at two pieces by end fixed block
Between installation riser, end baffle is located above first conveyer belt and the second conveyer belt, and end baffle will be in first conveyer belt
Workpiece shelves enter in the second conveyer belt；
Entrance shrinks slanted bar and entrance positioning strip is respectively at the both sides of the second conveyer belt, and entrance shrinks slanted bar and is located at the first conveying
Band top, entrance shrink slanted bar one end and are mounted in material folding channel parts, and entrance shrinks the slanted bar other end towards end baffle, passes through
Inclined entrance shrinks the workpiece direction on the second conveyer belt between slanted bar adjustment entrance contraction slanted bar and entrance positioning strip；Enter
There are blanking ports, blanking port to be in the surface on blanking slope between mouth positioning strip and material folding channel parts；Second at blanking port
Higher than the first conveyer belt position at blanking slope, the second conveyer belt position at end baffle, which is less than, to be leaned on for conveyer belt position
First conveyer belt position at close end baffle.
Preferably, material folding channel parts include left fixed plate, right fixed plate, left guide pad, right guide pad, the first infrared biography
Sensor, cylinder guide rod, left spring, right spring, left adjusting screw and right adjusting screw；Left fixed plate and right fixed plate are installed respectively
In one piece of installation riser；Left guide pad is connected with right guide pad by cylinder guide rod, is set between left guide pad and right guide pad
There are feed zone and charge region, feed zone to pass through for workpiece, charge region is parked for workpiece, the first infrared sensor
Position corresponds to charge region, and the first infrared sensor is for confirming whether charge region has workpiece；Left fixed plate passes through left adjusting
Screw connects left guide pad, is arranged with left spring on the cylinder guide rod between left fixed plate and left guide pad, right fixed plate passes through
Right adjusting screw connects right guide pad, is arranged with right spring on the cylinder guide rod between right fixed plate and right guide pad, passes through rotation
The adjusting screw that turns left and right adjusting screw adjust the position between left guide pad and right guide pad, that is, pass through left adjusting screw and the right side
Adjusting screw adjusts the size of feed zone.
Preferably, the end baffle above the second conveyer belt is equipped with and is inclined from first conveyer belt to the second belt direction
Oblique folded plate, folded plate enter the workpiece shelves in first conveyer belt in the second conveyer belt.
Preferably, guide wheel tension assembly connection tensioning guide wheel, tensioning guide wheel is two, and two tensioning guide wheels are separately connected
First conveyer belt and the second conveyer belt, guide wheel tension assembly are tensioned guide wheel to be tensioned the in endless apron mechanism by adjusting
One conveyer belt and the second conveyer belt.
The semiconductor packaging device of above-mentioned technical proposal is used, semiconductor feeding equipment is for realizing semiconductor to be packaged
Feeding function, semiconductor positioning device is for positioning semiconductor to be packaged, and conveying robot unit is for semiconductor charging dress
Set, between semiconductor positioning device and automatic packing apparatus semiconductor workpiece carrying, automatic packing apparatus is for material cup
The heat-sealing of material, the feeding of heat-sealing film and heat-sealing film and material cup.The advantages of semiconductor packaging device is can be automatically finished
The feeding of semiconductor element device, material cup and heat-sealing film, and the encapsulation of semiconductor element device is completed, it is high in machining efficiency.
Description of the drawings
Fig. 1 is the configuration schematic diagram of the embodiment of the present invention.
Fig. 2 is the configuration schematic diagram of the semiconductor feeding equipment of the embodiment of the present invention.
Fig. 3 is the configuration schematic diagram of the endless apron mechanism of the embodiment of the present invention.
Fig. 4 is the semiconductor schematic diagram to be packaged of the embodiment of the present invention.
Fig. 5 is the configuration schematic diagram of the material folding channel parts of the embodiment of the present invention.
Fig. 6 is the configuration schematic diagram of the semiconductor positioning device of the embodiment of the present invention.
Fig. 7 is the configuration schematic diagram of the conveying robot unit of the embodiment of the present invention.
Fig. 8 is the first of the embodiment of the present invention configuration schematic diagram for pipetting manipulator.
Fig. 9 is the second of the embodiment of the present invention configuration schematic diagram for pipetting manipulator.
Figure 10 is the configuration schematic diagram of the automatic packing apparatus of the embodiment of the present invention.
Figure 11 is the configuration schematic diagram of the material cup feeding receiving mechanism of the embodiment of the present invention.
Figure 12 is the configuration schematic diagram of the heat-sealing film feed mechanism of the embodiment of the present invention.
Figure 13 is the configuration schematic diagram of the semiconductor feeding port component of the embodiment of the present invention.
Figure 14 is the configuration schematic diagram of the flanging component of the embodiment of the present invention.
