CN106271062A - Laser spray welding mouth, spray welding unit and method - Google Patents
Laser spray welding mouth, spray welding unit and method Download PDFInfo
- Publication number
- CN106271062A CN106271062A CN201610872417.6A CN201610872417A CN106271062A CN 106271062 A CN106271062 A CN 106271062A CN 201610872417 A CN201610872417 A CN 201610872417A CN 106271062 A CN106271062 A CN 106271062A
- Authority
- CN
- China
- Prior art keywords
- solder ball
- nozzle
- spray welding
- laser
- mouth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
Abstract
The open a kind of laser spray welding mouth of the present invention and spray welding unit, wherein laser spray welding mouth includes the surfacing mouth body being provided with cavity, this surfacing mouth body be provided with connect with cavity air supply opening, send stannum hole and nozzle, this solder ball coordinates with nozzle gap, makes solder ball automatically land motion.Solder ball movement of falling object in nozzle during use, when its molten state, it is to avoid scolding tin contacts with nozzle and remains, reduces spray nozzle clogging phenomenon.Using the laser spray welding device of described surfacing mouth simultaneously, when solder ball melts by the certain pressure gas produced for press mechanism, provide power to scolding tin, this pressed gas is noble gas, scolding tin can be played protection.Simultaneously because solder ball can the movement of falling object in nozzle; there is gap between this solder ball and nozzle wall, when solder ball is pressed by pressed gas, the gas of part is discharged from gap; make solder ball and nozzle wall form protection air film, scolding tin can be avoided to remain on nozzle.
Description
Technical field
The present invention relates to laser spray welding technical field, particularly relate to a kind of laser spray welding mouth, spray welding unit and method.
Background technology
Existing laser spray welding device, places solder ball in trend nozzle before surfacing, this solder ball blocks nozzle just
Mouthful, then in the annular seal space cooperatively formed by solder ball and nozzle, inject protective gas, when annular seal space internal gas pressure reaches setting value
After, control laser instrument and send laser irradiation solder ball, when solder ball melts, the pressure that protective gas produces makes the height of fusing
Temperature scolding tin moment is ejected into the position needing welding, it is achieved welding.Weld although this structure can realize laser spray welding, but due to
When laser does not irradiates solder ball, this solder ball just can be formed with nozzle and be in close contact, when laser adds heat fusing to solder ball
Shi Rongyi is connected with nozzle, leaves residual on nozzle, and on the one hand time length causes spray nozzle clogging, on the other hand decreases every
Secondary spray stannum amount, affects surfacing efficiency.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of laser spray welding mouth, spray welding unit and method, and this laser sprays
Tip, spray welding unit and method can avoid the scolding tin melted during laser spray welding to leave the spray nozzle clogging that residual causes on nozzle
Phenomenon, improves laser spray welding efficiency.
In order to solve above-mentioned technical problem, the present invention provides a kind of laser spray welding mouth, and this laser spray welding mouth includes being provided with sky
The surfacing mouth body in chamber, this surfacing mouth body be provided with connect with cavity air supply opening, send stannum hole and nozzle, this solder ball and nozzle
Matched in clearance, makes solder ball automatically land motion.
Saying further, the gap between described solder ball and nozzle is 0.1-0.5MM.
Say further, a length of solder ball of described nozzle free-falling move distance in being heated to fusing time.
Saying further, described air supply opening is positioned at nozzle.
The present invention also provides for a kind of laser spray welding device, and this laser spray welding device includes laser instrument, surfacing mouth, supplies press mechanism
And the Song Xi mechanism being connected with surfacing mouth, and coordinate Song Xi mechanism, for press mechanism and the surfacing controller of laser works, institute
State surfacing mouth and include being provided with the tip body of cavity, this tip body be provided with connect with cavity air supply opening, send stannum hole and nozzle,
Described air supply opening is connected with for press mechanism, and described Song Xi mechanism is connected with sending stannum hole, and this solder ball and nozzle are matched in clearance, make
Solder ball lands motion automatically.
