CN107871828A - Decompression dry device and decompression drying method - Google Patents
Decompression dry device and decompression drying method Download PDFInfo
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- CN107871828A CN107871828A CN201710863857.XA CN201710863857A CN107871828A CN 107871828 A CN107871828 A CN 107871828A CN 201710863857 A CN201710863857 A CN 201710863857A CN 107871828 A CN107871828 A CN 107871828A
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- 230000006837 decompression Effects 0.000 title claims abstract description 77
- 238000001035 drying Methods 0.000 title claims description 22
- 239000000758 substrate Substances 0.000 claims abstract description 160
- 238000000034 method Methods 0.000 claims abstract description 53
- 230000008569 process Effects 0.000 claims abstract description 44
- 239000002904 solvent Substances 0.000 claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 239000011368 organic material Substances 0.000 claims abstract description 13
- 230000011218 segmentation Effects 0.000 claims description 66
- 238000000926 separation method Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 187
- 239000012298 atmosphere Substances 0.000 description 59
- 238000002347 injection Methods 0.000 description 34
- 239000007924 injection Substances 0.000 description 34
- 230000015572 biosynthetic process Effects 0.000 description 31
- 238000000576 coating method Methods 0.000 description 30
- 239000011248 coating agent Substances 0.000 description 27
- 239000007788 liquid Substances 0.000 description 24
- 206010021143 Hypoxia Diseases 0.000 description 20
- 208000018875 hypoxemia Diseases 0.000 description 20
- 238000000137 annealing Methods 0.000 description 17
- 239000012044 organic layer Substances 0.000 description 13
- 238000010304 firing Methods 0.000 description 12
- 239000007789 gas Substances 0.000 description 12
- 238000001179 sorption measurement Methods 0.000 description 9
- 230000032258 transport Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 239000000178 monomer Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The present invention provides a kind of uneven decompression dry device for being dried under reduced pressure speed for the overlay that can mitigate in the face of substrate.The decompression dry device of the present invention, including：Process container, it is stored formed with the substrate comprising organic material and the overlay of solvent；The board holder of aforesaid substrate is kept from below in the inside of above-mentioned process container；It is connected with the exhaust outlet of above-mentioned process container, by the mechanism of decompressor of the inner pressure relief of above-mentioned process container；The air-flow limiting unit limited with the air-flow to being gone near the upper surface of the aforesaid substrate kept from aforesaid substrate maintaining part to the exhaust outlet of above-mentioned process container, said flow limiting unit include：The side of sidewall portion of air-flow is blocked in the side of the aforesaid substrate kept by aforesaid substrate maintaining part；With the top that air-flow is blocked above the aforesaid substrate kept by aforesaid substrate maintaining part.
Description
Technical field
The present invention relates to decompression dry device and decompression drying method.
Background technology
Organic EL (Electroluminescence are utilized it is known in the art that being used as：Electroluminescent) luminous hair
Organic Light Emitting Diode (the OLED of optical diode：Organic Light Emitting Diode).Use organic light-emitting diodes
The organic el display of pipe has slim light weight and low power consumption, and excellent in terms of response speed, angle of visibility, contrast ratio
The advantages that.Therefore, the flat-panel monitor (FPD) in recent years as time generation attracts attention.
Organic Light Emitting Diode is arranged on the opposite side of substrate with the anode formed on substrate, on the basis of anode
Negative electrode and the organic layer that is arranged between them.Organic layer for example has sky successively from anode side cathode side by following orders
Cave implanted layer, hole transporting layer, luminescent layer, electron supplying layer and electron injecting layer.
The applying device of ink-jetting style is used in the formation of hole injection layer, hole transporting layer, luminescent layer etc..Applying device
By the way that the coating liquid containing organic material and solvent is coated on substrate to form overlay.By subtracting to the overlay
Dry, firing is pressed dry, is formed (referring for example to patent documents 1) such as hole injection layers.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2016-77966 publications
The content of the invention
Technical problems to be solved are thought in invention
In the prior art, in the face of substrate, there is inequality in the speed that is dried under reduced pressure of overlay.
The present invention in view of above-mentioned problem and propose, main purpose is to provide a kind of coating that can mitigate in the face of substrate
The uneven decompression dry device for being dried under reduced pressure speed of layer.
For solving the technical scheme of technical problem
In order to solve above-mentioned problem, according to the mode of the present invention, there is provided a kind of decompression dry device, it includes：
Process container, it is stored formed with the substrate comprising organic material and the overlay of solvent；
The board holder of aforesaid substrate is kept from below in the inside of above-mentioned process container；
It is connected with the exhaust outlet of above-mentioned process container, by the mechanism of decompressor of the inner pressure relief of above-mentioned process container；With
Limit the exhaust near the upper surface of the aforesaid substrate kept from aforesaid substrate maintaining part to above-mentioned process container
The air-flow limiting unit for the air-flow that mouth is gone,
Said flow limiting unit includes：The side of air-flow is blocked in the side of the aforesaid substrate kept by aforesaid substrate maintaining part
Wall portion；With the top that air-flow is blocked above the aforesaid substrate kept by aforesaid substrate maintaining part.
The effect of invention
According to the mode of the present invention, using the teaching of the invention it is possible to provide a kind of overlay that can mitigate in the face of substrate is dried under reduced pressure
The uneven decompression dry device of speed.
Brief description of the drawings
Fig. 1 is the plan for the organic el display for representing an embodiment.
Fig. 2 is the sectional view of the major part for the organic el display for representing an embodiment.
Fig. 3 is the flow chart of the manufacture method for the Organic Light Emitting Diode for representing an embodiment.
Fig. 4 is that the formation for representing an embodiment has the sectional view of the substrate of overlay.
Fig. 5 is the sectional view of substrate for representing to be dried under reduced pressure Fig. 4 overlay.
Fig. 6 is the plan for the base plate processing system for representing an embodiment.
Fig. 7 is the figure of state when being dried under reduced pressure for the decompression dry device for representing an embodiment, is along Fig. 9
The sectional view of VII-VII lines.
Fig. 8 is the figure of state when receiving of the substrate for the decompression dry device for representing Fig. 7.
Fig. 9 is the figure for the decompression dry device for representing an embodiment, is the sectional view along Fig. 7 IX-IX lines.
Figure 10 is the figure for the decompression dry device for representing an embodiment, is the sectional view along Fig. 7 X-X lines.
Figure 11 is the stereogram of the segmentation cover of the Y-direction one end for representing the cover shown in Fig. 9 and Figure 10.
Figure 12 is the stereogram of the segmentation cover in the Y-direction center for representing the cover shown in Fig. 9 and Figure 10.
Figure 13 is the stereogram for representing the segmentation cover that the segmentation cover shown in alternate figures 11 uses.
Figure 14 is the stereogram for the air-flow limiting unit for representing variation.
Description of reference numerals
10 substrates
13 Organic Light Emitting Diodes
21 anodes
22 negative electrodes
23 organic layers
100 base plate processing systems
123c decompression dry devices
150 process containers
151 exhaust outlets
161 mounting tables
162 flat parts
163 lifting units
170 mechanisms of decompressor
171 decompression occurring sources
190 air-flow limiting units
191 side of sidewall portion
191a~191d splits side of sidewall portion
192 tops
192a~192d segmentations top
193 opening portions
194 covers
194a~194d segmentation covers
195 lattices.
