CN106079115A - The dividing method of adhesive substrates and segmenting device - Google Patents
The dividing method of adhesive substrates and segmenting device Download PDFInfo
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- CN106079115A CN106079115A CN201610149585.2A CN201610149585A CN106079115A CN 106079115 A CN106079115 A CN 106079115A CN 201610149585 A CN201610149585 A CN 201610149585A CN 106079115 A CN106079115 A CN 106079115A
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- adhesive substrates
- interarea
- adhesive
- precalculated position
- line
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention relates to dividing method and the segmenting device of a kind of adhesive substrates.The present invention provides can be by the method utilizing the adhesive linkage laminating silicon substrate adhesive substrates with glass substrate preferably to split and segmenting device.Adhesive substrates is included in the method for specific segmentation precalculated position segmentation: line forming step (unit), in the segmentation precalculated position of an interarea of glass substrate, form line by specific scoring tool；Cutting groove forming step (unit), in the segmentation precalculated position of an interarea of silicon substrate, utilizes specific groove portion formation mechanism to form groove portion from an interarea of silicon substrate to the midway of adhesive linkage；And cutting off step (unit), the adhesive substrates that will be formed with line and groove portion cuts off between line and groove portion.
Description
Technical field
The present invention relates to a kind of dividing method utilizing adhesive linkage laminating silicon substrate and the substrate of glass substrate and divide
Cut device.
Background technology
Silicon substrate is widely used as the substrate of semiconductor element (semiconductor chip), but substrate Composite and
Under other purposes, sometimes use and utilize adhesive linkage (bonding agent) silicon substrate and glass substrate to be fitted and form the patch of (bonding form)
Close substrate.It addition, in using the manufacture processing procedure of semiconductor element of silicon substrate, generally, use by utilizing cutting of cutting machine
Cut the method split by the i.e. silicon substrate of mother substrate being formed with multiple element pattern two-dimensionally and obtain each chip, use institute
State the adhesive substrates of silicon substrate and glass substrate as mother substrate in the case of, be also adopted by identical order.
It addition, the fragile material with resin of interarea that thermosetting resin will be made to be attached to brittle substrate
The method of substrate segmentation also has been known (for example, referring to patent documentation 1).
[prior art literature]
[patent documentation]
No. 5170195 publications of [patent documentation 1] Japan Patent
Summary of the invention
[inventing problem to be solved]
In the situation that the adhesive linkage laminating silicon substrate adhesive substrates with glass substrate will be utilized to split by cutting machine
Under, it is difficult to because of the character of glass substrate improve process velocity, further, since glass substrate easily produces chip (fragmentation), institute
The problem poor there is productivity.Further it is necessary to use the special cutting blades such as resin blade, but it is very fast to there is also abrasion
And the problem becoming the high reason of cost.And then, the water capacity used for purposes such as coolings when there is also cutting easily penetrates into
Problem between adhesive linkage and glass.
The present invention is developer in view of described problem, and its object is to offer can will utilize adhesive linkage laminating silicon substrate
The method preferably split with the adhesive substrates of glass substrate.
[solving the technological means of problem]
In order to solve described problem, the invention of technical scheme 1 is characterised by: it is will to utilize adhesive linkage laminating silicon substrate
The method split in specific segmentation precalculated position with the adhesive substrates of glass substrate, and include: line forming step,
Form the described segmentation precalculated position of an interarea of the described glass substrate of side's interarea of described adhesive substrates, by specifically
Scoring tool forms line；Cutting groove forming step, at the described silicon substrate of the opposing party's interarea forming described adhesive substrates
The described segmentation precalculated position of one interarea, utilizes spy from a described interarea of described silicon substrate to the midway of described adhesive linkage
Fixed groove portion formation mechanism forms groove portion；And cut-out step, will be formed with the described adhesive substrates of described line and described groove portion
Cut off between described line and described groove portion.
The invention of technical scheme 2 is the dividing method according to the adhesive substrates described in technical scheme 1, it is characterised in that:
In described cut-out step, described adhesive substrates is being become topmost with described silicon substrate side, and described glass substrate side is becoming
Under the state of the upper surface that the mode of foot is positioned in the supporting part comprising elastomer, make upper from described silicon substrate of amputation knife
Side relative to described segmentation precalculated position abut and and then under press, thus by described adhesive substrates disjunction.