Figure 15 is the structural schematic diagram of the material cup Zou Liao mechanisms of the embodiment of the present invention.
Figure 16 is the configuration schematic diagram of the press mold guide rail of the embodiment of the present invention.
Specific implementation mode
The present invention is described further with embodiment with reference to the accompanying drawings of the specification.
The semiconductor packaging device as shown in Fig. 1-Figure 16, including rack components 1 and semiconductor feeding equipment 2 thereon,
Semiconductor positioning device 3, conveying robot unit 4 and automatic packing apparatus 5；Semiconductor feeding equipment 2 is fixed at rack
On component 1, semiconductor feeding equipment 2 for realizing semiconductor to be packaged feeding function.Semiconductor positioning device 3 and semiconductor
2 phase of feeding equipment is connected, and semiconductor positioning device 3 improves the accuracy of gripping for positioning semiconductor to be packaged.Handling machinery
Arm device 4 is removed for semiconductor workpiece between semiconductor feeding equipment 2, semiconductor positioning device 3 and automatic packing apparatus 5
Fortune.Automatic packing apparatus 5 is connected with 3 phase of semiconductor positioning device, and automatic packing apparatus 5 is for the feeding of material cup, heat-sealing film
The heat-sealing of feeding and heat-sealing film and material cup.
As shown in Fig. 2, Fig. 3, Fig. 4 and Fig. 5, semiconductor feeding equipment 2 include mounting bracket, first motor 22, gear set and
Endless apron mechanism 25 and guide wheel tension assembly 26；Mounting bracket 21 include two pieces of installation risers 211 and connecting rod 212, two pieces
Installation riser 211 is fixedly connected by connecting rod 212；Gear set includes the first gear 23 and second gear 24 of engagement connection；
Installation riser 211 is fixed in rack components 1, and first motor 22 is fixed at by motor mounting rack on mounting bracket, and first
Motor 22 connects endless apron mechanism 25 by gear set；Endless apron mechanism 25 and guide wheel tension assembly 26 are mounted on peace
It shelves on 21, guide wheel tension assembly 26 connects endless apron mechanism 25；Endless apron mechanism 25 includes the first drive roll
251, the second drive roll 252, first conveyer belt 253, the second conveyer belt 254, tensioning guide wheel 255, blanking slope 256, side block
Plate 257, end baffle 258, end fixed block 259, entrance shrink slanted bar 2510, entrance positioning strip 2512 and material folding channel parts
2511；First drive roll 251 and the second drive roll 252 are mounted on by bearing in installation riser 211.
Material folding channel parts 2511 are in the top of 254 one end of the second conveyer belt, and end baffle 258 is in the second conveyer belt
The top of 254 other ends, the top of 256 first conveyer belt of blanking slope, 253 one end, end baffle 258 are in first conveyer belt
The top of 253 other ends, blanking slope 256 are in the lower section of material folding channel parts 2511；The connection of first gear 23 first is actively rolled
Cylinder 251, second gear 24 connect the second drive roll 252, and first gear 23 and second gear 24 form external toothing, and transmission ratio is
1:1 so that the first drive roll 251 and 252 constant speed of the second drive roll rotate backward；First conveyer belt 253 is wrapped in first
On drive roll 251, the second conveyer belt 254 is wrapped on the second drive roll 252, first conveyer belt 253 and the second conveyer belt
254 direction of motion is on the contrary, the direction of motion of first conveyer belt 253 is to illustrate c to the direction of motion of the second conveyer belt 254 is
Illustrate b to.
Blanking slope 256 is mounted between two pieces of installation risers 211, and blanking slope 256 is located on the second conveyer belt 254
Side, blanking slope 256 is for accepting the workpiece fallen from first conveyer belt 253；Side shield 257 is fixed at installation riser
On 211, the position of side shield 257 is matched with the second conveyer belt 254, and side shield 257 is for the work on regular second conveyer belt 254
Part；Between end baffle 258 is fixed at two pieces of installation risers 211 by end fixed block 259, end baffle 258 is located at
First conveyer belt 253 and the top of the second conveyer belt 254, it is defeated that the workpiece shelves in first conveyer belt 253 are entered second by end baffle 258
It send in band 254.
The end baffle 258 of the top of second conveyer belt 254 is equipped with from first conveyer belt 253 to 254 side of the second conveyer belt
To inclined folded plate, folded plate enters the workpiece shelves in first conveyer belt 253 in second conveyer belt 254, and the second conveyer belt 254 is in b
To when movement, the workpiece on the second conveyer belt 254 is fallen on after reaching end baffle 258 in first conveyer belt 253.