Embodiment
Illustrate the mode for implementing the present invention referring to the drawings.In the drawings, for identical or corresponding structure,
Mark identical or corresponding reference and omit the description.
<Organic el display>
Fig. 1 is the plan for the organic el display for representing an embodiment.In Fig. 1, one unit electricity of enlarged representation
The circuit on road 11.
Organic el display include substrate 10, arrange on the substrate 10 multiple unit circuits 11, set on the substrate 10
Scan line drive circuit 14 and data line drive circuit 15 on the substrate 10 is set.By connecting with scan line drive circuit 14
The region that the multiple scan lines 16 connect and the multiple data wires 17 being connected with data line drive circuit 15 surround is provided with unit electricity
Road 11.Unit circuit 11 includes TFT layer 12 and Organic Light Emitting Diode 13.
TFT layer 12 has multiple TFT (Thin Film Transistor：Thin film transistor (TFT)).One TFT, which has to be used as, to be opened
The function of element is closed, the current control that another TFT has the magnitude of current flowed as control in Organic Light Emitting Diode 13 is used
The function of element.TFT layer 12 is acted using scan line drive circuit 14 and data line drive circuit 15, to Organic Light Emitting Diode
13 supply electric currents.TFT layer 12 is set by each unit circuit 11, multiple independent controls of unit circuit 11.In addition, TFT layer 12
If in general structure, it is not limited to the structure shown in Fig. 1.
In addition, the type of drive of organic el display is active matrix mode in the present embodiment but it is also possible to be nothing
Source matrix mode.
Fig. 2 is the sectional view of the major part for the organic el display for representing an embodiment.As substrate 10, use
The transparency carriers such as glass substrate, resin substrate.On the substrate 10 formed with TFT layer 12.Formed with making by TFT on TFT layer 12
The planarization layer 18 for the jump planarization that layer 12 is formed.
Planarization layer 18 has insulating properties.The intercommunicating pore of planarization layer 18 is being penetrated formed with attachment plug 19.Connection is inserted
Plug 19 electrically connects the anode 21 that pixel electrode is formed as in the tabular surface of planarization layer 18 and TFT layer 12.Attachment plug
19 can be by forming simultaneously with the identical material of anode 21.
Organic Light Emitting Diode 13 is formed on the tabular surface of planarization layer 18.Organic Light Emitting Diode 13 includes：As
The anode 21 of pixel electrode；The negative electrode as comparative electrode of the opposite side for the substrate 10 being arranged on using on the basis of pixel electrode
22；；And the organic layer 23 formed between anode 21 and negative electrode 22.By acting TFT layer 12, between anode 21 and negative electrode 22
Apply voltage, organic layer 23 is luminous.
Anode 21 for example by the formation such as ITO (Indium Tin Oxide, tin indium oxide), makes the light from organic layer 23 saturating
Cross.Substrate 10 is passed through through the light of anode 21, is fetched into outside.Anode 21 is set by each unit circuit 11.
Negative electrode 22 makes the light from organic layer 23 be reflected to organic layer 23 such as being formed as aluminium.Reflected by negative electrode 22
Light, through organic layer 23, anode 21, substrate 10, it is fetched into outside.Negative electrode 22 shares in multiple unit circuits 11.
Organic layer 23 is for example sequentially formed with hole injection layer 24, cavity conveying from the side of anode 21 to the side of negative electrode 22 by following
Layer 25, luminescent layer 26, electron supplying layer 27 and electron injecting layer 28.When voltage is put between anode 21 and negative electrode 22, hole
Hole injection layer 24 is injected from anode 21, and electronics injects electron injecting layer 28 from negative electrode 22.Focus on into hole injection layer
24 hole is conveyed from hole transporting layer 25 to luminescent layer 26.In addition, the electronics of electron injecting layer 28 is injected into by electron transport
Layer 27 conveys to luminescent layer 26.Then, in luminescent layer 26 hole and electronics in conjunction with the luminescent material of luminescent layer 26 is swashed
Encourage, luminescent layer 26 is luminous.
As luminescent layer 26, such as shown in Figure 10, formed with red light emitting layer, green light emitting layer and blue light-emitting layer.
Red light emitting layer is formed by the red illuminating material for sending red light, and green light emitting layer is by sending the green luminescent material of green light
Formed, blue light-emitting layer is formed by the blue emitting material for sending blue light.Red light emitting layer, green light emitting layer and blue-light-emitting
Layer is formed at the opening portion 31 of separation levee 30.
The painting of the coating liquid of the barrier red light emitting layer of separation levee 30, the coating liquid and blue light-emitting layer of green light emitting layer
Liquid is applied, so as to prevent these coating liquids from mixing.Separation levee 30 has insulating properties, the intercommunicating pore of landfill insertion planarization layer 18.
<The manufacture method of Organic Light Emitting Diode>
Fig. 3 is the flow chart of the manufacture method for the Organic Light Emitting Diode for representing an embodiment.
First, in step S101, the formation of the anode 21 as pixel electrode is carried out.In the formation of anode 21 for example
Use vapour deposition method.Anode 21 is formed in the tabular surface of planarization layer 18 by each unit circuit 11.Can together with anode 21 shape
Into attachment plug 19.
Then the formation of separation levee 30 is carried out in step s 102.Separation levee 30 is for example formed using photoresist, passes through light
Pattern Processing chemical conversion is carved as defined pattern.Anode 21 exposes in the opening portion 31 of separation levee 30.
Then the formation of hole injection layer 24 is carried out in step s 103.Ink-jet is used in the formation of hole injection layer 24
Method etc..By ink-jet method thus the coating liquid of hole injection layer 24 is formed into overlay L as shown in Figure 4 coated on anode 21.
By being dried, firing to overlay L, hole injection layer 24 is formed as shown in Figure 5.
Then the formation of hole transporting layer 25 is carried out in step S104.In the formation of hole transporting layer 25, with hole
The formation of implanted layer 24 is similarly using ink-jet method etc..By the way that the coating liquid of hole transporting layer 25 is coated in into sky by ink-jet method
On cave implanted layer 24, overlay is formed.By being dried, firing to the overlay, hole transporting layer 25 is formed.
Then the formation of luminescent layer 26 is carried out in step S105.In the formation of luminescent layer 26, with hole injection layer 24
Formation with hole transporting layer 25 is similarly using ink-jet method etc..By the way that the coating liquid of luminescent layer 26 is coated in by ink-jet method
On hole transporting layer 25, overlay is formed.By being dried, firing to the overlay, luminescent layer 26 is formed.
As luminescent layer 26, such as form red light emitting layer, green light emitting layer and blue light-emitting layer.It is red light emitting layer, green
Color luminescent layer and blue light-emitting layer are formed at the opening portion 31 of separation levee 30.Separation levee 30 obstructs the coating liquid, green of red light emitting layer
The coating liquid of color luminescent layer and the coating liquid of blue light-emitting layer, so as to prevent these coating liquids from mixing.
Then the formation of electron supplying layer 27 is carried out in step s 106.In the formation of electron supplying layer 27 for example using
Vapour deposition method etc..Electron supplying layer 27 can share in multiple unit circuits 11, therefore can not only form opening in separation levee 30
On luminescent layer 26 in oral area 31, it can also be formed on separation levee 30.