The invention of technical scheme 3 is the dividing method according to the adhesive substrates described in technical scheme 2, it is characterised in that:
In described cut-out step, make described amputation knife be connected to described groove portion bottom and and then under press, thus one side is by described
Described adhesive linkage is cut by amputation knife, and one side makes vertical slight crack stretch from described line, thus by described adhesive substrates disjunction.
The invention of technical scheme 4 is the dividing method according to the adhesive substrates described in technical scheme 2, it is characterised in that:
In described cut-out step, the point of a knife side of described amputation knife is made to be connected to the described groove portion of a described interarea of described silicon substrate
Open end and and then under press, thus described adhesive linkage is rived and make vertical slight crack from described line stretch, thus will
Described adhesive substrates disjunction.
The invention of technical scheme 5 is the segmentation according to the adhesive substrates according to any one of technical scheme 1 to technical scheme 4
Method, it is characterised in that: described specific scoring tool is stitch marker.
The invention of technical scheme 6 is the segmentation according to the adhesive substrates according to any one of technical scheme 1 to technical scheme 5
Method, it is characterised in that: described specific groove portion formation mechanism is cutting machine.
The invention of technical scheme 7 is characterised by: it forms utilizing adhesive linkage laminating silicon substrate with glass substrate
Adhesive substrates is at the segmenting device of specific segmentation precalculated position segmentation, and possesses: line forms unit (so-called scribing rod),
Form the described segmentation precalculated position of an interarea of the described glass substrate of side's interarea of described adhesive substrates, by specifically
Scoring tool forms line；Cutting groove forms unit (so-called cutting machine), is forming the opposing party's interarea of described adhesive substrates
The described segmentation precalculated position of one interarea of described silicon substrate, from a described interarea of described silicon substrate to described adhesive linkage
Specific groove portion formation mechanism is utilized to form groove portion till Tu；And cutting unit (so-called cutting machine), will be formed with described line
And the described adhesive substrates in described groove portion cuts off between described line and described groove portion.
[invention effect]
Invention according to technical scheme 1 to technical scheme 7, it is possible to will utilize adhesive linkage laminating silicon substrate and glass substrate and
The adhesive substrates become preferably is split.
Accompanying drawing explanation
Fig. 1 (a), 1 (b) are the sectional views of the composition being diagrammatically denoted by adhesive substrates 10.
Fig. 2 is to the figure illustrated in the order that segmentation precalculated position A is split by adhesive substrates 10.
Fig. 3 (a)～(c) are the figures of the formation that line SL is described.
Fig. 4 (a)～(c) are the figures of the formation (state in formation) that cutting groove DG is described.
Fig. 5 is the figure of the formation (state after formation) that cutting groove DG is described.
Fig. 6 is the figure illustrating and being formed with the adhesive substrates 10 after solder ball SB.
Fig. 7 is the figure being diagrammatically denoted by the situation that adhesive substrates 10 is cut off by use shearing device 300.
Fig. 8 (a)～(c) are the figures representing the 1st cutting-off method.
Fig. 9 (a)～(c) are the figures representing the 2nd cutting-off method.
Detailed description of the invention
＜ adhesive substrates ＞
Fig. 1 is the section view of the composition of the adhesive substrates 10 being diagrammatically denoted by present embodiment becoming the object of segmentation
Figure.In the present embodiment, so-called adhesive substrates 10 is by utilizing adhesive linkage 3 by bonding with silicon substrate 2 for glass substrate 1 and paste
Close, the winner collectively as a substrate.
Adhesive substrates 10 is by utilizing following side as the segmentation precalculated position A carrying out the position split prespecified
Method is split along thickness direction disjunction.Segmentation precalculated position A is that to be defined as wire along the interarea of adhesive substrates 10 (the most straight
Wire).In FIG, the situation that the direction vertical with accompanying drawing specifies to have segmentation precalculated position A it is illustrated in.Additionally, exist in FIG
Both of interarea 2a of interarea 1a and silicon substrate 2 as the glass substrate 1 of two interareas of adhesive substrates 10 indicate that segmentation is in advance
A is put in location, certainly, and the segmentation precalculated position A of each interarea in the case of the interarea overlooking (plane perspective) adhesive substrates 10
Identical.In other words, if making the segmentation precalculated position A of side's interarea move in parallel at the thickness direction of adhesive substrates 10, can
Consistent with the segmentation precalculated position A of the opposing party's interarea.
