JP6805017B2 - Coating device and coating method - Google Patents

Description

The present invention relates to a coating apparatus and a coating method.

Conventionally, an organic light emitting diode (OLED: Organic Light Emitting Diode), which is a light emitting diode utilizing light emission of organic EL (Electroluminescence), is known. An organic EL display using an organic light emitting diode has advantages such as thinness, light weight, low power consumption, and excellent response speed, viewing angle, and contrast ratio. For this reason, it has been attracting attention in recent years as a next-generation flat panel display (FPD).

The organic light emitting diode has an anode formed on the substrate, a cathode provided on the side opposite to the substrate with reference to the anode, and an organic layer provided between the anode and the cathode. The organic layer has, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in this order from the anode side to the cathode side. An inkjet coating device is used to form the light emitting layer and the like.

The coating apparatus described in Patent Document 1 includes a plurality of functional droplet ejection heads that draw on a work by an inkjet method, a work stage on which the work is mounted, and a linear motor that moves the work stage in the main scanning direction. The work stage has a suction table for sucking the work, a θ table for correcting the position of the work set on the suction table by θ in the θ-axis direction, and the like.

Japanese Unexamined Patent Publication No. 2004-177262

Conventionally, the work stage for holding the substrate is heavy, the driving force for moving the substrate is large, and there is room for improvement in the position controllability of the substrate.

The present invention has been made in view of the above problems, and a main object of the present invention is to provide a coating device capable of improving the position controllability of a substrate.

In order to solve the above problems, according to one aspect of the present invention,
A coating device that draws a drawing pattern of the functional liquid on the substrate by moving the landing position of the droplet of the functional liquid on the substrate in the main scanning direction and the sub-scanning direction.
A stage portion that floats the substrate to a predetermined height by the wind pressure of gas, and
A droplet ejection portion for dropping droplets of the functional liquid from above onto the substrate floating at a predetermined height from the stage portion.
It is provided with a substrate moving portion that holds an end portion of the substrate floating at a predetermined height from the stage portion from above and moves the substrate in the main scanning direction and the sub-scanning direction.
The substrate moving portion is provided on both sides of the droplet ejection portion in the main scanning direction.
One of the substrate moving portions, while the plurality of substrate moving portions deliver the substrate and pass under the droplet ejection portion and the droplet ejection portion repeatedly drops the droplets on the substrate. Provides a coating device that moves the substrate in the sub-scanning direction.

According to one aspect of the present invention, there is provided a coating device capable of improving the position controllability of the substrate.

It is a top view which shows the organic EL display by one Embodiment. It is sectional drawing which shows the main part of the organic EL display by one Embodiment. It is a flowchart which shows the manufacturing method of the organic light emitting diode by one Embodiment. It is sectional drawing which shows the substrate which formed the coating layer by one Embodiment. It is sectional drawing which shows the substrate which dried the coating layer of FIG. 4 under reduced pressure. It is a top view which shows the substrate processing system by one Embodiment. It is a top view which shows the coating apparatus by one Embodiment. It is a side view which shows the coating apparatus by one Embodiment, and is the side view which shows the state at the time of yawing of the substrate by the substrate moving part on the left side. It is a side view which shows the coating apparatus by one Embodiment, and is the side view which shows the state at the start of the process which transfers a substrate from the substrate moving part on the left side to the substrate moving part on the right side. It is a side view which shows the coating apparatus by one Embodiment, and is the side view which shows the state in the process of handing over a substrate from the substrate moving part on the left side to the substrate moving part on the right side. It is a side view which shows the coating apparatus by one Embodiment, and is the side view which shows the state at the time of yawing of a substrate by the substrate moving part on the right side. It is a side view which shows the coating apparatus by one Embodiment, and is the side view which shows the state when the substrate is moved in the Y direction by the substrate moving part on the right side. It is a top view which shows the arrangement of the discharge head by one Embodiment. It is the figure which looked at the yawing correction part of the substrate moving part by one Embodiment from the bottom.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In each drawing, the same or corresponding configurations are designated by the same or corresponding reference numerals and the description thereof will be omitted.

<Organic EL display>
FIG. 1 is a plan view showing an organic EL display according to an embodiment. In FIG. 1, the circuit of one unit circuit 11 is enlarged and shown.

The organic EL display includes a substrate 10, a plurality of unit circuits 11 arranged on the substrate 10, a scanning line drive circuit 14 provided on the substrate 10, and a data line drive circuit 15 provided on the substrate 10. .. The unit circuit 11 is provided in a region surrounded by the plurality of scanning lines 16 connected to the scanning line driving circuit 14 and the plurality of data lines 17 connected to the data line driving circuit 15. The unit circuit 11 includes a TFT layer 12 and an organic light emitting diode 13.

The TFT layer 12 has a plurality of TFTs (Thin Film Transistors). One TFT has a function as a switching element, and the other TFT has a function as a current control element for controlling the amount of current flowing through the organic light emitting diode 13. The TFT layer 12 is operated by the scanning line driving circuit 14 and the data line driving circuit 15 to supply a current to the organic light emitting diode 13. The TFT layer 12 is provided for each unit circuit 11, and the plurality of unit circuits 11 are independently controlled. The TFT layer 12 may have a general configuration and is not limited to the configuration shown in FIG.

The drive method of the organic EL display is an active matrix method in this embodiment, but may be a passive matrix method.

FIG. 2 is a cross-sectional view showing a main part of the organic EL display according to the embodiment. As the substrate 10, a transparent substrate such as a glass substrate or a resin substrate is used. A TFT layer 12 is formed on the substrate 10. A flattening layer 18 for flattening the step formed by the TFT layer 12 is formed on the TFT layer 12.

The flattening layer 18 has an insulating property. A contact plug 19 is formed in the contact hole penetrating the flattening layer 18. The contact plug 19 electrically connects the anode 21 as a pixel electrode formed on the flat surface of the flattening layer 18 and the TFT layer 12. The contact plug 19 may be made of the same material as the anode 21 and may be formed at the same time.

The organic light emitting diode 13 is formed on the flat surface of the flattening layer 18. The organic light emitting diode 13 has an anode 21 as a pixel electrode, a cathode 22 as a counter electrode provided on the opposite side of the substrate 10 with respect to the pixel electrode, and an organic layer formed between the anode 21 and the cathode 22. It has 23 and. By operating the TFT layer 12, a voltage is applied between the anode 21 and the cathode 22, and the organic layer 23 emits light.

The anode 21 is formed of, for example, ITO (Indium Tin Oxide) and transmits light from the organic layer 23. The light transmitted through the anode 21 passes through the substrate 10 and is taken out to the outside. The anode 21 is provided for each unit circuit 11.

The cathode 22 is formed of, for example, aluminum or the like, and reflects light from the organic layer 23 toward the organic layer 23. The light reflected by the cathode 22 passes through the organic layer 23, the anode 21, and the substrate 10 and is taken out to the outside. The cathode 22 is common to the plurality of unit circuits 11.