Then the formation of electron injecting layer 28 is carried out in step s 107.In the formation of electron injecting layer 28 for example using
Vapour deposition method etc..Electron injecting layer 28 is formed on electron supplying layer 27.Electron injecting layer 28 can be in multiple unit circuits 11
Share.
Then the formation of negative electrode 22 is carried out in step S108.In the formation of negative electrode 22 such as using vapour deposition method.It is cloudy
Pole 22 is formed on electron injecting layer 28.Negative electrode 22 can share in multiple unit circuits 11.
In addition, the type of drive of organic el display is not active matrix mode but during passive matrix mode, negative electrode 22
It is patterned as defined pattern.
Process more than, manufacture Organic Light Emitting Diode 13.Hole injection layer 24 in organic layer 23, hole are defeated
Send and base plate processing system 100 is used in the formation of layer 25 and luminescent layer 26.
<Base plate processing system>
Fig. 6 is the plan for the base plate processing system for representing an embodiment.Base plate processing system 100 carries out and Fig. 3
The suitable each processing of step S103~S105, hole injection layer 24, hole transporting layer 25 and luminescent layer are formed on anode 21
26.Base plate processing system 100, which has, to be moved into station 110, treating stations 120, takes out of station 130 and control device 140.
Move into station 110 to move into the box C for storing multiple substrates 10 from outside, taken out successively from box C by multiple substrates 10.
Each substrate 10 is pre-formed with TFT layer 12, planarization layer 18, anode 21, separation levee 30 etc..
Moving into station 110 includes：Load box C box mounting table 111；Set between box mounting table 111 and treating stations 120
Transport path 112；Body 113 is transported with the substrate for being arranged at transport path 112.Substrate conveyance body 113 is being placed in box mounting table
Substrate 10 is transported between 111 box C and treating stations 120.
Treating stations 120 form hole injection layer 24, hole transporting layer 25 and luminescent layer 26 on anode 21.Treating stations 120
Including：The hole injection layer for forming hole injection layer 24 forms block 121；The hole transporting layer for forming hole transporting layer 25 is formed
Block 122；Block 123 is formed with the luminescent layer for forming luminescent layer 26.
Hole injection layer forms block 121 and applies the coating liquid of hole injection layer 24 coated in formation on anode 21
Layer, by being dried, firing to the overlay, form hole injection layer 24.The coating liquid of hole injection layer 24 includes
Machine material and solvent.The organic material can be any one in polymer and monomer.For monomer when, can by firing and
Polymerization turns into polymer.
Hole injection layer formed block 121 include applying device 121a, buffer unit 121b, decompression dry device 121c,
Annealing device 121d and temperature-adjusting device 121e.Applying device 121a by the drop of the coating liquid of hole injection layer 24 to
Discharge the opening portion 31 of separation levee 30.Buffer unit 121b temporarily stores pending substrate 10.Decompression dry device 121c to by
The overlay of applying device 121a coatings is dried under reduced pressure, and removes the solvent for being contained in overlay.121d pairs of annealing device
Heated by the decompression dry device 121c overlays dried.Temperature-adjusting device 121e will be by annealing device
The temperature adjustment of substrate 10 after 121d heating is defined temperature such as normal temperature.
Applying device 121a, buffer unit 121b, annealing device 121d and temperature-adjusting device 121e inside maintain
For air atmosphere.Decompression dry device 121c makes the atmosphere of inside switch between air atmosphere and reduced atmosphere.
In addition, formed in hole injection layer in block 121, applying device 121a, buffer unit 121b, decompression dry device
121c, annealing device 121d and temperature-adjusting device 121e configuration, number, the atmosphere of inside can be selected arbitrarily.
In addition, hole injection layer, which forms block 121, has base board delivery device CR1~CR3 and connection device TR1~TR3.
Base board delivery device CR1~CR3 transports substrate 10 to each adjacent each device.For example, base board delivery device CR1 is to adjacent
Applying device 121a and buffer unit 121b conveyance substrates 10.Base board delivery device CR2 is in itself and adjacent decompression dry device
Substrate 10 is transported between 121c.Base board delivery device CR3 removes to adjacent annealing device 121d and temperature-adjusting device 121e
Send substrate 10.Connection device TR1~TR3 be set in turn in respectively move between 110 and base board delivery device CR1 of station, substrate removes
Send between device CR1 and base board delivery device CR2, between base board delivery device CR2 and base board delivery device CR3, at them it
Between substrate 10 is relayed.Base board delivery device CR1~CR3, connection device TR1~TR3 inside are maintained air atmosphere.
The base board delivery device CR3 and hole transporting layer formation block 122 of block 121 substrate are formed in hole injection layer
Between carrying device CR4, the connection device TR4 relayed between them to substrate 10 is provided with.Connection device TR4 inside
It is maintained air atmosphere.
Hole transporting layer forms block 122 by the coating liquid of hole transporting layer 25 coated in shape on hole injection layer 24
Into overlay, by being dried, firing to the overlay, hole transporting layer 25 is formed.The coating liquid of hole transporting layer 25
Including organic material and solvent.The organic material can be any one in polymer and monomer.For monomer when, can pass through
Fire and polymerize turn into polymer.
Hole transporting layer formed block 122 include applying device 122a, buffer unit 122b, decompression dry device 122c,
Annealing device 122d and temperature-adjusting device 122e.Applying device 122a by the drop of the coating liquid of hole transporting layer 25 to
Discharge the opening portion 31 of separation levee 30.Buffer unit 122b temporarily stores pending substrate 10.Decompression dry device 122c to by
The overlay of applying device 122a coatings is dried under reduced pressure, and removes the solvent for being contained in overlay.122d pairs of annealing device
Heated by the decompression dry device 122c overlays dried.Temperature-adjusting device 122e will be by annealing device
The temperature adjustment of substrate 10 after 122d heating is defined temperature such as normal temperature.
Applying device 122a and buffer unit 122b inside are maintained air atmosphere.On the other hand, annealing device
For 122d and temperature-adjusting device 122e in order to suppress the deterioration of the organic material of hole transporting layer 25, inside is maintained hypoxemia and low
The atmosphere of dew point.Decompression dry device 122c switches the atmosphere of inside between the atmosphere and reduced atmosphere of hypoxemia and low dew point.
Herein, the atmosphere of hypoxemia refers to the oxygen concentration atmosphere lower than air, such as the atmosphere that oxygen concentration is below 10PPM.
In addition, the atmosphere of low dew point refers to the dew-point temperature atmosphere lower than air, such as the atmosphere that dew-point temperature is less than -10 DEG C.It is low
The atmosphere of oxygen and low dew point is formed such as the inactive gas as nitrogen.
In addition, formed in hole transporting layer in block 122, applying device 122a, buffer unit 122b, decompression dry device
122c, annealing device 122d and temperature-adjusting device 122e configuration, number, the atmosphere of inside can be selected arbitrarily.
In addition, hole transporting layer, which forms block 122, includes base board delivery device CR4~CR6 and connection device TR5~TR6.
Base board delivery device CR4~CR6 transports substrate 10 to adjacent each device respectively.Connection device TR5~TR6 is set gradually respectively
Between base board delivery device CR4 and base board delivery device CR5, between base board delivery device CR5 and base board delivery device CR6,
Substrate 10 is relayed between them.
