CN101093555A - Method for preparing electronic equipment - Google Patents
Method for preparing electronic equipment Download PDFInfo
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- CN101093555A CN101093555A CN 200610093188 CN200610093188A CN101093555A CN 101093555 A CN101093555 A CN 101093555A CN 200610093188 CN200610093188 CN 200610093188 CN 200610093188 A CN200610093188 A CN 200610093188A CN 101093555 A CN101093555 A CN 101093555A
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- electronic installation
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Abstract
A method for preparing electronic device includes setting multiple bottom cover body and semiconductor packaged element as well as top cover body on assembling-operation region, providing carry-fixture with multiple positioning unit, placing multiple bottom cover body on said multiple positioning unit, setting semiconductor packaged element and top cover body on bottom cover body, sending carry-fixture with bottom and top cover bodies as well as semiconductor packaged element to combination operation region then combining two said cover bodies on carry-fixture to form electronic device with semiconductor packaged element.
Description
Technical field
The invention relates to a kind of method for making of electronic installation, particularly about a kind of method for making of card-type electronic device.
Background technology
Ultrasonic fusing is a kind of welding mode of Environmental Safety, and it utilizes contact friction to produce heat and makes the plastics adhere, and the shell of present many electronic installations all utilizes this welding mode to carry out combination.
Fig. 1 is traditional secure digital storage card 1 (Secure Digital memory card, be called for short SD card), it comprises: semiconductor package part 11 and the relative lid 101,102 that coats this semiconductor package part 11, and after finishing, assembling carries out ultrasonic fusing, make SD storage card 1.
Above-mentioned assembling mode is undertaken by manual type in early days, yet, by the assembling of manual type, usually cause a deviation because of artificial carelessness, the last acceptance rate that often influences finished product, when deviate is excessive, the SD storage card of making can't be packed in the compatible electronic product.
In recent years, the littler mini-SD card of volume comes out, if still manually assembling, will be bigger for the influence of precision, and also can reduce the speed of production of product.Therefore, the TaiWan, China patent discloses a kind of storage card housing molding structure for No. 572288, meaning will be improved above problem, see also Fig. 2, storage card 2 comprises: lid 21 and lid 22 that links to each other with flexible lug 24 and the semiconductor package part 23 that is mounted on lid 22, by lug 24 lid 21 is equivalent in lid 22, locatees two lids.
But, though aforesaid way can make two lids that separate originally amount to back realization group by lug 24 and set the position, when on production line, making in a large number, the action of amounting to is difficult to utilize the robotization mode to be finished, therefore increased the difficulty of volume production, when particularly carrying out ultrasonic fusing, if two lids are not folded to certain position, the partly situation of welding can take place, and also will increase the cost of manufacture of lid simultaneously.
Therefore, how to improve above various shortcoming, become problem demanding prompt solution.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, fundamental purpose of the present invention is to provide a kind of method for making of electronic installation, adopts full-automatic operation to make the electronic installation with housing.
A further object of the present invention is to provide a kind of method for making of electronic installation, improves the speed of production and the production capacity of electronic installation.
Another object of the present invention is to provide a kind of method for making of electronic installation, improve the precision that group is established between semiconductor package part and corresponding housing thereof.
For realizing above-mentioned and other purpose, the invention provides a kind of method for making of electronic installation, the method for making of this electronic installation is locked in semiconductor package part the housing with relative upper and lower cover body, the method for making of this electronic installation comprises: a plurality of semiconductor package parts, upper cover body and lower cover are provided, and respectively these a plurality of lower covers, semiconductor package part and upper cover body classification configurations in a loading operation district, and a carrying jig is provided, this carrying jig is provided with a plurality of location divisions; Should carry jig by the robotization transmission equipment and be delivered to this loading operation district, and, a plurality of lower covers were positioned at respectively on the location division of this carrying jig, and semiconductor package part and upper cover body be connect place on this lower cover successively by the robotization mode; And be transported in conjunction with the operation area by this carrying jig that the robotization transmission equipment will be carried lower cover, semiconductor package part and upper cover body, to place respectively this upper cover body and lower cover on this carrying jig to carry out, form the electronic installation of sealing semiconductor package part in conjunction with operation.