Though omitting diagram in FIG, but also can specify multiple segmentation precalculated position A relative to an adhesive substrates 10, such as,
It is alternatively the aspect of clathrate ground regulation segmentation precalculated position A.In the case of regulation has multiple segmentation precalculated position A, each
Segmentation precalculated position A being spaced in each other can preferably carry out suitably specifying in the range of the segmentation of following order.
In FIG so also illustrate that segmentation time the actual advance of disjunction precalculated position i.e. disjunction advance precalculated position B.
Disjunction advance precalculated position B is considered the two interareas i.e. interarea 1a of glass substrate 1 of the adhesive substrates 10 and interarea 2a of silicon substrate 2
Each segmentation precalculated position A between the face along thickness direction.In the case of Fig. 1 illustrates, disjunction advance pre-determined bit
Put direction vertical when observing accompanying drawing for B to extend.
As the material of glass substrate 1, various as alkali glass such as exemplary boron silicate glasses, alkali-free glass, soda-lime glass etc.
Glass.As the material of adhesive linkage 3, illustrate thermmohardening type epoxy resin etc..
Glass substrate 1, silicon substrate 2 and the thickness of adhesive linkage 3 and then the gross thickness of adhesive substrates 10, as long as under utilizing
State and can preferably carry out splitting the most without particular limitation when adhesive substrates 10 is split by method, 100 μm～1000 μ can be illustrated respectively
M, 50 μm～1000 μm, 10 μm～200 μm, 150 μm～the scope of 1500 μm.It addition, about adhesive substrates planar dimension also
Without particular limitation, vertical 1～the scope of about 3mm × horizontal stroke 1～about 3mm can be illustrated.
It addition, in FIG, be illustrated in silicon substrate 2 side's interarea and with and the proximal surface of adhesive linkage 3 be opposition side
When interarea i.e. observes accompanying drawing, the interarea 2a of upper surface side is provided with the situation of upper layer 4.Fig. 1 (a) illustrates the interarea 2a of silicon substrate 2
In, the near zone of segmentation precalculated position A be set to the formation aspect of the upper layer 4 in the case of non-formation region RE, Fig. 1 (b)
It is illustrated in the formation aspect in the case of the whole surface of interarea 2a is formed with upper layer 4.
Additionally, the most for simplicity, the mode with upper layer 4 as simple layer illustrates, but upper layer 4 both can be
Simple layer, it is possible to be the multiple layers including identical material or unlike material.As the constituent material of upper layer 4, illustrate various gold
Belong to the various materials such as layer, ceramic layer, semiconductor layer, amorphous layer, resin bed.
But, when adhesive substrates 10 is split by the dividing method utilizing present embodiment, the existence of upper layer 4 is not
Required.Therefore, in the following description, about being formed with the situation of upper layer 4, the most sometimes by simple with upper layer 4 for silicon substrate 2
Be generically and collectively referred to as silicon substrate 2, it addition, sometimes the face of upper surface forming upper layer 4 to be referred to as the interarea of silicon substrate 2 for Yan Ge
2a。
Order ＞ of ＜ segmentation
Secondly, illustrate in the order of segmentation precalculated position A segmentation by the adhesive substrates 10 with described composition.Figure
2 is the figure of the order representing this segmentation.
First, adhesive substrates 10 (step S1) as illustrated in Figure 1 is prepared.That is, prepare to utilize adhesive linkage 3 to fit glass base
Plate 1 and silicon substrate 2 form and specify the adhesive substrates 10 having segmentation precalculated position A.
Then, the segmentation precalculated position A in glass substrate 1 side of the adhesive substrates 10 prepared forms line SL (Fig. 3)
(step S2).Fig. 3 is the figure of the formation that this line SL is described.Additionally, in figure 3, illustrate be set with each with accompanying drawing
The situation (the most identical in Fig. 4～Fig. 7) of multiple segmentation precalculated position A that vertical direction linearly extends.