Base board delivery device CR4 inside is maintained air atmosphere.On the other hand, base board delivery device CR5~CR6's is interior
Portion is maintained the atmosphere of hypoxemia and low dew point.Because the decompression dry device 122c adjacent with base board delivery device CR5
Inside is switched between the atmosphere and reduced atmosphere of hypoxemia and low dew point.In addition, because with base board delivery device CR6 phases
The annealing device 122d of neighbour's setting, temperature-adjusting device 122e inside are maintained the atmosphere of hypoxemia and low dew point.
Connection device TR5 is configured to the dress that its internal atmosphere switches between the atmosphere of air atmosphere and hypoxemia and low dew point
Carry locking device.Because decompression dry device 122c has been disposed adjacent it in connection device TR5 downstream.On the other hand,
Connection device TR6 inside is maintained the atmosphere of hypoxemia and low dew point.
The base board delivery device CR6 of block 122 is formed in hole transporting layer and luminescent layer forms the substrate conveyance of block 123
Between device CR7, the connection device TR7 relayed between them to substrate 10 is provided with.Base board delivery device CR6 inside
The atmosphere of hypoxemia and low dew point is maintained, base board delivery device CR7 inside is maintained air atmosphere.Therefore, connection device TR7
It is configured to the load lock that its internal atmosphere switches between the atmosphere and air atmosphere of hypoxemia and low dew point.
Luminescent layer forms block 123 by the coating liquid of luminescent layer 26 coated in formation coating on hole transporting layer 25
Layer, by being dried, firing to the overlay of formation, form luminescent layer 26.The coating liquid of luminescent layer 26 includes organic material
Material and solvent.The organic material can be any one in polymer and monomer.For monomer when, can be polymerize by firing
As polymer.
Luminescent layer, which forms block 123, includes applying device 123a, buffer unit 123b, decompression dry device 123c, Re Chu
Manage device 123d and temperature-adjusting device 123e.Applying device 123a is by the drop of the coating liquid of luminescent layer 26 to separation levee 30
Discharge opening portion 31.Buffer unit 123b temporarily stores pending substrate 10.Decompression dry device 123c is to by applying device
The overlay of 123a coatings is dried under reduced pressure, and removes the solvent for being contained in overlay.Annealing device 123d is to dry by depressurizing
The overlay that dry device 123c has been dried is heated.Temperature-adjusting device 123e will be by annealing device 123d heating
The temperature adjustment of substrate 10 after reason is defined temperature such as normal temperature.
Applying device 123a and buffer unit 123b inside are maintained air atmosphere.On the other hand, annealing device
For 123d and temperature-adjusting device 123e in order to suppress the deterioration of the organic material of luminescent layer 26, inside is maintained hypoxemia and low dew point
Atmosphere.Decompression dry device 123c switches the atmosphere of inside between the atmosphere and reduced atmosphere of hypoxemia and low dew point.
In addition, formed in luminescent layer in block 123, applying device 123a, buffer unit 123b, decompression dry device
123c, annealing device 123d and temperature-adjusting device 123e configuration, number, the atmosphere of inside can be selected arbitrarily.
In addition, luminescent layer, which forms block 123, includes base board delivery device CR7~CR9 and connection device TR8~TR9.Substrate
Carrying device CR7~CR9 transports substrate 10 to adjacent each device respectively.Connection device TR8~TR9 is successively set on base respectively
Between plate conveying device CR7 and base board delivery device CR8, between base board delivery device CR8 and base board delivery device CR9, at it
Between substrate 10 is relayed.
Base board delivery device CR7 inside is maintained air atmosphere.On the other hand, base board delivery device CR8~CR9's is interior
Portion is maintained the atmosphere of hypoxemia and low dew point.Because the decompression dry device 123c adjacent with base board delivery device CR8
Inside is switched between the atmosphere and reduced atmosphere of hypoxemia and low dew point.In addition, because with base board delivery device CR9 phases
The annealing device 123d of neighbour's setting, temperature-adjusting device 123e inside are maintained the atmosphere of hypoxemia and low dew point.
Connection device TR8 is configured to switch its internal atmosphere between the atmosphere of air atmosphere and hypoxemia and low dew point
Load lock.Because decompression dry device 123c has been disposed adjacent it in connection device TR8 downstream.Connection device
TR9 inside is maintained the atmosphere of hypoxemia and low dew point.
Between luminescent layer forms the base board delivery device CR9 of block 123 and takes out of station 130, it is right between them to be provided with
The connection device TR10 that substrate 10 is relayed.Base board delivery device CR9 inside is maintained the atmosphere of hypoxemia and low dew point, removes
Outbound 130 inside is maintained air atmosphere.Therefore, connection device TR7 is configured to its internal atmosphere in hypoxemia and low dew point
Atmosphere and air atmosphere between the load lock that switches.
Take out of station 130 and multiple substrates 10 are accommodated in box C successively, box C is taken out of to outside.Taking out of station 130 includes：Mounting
Box C box mounting table 131；The transport path 132 being arranged between box mounting table 131 and treating stations 120；It is arranged at transport path
132 substrate conveyance body 133.Substrate conveyance body 133 transports base between treating stations 120 and the box C for being placed in box mounting table 131
Plate 10.
Control device 140 is by including CPU (Central Processing Unit, central processing unit) 141 and memory etc.
The computer of storage medium 142 is formed, be stored in by being performed by CPU141 the program (also referred to as scheme) of storage medium 142 come
Realize various processing.
The program storage of control device 140 is installed in information storage medium from information storage medium.Store and be situated between as information
Matter, such as hard disk (HD), floppy disk (FD), CD (CD), magneto-optic disk (MO), storage card etc. can be enumerated.In addition, program can be through
Installed by internet after server download.
Then explanation uses the substrate processing method using same of the base plate processing system 100 of said structure.When being accommodated with multiple substrates
When 10 box C is positioned in box mounting table 111, substrate conveyance body 113 takes out substrate 10 successively from the box C in box mounting table 111,
Conveyance to hole injection layer forms block 121.
Hole injection layer forms block 121 by the coating liquid of hole injection layer 24 coated in formation coating on anode 21
Layer, by being dried, firing to the overlay of formation, form hole injection layer 24.
Substrate 10 formed with hole injection layer 24 forms block 121 from hole injection layer by connection device TR4 and is handover to
Hole transporting layer forms block 122.
Hole transporting layer forms block 122 by the coating liquid of hole transporting layer 25 coated in shape on hole injection layer 24
Into overlay, by being dried, firing to the overlay of formation, hole transporting layer 25 is formed.Formed with hole transporting layer 25
Substrate 10 by connection device TR7 form block 122 from hole transporting layer and be handover to luminescent layer and form block 123.
Luminescent layer forms block 123 by the coating liquid of luminescent layer 26 coated in formation coating on hole transporting layer 25
Layer, by being dried, firing to the overlay of formation, form luminescent layer 26.Substrate 10 formed with luminescent layer 26 is by joining
Device TR10 is handover to from luminescent layer formation block 123 and takes out of station 130.
The substrate 10 received from connection device TR10 is accommodated in box mounting table 131 by the substrate conveyance body 133 for taking out of station 130
On defined box C.Thus, the processing of a series of substrate 10 of base plate processing system 100 terminates.
Substrate 10 is taken out of with being accommodated in box C state from station 130 is taken out of to outside.Formed in the substrate 10 for taking out of outside
Electron supplying layer 27, electron injecting layer 28, negative electrode 22 etc..