The organic layer 23 has, for example, a hole injection layer 24, a hole transport layer 25, a light emitting layer 26, an electron transport layer 27, and an electron injection layer 28 in this order from the anode 21 side to the cathode 22 side. When a voltage is applied between the anode 21 and the cathode 22, holes are injected from the anode 21 into the hole injection layer 24, and electrons are injected from the cathode 22 into the electron injection layer 28. The holes injected into the hole injection layer 24 are transported to the light emitting layer 26 by the hole transport layer 25. Further, the electrons injected into the electron injection layer 28 are transported to the light emitting layer 26 by the electron transport layer 27. Then, holes and electrons are recombined in the light emitting layer 26, the light emitting material of the light emitting layer 26 is excited, and the light emitting layer 26 emits light.

As the light emitting layer 26, for example, a red light emitting layer, a green light emitting layer, and a blue light emitting layer are formed. The red light emitting layer is formed of a red light emitting material that emits red light, the green light emitting layer is formed of a green light emitting material that emits green light, and the blue light emitting layer is formed of a blue light emitting material that emits blue light. The red light emitting layer, the green light emitting layer, and the blue light emitting layer are formed in the opening 31 of the bank 30.

The bank 30 separates the material liquid of the red light emitting layer, the material liquid of the green light emitting layer, and the material liquid of the blue light emitting layer to prevent mixing of these material liquids. The bank 30 has an insulating property and fills a contact hole penetrating the flattening layer 18.

<Manufacturing method of organic light emitting diode>
FIG. 3 is a flowchart showing a method for manufacturing an organic light emitting diode according to an embodiment.

First, in step S101, the anode 21 as a pixel electrode is formed. For example, a thin-film deposition method is used to form the anode 21. The anode 21 is formed on the flat surface of the flattening layer 18 for each unit circuit 11. A contact plug 19 may be formed together with the anode 21.

In the following step S102, the bank 30 is formed. The bank 30 is formed using, for example, a photoresist, and is patterned into a predetermined pattern by a photolithography process. The anode 21 is exposed at the opening 31 of the bank 30.

In the following step S103, the hole injection layer 24 is formed. An inkjet method or the like is used to form the hole injection layer 24. By applying the material liquid of the hole injection layer 24 on the anode 21 by the inkjet method, the coating layer L is formed as shown in FIG. By drying and firing the coating layer L, the hole injection layer 24 is formed as shown in FIG.

In the following step S104, the hole transport layer 25 is formed. Similar to the formation of the hole injection layer 24, an inkjet method or the like is used to form the hole transport layer 25. A coating layer is formed by applying the material liquid of the hole transport layer 25 onto the hole injection layer 24 by an inkjet method. The hole transport layer 25 is formed by drying and firing the coating layer.

In the following step S105, the light emitting layer 26 is formed. Similar to the formation of the hole injection layer 24 and the hole transport layer 25, an inkjet method or the like is used to form the light emitting layer 26. A coating layer is formed by coating the material liquid of the light emitting layer 26 on the hole transport layer 25 by an inkjet method. The light emitting layer 26 is formed by drying and firing the coating layer.

As the light emitting layer 26, for example, a red light emitting layer, a green light emitting layer, and a blue light emitting layer are formed. The red light emitting layer, the green light emitting layer, and the blue light emitting layer are formed in the opening 31 of the bank 30. The bank 30 separates the material liquid of the red light emitting layer, the material liquid of the green light emitting layer, and the material liquid of the blue light emitting layer to prevent mixing of these functional liquids.

In the following step S106, the electron transport layer 27 is formed. For example, a thin-film deposition method is used to form the electron transport layer 27. Since the electron transport layer 27 may be common to the plurality of unit circuits 11, it may be formed not only on the light emitting layer 26 in the opening 31 of the bank 30 but also on the bank 30.

In the following step S107, the electron injection layer 28 is formed. For example, a thin-film deposition method is used to form the electron injection layer 28. The electron injection layer 28 is formed on the electron transport layer 27. The electron injection layer 28 may be common to the plurality of unit circuits 11.

In the following step S108, the cathode 22 is formed. For the formation of the cathode 22, for example, a vapor deposition method or the like is used. The cathode 22 is formed on the electron injection layer 28. The cathode 22 may be common to a plurality of unit circuits 11.

When the driving method of the organic EL display is not the active matrix method but the passive matrix method, the cathode 22 is patterned in a predetermined pattern.

The organic light emitting diode 13 is manufactured by the above steps. Among the organic layers 23, the substrate processing system 100 is used for forming the hole injection layer 24, the hole transport layer 25, and the light emitting layer 26.

<Board processing system>
FIG. 6 is a plan view showing a substrate processing system according to an embodiment. The substrate processing system 100 performs each process corresponding to steps S103 to S105 in FIG. 3 to form a hole injection layer 24, a hole transport layer 25, and a light emitting layer 26 on the anode 21. The substrate processing system 100 includes a carry-in station 110, a processing station 120, a carry-out station 130, and a control device 140.

The carry-in station 110 carries in a cassette C accommodating a plurality of boards 10 from the outside, and sequentially takes out the plurality of boards 10 from the cassette C. A TFT layer 12, a flattening layer 18, an anode 21, a bank 30, and the like are formed in advance on each substrate 10.

The carry-in station 110 includes a cassette mounting table 111 on which the cassette C is mounted, a transport path 112 provided between the cassette mounting table 111 and the processing station 120, and a substrate carrier 113 provided in the transport path 112. The substrate carrier 113 conveys the substrate 10 between the cassette C mounted on the cassette mounting table 111 and the processing station 120.

The processing station 120 forms a hole injection layer 24, a hole transport layer 25, and a light emitting layer 26 on the anode 21. The processing station 120 includes a hole injection layer forming block 121 that forms the hole injection layer 24, a hole transport layer forming block 122 that forms the hole transport layer 25, and a light emitting layer forming block 123 that forms the light emitting layer 26. To be equipped.

The hole injection layer forming block 121 forms the hole injection layer 24 by applying the material liquid of the hole injection layer 24 on the anode 21 to form a coating layer, and drying and firing the coating layer. .. The material liquid of the hole injection layer 24 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may be polymerized by firing to form a polymer.

The hole injection layer forming block 121 includes a coating device 121a, a buffer device 121b, a vacuum drying device 121c, a heat treatment device 121d, and a temperature control device 121e. The coating device 121a discharges the droplets of the material liquid of the hole injection layer 24 toward the opening 31 of the bank 30. The buffer device 121b temporarily accommodates the substrate 10 waiting to be processed. The vacuum drying device 121c dries the coating layer coated by the coating device 121a under reduced pressure to remove the solvent contained in the coating layer. The heat treatment apparatus 121d heat-treats the coating layer dried by the vacuum drying apparatus 121c. The temperature control device 121e adjusts the temperature of the substrate 10 heat-treated by the heat treatment device 121d to a predetermined temperature, for example, room temperature.