Saying further, the gap between described solder ball and nozzle is 0.1-0.5MM.
Say further, a length of solder ball of described nozzle free-falling move distance in being heated to fusing time.
Saying further, described air supply opening is positioned at nozzle.
Saying further, described laser spray welding device also includes the Temperature sampler being connected with surfacing controller signals.
Saying further, described Temperature sampler includes infrared temperature sensor.
Saying further, described pressed gas is noble gas.
Saying further, described laser spray welding device also includes the position being connected detection solder ball with surfacing controller signals
Sensor, this position sensor is positioned at the entrance of nozzle.
The present invention also provides for a kind of laser spray welding method, and this laser spray welding method includes, first solder ball is placed on surfacing
In mouth, when solder ball is positioned at the entrance of nozzle, laser starts to heat solder ball, when solder ball A adds heat fusing to fusing
Solder ball A expulsion pressure gas, makes the solder ball of fusing spray to pad from the outlet of nozzle.
Laser spray welding mouth of the present invention, including being provided with the surfacing mouth body of cavity, this surfacing mouth body is provided with and connects with cavity
Air supply opening, send stannum hole and nozzle, this solder ball and nozzle are matched in clearance, make solder ball automatically land motion.Weld during use
The movement of falling object in nozzle of stannum ball, when its molten state, it is to avoid scolding tin contacts with nozzle and remains, reduces spray nozzle clogging
Phenomenon.Use the laser spray welding device of described surfacing mouth, when solder ball melts by the certain pressure produced for press mechanism simultaneously
Gas, provides power to scolding tin, and this pressed gas is noble gas, scolding tin can be played protection.Simultaneously because solder ball can
With the movement of falling object in nozzle, between this solder ball and nozzle wall, there is gap, when solder ball is pressed by pressed gas,
The gas of part is discharged from gap so that solder ball and nozzle wall form protection air film, and scolding tin can be avoided to remain on nozzle.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, and the accompanying drawing in describing is the one of the present invention
A little embodiments, to those skilled in the art, on the premise of not paying creative work, it is also possible to according to these
Accompanying drawing obtains other accompanying drawings.
Fig. 1 is laser spray welding mouth embodiment sectional structure schematic diagram.
Fig. 2 is laser spray welding device embodiment sectional structure schematic diagram.
Fig. 3 is that laser spray welding device is intended to for embodiment sectional structure during pressed gas.
Below in conjunction with embodiment, and referring to the drawings, realization, functional characteristics and the advantage of the object of the invention is made furtherly
Bright.
Detailed description of the invention
In order to make the purpose of invention, technical scheme and advantage clearer, attached below in conjunction with in the embodiment of the present invention
Figure, is clearly and completely described the technical scheme in the embodiment of the present invention, it is clear that described embodiment is invention one
Section Example rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing
The every other embodiment obtained on the premise of going out creative work, broadly falls into the scope of protection of the invention.
As it is shown in figure 1, the present invention provides a kind of laser spray welding mouth embodiment.
This laser spray welding mouth includes: be provided with the surfacing mouth body 1 of cavity 10, and this surfacing mouth body 1 is provided with cavity 10 even
Logical air supply opening 13, sending stannum hole 11 and nozzle 12, described solder ball and nozzle are matched in clearance, make solder ball automatically land fortune
Dynamic.
Specifically, the solder ball diameter for welding is less than the diameter of described nozzle 12, and this solder ball can be at nozzle
12 movement of falling objects, in order to when ensureing to apply pressed gas in nozzle 12 or cavity 10 be solder ball offer power,
Being matched in clearance between described solder ball and nozzle 12, this gap is 0.1-0.5MM.By limited test and calculating, permissible
Determining the pressure of pressed gas and the length of nozzle, the length of this nozzle at least can ensure that can when solder ball free-falling
Melted by laser instrument, therefore the length of nozzle can be set to solder ball in being heated to fusing time free-falling campaign away from
From.