Entrance shrinks slanted bar 2510 and entrance positioning strip 2512 is respectively at the both sides of the second conveyer belt 254, and entrance is shunk
Slanted bar 2510 is located at 253 top of first conveyer belt, and entrance shrinks 2510 one end of slanted bar and is mounted in material folding channel parts 2511, entrance
2510 other end of slanted bar is shunk towards end baffle 258, and slanted bar 2510 is shunk by inclined entrance and adjusts entrance contraction slanted bar
The workpiece direction on the second conveyer belt 254 between 2510 and entrance positioning strip 2512, and prevent workpiece is premature from falling into first
On conveyer belt 253；There are blanking ports, blanking port to be in blanking slope between entrance positioning strip 2512 and material folding channel parts 2511
256 surface；
Close end is leaned in 254 position of the second conveyer belt at blanking port higher than 253 position of first conveyer belt at blanking slope 256
254 position of the second conveyer belt at baffle 258 is less than 253 position of first conveyer belt at end baffle 258.
The connection tensioning guide wheel 255 of guide wheel tension assembly 26, tensioning guide wheel 255 is two, and two tensioning guide wheels 255 connect respectively
First conveyer belt 253 and the second conveyer belt 254 are connect, it is defeated that guide wheel tension assembly 26 is tensioned cycle by adjusting tensioning guide wheel 255
First conveyer belt 253 on tape-feed 25 and the second conveyer belt 254.
Material folding channel parts 2511 include left fixed plate 25111, right fixed plate 25110, left guide pad 25112, right guide pad
25117, the first infrared sensor 25113, cylinder guide rod 25114, left spring 25115, right spring 25119, left adjusting screw
25116 and right adjusting screw 25118；Left fixed plate 25111 and right fixed plate 25110 are separately mounted to one piece of installation riser 211
On；Left guide pad 25112 is connected with right guide pad 25117 by cylinder guide rod 25114, left guide pad 25112 and right guide pad
It being equipped with feed zone between 25117 and charge region, feed zone pass through for workpiece, charge region is parked for workpiece, the
One infrared sensor, 25113 position corresponds to charge region, and the first infrared sensor 25113 is for confirming whether charge region has work
Part, convenient for gripping workpiece so as to conveying robot unit 4；Left fixed plate 25111 connects left guide by left adjusting screw 25116
Block 25112 is arranged with left spring 25115 on the cylinder guide rod 25114 between left fixed plate 25111 and left guide pad 25112, right
Fixed plate 25110 connects right guide pad 25117, right fixed plate 25110 and right guide pad 25117 by right adjusting screw 25118
Between cylinder guide rod 25114 on be arranged with right spring 25119, pass through and rotate left adjusting screw 25116 and right adjusting screw
Position between the left guide pad 25112 of 25118 adjustment and right guide pad 25117, that is, pass through left adjusting screw 25116 and right adjusting
Screw 25118 adjusts the size of feed zone, to adapt to various sizes of workpiece.
Semiconductor a shapes to be packaged are as shown in Figure 4.Semiconductor feeding equipment 2 is in use, the driving warp of first motor 22
After external gear pump transmission, first conveyer belt 253 and the second conveyer belt 254 is driven reversely to move at the uniform velocity, in first conveyer belt 253
Workpiece c to moving to left, pass through the posture that entrance shrinks slanted bar 2510 and entrance positioning strip 2512 adjusts workpiece, the work of vertical posture
Part a enters in material folding channel parts 2511 just, and the inappropriate workpiece of posture is shunk the constraint of slanted bar 2510 from entrance by entrance
It is fallen at blanking port between positioning strip 2512 and material folding channel parts 2511, workpiece falls into blanking slope 256, subsequently into second
Conveyer belt 254, workpiece moves right along b, until being fallen on the second conveyer belt 254 after contact end baffle 258 so that workpiece is following
25 shuttling movement of endless conveying belt mechanism, the workpiece of some vertical states, which enters, waits for gripping in material folding channel parts 2511, improper
Workpiece continues cycling through, until entering material folding channel parts 2511；Endless apron mechanism 25 drives semiconductor for recycling, and will partly lead
Body is transported to suitable position and gripping is waited for carry.