The inside of the coating device 121a, the buffer device 121b, the heat treatment device 121d, and the temperature control device 121e is maintained in an atmospheric atmosphere. The vacuum drying device 121c switches the internal atmosphere between an atmospheric atmosphere and a reduced pressure atmosphere.

In the hole injection layer forming block 121, the arrangement, number, and internal atmosphere of the coating device 121a, the buffer device 121b, the vacuum drying device 121c, the heat treatment device 121d, and the temperature control device 121e can be arbitrarily selected.

Further, the hole injection layer forming block 121 includes substrate transport devices CR1 to CR3 and delivery devices TR1 to TR3. The substrate transport devices CR1 to CR3 transport the substrate 10 to each adjacent device. For example, the substrate transfer device CR1 transfers the substrate 10 to the adjacent coating device 121a and buffer device 121b. The substrate transfer device CR2 transfers the substrate 10 to the adjacent vacuum drying device 121c. The substrate transfer device CR3 conveys the substrate 10 to the adjacent heat treatment device 121d and temperature control device 121e. The delivery devices TR1 to TR3 are provided in order between the carry-in station 110 and the board transfer device CR1, between the board transfer device CR1 and the board transfer device CR2, and between the board transfer device CR2 and the board transfer device CR3. The substrate 10 is relayed between them. The inside of the substrate transfer devices CR1 to CR3 and the delivery devices TR1 to TR3 is maintained in an atmospheric atmosphere.

Between the substrate transfer device CR3 of the hole injection layer forming block 121 and the substrate transfer device CR4 of the hole transport layer forming block 122, a delivery device TR4 that relays the substrate 10 between them is provided. The inside of the delivery device TR4 is maintained in an atmospheric atmosphere.

The hole transport layer forming block 122 is formed by applying the material liquid of the hole transport layer 25 on the hole injection layer 24 to form a coating layer, and drying and firing the coating layer to dry and fire the hole transport layer 25. To form. The material liquid of the hole transport layer 25 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may be polymerized by firing to form a polymer.

The hole transport layer forming block 122 includes a coating device 122a, a buffer device 122b, a vacuum drying device 122c, a heat treatment device 122d, and a temperature control device 122e. The coating device 122a discharges the droplets of the material liquid of the hole transport layer 25 toward the opening 31 of the bank 30. The buffer device 122b temporarily accommodates the substrate 10 waiting to be processed. The vacuum drying device 122c dries the coating layer coated by the coating device 122a under reduced pressure to remove the solvent contained in the coating layer. The heat treatment apparatus 122d heat-treats the coating layer dried by the vacuum drying apparatus 122c. The temperature control device 122e adjusts the temperature of the substrate 10 heat-treated by the heat treatment device 122d to a predetermined temperature, for example, room temperature.

The inside of the coating device 122a and the buffer device 122b is maintained in an atmospheric atmosphere. On the other hand, the heat treatment device 122d and the temperature control device 122e suppress the deterioration of the organic material of the hole transport layer 25, so that the inside is maintained in an atmosphere of low oxygen and low dew point. The vacuum drying device 122c switches the internal atmosphere between a low oxygen and low dew point atmosphere and a reduced pressure atmosphere.

Here, the low oxygen atmosphere means an atmosphere having an oxygen concentration lower than that of the atmosphere, for example, an atmosphere having an oxygen concentration of 10 ppm or less. The low dew point atmosphere means an atmosphere in which the dew point temperature is lower than the atmosphere, for example, an atmosphere in which the dew point temperature is −10 ° C. or lower. The atmosphere of low oxygen and low dew point is formed by an inert gas such as nitrogen gas.

In the hole transport layer forming block 122, the arrangement, number, and internal atmosphere of the coating device 122a, the buffer device 122b, the vacuum drying device 122c, the heat treatment device 122d, and the temperature control device 122e can be arbitrarily selected.

Further, the hole transport layer forming block 122 includes substrate transport devices CR4 to CR6 and delivery devices TR5 to TR6. The substrate transport devices CR4 to CR6 transport the substrate 10 to each adjacent device. The delivery devices TR5 to TR6 are provided in order between the board transfer device CR4 and the board transfer device CR5, and between the board transfer device CR5 and the board transfer device CR6, and relay the board 10 between them.

The inside of the substrate transfer device CR4 is maintained in an atmospheric atmosphere. On the other hand, the inside of the substrate transport devices CR5 to CR6 is maintained in an atmosphere of low oxygen and low dew point. This is because the inside of the vacuum drying device 122c adjacent to the substrate transfer device CR5 can be switched between a low oxygen and low dew point atmosphere and a reduced pressure atmosphere. This is also because the inside of the heat treatment device 122d and the temperature control device 122e provided adjacent to the substrate transfer device CR6 is maintained in an atmosphere of low oxygen and low dew point.

The delivery device TR5 is configured as a load lock device that switches the internal atmosphere between the atmospheric atmosphere and the atmosphere of low oxygen and low dew point. This is because the vacuum drying device 122c is installed next to the delivery device TR6 on the downstream side. On the other hand, the inside of the delivery device TR6 is maintained in an atmosphere of low oxygen and low dew point.

A transfer device TR7 that relays the substrate 10 between the substrate transfer device CR6 of the hole transport layer forming block 122 and the substrate transfer device CR7 of the light emitting layer forming block 123 is provided. The inside of the substrate transfer device CR6 is maintained in an atmosphere of low oxygen and low dew point, and the inside of the substrate transfer device CR7 is maintained in an atmosphere of air. Therefore, the delivery device TR7 is configured as a load lock device that switches the atmosphere inside the delivery device TR7 between a low oxygen and low dew point atmosphere and an atmospheric atmosphere.

The light emitting layer forming block 123 forms the light emitting layer 26 by applying the material liquid of the light emitting layer 26 on the hole transport layer 25 to form a coating layer, and drying and firing the formed coating layer. The material liquid of the light emitting layer 26 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may be polymerized by firing to form a polymer.

The light emitting layer forming block 123 includes a coating device 123a, a buffer device 123b, a vacuum drying device 123c, a heat treatment device 123d, and a temperature control device 123e. The coating device 123a discharges the droplets of the material liquid of the light emitting layer 26 toward the opening 31 of the bank 30. The buffer device 123b temporarily accommodates the substrate 10 waiting to be processed. The vacuum drying device 123c dries the coating layer coated by the coating device 123a under reduced pressure to remove the solvent contained in the coating layer. The heat treatment apparatus 123d heat-treats the coating layer dried by the vacuum drying apparatus 123c. The temperature control device 123e adjusts the temperature of the substrate 10 heat-treated by the heat treatment device 123d to a predetermined temperature, for example, room temperature.

The inside of the coating device 123a and the buffer device 123b is maintained in an atmospheric atmosphere. On the other hand, the heat treatment device 123d and the temperature control device 123e suppress the deterioration of the organic material of the light emitting layer 26, so that the inside is maintained in an atmosphere of low oxygen and low dew point. The vacuum drying device 123c switches the internal atmosphere between a low oxygen and low dew point atmosphere and a reduced pressure atmosphere.