<Decompression dry device and decompression drying method>
Then, 7~Figure 13 of reference picture illustrates that luminescent layer forms the decompression dry device 123c of block 123.In addition, hole is noted
Enter the decompression dry device 122c that layer forms the decompression dry device 121c of block 121 and hole transporting layer forms block 122, with
The decompression dry device 123c that luminescent layer forms block 123 is equally constituted, therefore is omitted the description.
Fig. 7 is the figure of state when being dried under reduced pressure for the decompression dry device for representing an embodiment, is along Fig. 9
The sectional view of VII-VII lines.In Fig. 7, arrow represents the main flow of air-flow.Fig. 8 is the substrate for the decompression dry device for representing Fig. 7
The figure of state when receiving.Fig. 9 is the figure for the decompression dry device for representing an embodiment, is cutting along Fig. 7 IX-IX lines
Face figure.Figure 10 is the figure for the decompression dry device for representing an embodiment, is the sectional view along Fig. 7 X-X lines.Figure 11 is table
The stereogram of the segmentation cover of Y-direction one end of diagram 9 and the cover shown in Figure 10.Figure 12 is the Y for representing the cover shown in Fig. 9 and Figure 10
The stereogram of the segmentation cover in direction center.Figure 13 is the stereogram for representing the segmentation cover that the segmentation cover shown in alternate figures 11 uses.
In Figure 11~Figure 13, in order to simplify accompanying drawing, the diagram of the opening portion 193 shown in Fig. 9 is eliminated.In following accompanying drawing, X-direction and
Y-direction is mutually orthogonal directions horizontal direction, and Z-direction is the vertical orthogonal with X-direction and Y-direction.
Decompression dry device 123c will be accommodated in processing formed with the substrate 10 comprising organic material and the overlay of solvent
The inside of container 150, in the reduced atmosphere that air pressure forces down than air, solvent is set to be evaporated from overlay.Decompression dry device
123c is for example including process container 150, maintaining body 160, the mechanism of decompressor 170 and gas supply mechanism 180.
Process container 150 is stored formed with the substrate 10 for including organic material and the overlay of solvent.In the upper of substrate 10
Side is configured with overlay.The carrying-in/carrying-out mouth of substrate 10 is formed in the side of sidewall portion of process container 150, is set in the carrying-in/carrying-out mouth
It is opened and closed lock.Opening and closing lock opens the carrying-in/carrying-out that carrying-in/carrying-out mouth is then able to carry out substrate 10, and opening and closing lock closes carrying-in/carrying-out mouth
It is then able to carry out the decompression of the inside of process container 150.The inside of process container 150 is hypoxemia and low dew before decompression starts
The atmosphere such as nitrogen atmosphere of point.
Maintaining body 160 has：Keep the mounting table 161 of substrate 10 from below in the inside of process container 150；With locating
The inside of reason container 150 makes the lifting unit 163 that mounting table 161 lifts.Mounting table 161 corresponds to the substrate that technical scheme is recorded and protected
Hold portion.Mounting table 161 is divided into the flat part 162 of multiple strips as shown in Fig. 7 etc., and lifting unit 163 makes multiple flat parts
162 independent-liftings.The fork-shaped for being used to load substrate 10 with base board delivery device CR8 during the carrying-in/carrying-out of substrate 10 can be prevented
The interference in portion.In addition, in the entirety that substrate 10 can be kept when being dried under reduced pressure of substrate 10.
During the carrying-in/carrying-out of substrate 10, fork is moved to the position overlapping with mounting table 161 when overlooking.Now, exist
The flat part 162 overlapping with fork during vertical view, keep out of the way the low position of the flat part more not overlapping with fork than when overlooking,
So that it is not disturbed with fork.By making fork be lifted from the state, join substrate between fork and mounting table 161
10。
In addition, for the handing-over of substrate 10, can also substitute lifts fork, and make overlook when not with fork weight
Folded flat part 162 lifts.In this case, the flat part not overlapping with fork when overlooking, than fork on the lower
Position and the position more top than fork between lift.Thus, substrate 10 is joined between fork and mounting table 161.
In addition, mounting table 161 as shown in Fig. 7 etc., is divided into the flat part 162 of multiple strips, but can not also be by
Segmentation, can form and be integrated.In this case, mounting table 161 be provided with multiple inside for being fixed on process container 150,
The lifter pin to be haunted relative to the upper surface of mounting table 161.Multiple lifter pins join base between the CR8 of base board delivery device
Between the position of plate 10 and the position for joining substrate 10 between mounting table 161, lift substrate 10.
The mechanism of decompressor 170 is connected with the exhaust outlet 151 of process container 150, by the inner pressure relief of process container 150 to than big
The low air pressure of air pressure.The mechanism of decompressor 170 for example with decompression occurring source 171 and APC (Adaptive Pressure Control,
Adaptability Stress control) valve 172.As decompression occurring source 171, such as use dry pump, geared supercharging pump, turbomolecular pump
Deng.Decompression occurring source 171 is connected via the pipe arrangement that APC valves 172 are provided with halfway with process container 150, makes process container 150
Inner pressure relief.The air pressure of the inside of process container 150 is adjusted by APC valves 172, is decompressed to such as below 1PA.Process container
150 exhaust outlet 151 forms the lower wall portion in process container 150 as shown in Figure 7, but can also be formed in upper wall portions or side wall
Portion.
Gas supply mechanism 180 is in order that the inside of the process container 150 after being depressurized by the mechanism of decompressor 170 returns to originally
Atmosphere, supply the gas such as nitrogen to the inside of process container 150.Gas supply mechanism 180 is for example including gas supply source
181st, mass flow controller 182 and open and close valve 183.Gas supply source 181 sets mass flow controller via in midway
182nd, the pipe arrangement of open and close valve 183 is connected with process container 150, to the inside supply gas of process container 150.The quantity delivered can
Adjusted by mass flow controller 182.
In addition, decompression dry device 123c by applying device 123a as described above, to forming overlay on the substrate 10
It is dried under reduced pressure, makes solvent evaporation contained in overlay.The steam of solvent turns into air-flow, near the upper surface of substrate 10
It is transported to the exhaust outlet 151 of process container 150.The position of the easier movement of air-flow, dry easier progress.
Then, decompression dry device 123c has air-flow limiting unit 190 to mitigate the rate of drying of overlay inequality.
Air-flow limiting unit 190 is limited near the upper surface of the substrate 10 kept by mounting table 161 to the exhaust outlet of process container 150
151 air-flows gone.
As shown in fig. 7, air-flow limiting unit 190 includes：Air-flow is blocked in the side of the substrate 10 kept by mounting table 161
Side of sidewall portion 191；With the top 192 that air-flow is blocked in the top of the substrate 10 kept by mounting table 161.Pass through the He of side of sidewall portion 191
Air-flow is blocked at top 192, and the drying at the position that rate of drying is too fast in the prior art can be made slack-off.Thereby, it is possible to mitigate base
The inequality of the rate of drying of overlay in the face of plate 10.
Top 192 has to be passed through for the air-flow gone upward near the upper surface of the substrate 10 kept by mounting table 161
Opening portion 193.By the distribution for the aperture opening ratio for adjusting top 192, the drying of the overlay in the face of substrate 10 can be mitigated
The inequality of speed.