As shown in fig. 6, semiconductor positioning device 3 includes fixing bracket 31, the second motor 32, shaft mounting base 33, positioning
Shaft 34, positioning rotor 35, limit card slot 36, positioning plate 37, positioning side plate 38, locating piece 30 and the second infrared sensor
39；Fixing bracket 31 is fixed in rack components 1, and shaft mounting base 33 is arranged on fixing bracket 31, and locating piece 30 is pacified
In shaft mounting base 33, the second motor 32 is mounted on by motor mount in shaft mounting base 33；Positioning rotating shaft 34 is pacified
In shaft mounting base 33, positioning rotor 35 is arranged on positioning rotating shaft 34, and 34 left end of positioning rotating shaft connects the second motor 32
Output shaft, 34 right end of positioning rotating shaft are fixedly connected with limit card slot 36, and positioning rotating shaft 34 is in 37 lower section of positioning plate；Limiting card
Arc groove e is provided on slot 36, arc groove e is matched with 33 right end pillar f of shaft mounting base so that 36 rotation amplitude of limit card slot
It is restricted, to control the corner of positioning rotor 35；Positioning plate 37 is arranged in shaft mounting base 33, and positioning side plate 38 is pacified
On positioning plate 37,38 one end of positioning side plate is against on locating piece 30, and positioning side plate 38 is two pieces of left and right, two pieces of oriented sides
Plate 38 is mounted on by adjusting screw on positioning plate 37, and material passing passage, two pieces of oriented sides are formed between two blocks of positioning side plates 38
Feeding chamber is formed between plate 38 and locating piece 30, material passing passage is connected to feeding chamber, and two blocks of positioning side plates are adjusted by adjusting screw
The size of material passing passage between 38, to adapt to various sizes of workpiece；Second infrared sensor 39 is mounted on locating piece 30, the
Two infrared sensors, 39 position corresponds to feeding chamber, and the second infrared sensor 39 is for confirming in feeding chamber whether there is workpiece；Shaft
Position and the matched through-hole of material passing passage are respectively equipped in mounting base 33 and positioning plate 37,35 position of positioning rotor corresponds to punishment in advance
Channel, positioning rotor 35 are used for the piece-holder in feeding chamber at it between locating piece 30.
Semiconductor positioning device 3 in use, conveying robot unit 4 by workpiece handling to two pieces positioning side plates 38 between
In feeding chamber, the second motor 32 is driven to rotate after being detected by the second infrared sensor 39, to drive positioning rotor 35 to rotate,
Positioning rotor 35 passes through the through-hole in shaft mounting base 33 and positioning plate 37 that workpiece a is clamped in positioning rotor 35 and locating piece
Between 30,
Realize workpiece positioning.The amplitude that positioning rotor 35 rotates is controlled by limit card slot 36, after 36 turns of limit card slot is motionless, instead
It is resetted to rotation.
As shown in Figure 7, Figure 8 and Figure 9, conveying robot unit 4 includes first movement component 41, traversing mounting plate 42, limit
Bit detector 43, first pipette manipulator 44, second pipette manipulator 45, gantry fixed frame 46 and traversing slide 47；First moves
Dynamic 41 level of component is fixedly mounted on gantry fixed frame 46, and gantry fixed frame 46 is fixed in rack components 1, and first moves
Dynamic component 41 is located at 5 top of semiconductor feeding equipment 2, semiconductor positioning device 3 and automatic packing apparatus.
Third motor 48 drives traversing slide 47 to be moved on first movement component 41, and traversing mounting plate 42 is arranged traversing
On slide 47, limit detector 43, second pipette manipulator 45 and first and pipette manipulator 44 on traversing mounting plate 42,
Limit detector 43 is used to control the second distance for pipetting the decline of manipulator 45；First, which pipettes manipulator 44, is used for workpiece from partly
Conductor feeding equipment 2 is transported in semiconductor positioning device 3, and second pipettes manipulator 45 fills for positioning workpiece from semiconductor
3 are set to be transported in automatic packing apparatus 5.
Conveying robot unit 4 is in use, first movement component 41 is driven by third motor 48, through feed screw nut's auxiliary driving
After drive traversing slide 47 to move horizontally, displacement distance can be controlled by limit sensors；Manipulator 44 is pipetted by work by first
Part is transported to from semiconductor feeding equipment 2 in semiconductor positioning device 3, and manipulator 45 is pipetted by workpiece from semiconductor by second
Positioning device 3 is transported in automatic packing apparatus 5.
First, which pipettes manipulator 44, includes the first cylinder 441, the first cylinder fixed seat 442, the first linear guide rail assembly
443, the second cylinder mounting base 444, contact switch 445, the second cylinder 446 and movable chuck 447；The fixation of first cylinder 441 is set
It sets in the first cylinder fixed seat 442, the first cylinder fixed seat 442 is fixed in the first cylinder fixed seat 442, the second gas
Cylinder mounting base 444 is mounted on by the first linear guide rail assembly 443 in the first cylinder fixed seat 442；Contact switch 445 is mounted on
In second cylinder mounting base 444, contact switch 445 is used to control the minimum allowable distance of the second cylinder mounting base 444 decline；Second gas
446 fixing end of cylinder is vertically arranged in the second cylinder mounting base 444, and two movable chucks 447 are fixed at the second cylinder 446
Lower end.