In the light emitting layer forming block 123, the arrangement, number, and internal atmosphere of the coating device 123a, the buffer device 123b, the vacuum drying device 123c, the heat treatment device 123d, and the temperature control device 123e can be arbitrarily selected.

Further, the light emitting layer forming block 123 includes substrate transport devices CR7 to CR9 and delivery devices TR8 to TR9. The substrate transport devices CR7 to CR9 transport the substrate 10 to each adjacent device. The delivery devices TR8 to TR9 are provided in order between the board transfer device CR7 and the board transfer device CR8, and between the board transfer device CR8 and the board transfer device CR9, and relay the board 10 between them.

The inside of the substrate transfer device CR7 is maintained in an atmospheric atmosphere. On the other hand, the inside of the substrate transport devices CR8 to CR9 is maintained in an atmosphere of low oxygen and low dew point. This is because the inside of the vacuum drying device 123c adjacent to the substrate transfer device CR8 can be switched between a low oxygen and low dew point atmosphere and a reduced pressure atmosphere. This is also because the inside of the heat treatment device 123d and the temperature control device 123e provided adjacent to the substrate transfer device CR9 is maintained in an atmosphere of low oxygen and low dew point.

The delivery device TR8 is configured as a load lock device that switches the internal atmosphere between the atmospheric atmosphere and the atmosphere of low oxygen and low dew point. This is because the vacuum drying device 123c is installed next to the delivery device TR8 on the downstream side. The inside of the delivery device TR9 is maintained in an atmosphere of low oxygen and low dew point.

Between the substrate transfer device CR9 of the light emitting layer forming block 123 and the carry-out station 130, a delivery device TR10 that relays the substrate 10 between them is provided. The inside of the substrate transfer device CR9 is maintained in an atmosphere of low oxygen and low dew point, and the inside of the carry-out station 130 is maintained in an atmosphere of air. Therefore, the delivery device TR7 is configured as a load lock device that switches the atmosphere inside the delivery device TR7 between a low oxygen and low dew point atmosphere and an atmospheric atmosphere.

The carry-out station 130 sequentially stores the plurality of boards 10 in the cassette C, and carries out the cassette C to the outside. The unloading station 130 includes a cassette mounting table 131 on which the cassette C is mounted, a transport path 132 provided between the cassette mounting table 131 and the processing station 120, and a substrate carrier 133 provided in the transport path 132. The substrate transfer body 133 conveys the substrate 10 between the processing station 120 and the cassette C mounted on the cassette mounting table 131.

The control device 140 is composed of a computer including a CPU (Central Processing Unit) 141 and a storage medium 142 such as a memory, and causes the CPU 141 to execute various processes by causing the CPU 141 to execute a program (also called a recipe) stored in the storage medium 142. To realize.

The program of the control device 140 is stored in the information storage medium and installed from the information storage medium. Examples of the information storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical desk (MO), a memory card, and the like. The program may be downloaded and installed from the server via the Internet.

Next, a substrate processing method using the substrate processing system 100 having the above configuration will be described. When the cassette C accommodating the plurality of substrates 10 is mounted on the cassette mounting table 111, the substrate carrier 113 sequentially takes out the substrate 10 from the cassette C on the cassette mounting table 111, and the hole injection layer forming block 121. Transport to.

The hole injection layer forming block 121 forms the hole injection layer 24 by applying the material liquid of the hole injection layer 24 on the anode 21 to form a coating layer, and drying and firing the formed coating layer. To do. The substrate 10 on which the hole injection layer 24 is formed is delivered from the hole injection layer forming block 121 to the hole transport layer forming block 122 by the delivery device TR4.

The hole transport layer forming block 122 is formed by applying the material liquid of the hole transport layer 25 on the hole injection layer 24 to form a coating layer, and drying and firing the formed coating layer to form a hole transport layer. 25 is formed. The substrate 10 on which the hole transport layer 25 is formed is delivered from the hole transport layer forming block 122 to the light emitting layer forming block 123 by the delivery device TR7.

The light emitting layer forming block 123 forms the light emitting layer 26 by applying the material liquid of the light emitting layer 26 on the hole transport layer 25 to form a coating layer, and drying and firing the formed coating layer. The substrate 10 on which the light emitting layer 26 is formed is delivered from the light emitting layer forming block 123 to the carry-out station 130 by the delivery device TR10.

The board carrier 133 of the unloading station 130 stores the board 10 received from the delivery device TR10 in a predetermined cassette C on the cassette mounting table 131. As a result, a series of processing of the substrate 10 in the substrate processing system 100 is completed.

The substrate 10 is carried out from the carry-out station 130 in a state of being housed in the cassette C. An electron transport layer 27, an electron injection layer 28, a cathode 22, and the like are formed on the substrate 10 carried out to the outside.

<Applying device and coating method>
Next, the coating device 123a of the light emitting layer forming block 123 will be described mainly with reference to FIGS. 7 to 12. FIG. 7 is a plan view showing a coating apparatus according to an embodiment. In FIG. 7, the carry-in position of the substrate 10 is shown by a broken line. 8 to 12 are side views showing the coating apparatus according to one embodiment, FIG. 8 is a side view showing a state of the substrate when the substrate is yawed by the substrate moving portion on the left side, and FIG. A side view showing a state at the start of the process of delivering the substrate to the substrate moving portion of the above, FIG. 10 is a side view and a view showing a state in the middle of the process of delivering the substrate from the substrate moving portion on the left side to the substrate moving portion on the right side. 11 is a side view showing the state of the substrate when the substrate is yawed by the substrate moving portion on the right side, and FIG. 12 is a side view showing the state when the substrate is moved in the Y direction by the substrate moving portion on the right side. In the drawings below, the X direction is the main scanning direction, the Y direction is the sub scanning direction, and the Z direction is the vertical direction. The X and Y directions are horizontal directions that are orthogonal to each other. The X direction and the Y direction may intersect with each other and may not be orthogonal to each other. Further, in FIGS. 7 to 12, one side of the droplet ejection portion 160 in the X direction is also referred to as “left side”, and the opposite side of the droplet ejection portion 160 in the X direction is also referred to as “right side”.

The coating device 123a moves the landing position of the droplet of the functional liquid (for example, the material liquid of the light emitting layer 26) on the substrate 10 in the X direction and the Y direction, and draws a drawing pattern of the functional liquid on the substrate 10. The coating device 123a is, for example, a stage portion 150 in which the substrate 10 is floated at a predetermined height by the wind pressure of a gas, and a droplet in which droplets of the functional liquid are dropped onto the substrate 10 floating from the stage portion 150 at a predetermined height. It is provided with a discharge unit 160. Further, the coating device 123a holds the end portion of the substrate 10 (for example, a portion outside the drawing area of the functional liquid) floating from the stage portion 150 at a predetermined height from above and moves in the X direction and the Y direction. A substrate moving unit 170 is provided. The substrate moving portions 170 are provided on both sides of the droplet ejection portion 160 in the X direction. A plurality of substrate moving portions 170 pass the substrate 10 and pass under the droplet ejection portion 160, and the droplet ejection portion 160 drops droplets on the substrate 10. Further, the coating device 123a includes a slide mechanism unit 200 for moving the droplet ejection unit 160 in the Y direction, and a maintenance unit 210 for performing a process for maintaining the function of the droplet ejection unit 160.