Line SL is the position becoming the starting point that slight crack (vertical slight crack) stretches in following step.The formation of line SL is
As shown in Fig. 3 (a), become topmost with glass substrate 1 and silicon substrate 2 becomes the flat-hand position of foot and keeps adhesive substrates 10
And carry out.Now, both adhesive substrates 10 directly can be maintained at microscope carrier, it is possible to replace this to be following aspect, i.e. by silicon substrate
The interarea 2a side of 2 is attached to such as to open to set and is maintained at the cutting belt etc. of the isothrausmatic holding member of cut ring and keeps band, and together with
Adhesive substrates 10 is maintained at microscope carrier by these holding members and holding band together.
For roughly, line SL the following manner that is formed by carry out, i.e. by adhesive substrates 10 with this posture
Under the state of the microscope carrier being maintained at the not shown known chalker possessing specific scoring tool, this scoring tool is made to exist
Relatively move relative to segmentation precalculated position A on the interarea 1a of glass substrate 1.
In Fig. 3 (b), indicate and use known stitch marker 101 to form the situation of line SL as scoring tool.Line
Wheel 101 is the disk being formed and having the shape connected in bottom surface (bottom surface of a bigger side) side of each by 2 frustums of a cone
Shape (abacus bead shape) and its outer peripheral portion become the instrument of point of a knife.Line SL is by making this stitch marker 101 (in more detail
For for its point of a knife) roll along segmentation precalculated position A crimping and formed on the interarea 1a of glass substrate 1.Additionally, point of a knife was both
Can be equally throughout the all-round of stitch marker 101, it is possible to for periodically having the aspect of recess.
In Fig. 3 (b) as shown in arrow AR1 and AR2, stitch marker 101 is sequentially made to press relative to each segmentation precalculated position A
Connect rolling and form line SL, finally, as shown in Fig. 3 (c), be formed with line SL at all segmentation precalculated position A.In addition, it is possible to
The aspect that vertical slight crack stretches to the thickness direction of glass substrate 1 from line SL for the formation with this line SL.
It addition, as scoring tool, it is possible to for using known diamond point and other aspect.
When being formed with line SL relative to the segmentation precalculated position of glass substrate 1 side, then at the silicon of adhesive substrates 10
The segmentation precalculated position A of substrate 2 side carries out cutting and forming cutting groove DG (Fig. 4) (step S3).Fig. 4 and Fig. 5 is to illustrate
The figure of the formation of this cutting groove DG.Cutting groove DG is formed as groove portion, and becomes the starting point of cut-out in following step.
The formation of cutting groove DG is as shown in Fig. 4 (a), becomes topmost with silicon substrate 2, and glass substrate 1 becomes under
The flat-hand position in portion keeps adhesive substrates 10 to carry out.That is, laminating base is kept by the posture of reversion during to be formed with line SL
Plate 10 and carry out.Now, adhesive substrates 10 both can directly be maintained at microscope carrier, it is possible to replaces this to be following aspect, i.e. by glass
The interarea 1a side of substrate 1 is attached to such as to open to set and is maintained at the cutting belt etc. of the isothrausmatic holding member of cut ring and keeps band, and
Together with these holding members and holding band, adhesive substrates 10 is maintained at microscope carrier.
As shown in Fig. 4 (b), cutting groove DG is formed completely through silicon substrate 2 and arrives the groove portion till adhesive linkage 3.In other words
Saying, cutting groove DG is more than the thickness of silicon substrate 2 and less than silicon substrate 2 and the side of the summation of the thickness of adhesive linkage 3 with its degree of depth h
Formula is formed.Additionally, though details is described below, but the size of cutting groove DG (degree of depth h, width w), the bottom of cutting groove DG
Distance d of DG1 and adhesive linkage 3 is the cutting-off method in the following cut-out step selected according to the material corresponding to adhesive linkage 3
And specify.
For roughly, the following manner that is formed by of cutting groove DG is carried out, i.e. by adhesive substrates 10 with this appearance
Under the state of the microscope carrier that gesture is maintained at the not shown known cutter sweep (cutting machine) possessing specific cutting mechanism, at silicon
The segmentation precalculated position A of the interarea 2a side of substrate 2 is carried out by cutting mechanism at the particular range of thickness direction and width
Cutting.