First pipettes manipulator 44 in use, the second cylinder 446 control movable chuck 447 moves, to realize clamping work
Workpiece is transported to semiconductor positioning dress by part by the first cylinder 441 and 48 collective effect of third motor from semiconductor feeding equipment 2
It sets in 3.
Second pipette manipulator 45 include the 4th motor 451, vertical shaft bearing 452, leading screw 453, feed screw nut seat 454,
Second linear guide rail assembly 455, third cylinder 456 and pneumatic chuck 457；4th motor 451 is arranged on traversing mounting plate 42,
456 output shaft of third cylinder is connect with leading screw 453 by shaft coupling；453 upper end of leading screw is mounted in vertical shaft bearing 452, silk
453 lower end of thick stick is mounted in traversing mounting plate 42；Feed screw nut seat 454 is fitted to by screw pair in leading screw 453；
Second linear guide rail assembly 455 includes sliding rail and slide, and the two forms prismatic pair connection, and sliding rail is fixed at traversing mounting plate
In 42, slide is fixedly connected with 454 phase of feed screw nut seat；Third cylinder 456 is fixed on feed screw nut seat 454, third
Collet 458 is arranged in the output axis connection pneumatic chuck 457 of cylinder 456,457 bottom end of pneumatic chuck；
Second pipettes manipulator 45 in use, by screw nut driven, and feed screw nut seat 454 is driven to move up and down, it is mobile away from
It is controlled from the limit detector 43 by being arranged on traversing mounting plate 42；Pneumatic chuck is controlled by 456 inflation/deflation of third cylinder
The folding of 457 upper grips 458, realization pick and place workpiece, are lifted after workpiece is clamped in the decline of pneumatic chuck 457, by third electricity
The workpiece clamped is transported to from semiconductor positioning device 3 in automatic packing apparatus 5 by 451 collective effect of machine 48 and the 4th motor.
As shown in Figure 10, Figure 11, Figure 12, Figure 13, Figure 14, Figure 15 and Figure 16, automatic packing apparatus 5 includes packaging rack
51, material cup feeding receiving mechanism 52, heat-sealing film feed mechanism 53, semiconductor feeding port component 54, flanging component 55, material cup guide rod
56, material cup Zou Liao mechanisms 57 and press mold guide rail 58；Packaging rack 51 is fixed in rack components 1, material cup feeding collecting machine
The setting of structure 52 is in packaging rack 51；The setting of heat-sealing film feed mechanism 53 is in packaging rack 51, heat-sealing film feed mechanism 53
Above press mold guide rail 58, heat-sealing film feed mechanism 53 for realizing heat-sealing film feeding；Semiconductor feeding port component 54 and pressure
Component 55 position in side corresponds to the material cup in press mold guide rail 58, and conveying robot unit 4 is placed at material mouth component 54 on the semiconductor
Workpiece to be packaged, workpiece slide from feeding port component 54 to falling into material cup；Flanging component 55 is used to heat-sealing film being pressed on material
On cup；Material cup guide rod 56 is fixed in packaging rack 51, and material cup guide rod 56 is located at 58 lower section of press mold guide rail, material cup guide rod 56
Position corresponds to material cup, and material cup guide rod 56 is for keeping material cup horizontal；Material cup Zou Liao mechanisms 57 are mounted on 58 lower section of press mold guide rail, material
Bei Zouliao mechanisms 57 are used to material cup realizing step-by-step movement feed motion；Along direction of feed feeding port component 54, the heat-sealing film of material cup
Feed mechanism 53, flanging component 55 are arranged in order；
Automatic packing apparatus 5 is in use, material cup feeding receiving mechanism 52 and material cup Zou Liao mechanisms 57 realize the feeding of material cup, by heat
Sealer feed mechanism 53 realizes the feeding of heat-sealing film, and material cup and heat-sealing film realize synchro-feed, workpiece material mouth group on the semiconductor
It is put into material cup at part 54, each material cup places a semiconductor, by realizing heat sealed package after flanging component 55, after packaging
Workpiece is completed to collect in left end material cup feeding receiving mechanism 52；
Press mold guide rail 58 includes that the first pressure rail 581 and second presses rail 582, the first pressure rail 581 and second that rail 582 is pressed to be mounted on packaging
In rack 51, there are the material cup channels that supply cup passes through between the first pressure pressure rail 582 of rail 581 and second；
First pressure rail 581 includes that rail and first is pressed to push rail on first, and the second pressure rail 582 includes pressure rail and the second pushing on second
Rail, the inner end of pressure rail and the second pushing rail is equipped with inwardly projecting flanging 583 on second, and material cup be in below flanging 583, from
The heat-sealing film g exported on heat-sealing film feed mechanism 53 is pressed in the material cup between two pieces of flanging.