During use solder ball can the movement of falling object in nozzle, will not come in contact with nozzle 11, when its molten state
Time, it is to avoid scolding tin remains on nozzle, thus reduces spray nozzle clogging phenomenon, improves laser spray welding efficiency.
In the present embodiment, described air supply opening 13 is positioned at nozzle, in order to ensure that the LASER HEATING solder ball time controls essence
Degree, this air supply opening 13 is preferably located at laser can make solder ball melt position just.
As in figure 2 it is shown, the present invention also provides for a kind of laser spray welding device embodiment.
This laser spray welding device includes: laser instrument 2, surfacing mouth 1, confession press mechanism 4 and the Song Xi mechanism being connected with surfacing mouth
3, and coordinate Song Xi mechanism 3, for press mechanism 4 and the surfacing controller (accompanying drawing does not indicates) of laser instrument 2 work, described surfacing mouth
1 includes the tip body being provided with cavity 10, this tip body be provided with connect with cavity 10 air supply opening 13, send stannum hole 11 and nozzle
12, described air supply opening 13 is connected with for press mechanism 4, and described Song Xi mechanism 3 is connected with sending stannum hole 11, described solder ball A and nozzle
For matched in clearance, solder ball is made automatically to land motion.
Specifically, described confession press mechanism 4 refers to provide the gas of certain pressure, for the scolding tin melted by light light
Ball A provides power so that it is can be ejected into welding position.This gas can use noble gas, can play the solder ball of fusing
To protective effect.Gap between described solder ball A and nozzle is 0.1-0.5MM, when so can ensure that applying pressed gas
Solder ball A provides certain power, and pressed gas is discharged on a small quantity by gap simultaneously so that formed between scolding tin and nozzle by
The protection air film that pressed gas is formed, can avoid contacting between solder ball A and the nozzle of fusing, it is to avoid weld in spray process
The solder ball of stannum fusing has residual phenomena to occur on nozzle.
Described Song Xi mechanism 3, for delivering in cavity 10 one by one by solder ball A, is funnel-form by cavity, and solder ball A can
Enter nozzle 12.Described surfacing controller is used for coordinating laser instrument 2, working, i.e. when sending stannum machine for press mechanism 4 and Song Xi mechanism 3
After solder ball A is sent into cavity by structure 3, surfacing controller controls laser instrument 2 and works, and sends laser and heats solder ball A, works as scolding tin
When ball A adds heat fusing, control to discharge for press mechanism 4 gas of certain pressure, make solder ball A of fusing accelerate to pad and spray
Penetrate.The described gas pressure size provided for press mechanism 4 is not construed as limiting, and it can require to determine according to surfacing.
The length of described nozzle 12 can be by limited test and calculating, it may be determined that the pressure of pressed gas and nozzle
Length, the length of this nozzle 12 at least can ensure that and can be melted by laser instrument when solder ball free-falling, therefore may be used
The length of nozzle to be set to solder ball free-falling move distance in being heated to fusing time.
During use solder ball can the movement of falling object in nozzle, will not come in contact with nozzle, when its molten state,
Avoid scolding tin that viscous stannum occurs in the exit of nozzle, reduce spray nozzle clogging phenomenon, improve laser spray welding efficiency.Use described simultaneously
The laser spray welding device of surfacing mouth, when solder ball melts by the certain pressure gas produced for press mechanism, provides dynamic to scolding tin
Power, this pressed gas is noble gas, scolding tin can be played protection.Simultaneously because solder ball can in nozzle freely falling body
, there is gap between this solder ball and nozzle wall in motion, when solder ball is pressed by pressed gas, the gas of part is arranged from gap
Go out so that solder ball and nozzle wall form protection air film, and scolding tin can be avoided to remain on nozzle.