In addition, the method for making of this electronic installation also comprises by the robotization transmission equipment, and this carrying jig of carrying electronic installation is delivered to the unloading operation district, and this electronic installation is unloaded from this carrying jig; And, this carrying jig of finishing unloading is delivered to the loading operation district by the robotization transmission equipment, continue to utilize this carrying jig sealing semiconductor package part.
This electronic installation is card-type electronic devices such as secure digital storage card.This upper cover body utilizes ultrasonic vibration to be fused to this lower cover, and this location division is provided with a through hole that can be communicated with vacuum extractor, makes to be subjected to absorption to add strong fix when respectively this lower cover carries out ultrasonic fusing.
In actual production, can carry by the circulation of production line, earlier assemble lower cover, semiconductor package part and upper cover body successively by automation equipment, utilizing conveying belt will carry jig again, to be transported to the meet sb. at the airport pressure of carrying out upper and lower cover body of a ultrasonic wave molten, make required electronic installation, then unload this electronic installation, will carry the manufacturing side that jig transports back the assembling lower cover by conveying belt again.
Existing manual type causes when assembling that the product fine rate is on the low side, speed of production and the not good problem of production capacity, the method for making of electronic installation of the present invention is with the full-automatic mode of production, the positioning function of utilizing the carrying jig to provide, make automation equipment set positional parameter at the carrying jig, assembling accurately and in conjunction with each element of electronic installation avoids existing mode to cause the deviation of assembling because of the tired or carelessness of operator.
Moreover, even prior art can be improved assembly error, but the cover body structure of its design is unfavorable for full-automatic operation, the locating effect of the method for making utilization carrying jig of electronic installation of the present invention, each operation area of production line can be finished easily and be put or the combination action, and need not design complicated facility, thereby accelerate speed of production and improved production capacity.
Description of drawings
Fig. 1 is the explosive view of conventional security digital memory card;
Fig. 2 is the storage card synoptic diagram of No. the 572288th, TaiWan, China patent;
Fig. 3 is the method for making schematic flow sheet of electronic installation of the present invention; And
Fig. 4 A to Fig. 4 G is the method for making partial exploded view of electronic installation of the present invention.
Embodiment
Embodiment
Fig. 3 is the method for making schematic flow sheet of electronic installation of the present invention, and Fig. 4 A to Fig. 4 G is the partial schematic diagram of each flow process.
Shown in Fig. 3 and Fig. 4 A, provide a plurality of semiconductor package parts 30 and with these semiconductor package part 30 sealing housing wherein, this housing comprises upper cover body 310 and lower cover 311, and respectively these a plurality of lower covers 311, semiconductor package part 30 and upper cover body 310 classification configurations in loading active region Z1, this loading active region Z1 is provided with the first station S1, the second station S2 and the 3rd station S3, corresponding configuration lower cover 311, semiconductor package part 30 and upper cover body 310.This upper cover body 310, lower cover 311 are working of plastics of injection moulding.
Shown in Fig. 3, Fig. 4 B and Fig. 4 C, other provides a carrying jig 4, this carrying jig 4 is provided with a plurality of location divisions 41, this carrying jig 4 is sent into the robotization transmission equipment of conveying belt 50 for example, the transport path of this conveying belt 50 is by having first station of a plurality of lower covers 311, by robotization mode, a plurality of lower covers 311 are positioned at respectively on a plurality of location divisions 41 of this carrying jig 4 as mechanical arm.This carrying jig 4 places and carries out the assembling of electronic installation on the conveying belt 50 and in conjunction with operation, the location division 41 of this carrying jig 4 is arranged with at these carrying jig 4 end faces, and to groove that should lower cover 311 shapes, respectively this location division 41 is provided with the bottom that through hole 410 is communicated in carrying jig 4.