Material cup feeding receiving mechanism 52 includes the 5th motor 520, loading plate 521, loading plate pillar 522, rewinding disk pillar
523, the first rotation seat 524, the second rotation seat 525, the first idler wheel 526, the second idler wheel 527, third idler wheel 528, rubber strip 529
With rewinding disk 5210；Loading plate 521 is mounted in the shaft 5211 of loading plate pillar 522, and loading plate pillar 522 is fixed at
On the one end for packing rack 51；Rewinding disk pillar 523 is fixed on the other end of packaging rack 51, the first rotation seat 524
It is separately positioned on 523 both sides of rewinding disk pillar with the second rotation seat 525；5th motor 520 exports the first idler wheel of axis connection 526,
In packaging rack 51, the second idler wheel 527 is mounted on the first rotation seat 524 setting of 5th motor 520, and third idler wheel 528 is pacified
On the second rotation seat 525；It is realized by rubber strip 529 between first idler wheel 526, the second idler wheel 527 and third idler wheel 528
Synchronous Transmission；Rewinding disk 5210 is arranged on the central shaft of the second rotation seat 525；Heat-sealing film feed mechanism 53, semiconductor feeding
Mouth component 54, flanging component 55, material cup guide rod 56, material cup Zou Liao mechanisms 57 and press mold guide rail 58 are in loading plate 521 and rewinding
Between disk 5210；
52 left end portions of material cup feeding receiving mechanism, that is, rewinding disk 5210 workpiece good for collecting packing, material cup feeding collecting machine
Right end portion, that is, loading plate 521 of structure 52 is for sending out material cup to be packaged.Material cup feeding receiving mechanism 52 is in use, loading plate
It is sky material cup in 521, is packaged material cup in rewinding disk 5210, is driven by the 5th motor 520, the transmission through rubber strip 529,
Rewinding disk 5210 is driven to rotate so that rows of material cup movement.
Heat-sealing film feed mechanism 53 includes hold-down support 531, heat-sealing film material tray 532, fixed seat 533, compresses adjusting screw
534, guide roller 535, swing idler wheel 536 and adjusting block 537；Hold-down support 531 and the setting of fixed seat 533 are in packaging rack 51
On, heat-sealing film material tray 532 is mounted on 531 upper end of hold-down support；Adjusting block 537 is turned with fixed seat 533 by guide roller 535
Axis forms revolute pair connection, swings idler wheel 536 and is mounted on adjusting block 537；Adjusting screw 534 is compressed to be mounted on by screw pair
In fixed seat 533, compresses 534 lower end of adjusting screw and contacted with adjusting block 537；Guide roller 535 and swing idler wheel 536 are located at pressure
58 top of film guide rail；
Heat-sealing film feed mechanism 53 by rotation in use, compress adjusting screw 534 so that adjusting block 537 is to the bottom, to change
Become the angle for swinging idler wheel 536, and heat-sealing film g is wrapped in guide roller 535 and swings on idler wheel 536 so that heat-sealing film g is compressed
In material cup upper limb, heat-sealing film and the frictional force that material cup generates and drive heat-sealing film g feedings.
Semiconductor feeding port component 54 includes blanking track 541 and blanking guiding block 542；The setting of blanking track 541 is being wrapped
Install frame 51 on, blanking track 541 be equipped with the matched horizontal concrete chute 5411 of workpiece shapes and blanking sliding slot 5412, blanking is led
Draw block 542 to be connected on the outlet end of blanking track 541, blanking guiding block 542 is equipped with and the matched guiding of workpiece shapes
Sliding slot, and guiding chute position is matched with blanking sliding slot 5412, workpiece is by blanking sliding slot and blanking guiding block 542 from blanking rail
It is slid into the accommodating chamber of material cup in the horizontal concrete chute in road 541.
Semiconductor feeding port component 54 in use, workpiece by blanking sliding slot and blanking guiding block 542 from blanking track 541
Horizontal concrete chute in slide into material cup accommodating chamber in, wait for heat-sealing be packaged；
Flanging component 55 includes flanging fixed seat 551, flanging frame 552 and flanging idler wheel 553；Flanging fixed seat 551 is fixedly installed
In packaging rack 51, flanging frame 552 forms revolute pair with flanging fixed seat 551 by axis pin and connect, and 552 upper end of flanging frame is logical
Screw 554 is crossed to connect with flanging fixed seat 551；Flanging idler wheel 553 is mounted on flanging frame 552, and 553 position of flanging idler wheel is in
Right over material cup channel；The height of flanging idler wheel 553 is adjusted by screw 554.
Screw 554 adjusts the height of flanging idler wheel 553, and flanging idler wheel 553 contacts heat-sealing film g, while flanging idler wheel 553 has
Heat-sealing film is bonded in material cup by certain temperature, when rolling.