Herein, the aperture opening ratio at top 192 refers to, the area of opening portion 193 accounts for the ratio of the unit area at top 192 during vertical view
Example.The aperture opening ratio at top 192 can be adjusted by shape, size, configuration of opening portion 193 etc..
As shown in figure 9, top 192 can be with the larger position in the less position of aperture opening ratio and aperture opening ratio.Top 192
There can be the position that aperture opening ratio is zero.
In addition, top 192 can have the function of the adsorption plate of the steam as adsorption solvent.Adsorption plate makes the steaming of solvent
Gas for example condenses to be trapped.The temperature-adjusting device of the temperature of adsorption plate can be provided for adjusting on adsorption plate.
Temperature-adjusting device improves arresting efficiency by cooling down adsorption plate when being dried under reduced pressure.In addition, temperature adjustment fills
Put makes again to be gasified from adsorption plate to depart from by the solvent that adsorption plate traps by heating adsorption plate after being dried under reduced pressure.
The cover 194 of box-like open downwards is formed on side of sidewall portion 191 and top 192.As shown in figure 8, under cover 194
Side, when mounting table 161 receives substrate 10 from base board delivery device CR8, lifting unit 163 rises mounting table 161, thus, such as
Shown in Fig. 7, the substrate 10 kept by mounting table 161 is received into the inside of cover 194.
In addition, in order to which the substrate kept by mounting table 161 10 to be received into the inside of cover 194, can also substitute makes mounting
Platform 161 rises and declines cover 194.Alternatively, it is also possible to rise mounting table 161 while decline cover 194.
Cover 194 internally stores the substrate 10 kept by mounting table 161.Because mounting table 161, substrate 10 are blocked from cover
The air-flow that 194 inside is gone downwards, so the air-flow gone upward near the upper surface of substrate 10 is top dog.By
This, is readily obtained the effect of the distribution of the aperture opening ratio at adjustment top 192.
As shown in Figure 10, air-flow limiting unit 190 also includes that 194 will be covered in the top of the substrate 10 kept by mounting table 161
Inside points every lattice 195.The space of the top of substrate 10 can be divided into multiple spaces, adjust the gas in each space
Stream.
Lattice 195 can be arranged at the big position of the aperture opening ratio portion small with the aperture opening ratio at top 192 at such as top 192
Between position.It is readily obtained the effect that difference is set to the aperture opening ratio at top 192.
Lifting unit 163 adjusts the substrate 10 kept by mounting table 161 and existed with lattice 195 by lifting mounting table 161
Interval S on above-below direction.Be spaced S it is smaller, be more readily obtained using lattice 195 by the inside points of cover 194 every separation imitate
Fruit.
Lifting unit 163 corresponds to the interval adjustment portion that technical scheme is recorded.In addition, interval adjustment portion is spaced S to adjust,
Can also substitute lifts mounting table 161 and drops the Noboru of cover 194.Alternatively, it is also possible to lift both.
As shown in Figure 9 and Figure 10, cover 194 is divided into 4 segmentation covers 194a, 194b, 194c, 194d in the Y direction.Respectively
Segmentation cover 194a, 194b, 194c, 194d, there is the segmentation side of sidewall portion of the part as side of sidewall portion 191 and be used as top 192
A part segmentation at the top of.
For example, as shown in figure 11, the segmentation cover 194a of Y-direction one end has 192a at the top of the segmentation of rectangle and is arranged at this
The segmentation side of sidewall portion 191a on segmentation top 192a connected 3 side.192a remaining 1 side is provided with point at the top of segmentation
Every portion 195.
As shown in figure 9, segmentation top 192a can be with the larger position in the less position of aperture opening ratio and aperture opening ratio.Pushing up
The corner portion in portion 192, aperture opening ratio can be minimum, can be, for example, zero.
Equally, the segmentation cover 194d of the Y-direction other end has 192d at the top of the segmentation of rectangle and is arranged at the top of the segmentation
The segmentation side of sidewall portion 191d on 192d connected 3 side.192d remaining 1 side is provided with lattice 195 at the top of segmentation.
As shown in figure 9, segmentation top 192d can be with the larger position in the less position of aperture opening ratio and aperture opening ratio.At top 192
Corner portion, aperture opening ratio can be minimum, can be, for example, zero.
In addition, as shown in figure 12, the segmentation cover 194b in Y-direction center has 192b at the top of the segmentation of rectangle and is arranged at this
The segmentation side of sidewall portion 191b on segmentation top 192b 2 sides relative to each other.As shown in figure 9, at the top of the segmentation in Y-direction center
192b can be bigger than 192a aperture opening ratios at the top of the segmentation of adjacent Y-direction one end.
Equally, the segmentation cover 194c in another Y-direction center has 192c at the top of the segmentation of rectangle and is arranged at the segmentation top
The segmentation side of sidewall portion 191c on portion 192c 2 sides relative to each other.As shown in figure 9,192c can be with the top of the segmentation in Y-direction center
It is bigger than 192d aperture opening ratios at the top of the segmentation of the adjacent Y-direction other end.
In addition, the cover 194 of present embodiment is to split in the Y direction, but can also split in the X direction, can also be
Split on two directions.In addition, the segmentation number of cover 194 is not limited to 4, can be less than 3, or more than 5.
Cover 194 is divided into multiple segmentation cover 194a, 194b, 194c, 194d, so split the combination of cover by changing,
The structure of air-flow limiting unit 190 can easily be changed.
For example, can be with the segmentation cover 194a shown in alternate figures 11, using the segmentation cover 194E shown in Figure 13, thus, it is possible to unload
Lower lattice 195.Equally, segmentation cover 194E has 192E at the top of the segmentation of rectangle and is arranged at being connected for segmentation top 192E
3 sides segmentation side of sidewall portion 191E.192E remaining 1 side is provided with lattice 195 at the top of segmentation.
In addition, segmentation cover is not limited to the segmentation cover shown in Figure 11~Figure 13.For example, can be in the segmentation shown in Figure 12
Cover 194b and lattice 195 is set.Lattice 195 can be arranged on splitting except being provided with segmentation top 192b 4 sides
2 of side of sidewall portion 191b while remaining 2 while any one of, both can also be arranged at.
By changing the combination of segmentation cover, lattice 195 can be assembled or unloaded, and top 192 can be adjusted
The distribution of aperture opening ratio.
Then, the decompression drying method of the decompression dry device 123c using said structure is illustrated.Decompression dry device
123c following actions are controlled by control device 140.Control device 140 is provided separately with decompression dry device 123c in figure 6,
But a decompression dry device 123c part can also be arranged to.
First, substrate 10 is moved to process container 150 by base board delivery device CR8 from decompression dry device 123c outside
Inside, mounting table 161 receives substrate 10 from base board delivery device CR8.Base board delivery device CR8 is out of process container 150
Portion is withdrawn into after outside, and lifting unit 163 rises mounting table 161, and thus, the substrate 10 kept by mounting table 161 is stored
To the inside of cover 194.
Then, the mechanism of decompressor 170 depressurizes to the inside of process container 150.Solvent is from overlay in reduced atmosphere
Evaporation.The steam of solvent turns into air-flow, and the exhaust outlet 151 of process container 150 is transported near the upper surface of substrate 10.This
When, air-flow limiting unit 190 limits the air-flow gone near the upper surface of substrate 10 to the exhaust outlet 151 of process container 150.By
This, can reduce the inequality of rate of drying.