In the present embodiment, described air supply opening 13 is positioned at nozzle, in order to ensure that the LASER HEATING solder ball time controls essence
Degree, this air supply opening 13 is preferably located at laser can make solder ball melt position just, and that so can also reduce pressed gas uses gas
Amount.
Real-time monitoring in order to ensure, to laser welding temperature, it is to avoid damaging welding material, described laser spray welding device is also
Including the Temperature sampler being connected with surfacing controller signals, this Temperature sampler includes infrared temperature sensor.
In order to more be accurately controlled LASER HEATING, described laser spray welding device also includes being connected with surfacing controller signals
The position sensor of detection solder ball, this position sensor is positioned at the entrance of nozzle 12.Detect when position sensor during work
During solder ball A, surfacing controller controls laser instrument 2 and sends laser, both can improve again add solder ball A with energy efficient
The accuracy of heat.
The present invention also provides for a kind of laser spray welding method, and this laser spray welding method includes, first solder ball A is placed on surfacing
In mouth, when solder ball A is positioned at the entrance of nozzle 12, laser starts to heat solder ball A, when solder ball A adds heat fusing to molten
The solder ball A expulsion pressure gas changed, makes the solder ball of fusing spray to pad from the outlet of nozzle.
Above example only in order to technical scheme to be described, is not intended to limit;Although with reference to previous embodiment
The present invention is described in detail, it will be understood by those within the art that: it still can be to aforementioned each enforcement
Technical scheme described in example is modified, or wherein portion of techniques feature carries out equivalent, and these are revised or replace
Change, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. laser spray welding mouth, including being provided with the surfacing mouth body of cavity, this surfacing mouth body be provided with connect with cavity air supply opening,
Send stannum hole and nozzle, it is characterised in that this solder ball coordinates with nozzle gap, make solder ball automatically land motion.
Laser spray welding mouth the most according to claim 1, it is characterised in that: described solder ball is 0.1-with the gap of nozzle
0.5MM。
Laser spray welding mouth the most according to claim 1 and 2, it is characterised in that: a length of solder ball of described nozzle is from adding
Heat is to free-falling move distance in fusing time.
4. laser spray welding device, including laser instrument, surfacing mouth, supplies press mechanism and the Song Xi mechanism being connected with surfacing mouth, and adjusts
Xie Song stannum mechanism, for press mechanism and the surfacing controller of laser works, described surfacing mouth includes the tip body being provided with cavity,
This tip body be provided with connect with cavity air supply opening, send stannum hole and nozzle, described air supply opening is connected with for press mechanism, described in give
Stannum mechanism is connected with sending stannum hole, it is characterised in that: this solder ball coordinates with nozzle gap, makes solder ball automatically land motion.
Laser spray welding device the most according to claim 4, it is characterised in that: described solder ball is 0.1-with the gap of nozzle
0.5MM。
6. according to the laser spray welding device described in claim 4 or 5, it is characterised in that: a length of solder ball of described nozzle from
It is heated to free-falling move distance in fusing time.
Laser spray welding device the most according to claim 4, it is characterised in that: described air supply opening is positioned at nozzle.
Laser spray welding device the most according to claim 4, it is characterised in that: described laser spray welding device also includes and surfacing
The Temperature sampler that controller signals connects.
Laser spray welding device the most according to claim 4, it is characterised in that: described laser spray welding device also includes and surfacing
Controller signals connects the position sensor of detection solder ball, and this position sensor is positioned at the entrance of nozzle.