In Fig. 4 (b) and Fig. 4 (c), indicate and use the cutting possessing known cutting blade 201 as cutting mechanism
Machine forms the situation of cutting groove DG.Cutting blade 201 is to form discoideus (circular) and its outer peripheral portion to become point of a knife
Instrument.In the case of using cutting blade 201 to form cutting groove DG, first, one side makes this cutting blade 201 with its interarea
The posture becoming parallel with vertical guide rotates in vertical guide, simultaneously as shown in arrow AR3 in Fig. 4 (b), and then such as Fig. 4 (c)
Its point of a knife part is made to decline as shown in middle arrow AR4 until arriving the target corresponding with degree of depth h of cutting groove DG to be formed
Till depth location.Then, when nose part is assigned to and reached target depth position, one side keeps this rotation status, and one side is along dividing
Cut precalculated position A (i.e. along disjunction advance precalculated position B) make cutting blade 201 relative to adhesive substrates 10 relative movement, by
This forms cutting groove DG.
When as shown in arrow AR5 and AR6 in Fig. 4 (b), or make cutting blade as shown in arrow AR7 and AR8 in Fig. 4 (c)
201 sequentially move relative to each segmentation precalculated position A and when being formed with cutting groove DG, the most as shown in Figure 5 in all segmentations
Precalculated position A is formed with cutting groove DG.
When being formed with cutting groove DG, adhesive substrates 10 realizes following state, i.e. at all segmentation precalculated position A, one
Interarea side, side is formed with line SL, and is formed with cutting groove DG in the opposing party's interarea side.
The adhesive substrates 10 achieving this state becomes the substrate that can implement to cut below step, but according to adhesive substrates
The kind of 10, more specifically, according to the kind of the chip obtained by being split by this adhesive substrates 10, it is possible to for following state
Sample, i.e. before this cut-out, on the interarea 2a of silicon substrate 2, tightened up in Fig. 3 to Fig. 5, omit the upper layer 4 of diagram
On be formed with solder ball SB (step S4).Fig. 6 is the figure illustrating and being formed with the adhesive substrates 10 after solder ball SB.Solder ball SB
(more specifically on the interarea of upper layer 4) that be formed on the interarea 2a of silicon substrate 2 is each by being finally completed segmentation
Respectively become the region of individual chip.But, the formation of solder ball SB is not required.
Additionally, solder ball SB is alternatively the time point before line SL is formed, the most initially prepares the time point of adhesive substrates,
Or line SL formed formation after and cutting groove DG formed before time point formed aspect.But, in the former case,
The interarea 2a side having irregular silicon substrate 2 that must will be formed with solder ball SB when the formation of the SL that rules is protected downward
Hold adhesive substrates 10, in the latter case, there is removing or the cleaning etc. of cutting groove DG that there is cutting blade during by cutting
The aspect that the water that used and the situation etc. of welding material corrosion ball SB should be noticed respectively, but the sequential after described cutting groove DG is formed
Formed solder ball SB aspect then with described notice a little unrelated, it is advantageous to.
It addition, the formation of line SL also can be contrary with the order of the formation of cutting groove DG.
After being respectively formed line SL and cutting groove DG, and being formed with solder ball SB in case of need, use
The cut-out of shearing device 300, between line SL and cutting groove DG, making advances along the disjunction of disjunction advance precalculated position B (walks
Rapid S5).
Fig. 7 is the figure being diagrammatically denoted by the situation that adhesive substrates 10 is cut off by use shearing device 300.
Shearing device 300 mainly possesses: supporting part 301, comprises elastomer, and loads adhesive substrates at upper surface 301a
10；And amputation knife 302, there is the point of a knife of the section view triangle extended in specific cutter span direction, and at vertical liter
Fall is freely.
Supporting part 301 is preferably 65 °～95 ° by hardness, preferably 70 °～90 °, the elastomer of the material of for example, 80 °
Formed.As this supporting part 301, such as can be preferably with silicone rubber etc..Additionally, supporting part 301 also can and then pass through
(the not having resilient) supporter of not shown hard and support below.