After the completion of being dried under reduced pressure, gas supply mechanism 180 holds processing to the inside supply gas of process container 150
Recover original atmosphere in the inside of device 150.In addition, lifting unit 163 declines mounting table 161, thus, will be protected by mounting table 161
The substrate 10 held takes out downwards from the inside of cover 194.Afterwards, joined in the lower section of cover 194, substrate 10 from mounting table 161
To base board delivery device CR8, the outside of process container 150 is transported to.
As described above, included according to present embodiment, air-flow limiting unit 190：What is kept by mounting table 161
Block the side of sidewall portion 191 of air-flow in the side of substrate 10；With the top that air-flow is blocked in the top of the substrate 10 kept by mounting table 161
Portion 192.Air-flow is blocked by side of sidewall portion 191 and top 192, the drying at the position that rate of drying is too fast in the prior art can be made
It is slack-off.The inequality of the rate of drying of the overlay in face thereby, it is possible to mitigate substrate 10.
In addition, according to present embodiment, top 192 has for attached from the upper surface of the substrate 10 kept by mounting table 161
The opening portion 193 that the air-flow that proximad top is gone passes through.By the distribution for the aperture opening ratio for adjusting top 192, substrate 10 can be mitigated
Face in overlay rate of drying inequality.
In addition, according to present embodiment, the cover 194 of box-like open downwards, cover are formed on side of sidewall portion 191 and top 192
The substrate 10 kept by mounting table 161 is accommodated in inside by 194.Because mounting table 161, substrate 10 are blocked from the inside of cover 194
The air-flow gone downwards, so the air-flow gone upward near the upper surface of substrate 10 is top dog.Thus, it is easy to obtain
To the effect of the distribution of the aperture opening ratio at adjustment top 192.
In addition, according to present embodiment, air-flow limiting unit 190 is also wrapped in the top of the substrate 10 kept by mounting table 161
Include by the inside points of cover 194 every lattice 195.The space of the top of substrate 10 can be divided into multiple spaces, adjustment is each
The air-flow in space.
In addition, according to present embodiment, lifting unit 163 is adjusted and kept by mounting table 161 by lifting mounting table 161
Substrate 10 and the interval S of lattice 195 in the vertical direction.It is smaller to be spaced S, being more readily obtained will cover using lattice 195
194 inside points every segregation.
In addition, according to present embodiment, cover 194 is divided into multiple segmentation cover 194a, 194b, 194c, 194d.Therefore,
By changing the combination of segmentation cover, the structure of air-flow limiting unit 190 can be easily changed.
<The air-flow limiting unit of variation>
The air-flow limiting unit 190 of above-mentioned embodiment has side of sidewall portion 191 and top 192, side of sidewall portion 191 and top 192
Form the cover 194 of box-like open downwards.Substrate 10 of the top 192 of cover 194 when overlooking than being kept by mounting table 161
Greatly, the entirety of cover substrate 10.On the other hand, the air-flow limiting unit 190A of this variation and the air-flow of above-mentioned embodiment limit
Portion 190 equally has side of sidewall portion 191A and top 192A, but bases of the top 192a when overlooking only with being kept by mounting table 161
The end of plate 10 is overlapping.Mainly illustrate difference below.
Figure 14 is the stereogram for the air-flow limiting unit for representing variation.In fig. 14, the diagram of mounting table 161 is omitted.Such as
Shown in Figure 14, air-flow limiting unit 190A has side of sidewall portion 191a and top 192A.At top, 192A does not form opening portion, but
Opening portion can be formed.
The end of substrates 10 of the top 192A when overlooking only with being kept by mounting table 161 is overlapping, the center with substrate 10
Portion is not overlapping.The drying of the end for the substrate 10 that rate of drying is too fast in the prior art can be made slack-off.It is dry thus, it is possible to reduce
The inequality of dry speed.
Top 192A is only overlapping with the corner of the substrate 10 of the rectangle kept by mounting table 161 when overlooking, with substrate 10
Central portion it is not overlapping.The drying in the corner for the substrate 10 that rate of drying is too fast in the prior art can be made slack-off.Thus, it is possible to
Reduce the inequality of rate of drying.
The embodiment of decompression dry device etc. is explained above, but the present invention is not limited to above-mentioned embodiment etc.,
Various modifications, improvement can be carried out in the range of the purport of the invention that claim is recorded.
For example, organic el display be in the above-described embodiment future the light of light emitting layer 26 go out from the side draw of substrate 10
The top light emitting mode that bottom-emission mode goes out but it is also possible to be the light of light emitting layer in future 26 from the opposite side draw of substrate 10.
In the case of for top light emitting mode, substrate 10 can not be transparency carrier, but opaque substrate.This be because
Go out to carry out the light of light emitting layer 26 from the opposite side draw of substrate 10.
In the case of for top light emitting mode, it is used as comparative electrode for the anode 21 of transparency electrode, negative electrode 22 is used as pressing
The pixel electrode that each unit circuit 11 is set.Now, anode 21 and negative electrode 22 configuration on the contrary, therefore on negative electrode 22 according to
It is following to sequentially form electron injecting layer 28, electron supplying layer 27, luminescent layer 26, hole transporting layer 25 and hole injection layer 24.
Organic layer 23 has hole injection from the side of anode 21 to the side of negative electrode 22 according to following orders in the above-described embodiment
Layer 24, hole transporting layer 25, luminescent layer 26, electron supplying layer 27 and electron injecting layer 28, but as long as at least having luminescent layer 26
.Organic layer 23 is not limited to the structure shown in Fig. 2.
Substrate 10 and top 192 are shaped as rectangle, but their shape is not particularly limited.
Decompression dry device is used for the manufacture of organic el display, but for example can be used for the manufacture of liquid crystal display.
Claims (13)
- A kind of 1. decompression dry device, it is characterised in that including：Process container, it is stored formed with the substrate comprising organic material and the overlay of solvent；The board holder of the substrate is kept from below in the inside of the process container；It is connected with the exhaust outlet of the process container, the mechanism of decompressor depressurized to the inside of the process container；WithLimitation is gone near the upper surface of the substrate kept from the board holder to the exhaust outlet of the process container Air-flow air-flow limiting unit,The air-flow limiting unit includes：The side of sidewall portion of air-flow is blocked in the side of the substrate kept by the board holder；WithThe top of air-flow is blocked above the substrate kept by the board holder.
- 2. decompression dry device as claimed in claim 1, it is characterised in that：The top includes the air-flow for being gone upward near the upper surface of the substrate kept by the board holder The opening portion passed through.
- 3. decompression dry device as claimed in claim 2, it is characterised in that：The cover of box-like open downwards is formed on the side of sidewall portion and the top,The substrate for covering on internal storage and being kept by the board holder.
- 4. decompression dry device as claimed in claim 3, it is characterised in that：The air-flow limiting unit is additionally included in the top of the substrate kept by the board holder by the inside of the cover The lattice of separation.
- 5. decompression dry device as claimed in claim 4, it is characterised in that also include：Be spaced adjustment portion, its to the substrate kept by the board holder and the lattice in the vertical direction between Every being adjusted.
- 6. the decompression dry device as any one of claim 3~5, it is characterised in that：The cover is divided into multiple segmentation covers,Each segmentation cover includes：At the top of segmentation as the part at the top；With the part as the side of sidewall portion Segmentation side of sidewall portion.