Material cup Zou Liao mechanisms 57 include bearing block 571, indexing drive disk 572 and third infrared sensor 573；5th motor
520 output shaft passes through the connection indexing drive disk 572 of bearing block 571；572 outer ring of indexing drive disk is provided with pillar, and pillar is straight
Diameter is adapted with the circular hole on material cup h, and the circular arc distance of two neighboring pillar on material cup h at a distance from adjacent circular holes it is equal,
So that pillar is inserted in circular hole, rotated by indexing drive disk 572 so that material cup h makees straight-line feed movement；The infrared biography of third
Sensor 573 is fixed in packaging rack 51, corresponding with the graduated disk of 572 end of indexing drive disk, third infrared sensor
573 for controlling indexing 572 stepwise motion of drive disk；
Material cup Zou Liao mechanisms 57 in use, indexing 572 circumference of drive disk on pillar be inserted in the circular hole of charging tray, drive material cup
H makees straight-line feed movement；5th motor 520 drives the transmission of the first idler wheel 526, realizes the movement of material cup feeding receiving mechanism 52,
The two holding moves synchronously.
In use, semiconductor feeding equipment 2 carries out cycle feeding to workpiece, then by conveying robot unit 4 by work
Part is transported to semiconductor positioning device 3 and is positioned, and then again positions workpiece from semiconductor by conveying robot unit 4 and fills
It is transported in setting 3 in automatic packing apparatus 5, the automatic charging of material cup and heat-sealing film is realized in automatic packing apparatus 5, when partly leading
After body falls into material cup, the process that heat-sealing is packaged is realized, then automatic coiling is collected, and completes the packing work to semiconductor.
Claims (4)
1. semiconductor packaging device, it is characterised in that including rack components（1）And semiconductor feeding equipment thereon（2）, partly lead
Body positioning device（3）, conveying robot unit（4）And automatic packing apparatus（5）；Semiconductor positioning device（3）With semiconductor into
Expect device（2）Mutually it is connected, automatic packing apparatus（5）With semiconductor positioning device（3）Mutually it is connected；
Semiconductor feeding equipment（2）Including mounting bracket, first motor（22）, gear set and endless apron mechanism（25）And guide wheel
Tension assembly（26）；Mounting bracket（21）Including two pieces of installation risers（211）And connecting rod（212）, two pieces of installation risers（211）It is logical
Cross connecting rod（212）It is fixedly connected；Gear set includes the first gear of engagement connection（23）And second gear（24）；Installation riser
（211）It is fixed on rack components（1）On, first motor（22）Endless apron mechanism is connected by gear set（25）；It recycles defeated
Tape-feed（25）With guide wheel tension assembly（26）Mounted on mounting bracket（21）On, guide wheel tension assembly（26）Connect circulation conveying
Band mechanism（25）；Endless apron mechanism（25）Including the first drive roll（251）, the second drive roll（252）, first conveying
Band（253）, the second conveyer belt（254）, blanking slope（256）, side shield（257）, end baffle（258）, end fixed block
（259）, entrance shrink slanted bar（2510）, entrance positioning strip（2512）With material folding channel parts（2511）；First drive roll（251）
With the second drive roll（252）It is mounted on installation riser by bearing（211）On；
Material folding channel parts（2511）In the second conveyer belt（254）The top of one end, end baffle（258）In the second conveyer belt
（254）The top of the other end, blanking slope（256）First conveyer belt（253）The top of one end, end baffle（258）In
One conveyer belt（253）The top of the other end, blanking slope（256）In material folding channel parts（2511）Lower section；First gear
（23）Connect the first drive roll（251）, second gear（24）Connect the second drive roll（252）；First conveyer belt（253）It twines
It is wound on the first drive roll（251）On, the second conveyer belt（254）It is wrapped in the second drive roll（252）On, first conveyer belt
（253）With the second conveyer belt（254）The direction of motion it is opposite；
Blanking slope（256）Mounted on two pieces of installation risers（211）Between, blanking slope（256）Positioned at the second conveyer belt（254）
Top, blanking slope（256）For accepting from first conveyer belt（253）On the workpiece that falls；Side shield（257）It is fixed at
Installation riser（211）On, side shield（257）Position and the second conveyer belt（254）Matching, side shield（257）For regular
Two conveyer belts（254）On workpiece；End baffle（258）Pass through end fixed block（259）It is fixed at two pieces of installation risers
（211）Between, end baffle（258）Positioned at first conveyer belt（253）With the second conveyer belt（254）Top, end baffle（258）
By first conveyer belt（253）On workpiece shelves enter the second conveyer belt（254）In；
Entrance shrinks slanted bar（2510）With entrance positioning strip（2512）It is respectively at the second conveyer belt（254）Both sides, entrance receive
Contracting slanted bar（2510）Positioned at first conveyer belt（253）Top, entrance shrink slanted bar（2510）One end is mounted on material folding channel parts
（2511）On, entrance shrinks slanted bar（2510）The other end is towards end baffle（258）, slanted bar is shunk by inclined entrance
（2510）It adjusts entrance and shrinks slanted bar（2510）With entrance positioning strip（2512）Between the second conveyer belt（254）On workpiece side
To；Entrance positioning strip（2512）With material folding channel parts（2511）Between there are blanking ports, blanking port to be in blanking slope（256）'s
Surface；The second conveyer belt at blanking port（254）Position is higher than blanking slope（256）The first conveyer belt at place（253）Position,
Close to end baffle（258）Second conveyer belt at place（254）Position is less than close to end baffle（258）The first conveyer belt at place
（253）Position.