10. laser spray welding method, including first solder ball being placed in surfacing mouth, the laser when solder ball is positioned at the entrance of nozzle
Start solder ball is heated, when solder ball A adds heat fusing to the solder ball A expulsion pressure gas of fusing, make the scolding tin of fusing
Ball sprays to pad from the outlet of nozzle.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610872417.6A CN106271062B (en) | 2016-09-29 | 2016-09-29 | Laser spray welding nozzle, spray welding device and method |
PCT/CN2017/078816 WO2018058925A1 (en) | 2016-09-29 | 2017-03-30 | Laser spray soldering nozzle, and spray soldering device and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610872417.6A CN106271062B (en) | 2016-09-29 | 2016-09-29 | Laser spray welding nozzle, spray welding device and method |
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Publication Number | Publication Date |
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CN106271062A true CN106271062A (en) | 2017-01-04 |
CN106271062B CN106271062B (en) | 2020-01-31 |
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ID=57716580
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CN201610872417.6A Active CN106271062B (en) | 2016-09-29 | 2016-09-29 | Laser spray welding nozzle, spray welding device and method |
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CN (1) | CN106271062B (en) |
WO (1) | WO2018058925A1 (en) |
Cited By (8)
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CN107570829A (en) * | 2017-10-20 | 2018-01-12 | 东莞市卓安精机自动化设备有限公司 | A kind of tin ball bonding structure and method for accurate fine solder region |
WO2018058925A1 (en) * | 2016-09-29 | 2018-04-05 | 深圳市艾贝特电子科技有限公司 | Laser spray soldering nozzle, and spray soldering device and method |
CN109365937A (en) * | 2018-12-10 | 2019-02-22 | 深圳市艾贝特电子科技有限公司 | A kind of engine commutator and varistor laser soldering device and method |
CN109396585A (en) * | 2018-12-10 | 2019-03-01 | 深圳市艾贝特电子科技有限公司 | A kind of engine commutator laser soldering device and method |
CN110523714A (en) * | 2018-05-24 | 2019-12-03 | 本田技研工业株式会社 | The cleaning method and cleaning device of optical component |
CN112620861A (en) * | 2020-12-17 | 2021-04-09 | 珠海冠宇电池股份有限公司 | Method and device for welding battery liquid injection hole |
CN114206534A (en) * | 2020-04-02 | 2022-03-18 | Tdk电子股份有限公司 | Electrical soldered connection, sensor with soldered connection and method for producing |
CN115178906A (en) * | 2022-09-14 | 2022-10-14 | 深圳市艾贝特电子科技有限公司 | Laser welding machine and feeding mechanism thereof |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040069758A1 (en) * | 2001-07-10 | 2004-04-15 | Ghassem Azdasht | Method and device for applying a solder to a substrate |
CN1767727A (en) * | 2004-09-24 | 2006-05-03 | Tdk株式会社 | Conductive ball bonding method and conductive ball bonding apparatus |
CN1846919A (en) * | 2005-03-30 | 2006-10-18 | Tdk株式会社 | Soldering method, soldering device, bonding method, bonding device, and nozzle unit |
US20060237514A1 (en) * | 2005-04-22 | 2006-10-26 | Tdk Corporation | Solder dispenser |
CN101722343A (en) * | 2008-10-10 | 2010-06-09 | 日立环球储存科技荷兰有限公司 | Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly |
CN105108264A (en) * | 2015-09-23 | 2015-12-02 | 武汉凌云光电科技有限责任公司 | Solder ball pump head for laser soldering |
CN206084135U (en) * | 2016-09-29 | 2017-04-12 | 深圳市艾贝特电子科技有限公司 | Laser surfacing mouth and surfacing device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004288350A (en) * | 2003-03-03 | 2004-10-14 | Shinka Jitsugyo Kk | Method and device for manufacturing magnetic head device, and the magnetic head device |