Shown in Fig. 3 and Fig. 4 D, will carry jig 4 by conveying belt 50 and deliver to second station that has a plurality of semiconductor package parts 30, in the robotization mode,, distinguish ccontaining this semiconductor package part 30 in that respectively this is positioned to carry in the lower cover 311 of jig 4.
Shown in Fig. 3 and Fig. 4 E, to carry jig 4 by conveying belt 50 and deliver to the 3rd station that has a plurality of upper cover body 310, in the robotization mode, in that respectively this is positioned to carry on the lower cover 311 of jig 4, this upper cover body 310 of difference winding, this semiconductor package part 30 is all coated by one group of upper cover body 310, lower cover 311, and this lower cover 311, semiconductor package part 30 and upper cover body 310 all be subjected to the location of this location division 41, can in subsequent delivery, do not produce skew.
Shown in Fig. 3 and Fig. 4 F, will carry jig 4 by conveying belt 50 and be transported in conjunction with operation area Z2, will place respectively this upper cover body 310, lower cover 311 on this carrying jig 4 to carry out in conjunction with operation, form the electronic installation of sealing semiconductor package part 30.This in conjunction with operation area Z2 in, the molten machine 6 of ultrasonic wave pressure makes upper cover body 310 be fused to this lower cover 311 by vibration of ultrasonic wave.In addition, when carrying out welding, can utilize vacuum pump that the through hole 410 of this carrying jig 4 is vacuumized operation, make this lower cover 311 be adsorbed in this carrying jig 4, strengthen locating effect.
Shown in Fig. 3 and Fig. 4 G, to carry jig 4 by conveying belt 50 is transported on the unloading operation district Z3, can utilize robotization mode as mechanical arm thereafter, finish the electronic installation 3 of semiconductor package part 30 assemblings from these carrying jig 4 unloadings, this electronic installation 3 is card-type electronic devices such as SD storage card, and these electronic installations can be placed in the carrier 7 (tray).
Afterwards, can should carry jig 4 by conveying belt 50 again and continue to be transported to loading operation district Z1, proceed the operation of this semiconductor package part 30 of sealing.
Existing manual type is assembled can cause that the product fine rate is on the low side, speed of production and the not good problem of production capacity, the method for making of electronic installation of the present invention is with the full-automatic mode of production, the positioning function of utilizing the carrying jig to provide, make automation equipment set positional parameter at the carrying jig, assembling accurately and in conjunction with each element of electronic installation avoids existing mode to cause the deviation of assembling because of the tired or carelessness of operator.
Moreover, even prior art can be improved assembly error, but the cover body structure of its design is unfavorable for full-automatic operation, the locating effect of the method for making utilization carrying jig of electronic installation of the present invention, each operation area of production line can be finished easily and be put or the combination action, and need not design complicated facility, thereby faster production and raising production capacity.
Claims (14)
1. the method for making of an electronic installation, the method for making of this electronic installation is locked in the housing with relative upper and lower cover body with semiconductor package part, it is characterized in that, and the method for making of this electronic installation comprises:
A plurality of semiconductor package parts, upper cover body and lower cover are provided, and respectively these a plurality of lower covers, semiconductor package part and upper cover body classification configurations in a loading operation district, and provide one the carrying jig, this carrying jig is provided with a plurality of location divisions;
Should carry jig by the robotization transmission equipment and be delivered to this loading operation district, and, a plurality of lower covers were positioned respectively on the location division of this carrying jig, and semiconductor package part and upper cover body be connect put on this lower cover successively by the robotization mode; And
This carrying jig that to carry lower cover, semiconductor package part and upper cover body by the robotization transmission equipment is transported in conjunction with the operation area, to place respectively this upper cover body and lower cover on this carrying jig to carry out, form the electronic installation of sealing semiconductor package part in conjunction with operation.