As it is shown in fig. 7, when cutting off, adhesive substrates 10 becomes topmost with the side being formed with the silicon substrate 2 of cutting groove DG,
And the side of glass substrate 1 being formed with line SL becomes the mode of foot and is positioned on the upper surface 301a of supporting part 301.This
Outward, following situation is indicated in the figure 7, i.e. with segmentation precalculated position A (therefore line SL and cutting groove DG) vertical with accompanying drawing
The mode that extends of direction adhesive substrates 10 is positioned in the upper surface 301a of supporting part 301, and at this segmentation precalculated position A
Vertical above, amputation knife 302 (more specifically its point of a knife) configure along the segmentation bearing of trend of precalculated position A.
Realize in the following way for using the cut-out roughly of this shearing device 300, i.e. make amputation knife 302 such as
In vertical relative under the segmentation precalculated position A (i.e. the forming position of cutting groove DG) of silicon substrate 2 side shown in arrow AR9
Fall, also descends crush-cutting breaking 302 with adhesive substrates 10 after amputation knife 302 abut.Then, as shown in arrow AR10, by phase
All segmentation precalculated position A are sequentially completed cut off, and adhesive substrates 10 is divided into the core of desired size and number
Sheet.
More specifically, in the present embodiment, it is used separately different two kinds of principle to cut according to the material of adhesive linkage 3
Disconnected method.In this case, according to selected cutting-off method, and make the point of a knife 302a (with reference to Fig. 8, Fig. 9) of amputation knife 302
The size of shape or cutting groove DG is respectively different.Hereinafter, two kinds of cutting-off methods are sequentially illustrated.
(the 1st cutting-off method)
Fig. 8 is the figure representing the 1st cutting-off method.1st cutting-off method is by making arrow in amputation knife 302 such as Fig. 7
The amputation knife 302 declined in vertical shown in AR9 and finally the produce abutting relative to cutting groove DG, first initially such as Fig. 8
Disjunction is made to advance after realizing between the bottom DG1 of the front end of point of a knife 302a and cutting groove DG shown in (a).
Specifically, when as shown in arrow AR11 in Fig. 8 (b), the bottom DG1 of the front end of point of a knife 302a and cutting groove DG supports
After connecing also by amputation knife 302 with specific power below vertical under press time, as shown in arrow AR12, point of a knife 302a is from adhesive linkage 3
By resistance, and also adhesive linkage 3 is cut one side along disjunction advance precalculated position B and declines by one side.Thus, adhesive linkage 3
Disjunction is advanced.
It addition, now, owing to the power that amputation knife 302 are pressed down below vertical is also served as adhesive substrates 10 relative to work
The power being pressed into along segmentation precalculated position A for the supporting part 301 of elastomer works, so adhesive substrates 10 can be from supporting part
301 relative to line SL symmetrically by the outbreak upwards as shown in arrow AR13 firmly.Then, as this outbreak firmly with
From the result being added to the power below vertical of amputation knife 302 effect, realize so-called 3 in glass substrate 1 side of adhesive substrates 10
Point bending situation, as shown in arrow AR14, vertical slight crack CR from line SL along disjunction advance precalculated position B to vertical above
Stretch.
Utilize disjunction (incision) and the glass substrate 1 below vertical of the adhesive linkage 3 above vertical of amputation knife 302
Vertical slight crack CR stretching, extension each along disjunction advance precalculated position B advance.When final both of which arrives adhesive linkage 3 and glass base
Disjunction is completed during the interface of plate 1.That is, adhesive substrates 10 can be divided into 2 monolithic 10a as shown in Fig. 8 (c).
In the case of utilizing and cutting off such as above the 1st cutting-off method, it is necessary to when make amputation knife 302 decline up to
Few mode not making point of a knife 302a contact with cutting groove DG before the front end of point of a knife 302a abuts with the bottom DG1 of cutting groove DG
The size of regulation cutting groove DG, and angle i.e. cutter formed by the point of a knife 302a on the cross section vertical with cutter span direction must be specified
Wedge angle θ.Generally, compared with following 2nd cutting-off method, can make that cutting groove DG's is relatively large sized, and make nose angle θ relatively
Little.