The stage portion 150 has a plurality of air supply ports 151 for injecting gas on the upper surface thereof. The stage portion 150 is connected to a gas supply source 152 that supplies gas to each air supply port 151. When the gas supply source 152 is operated, gas is injected from each air supply port 151 of the stage portion 150, and the substrate 10 is supported at a constant height from the upper surface of the stage portion 150 by the wind pressure of the gas.

The stage portion 150 may have a plurality of intake ports 153 for sucking gas on the upper surface thereof. The stage portion 150 is connected to a gas suction source 154 that sucks gas from each intake port 153. When the gas suction source 154 is operated, gas is sucked from each intake port 153. Thereby, the suction amount of the gas and the injection amount of the gas can be balanced, the variation in the gap between the substrate 10 and the stage portion 150 can be reduced, and the horizontality of the upper surface of the substrate 10 can be improved.

As shown in FIG. 8, the stage portion 150 may be divided into three regions X1, X2, and X3 in the X direction, and only the air supply ports 151 are provided in the regions X1 and X3 at both ends in the X direction, and the center in the X direction. The region X2 may be provided with both an air supply port 151 and an intake port 153. Above the region X2 in the center of the X direction, the horizontality of the substrate 10 can be improved, and the accuracy of the drawing pattern of the functional liquid on the substrate 10 can be improved. Both the air supply port 151 and the intake port 153 may be provided in the regions X1 and X3 at both ends in the X direction.

The stage portion 150 may have a lift pin (not shown) that appears and disappears from the upper surface thereof. When the stage portion 150 passes the substrate 10 to and from the robot, the lift pin protrudes from the upper surface of the stage portion 150. On the other hand, when the substrate moving portion 170 moves the substrate 10 and the droplet ejection portion 160 drops droplets of the functional liquid onto the substrate 10, the lift pin is immersed in the upper surface of the stage portion 150. As the lifting mechanism for raising and lowering the lift pin, for example, a pneumatic cylinder or the like is used.

The droplet ejection unit 160 ejects droplets of the functional liquid from the stage unit 150 toward the substrate 10 floating at a predetermined height. A plurality of droplet ejection portions 160 (for example, 10 in FIG. 7) are arranged in the Y direction. The plurality of droplet ejection portions 160 may be independently moved in the Y direction, or may be integrally moved in the Y direction.

Each droplet ejection unit 160 has a plurality of ejection heads 161 (see FIG. 8). Each discharge head 161 has a discharge nozzle row composed of a plurality of discharge nozzles arranged in the Y direction on the lower surface thereof. Each discharge head 161 may have a plurality of discharge nozzle rows on its lower surface.

Each discharge head 161 has a piezo element for each discharge nozzle. When a voltage is applied to the piezo element, the piezo element is deformed and droplets are ejected from the ejection nozzle. A heater or the like may be used instead of the piezo element. When a voltage is applied to the heater, bubbles are generated, and droplets are discharged from the discharge nozzle by the pressure of the generated bubbles.

Each droplet ejection unit 160 may eject a plurality of types of functional liquids. Examples of the plurality of types of functional liquids include a material liquid for a red light emitting layer, a material liquid for a green light emitting layer, and a material liquid for a blue light emitting layer. A plurality of discharge nozzles provided on the same discharge head 161 discharge droplets of the same type of functional liquid.

FIG. 13 is a plan view showing an arrangement of discharge heads according to one embodiment. Each droplet ejection unit 160 has two ejection head rows 162 arranged in the Y direction. Each discharge head row 162 is composed of six discharge heads 161 arranged in steps in the X direction. Each discharge head row 162 comprises a discharge head 161R that discharges droplets of the material liquid of the red light emitting layer, a discharge head 161G that discharges droplets of the material liquid of the green light emitting layer, and droplets of the material liquid of the blue light emitting layer. It has two discharge heads 161B for discharging.

As shown in FIG. 7, the slide mechanism unit 200 has a position at which the droplet discharge unit 160 is floated from the stage unit 150 to a substrate 10 at a predetermined height, and a maintenance unit 210. Move to and from the position that accepts the process for maintaining the function. The slide mechanism unit 200 is provided along a pair of Y-axis beams 201 spanning above the stage unit 150, a pair of Y-axis guides 202 laid on the pair of Y-axis beams 201, and a pair of Y-axis guides 202. It has a pair of Y-axis linear motors that move the droplet ejection unit 160.

The maintenance unit 210 performs a process of maintaining the function of the droplet ejection unit 160, and eliminates the ejection defect of the droplet ejection unit 160. The maintenance unit 210 has a wiping unit 211 that wipes the periphery of the discharge port of the discharge nozzle, and a suction unit 212 that sucks droplets from the discharge port of the discharge nozzle. The suction unit 212 also plays a role of closing the discharge port of the discharge nozzle in the dormant state and suppressing clogging due to drying.

Next, the substrate moving portion 170 provided on the left side of the droplet ejection portion 160 will be described. Since the substrate moving portion 170 provided on the right side of the droplet ejection portion 160 is configured in the same manner as the substrate moving portion 170 provided on the left side of the droplet ejection portion 160, the description thereof will be omitted.

The substrate moving portion 170 holds the end portion of the substrate 10 floating at a predetermined height from the stage portion 150 from above and moves the substrate 10 in the X direction and the Y direction. As a result, the landing position of the droplet of the functional liquid on the substrate 10 can be moved in the X direction and the Y direction. The reason why the substrate 10 is moved in the Y direction is that there is a gap ΔY between the plurality of discharge heads 161 that discharge the same type of functional liquid as shown in FIG. By moving the substrate 10 in the Y direction, it becomes possible to land a droplet of a specific type of functional liquid on the entire Y direction of the substrate 10. Further, the reason why the substrate 10 is moved in the Y direction instead of the droplet ejection portion 160 is to prevent the functional liquid contained in the droplet ejection portion 160 from shaking.

As shown in FIG. 8, for example, the substrate moving portion 170 has an X-axis guide portion 171 extending in the X direction and an X-axis slider portion 172 moved along the X-axis guide portion 171. The X-axis guide portion 171 is fixed to the X-axis beam 179 provided above the stage portion 150. A linear motor or the like is used as a drive source for moving the X-axis slider portion 172 along the X-axis guide portion 171. A pair of X-axis guide portions 171 and X-axis slider portions 172 are provided at intervals in the Y direction.