2. the method for making of electronic installation as claimed in claim 1, it is characterized in that, the method for making of this electronic installation also comprises by the robotization transmission equipment, and this carrying jig of carrying electronic installation is transported to the unloading operation district, and this electronic installation is unloaded from this carrying jig.
3. the method for making of electronic installation as claimed in claim 2 is characterized in that, the method for making of this electronic installation also comprises by the robotization transmission equipment, and this carrying jig of finishing unloading is delivered to the loading operation district, proceeds the operation of electronic installation.
4. the method for making of electronic installation as claimed in claim 2 is characterized in that, this electronic installation that unloads from the carrying jig is attached on the carrier.
5. the method for making of electronic installation as claimed in claim 1 is characterized in that, this loading operation district is provided with first station, second station and the 3rd station, is respectively applied for configuration lower cover, semiconductor package part and upper cover body.
6. the method for making of electronic installation as claimed in claim 1 is characterized in that, this location division is arranged with at this carrying jig end face, and to groove that should the lower cover shape.
7. the method for making of electronic installation as claimed in claim 1 is characterized in that, this lower cover, semiconductor package part and upper cover body all are subjected to the location of this location division, can not cause producing in the subsequent job process skew.
8. the method for making of electronic installation as claimed in claim 1 is characterized in that, this robotization transmission equipment can be a conveying belt.
9. the method for making of electronic installation as claimed in claim 1 is characterized in that, the method for making of this electronic installation is positioned at this lower cover, semiconductor package part and upper cover body on this carrying jig successively by the robotization mode of mechanical arm.
10. the method for making of electronic installation as claimed in claim 2 is characterized in that, the method for making of this electronic installation unloads electronic installation by the robotization mode of mechanical arm from this carrying jig.
11. the method for making of electronic installation as claimed in claim 1 is characterized in that, this makes this upper cover body be fused to this lower cover in conjunction with operation with ultrasonic vibration.
12. the method for making of electronic installation as claimed in claim 1 is characterized in that, this location division is provided with the through hole that is communicated with a vacuum extractor, is adsorbed when making this lower cover carry out in conjunction with operation and adds strong fix.
13. the method for making of electronic installation as claimed in claim 1 is characterized in that, this upper and lower cover body is an injection-moulding plastic.
14. the method for making of electronic installation as claimed in claim 1 is characterized in that, this electronic installation is the secure digital storage card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610093188 CN101093555A (en) | 2006-06-23 | 2006-06-23 | Method for preparing electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610093188 CN101093555A (en) | 2006-06-23 | 2006-06-23 | Method for preparing electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101093555A true CN101093555A (en) | 2007-12-26 |
Family
ID=38991803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610093188 Pending CN101093555A (en) | 2006-06-23 | 2006-06-23 | Method for preparing electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101093555A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103381550A (en) * | 2012-05-02 | 2013-11-06 | 珠海格力电器股份有限公司 | Assembling system and method of remote controller |
| CN108717935A (en) * | 2018-05-25 | 2018-10-30 | 王加骇 | Semiconductor packaging device |
-
2006
- 2006-06-23 CN CN 200610093188 patent/CN101093555A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103381550A (en) * | 2012-05-02 | 2013-11-06 | 珠海格力电器股份有限公司 | Assembling system and method of remote controller |
| CN103381550B (en) * | 2012-05-02 | 2015-11-04 | 珠海格力电器股份有限公司 | Assembling system and method of remote controller |
| CN108717935A (en) * | 2018-05-25 | 2018-10-30 | 王加骇 | Semiconductor packaging device |
| CN108717935B (en) * | 2018-05-25 | 2020-10-30 | 江苏爱矽半导体科技有限公司 | Semiconductor packaging equipment |
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