(the 2nd cutting-off method)
Fig. 9 is the figure representing the 2nd cutting-off method.2nd cutting-off method is by making arrow in amputation knife 302 such as Fig. 7
The amputation knife 302 declined in vertical shown in AR9 and finally the produce abutting relative to cutting groove DG is first initially such as Fig. 9
Between the open end DG2 that each of 2 side 302b of point of a knife 302a is corresponding with cutting groove DG, it is carried out shown in (a)
After, make disjunction advance.Herein, the open end DG2 of so-called cutting groove DG refers to the limit of the cutting groove DG on the surface of silicon substrate 2
Edge portion.
Specifically, when the opening of the side 302b and cutting groove DG of point of a knife 302a as shown in arrow AR21 in Fig. 9 (b)
Portion DG2 abut after also by amputation knife 302 with specific power below vertical under press time, 2 side 302b's of point of a knife 302a
Each, as shown in arrow AR22, makes the power in direction that is symmetrical relative to segmentation precalculated position A and that mutually deviate from act on
The corresponding open end DG2 of the cutting groove DG of direction contact.
If in this aspect lower open end DG2 by power, then as shown in arrow AR23, cut not formed of adhesive linkage 3
Cut the position of groove DG, produce relative to the symmetrical and rightabout power of disjunction advance precalculated position B.The pressure down of amputation knife 302 is more
Advancing then this power the biggest, final adhesive linkage 3 is rived below the vertical shown in arrow AR24 from the bottom DG1 of cutting groove DG.Its
As a result, it is formed with the be full of cracks CR1 along disjunction advance precalculated position B at adhesive linkage 3.Be full of cracks CR1 eventually arrives at adhesive linkage 3 and glass
The interface of glass substrate 1.
When this be full of cracks CR1 formed after also by amputation knife 302 below vertical under press time, amputation knife 302 to laminating base
The masterpiece that plate 10 gives is to be pressed into along segmentation precalculated position A relative to the supporting part 301 as elastomer by adhesive substrates 10
Power work.Therefore, identical with the situation of the 1st cutting-off method, adhesive substrates 10 can be from supporting part 301 as shown in arrow AR25
By the outbreak above vertical firmly.Therefore, the situation of 3 bendings is realized in glass substrate 1 side of adhesive substrates 10, such as arrow
Shown in head AR26, vertical slight crack CR2 extends above to vertical along disjunction advance precalculated position B from line SL.Finally, when vertically
Slight crack CR2 completes disjunction when arriving the interface of adhesive linkage 3 and glass substrate 1.That is, adhesive substrates 10 can be divided as shown in Fig. 9 (c)
It is segmented into 2 monolithic 10a.
In the case of utilizing and cutting off such as above the 2nd cutting-off method, it is necessary to when making amputation knife 302 decline
Before the front end of point of a knife 302a abuts with the bottom DG1 of cutting groove DG, the opening of the side 302b and cutting groove DG of point of a knife 302a
The mode of end DG2 contact specifies the dimensions of cutting groove DG and determines nose angle θ.Generally, with described 1st cutting-off method phase
Ratio, can make being relatively small in size of cutting groove DG, and make nose angle θ relatively large.It addition, about the bottom DG1 of cutting groove DG
Distance d with adhesive linkage 3, it is also necessary to consider that the balance with the intrusion of amputation knife 302 specifies.Its reason is, if away from
Excessive from d, then there is be full of cracks CR1 and cannot arrive the probability of adhesive linkage 3 and the interface of glass substrate 1.
Additionally, the 1st cutting-off method and being used separately of the 2nd cutting-off method preferably consider that the material of adhesive linkage 3 (forms, glues
Property, elasticity etc.) and select.Such as, in the case of the viscosity of adhesive linkage 3 is higher, exists and utilize the incision of amputation knife 302 to be difficult to
The tendency preferably advanced, so applying the 2nd cutting-off method compared with the 1st cutting-off method, then can preferably carry out disjunction can
Energy property is higher.
Or, it is possible to utilize the method being equivalent to the 1st cutting-off method to make disjunction advance, then, simultaneously when being initially switched off
Also realizing the state making the open end DG2 of the side 302b and cutting groove DG of point of a knife 302a abut, one side makes cut-out advance.