As shown in FIG. 8, the substrate moving portion 170 has a plurality of substrate holding portions 173 that hold the substrate 10 from above. Each substrate holding portion 173 holds an end portion of the substrate 10 from above so as to avoid a drawing area of the functional liquid of the substrate 10. As each substrate holding portion 173, for example, a vacuum suction pad is used, but an electrostatic suction pad or the like may be used.

A part of the substrate holding portion 173 holds the end portion of the substrate 10 from above while moving together with the X-axis slider portion 172. The remaining substrate holding portion 173 is used for leveling correction of the substrate 10 and yawing of the substrate 10, and does not move together with the X-axis slider portion 172.

All the substrate holding portions 173 may move together with the X-axis slider portion 172. If at least a part of the substrate holding portion 173 moves together with the X-axis slider portion 172, the movement of the substrate 10 in the X direction can be stabilized.

The substrate moving portion 170 further includes a Y-axis guide portion 181 extending in the Y direction and a Y-axis slider portion 182 that is moved along the Y-axis guide portion 181. The Y-axis guide portion 181 is fixed to, for example, the X-axis slider portion 172.

A part of the substrate holding portion 173 holds the end portion of the substrate 10 from above while moving together with the X-axis slider portion 172 and the Y-axis slider portion 182. The remaining substrate holding portion 173 is used for leveling correction of the substrate 10 and yawing of the substrate 10 as described above, and does not move together with the X-axis slider portion 172 and the Y-axis slider portion 182.

The substrate holding portion 173 that does not move together with the X-axis slider portion 172 may move together with the Y-axis slider portion 182. All substrate holders 173 may move with the Y-axis slider 182.

The substrate moving unit 170 may have a horizontality correction unit 184 that corrects the horizontality of the substrate 10 held by the plurality of substrate holding units 173. Thereby, for example, the upper surface of the bank 30 can be aligned horizontally, and the overflow of the functional liquid from the opening 31 of the bank 30 can be suppressed.

The levelness correction unit 184 includes, for example, a plurality of elevating units 185 that independently elevate and elevate the plurality of substrate holding units 173. The elevating part 185 is provided for each board holding part 173. Each elevating unit 185 includes, for example, a servomotor and a motion conversion mechanism such as a ball screw that converts the rotational motion of the servomotor into a linear motion. Each elevating unit 185 is also used for transferring the substrate 10 between the left substrate moving portion 170 and the right substrate moving portion 170, which will be described in detail later.

Further, the substrate moving unit 170 may have a yawing correction unit 190 (see FIG. 14) that rotationally moves the substrate 10 held by the plurality of substrate holding units 173 in a vertical direction. The center of rotation of the substrate 10 may be set at the center of the substrate 10. By yawing the substrate 10, the direction in which the openings 31 of the bank 30 are lined up and the extending direction of the discharge nozzle row can be aligned.

FIG. 14 is a view of the yawing correction portion of the substrate moving portion according to the embodiment as viewed from below. In FIG. 14, the holding position of the substrate 10 is shown by a broken line. Further, in FIG. 14, the yawing correction unit 190 is enlarged and shown.

The yawing correction unit 190 can, for example, independently move a plurality of rotation support portions 191 that independently rotate a plurality of substrate holding portions 173 and a plurality of substrate holding portions 173 in the X direction and the Y direction in a vertical direction. It has a plurality of moving support portions 192 that support the.

The rotation support portion 191 and the movement support portion 192 are provided for each substrate holding portion 173. As shown in FIG. 8, the substrate holding portion 173 is attached to the X-axis slider portion 172 or the X-axis beam 179 via the rotation support portion 191 and the moving support portion 192, the elevating portion 185, and the like.

The rotation support portion 191 is composed of a bearing or the like that rotatably supports a rotation shaft that rotates together with the substrate holding portion 173. On the other hand, the movement support portion 192 includes an X-axis position correction guide 193 extending in the X direction, an X-axis position correction slider 194 moved along the X-axis position correction guide 193, and a Y-axis position correction guide 195 extending in the Y direction. And a Y-axis position correction slider 196 that is moved along the Y-axis position correction guide 195.

For example, the rotation support portion 191 on the left side in FIG. 14 is fixed to the Y-axis position correction slider 196. The Y-axis position correction guide 195 that guides the Y-axis position correction slider 196 in the Y direction is fixed to the X-axis position correction slider 194. The X-axis position correction guide 193 that guides the X-axis position correction slider 194 in the X direction is attached to the X-axis slider portion 172 via the elevating portion 185 and the Y-axis slider portion 182.

Further, the rotation support portion 191 on the right side in FIG. 14 is fixed to the X-axis position correction slider 194. The X-axis position correction guide 193 that guides the X-axis position correction slider 194 in the X direction is fixed to the Y-axis position correction slider 196. The Y-axis position correction guide 195 that guides the Y-axis position correction slider 196 in the Y direction is attached to the X-axis beam 179 via the elevating portion 185.

The yawing correction unit 190 has an X-axis drive unit 197 that moves a part of the substrate holding unit 173 in the X direction, and a Y-axis drive unit 198 that moves a part of the substrate holding unit 173 in the Y direction. The X-axis drive unit 197 moves the X-axis position correction slider 194 along the X-axis position correction guide 193. The Y-axis drive unit 198 moves the Y-axis position correction slider 196 along the Y-axis position correction guide 195. The X-axis drive unit 197 and the Y-axis drive unit 198 are configured in the same manner as the elevating unit 185.

By operating the X-axis drive unit 197 and the Y-axis drive unit 198, the yawing correction unit 190 rotates the substrate 10 held by the plurality of substrate holding units 173 in a vertical direction. The yawing correction unit 190 having the above configuration can also translate the substrates 10 held by the plurality of substrate holding units 173 in the X direction or in the Y direction.

The yawing correction unit 190 has a braking device that prohibits the movement of the X-axis position correction slider 194, the movement of the Y-axis position correction slider 196, the rotation of the board holding unit 173, and the like in order to prevent unintended yawing of the substrate 10. You may. The brake device allows the movement of the X-axis position correction slider 194, the movement of the Y-axis position correction slider 196, the rotation of the substrate holding portion 173, and the like, if necessary.

Next, the coating method using the coating device 123a having the above configuration will be described mainly with reference to FIGS. 8 to 12. The following operations of the coating device 123a are controlled by the control device 140. Although the control device 140 is provided separately from the coating device 123a in FIG. 6, it may be provided as a part of the coating device 123a.

First, when the robot (not shown) carries the substrate 10 into the coating device 123a from the outside of the coating device 123a, the stage unit 150 projects the lift pin from the upper surface of the stage unit 150 and receives the substrate 10 from the robot by the lift pin. The robot may carry the substrate 10 between the stage portion 150 and the X-axis beam 179. After that, the stage portion 150 lowers the lift pin and floats the substrate 10 at a predetermined height from the upper surface of the stage portion 150 by the wind pressure of the gas injected from the air supply port 151. The X-axis beam 179 may retract in the Y direction when the substrate 10 is carried in and out by the robot.