2. semiconductor packaging device according to claim 1, it is characterised in that including being tensioned guide wheel（255）, guide wheel tensioning
Component（26）Connection tensioning guide wheel（255）, it is tensioned guide wheel（255）It is two, two tensioning guide wheels（255）It is defeated to be separately connected first
Send band（253）With the second conveyer belt（254）, guide wheel tension assembly（26）It is tensioned guide wheel by adjusting（255）It is defeated with tensioning cycle
Tape-feed（25）On first conveyer belt（253）With the second conveyer belt（254）.
3. semiconductor packaging device according to claim 1, it is characterised in that the second conveyer belt（254）The end of top is kept off
Plate（258）It is equipped with by first conveyer belt（253）To the second conveyer belt（254）The inclined folded plate in direction, folded plate are conveyed first
Band（253）On workpiece shelves enter the second conveyer belt（254）In.
4. semiconductor packaging device according to claim 1, it is characterised in that material folding channel parts（2511）Including left fixation
Plate（25111）, right fixed plate（25110）, left guide pad（25112）, right guide pad（25117）, the first infrared sensor
（25113）, cylinder guide rod（25114）, left spring（25115）, right spring（25119）, left adjusting screw（25116）With right adjusting
Screw（25118）；Left fixed plate（25111）With right fixed plate（25110）It is separately mounted to one piece of installation riser（211）On；It is left
Guide pad（25112）With right guide pad（25117）Pass through cylinder guide rod（25114）It is connected, left guide pad（25112）With right guide
Block（25117）Between be equipped with feed zone and charge region, the first infrared sensor（25113）Position corresponds to charge region, the
One infrared sensor（25113）For confirming whether charge region has workpiece；Left fixed plate（25111）Pass through left adjusting screw
（25116）Connect left guide pad（25112）, left fixed plate（25111）With left guide pad（25112）Between cylinder guide rod
（25114）On be arranged with left spring（25115）, right fixed plate（25110）Pass through right adjusting screw（25118）Connect right guide pad
（25117）, right fixed plate（25110）With right guide pad（25117）Between cylinder guide rod（25114）On be arranged with right spring
（25119）, by rotating left adjusting screw（25116）With right adjusting screw（25118）Adjust left guide pad（25112）It is led with the right side
Expect block（25117）Between position, that is, pass through left adjusting screw（25116）With right adjusting screw（25118）Adjust feed zone
Size.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810511315.0A CN108717935B (en) | 2018-05-25 | 2018-05-25 | Semiconductor packaging equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810511315.0A CN108717935B (en) | 2018-05-25 | 2018-05-25 | Semiconductor packaging equipment |
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| CN108717935A true CN108717935A (en) | 2018-10-30 |
| CN108717935B CN108717935B (en) | 2020-10-30 |
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| CN102332409A (en) * | 2010-07-13 | 2012-01-25 | 均豪精密工业股份有限公司 | Integrated manufacturing equipment for semiconductor component and manufacturing method thereof |
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| US20150325525A1 (en) * | 2014-05-08 | 2015-11-12 | Globalfoundries Inc. | Forming interconnect structure with polymeric layer and resulting device |
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| CN101093555A (en) * | 2006-06-23 | 2007-12-26 | 矽品精密工业股份有限公司 | Method for preparing electronic equipment |
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| CN108717935B (en) | 2020-10-30 |
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Effective date of registration: 20200927 Address after: No. A9 and A10, fenghuangwan Electronic Information Industrial Park, Xuzhou Economic and Technological Development Zone, 221000 Applicant after: Jiangsu AISI Semiconductor Technology Co.,Ltd. Address before: 315301 No. 1600 West Third Ring Road, Zonghan Street, Cixi City, Ningbo City, Zhejiang Province Applicant before: Wang Jiahai |
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