JP2007026478A (en) * | 2005-07-12 | 2007-02-01 | Alps Electric Co Ltd | Metal ball bonding method for magnetic head assembly |
US20070075056A1 (en) * | 2005-09-30 | 2007-04-05 | Sae Magnetics (H.K.) Ltd. | Soldering device and method for forming electrical solder connections in a disk drive unit |
JP2007245189A (en) * | 2006-03-16 | 2007-09-27 | Tdk Corp | Joining apparatus, and its nozzle unit |
US20130256281A1 (en) * | 2012-03-30 | 2013-10-03 | Tatsumi Tsuchiya | Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk drive |
CN103817438B (en) * | 2014-03-07 | 2017-01-18 | 大族激光科技产业集团股份有限公司 | Solder ball welding device and method |
CN106271062B (en) * | 2016-09-29 | 2020-01-31 | 深圳市艾贝特电子科技有限公司 | Laser spray welding nozzle, spray welding device and method |
-
2016
- 2016-09-29 CN CN201610872417.6A patent/CN106271062B/en active Active
-
2017
- 2017-03-30 WO PCT/CN2017/078816 patent/WO2018058925A1/en active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040069758A1 (en) * | 2001-07-10 | 2004-04-15 | Ghassem Azdasht | Method and device for applying a solder to a substrate |
CN1767727A (en) * | 2004-09-24 | 2006-05-03 | Tdk株式会社 | Conductive ball bonding method and conductive ball bonding apparatus |
CN1846919A (en) * | 2005-03-30 | 2006-10-18 | Tdk株式会社 | Soldering method, soldering device, bonding method, bonding device, and nozzle unit |
US20060237514A1 (en) * | 2005-04-22 | 2006-10-26 | Tdk Corporation | Solder dispenser |
CN101722343A (en) * | 2008-10-10 | 2010-06-09 | 日立环球储存科技荷兰有限公司 | Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly |
CN105108264A (en) * | 2015-09-23 | 2015-12-02 | 武汉凌云光电科技有限责任公司 | Solder ball pump head for laser soldering |
CN206084135U (en) * | 2016-09-29 | 2017-04-12 | 深圳市艾贝特电子科技有限公司 | Laser surfacing mouth and surfacing device |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018058925A1 (en) * | 2016-09-29 | 2018-04-05 | 深圳市艾贝特电子科技有限公司 | Laser spray soldering nozzle, and spray soldering device and method |
CN107570829A (en) * | 2017-10-20 | 2018-01-12 | 东莞市卓安精机自动化设备有限公司 | A kind of tin ball bonding structure and method for accurate fine solder region |
CN110523714A (en) * | 2018-05-24 | 2019-12-03 | 本田技研工业株式会社 | The cleaning method and cleaning device of optical component |
CN109365937A (en) * | 2018-12-10 | 2019-02-22 | 深圳市艾贝特电子科技有限公司 | A kind of engine commutator and varistor laser soldering device and method |
CN109396585A (en) * | 2018-12-10 | 2019-03-01 | 深圳市艾贝特电子科技有限公司 | A kind of engine commutator laser soldering device and method |
CN109396585B (en) * | 2018-12-10 | 2022-12-23 | 深圳市艾贝特电子科技有限公司 | Motor commutator laser welding device and method |
CN109365937B (en) * | 2018-12-10 | 2023-01-20 | 深圳市艾贝特电子科技有限公司 | Laser welding device and method for motor commutator and piezoresistor |
CN114206534A (en) * | 2020-04-02 | 2022-03-18 | Tdk电子股份有限公司 | Electrical soldered connection, sensor with soldered connection and method for producing |
CN112620861A (en) * | 2020-12-17 | 2021-04-09 | 珠海冠宇电池股份有限公司 | Method and device for welding battery liquid injection hole |
CN115178906A (en) * | 2022-09-14 | 2022-10-14 | 深圳市艾贝特电子科技有限公司 | Laser welding machine and feeding mechanism thereof |
CN115178906B (en) * | 2022-09-14 | 2022-12-30 | 深圳市艾贝特电子科技有限公司 | Laser welding machine and feeding mechanism thereof |
Also Published As
Publication number | Publication date |
---|---|
CN106271062B (en) | 2020-01-31 |
WO2018058925A1 (en) | 2018-04-05 |
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