Subsequently, as shown in FIG. 8, the substrate moving portion 170 on the left side holds the end portion of the substrate 10 by the plurality of substrate holding portions 173, and yaws the substrate 10 based on an image obtained by capturing the alignment mark of the substrate 10. I do. In addition to yawing of the substrate 10, translation of the substrate 10 in the X and Y directions and levelness correction of the substrate 10 may be performed.

After that, the substrate moving portion 170 on the left side releases the holding of the substrate 10 by the substrate holding portion 173 that does not move together with the X-axis slider portion 172, and retracts the substrate holding portion 173 that has released the holding of the substrate 10 upward. Subsequently, the substrate moving portion 170 on the left side moves the X-axis slider portion 172 while holding the substrate 10 from above by the remaining substrate holding portion 173, and moves the substrate 10 in the X direction. As a result, the substrate 10 starts to move from the left side to the right side.

Next, as shown in FIG. 9, the substrate moving portion 170 on the right side starts moving the X-axis slider portion 172 on the right side. The X-axis slider section 172 on the right side is gradually accelerated to reach the same moving speed as the X-axis slider section 172 on the left side.

After that, as shown in FIG. 10, the substrate holding portion 173 that moves together with the X-axis slider portion 172 on the right side is displaced downward to hold the end portion of the substrate 10. Subsequently, the substrate holding portion 173 that moves together with the X-axis slider portion 172 on the left side releases the holding of the substrate 10 and is displaced upward. Next, the left X-axis slider portion 172 is stopped.

In this way, the substrate moving portion 170 on the left side and the substrate moving portion 170 on the right side pass the substrate 10 and pass under the droplet ejection portion 160. While the substrate 10 passes under the droplet ejection portion 160, the droplet ejection portion 160 ejects droplets toward the substrate 10.

Next, as shown in FIG. 11, the substrate moving portion 170 on the right side holds the end portion of the substrate 10 by the plurality of substrate holding portions 173, and yaws the substrate 10 based on the image obtained by capturing the alignment mark of the substrate 10. Do. It is possible to correct the deviation of the substrate 10 during delivery. In addition to yawing of the substrate 10, translation of the substrate 10 in the X and Y directions and levelness correction of the substrate 10 may be performed.

After that, as shown in FIG. 12, the substrate moving portion 170 on the right side releases the holding of the substrate 10 by the substrate holding portion 173 that does not move together with the Y-axis slider portion 182, and the substrate holding portion 173 released from holding the substrate 10. Evacuate upward. Subsequently, the substrate moving portion 170 on the right side moves the Y-axis slider portion 182 in the Y direction while holding the substrate 10 by the remaining substrate holding portion 173, and moves the substrate 10 in the Y direction. The reason why the substrate 10 is moved in the Y direction is that there is a gap ΔY between the plurality of discharge heads 161 that discharge the same type of functional liquid as shown in FIG. By moving the substrate 10 in the Y direction, it becomes possible to land a droplet of a specific type of functional liquid on the entire Y direction of the substrate 10. Further, the reason why the substrate 10 is moved in the Y direction instead of the droplet ejection portion 160 is to prevent the functional liquid contained in the droplet ejection portion 160 from shaking.

The substrate moving portion 170 on the right side moves the Y-axis slider portion 182 in the Y direction in order to move the substrate 10 in the Y direction. Along with this, the substrate moving portion 170 on the left side moves the Y-axis slider portion 182 in the Y direction so that the end portion of the substrate 10 can be held when the substrate 10 is received from the substrate moving portion 170 on the right side. The Y-axis slider portion 182 on the right side and the Y-axis slider portion 182 on the left side are moved in the same movement direction by the same amount of movement.

The order of the processing shown in FIG. 12 and the processing shown in FIG. 11 may be reversed. That is, after moving the substrate 10 in the Y direction, yawing of the substrate 10 may be performed. Further, if there is almost no deviation at the time of delivery of the substrate 10, it is not necessary to yaw the substrate 10.

After that, the substrate moving portion 170 on the right side and the substrate moving portion 170 on the left side perform the operation opposite to the delivery of the substrate 10 from the left side to the right side, thereby delivering the substrate 10 from the right side to the left side. While the substrate 10 passes under the droplet ejection portion 160, the droplet ejection portion 160 ejects droplets toward the substrate 10.

In this way, the coating device 123a moves the substrate 10 in the X direction by the plurality of substrate moving portions 170, drops droplets by the droplet ejection portion 160, and moves the substrate 10 in the Y direction by one substrate moving portion 170. By repeating the process alternately, a drawing pattern of the functional liquid is drawn on the substrate 10.

After the drawing is completed, the stage unit 150 lifts the substrate 10 with a lift pin and hands the substrate 10 to the robot. After that, the robot carries out the substrate 10 from the inside of the coating device 123a to the outside of the coating device 123a.

After that, the robot carries the next substrate 10 from the outside of the coating device 123a into the coating device 123a, the coating device 123a draws a drawing pattern of the functional liquid on the substrate 10, and the robot draws the substrate 10 from the inside of the coating device 123a. It is repeatedly carried out to the outside of the coating device 123a.

The process of maintaining the function of the droplet ejection unit 160 by the maintenance unit 210 is appropriately performed during the replacement of the substrate 10.

<Summary>
As described above, according to the present embodiment, the coating device 123a draws a drawing pattern of the functional liquid on the substrate 10 while floating the substrate 10 from the stage portion 150 at a predetermined height by the wind pressure of the gas. The driving force to move the can be reduced. Therefore, the position controllability of the substrate 10 can be improved, and the moving speed of the substrate 10 can be increased. To make this possible, the coating device 123a includes a substrate moving portion 170 that holds the end portion of the substrate 10 floating at a predetermined height from the stage portion 150 from above and moves it in the X direction and the Y direction. The substrate moving portions 170 are provided on both sides of the droplet ejection portion 160 in the X direction. While the plurality of substrate moving portions 170 pass the substrate 10 and pass under the droplet ejection portion 160 and the droplet ejection portion 160 repeatedly drops droplets on the substrate 10, one substrate moving portion 170 The substrate 10 is moved in the Y direction. By providing the substrate moving portion 170 above the stage portion 150, the gas air supply port 151 can be provided directly under the substrate moving portion 170, the area where the gas of the substrate 10 hits can be expanded, and the posture of the substrate 10 can be expanded. Can be stabilized.

According to the present embodiment, each substrate moving portion 170 holds the X-axis guide portion 171 extending in the X direction, the X-axis slider portion 172 moved along the X-axis guide portion 171 and the substrate 10 from above. It has a plurality of substrate holding portions 173. At least a part of the substrate holding portion 173 holds the substrate 10 from above while moving together with the X-axis slider portion 172. The movement of at least a part of the substrate holding portion 173 in the X direction can be stabilized by the X-axis guide portion 171 and the movement of the substrate 10 in the X direction can be stabilized.