- 7. decompression dry device as claimed in claim 6, it is characterised in that：At least one segmentation cover includes：At the top of the segmentation of rectangle；Be arranged at the top of the segmentation be connected three The side of sidewall portion on side.
- 8. decompression dry device as claimed in claim 6, it is characterised in that：At least one segmentation cover includes：At the top of the segmentation of rectangle；It is relative to each other at the top of the segmentation with being arranged at The side of sidewall portion on two sides.
- 9. the decompression dry device as any one of claim 6~8, it is characterised in that：It is provided with the cover at least one segmentation cover in the top of the substrate kept by the board holder Inside points every lattice.
- 10. decompression dry device as claimed in claim 1 or 2, it is characterised in that：The end of the substrate of the top when overlooking only with being kept by the board holder is overlapping.
- 11. decompression dry device as claimed in claim 1 or 2, it is characterised in that：The corner of the substrate of the top when overlooking only with being kept by the board holder is overlapping.
- A kind of 12. decompression drying method, it is characterised in that：Decompression dry device any one of usage right requirement 1~11 dries the overlay for being formed at the substrate.
- 13. decompression drying method as claimed in claim 12, it is characterised in that：The overlay is used for the manufacture of organic EL light emitting diodes.
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| JP2016186195A JP6804250B2 (en) | 2016-09-23 | 2016-09-23 | Vacuum drying device and vacuum drying method |
| JP2016-186195 | 2016-09-23 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111987241A (en) * | 2019-05-21 | 2020-11-24 | 东京毅力科创株式会社 | Decompression drying device |
| CN113410419A (en) * | 2021-08-18 | 2021-09-17 | 深圳市华星光电半导体显示技术有限公司 | Manufacturing method of display panel and drying equipment |
| CN114850003A (en) * | 2021-02-03 | 2022-08-05 | 芝浦机械电子装置株式会社 | Heat treatment apparatus |
| TWI836297B (en) * | 2020-11-30 | 2024-03-21 | 日商斯庫林集團股份有限公司 | Reduced pressure drying device |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020023485A1 (en) * | 2018-07-23 | 2020-01-30 | Kateeva, Inc. | Systems and methods for drying patterned oled formulations |
| JP7076135B2 (en) | 2018-07-27 | 2022-05-27 | 株式会社Joled | Manufacturing method of organic EL display panel |
| KR102367476B1 (en) * | 2020-05-15 | 2022-02-25 | 주식회사 선익시스템 | Substrate decompression drying apparatus includung vacuum suction part |
| KR102367478B1 (en) * | 2020-05-15 | 2022-02-25 | 주식회사 선익시스템 | Substrate decompression drying apparatus including cover member |
| KR102367475B1 (en) * | 2020-05-15 | 2022-02-25 | 주식회사 선익시스템 | Substrate decompression drying apparatus includung lifting cover part and method for controlling the same |
| WO2022196312A1 (en) | 2021-03-17 | 2022-09-22 | パナソニックＩｐマネジメント株式会社 | Vacuum drying device and vacuum drying method |
| KR102643857B1 (en) | 2021-11-02 | 2024-03-07 | 한국생산기술연구원 | Dispersion flow path apparatus and Vacuum drying apparatus with the same |
| KR20230066880A (en) | 2021-11-08 | 2023-05-16 | 한국생산기술연구원 | Vacuum drying apparatus with substrate heater means and vapor dispersion cooling plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007234390A (en) * | 2006-03-01 | 2007-09-13 | Seiko Epson Corp | Method of manufacturing organic el panel, and its manufacturing device |
| JP2010267428A (en) * | 2009-05-13 | 2010-11-25 | Panasonic Corp | Method and device for forming functional film |
| JP2011044380A (en) * | 2009-08-24 | 2011-03-03 | Panasonic Corp | Manufacturing device and manufacturing method of functional layer of organic el element |
| CN104596205A (en) * | 2015-02-13 | 2015-05-06 | 京东方科技集团股份有限公司 | Vacuum drying device and vacuum drying method |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101090895B1 (en) * | 2003-05-09 | 2011-12-08 | 에이에스엠 아메리카, 인코포레이티드 | Reactor surface passivation through chemical deactivation |
| JP2007090200A (en) * | 2005-09-28 | 2007-04-12 | Seiko Epson Corp | Drying method, drying equipment, and deposition method, method for manufacturing electrooptical apparatus, and electrooptical apparatus, and electronic equipment |
| JP2007232268A (en) * | 2006-02-28 | 2007-09-13 | Toshiba Corp | Pressure-reduced dryer and manufacturing process of coated object |
| JP2008218253A (en) * | 2007-03-06 | 2008-09-18 | Seiko Epson Corp | Manufacturing method of electro-optical device, and drying device |
| JP2011071013A (en) * | 2009-09-28 | 2011-04-07 | Panasonic Corp | Apparatus and method for manufacturing functional layer of organic el device |
| KR101188109B1 (en) * | 2010-09-20 | 2012-10-05 | 에스엔유 프리시젼 주식회사 | Monomer deposition apparatus |
| JP6328434B2 (en) * | 2013-03-14 | 2018-05-23 | 東京エレクトロン株式会社 | Drying apparatus and drying processing method |
| JP6338507B2 (en) | 2014-10-16 | 2018-06-06 | 東京エレクトロン株式会社 | Droplet ejection apparatus, droplet ejection method, program, and computer storage medium |
-
2016
- 2016-09-23 JP JP2016186195A patent/JP6804250B2/en not_active Expired - Fee Related
-
2017
- 2017-09-19 KR KR1020170120299A patent/KR102377344B1/en active IP Right Grant
- 2017-09-22 CN CN202110263228.XA patent/CN113036066A/en active Pending
- 2017-09-22 CN CN201710863857.XA patent/CN107871828B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007234390A (en) * | 2006-03-01 | 2007-09-13 | Seiko Epson Corp | Method of manufacturing organic el panel, and its manufacturing device |
| JP2010267428A (en) * | 2009-05-13 | 2010-11-25 | Panasonic Corp | Method and device for forming functional film |
| JP2011044380A (en) * | 2009-08-24 | 2011-03-03 | Panasonic Corp | Manufacturing device and manufacturing method of functional layer of organic el element |
| CN104596205A (en) * | 2015-02-13 | 2015-05-06 | 京东方科技集团股份有限公司 | Vacuum drying device and vacuum drying method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111987241A (en) * | 2019-05-21 | 2020-11-24 | 东京毅力科创株式会社 | Decompression drying device |
| TWI836297B (en) * | 2020-11-30 | 2024-03-21 | 日商斯庫林集團股份有限公司 | Reduced pressure drying device |
| CN114850003A (en) * | 2021-02-03 | 2022-08-05 | 芝浦机械电子装置株式会社 | Heat treatment apparatus |
| CN113410419A (en) * | 2021-08-18 | 2021-09-17 | 深圳市华星光电半导体显示技术有限公司 | Manufacturing method of display panel and drying equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102377344B1 (en) | 2022-03-21 |
| JP2018049806A (en) | 2018-03-29 |
| CN107871828B (en) | 2021-09-14 |
| KR20180033079A (en) | 2018-04-02 |
| CN113036066A (en) | 2021-06-25 |
| JP6804250B2 (en) | 2020-12-23 |
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