According to the present embodiment, a part of the substrate holding portion 173 provided on one side of the droplet ejection portion 160 in the X direction and a part of the substrate holding portion 173 provided on the opposite side of the droplet ejection portion 160 in the X direction are The substrate 10 is passed under the droplet ejection portion 160 while moving in the X direction at the same speed. Since the substrate 10 is delivered without pausing the substrate 10, the substrate 10 can be passed under the droplet ejection portion 160 at a constant speed without accelerating. Therefore, since the droplets are landed on the substrate 10 from the droplet ejection portion 160 while the substrate 10 is moved with respect to the droplet ejection portion 160 at a constant speed, the accuracy of the landing position of the droplets on the substrate 10 can be improved.

According to the present embodiment, each substrate moving unit 170 further includes a yawing correction unit 190 that rotationally moves the substrate 10 held by the plurality of substrate holding units 173 in a vertical direction. Thereby, for example, the direction in which the openings 31 of the bank 30 are lined up and the extending direction of each discharge nozzle row (that is, the direction in which the discharge nozzles are lined up) can be aligned.

According to the present embodiment, each substrate moving unit 170 further includes a levelness correction unit 184 that corrects the levelness of the substrate 10 held by the plurality of substrate holding units 173. Thereby, for example, the upper surface of the bank 30 can be aligned horizontally, and the overflow of the functional liquid from the opening 31 of the bank 30 can be suppressed.

<Transformation, improvement>
Although the embodiments of the coating apparatus and the like have been described above, the present invention is not limited to the above-described embodiments, and various modifications and improvements can be made within the scope of the gist of the present invention described in the claims. is there.

For example, in the above embodiment, the case where the present invention is applied to the coating device 123a of the light emitting layer forming block 123 has been described, but the present invention is not limited thereto. The coating apparatus of the present invention may be any as long as it draws a drawing pattern of the functional liquid on the substrate. For example, the present invention is also applicable to the coating device 121a of the hole injection layer forming block 121 and the coating device 122a of the hole transport layer forming block 122. Further, the coating device 122a of the hole transport layer forming block 122 may form a plurality of types of hole transport layers 25 corresponding to the plurality of types of light emitting layers 26. The compatibility between the light emitting layer 26 and the hole transport layer 25 can be improved. Similarly, the coating device 121a of the hole injection layer forming block 121 may form a plurality of types of hole injection layers 24 corresponding to the plurality of types of light emitting layers 26. The compatibility between the light emitting layer 26 and the hole injection layer 24 can be improved.

In the above embodiment, the types of the light emitting layer 26 are three, a red light emitting layer, a green light emitting layer, and a blue light emitting layer, but the present invention is not limited thereto. For example, in addition to these three light emitting layers, a yellow light emitting layer containing a yellow light emitting material that emits yellow, which is an intermediate color between red and green, and / or a cyan color that emits cyan light, which is an intermediate color between green and blue. A light emitting layer containing a light emitting material or the like may be used. The larger the number of emission color combinations, the wider the range of color coordinates that can be displayed.

In the above embodiment, the plurality of substrate moving portions 170 provided on both sides of the droplet ejection portion 160 in the X direction are similarly configured, but the present invention is not limited thereto. For example, if there is almost no misalignment of the substrate 10 when the substrate 10 is delivered, only one of the left substrate moving portion 170 and the right substrate moving portion 170 may have the yawing correction portion 190.

In the above embodiment, the organic EL display is a bottom emission method in which the light from the light emitting layer 26 is taken out from the substrate 10 side, but a top emission method in which the light from the light emitting layer 26 is taken out from the side opposite to the substrate 10 may be used.

In the case of the top emission method, the substrate 10 does not have to be a transparent substrate and may be an opaque substrate. This is because the light from the light emitting layer 26 is taken out from the side opposite to the substrate 10.

In the case of the top emission method, the anode 21 which is a transparent electrode is used as a counter electrode, and the cathode 22 is used as a pixel electrode provided for each unit circuit 11. In this case, since the arrangement of the anode 21 and the cathode 22 is reversed, the electron injection layer 28, the electron transport layer 27, the light emitting layer 26, the hole transport layer 25, and the hole injection layer 24 are placed in this order on the cathode 22. Is formed by.

In the above embodiment, the organic layer 23 includes the hole injection layer 24, the hole transport layer 25, the light emitting layer 26, the electron transport layer 27, and the electron injection layer 28 in this order from the anode 21 side to the cathode 22 side. It has, but at least it may have a light emitting layer 26. The organic layer 23 is not limited to the configuration shown in FIG.

10 Substrate 13 Organic light emitting diode 100 Substrate processing system 123a Coating device 140 Control device 150 Stage section 160 Droplet ejection section 170 Substrate moving section 171 X-axis guide section (main scanning direction guide section)
172 X-axis slider section (main scanning direction slider section)
173 Board holding unit 184 Horizontalness correction unit 190 Yawing correction unit

Claims (7)

A coating device that draws a drawing pattern of the functional liquid on the substrate by moving the landing position of the droplet of the functional liquid on the substrate in the main scanning direction and the sub-scanning direction.
A stage portion that floats the substrate to a predetermined height by the wind pressure of gas, and
A droplet ejection portion for dropping droplets of the functional liquid from above onto the substrate floating at a predetermined height from the stage portion.
It is provided with a substrate moving portion that holds an end portion of the substrate floating at a predetermined height from the stage portion from above and moves the substrate in the main scanning direction and the sub-scanning direction.
The substrate moving portion is provided on both sides of the droplet ejection portion in the main scanning direction.
One of the substrate moving portions, while the plurality of substrate moving portions deliver the substrate and pass under the droplet ejection portion and the droplet ejection portion repeatedly drops the droplets on the substrate. Is a coating device that moves the substrate in the sub-scanning direction. Each of the substrate moving portions includes a main scanning direction guide portion extending in the main scanning direction, a main scanning direction slider portion moved along the main scanning direction guide portion, and a plurality of substrates holding an end portion of the substrate from above. Has a board holding part and
The coating device according to claim 1, wherein at least a part of the substrate holding portion holds the end portion of the substrate from above while moving together with the main scanning direction slider portion. The substrate holding portion provided on one side of the droplet ejection portion in the main scanning direction and the substrate holding portion provided on the opposite side of the droplet ejection portion in the main scanning direction are at the same speed in the main scanning direction. The coating device according to claim 2, wherein the substrate is delivered while moving and passed under the droplet ejection portion. The coating device according to claim 2 or 3, wherein the at least one substrate moving portion further includes a yawing correction portion for rotationally moving the substrate held by the plurality of substrate holding portions in a vertical direction. The coating according to any one of claims 2 to 4, wherein the at least one substrate moving portion further includes a levelness correction portion for correcting the horizontality of the substrate held by the plurality of substrate holding portions. apparatus. A coating method for drawing a drawing pattern of the functional liquid on the substrate by using the coating apparatus according to any one of claims 1 to 5. The coating method according to claim 6, wherein the functional liquid is used for manufacturing an organic light emitting diode.

Images