As mentioned above, according to present embodiment, carry out in the following way utilizing adhesive linkage laminating silicon substrate and glass
The segmentation of the adhesive substrates of glass substrate and can preferably split this adhesive substrates, i.e. the segmentation in glass substrate side makes a reservation for
Position formation line, and the cutting groove arriving adhesive linkage is formed in the segmentation precalculated position of silicon substrate side, and by cut-out
Chien shih disjunction in line with cutting groove is advanced.Due to not glass-cutting substrate, so suppression glass substrate produces chip, separately
Outward, it is achieved productive raising and the reduction of cost.It addition, water does not penetrates between adhesive linkage and glass substrate yet.
[explanation of symbol]
1 glass substrate
1a (glass substrate) interarea
2 silicon substrates
2a (silicon substrate) interarea
3 adhesive linkages
4 upper layer
10 adhesive substrates
10a monolithic
101 stitch markers
201 cutting blades
300 shearing devices
301 supporting parts
301a (supporting part) upper surface
302 amputation knife
302a (amputation knife) point of a knife
302b (point of a knife) side
A splits precalculated position
B disjunction advance precalculated position
The vertical slight crack of CR, CR2
CR1 chaps
DG cutting groove
DG1 (cutting groove) bottom
DG2 (cutting groove) open end
SB solder ball
SL rules
Claims (7)
1. the dividing method of an adhesive substrates, it is characterised in that: it is will to utilize adhesive linkage laminating silicon substrate and glass substrate
Adhesive substrates in the method for specific segmentation precalculated position segmentation, and include:
Line forming step, in the described segmentation of an interarea of the described glass substrate of the side's interarea forming described adhesive substrates
Precalculated position, forms line by specific scoring tool；
Cutting groove forming step, at described in an interarea of the described silicon substrate of the opposing party's interarea forming described adhesive substrates point
Cut precalculated position, utilize specific groove portion to form machine to the midway of described adhesive linkage from a described interarea of described silicon substrate
Configuration grooving portion；And
Cut off step, will be formed with the described adhesive substrates in described line and described groove portion between described line and described groove portion
Cut off.
The dividing method of adhesive substrates the most according to claim 1, it is characterised in that:
In described cut-out step, described adhesive substrates is being become topmost, and described glass substrate with described silicon substrate side
Under the state that side becomes the upper surface that the mode of foot is positioned in the supporting part comprising elastomer, make amputation knife from described silica-based
The top of plate relative to described segmentation precalculated position abut and and then under press, thus by described adhesive substrates disjunction.
The dividing method of adhesive substrates the most according to claim 2, it is characterised in that:
In described cut-out step, make described amputation knife be connected to described groove portion bottom and and then under press, thus one side is logical
Crossing described amputation knife to be cut by described adhesive linkage, one side makes vertical slight crack stretch from described line, thus by described adhesive substrates
Disjunction.
The dividing method of adhesive substrates the most according to claim 2, it is characterised in that:
In described cut-out step, the point of a knife side of described amputation knife is made to be connected to a described interarea described of described silicon substrate
The open end in groove portion and and then under press, thus described adhesive linkage rived and make vertical slight crack stretch from described line,
Thus by described adhesive substrates disjunction.
The dividing method of adhesive substrates the most according to any one of claim 1 to 4, it is characterised in that:
Described specific scoring tool is stitch marker.
The dividing method of adhesive substrates the most according to any one of claim 1 to 4, it is characterised in that:
Described specific groove portion formation mechanism is cutting machine.
7. the segmenting device of an adhesive substrates, it is characterised in that: it is will to utilize adhesive linkage laminating silicon substrate and glass substrate
Adhesive substrates specific segmentation precalculated position divider, and possess:
Line forms unit, in the described segmentation of an interarea of the described glass substrate of the side's interarea forming described adhesive substrates
Precalculated position, forms line by specific scoring tool；
Cutting groove forms unit, at described in an interarea of the described silicon substrate of the opposing party's interarea forming described adhesive substrates point
Cut precalculated position, utilize specific groove portion to form machine to the midway of described adhesive linkage from a described interarea of described silicon substrate
Configuration grooving portion；And
Cutting unit, will be formed with the described adhesive substrates in described line and described groove portion between described line and described groove portion
Cut off.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015092931A JP6561565B2 (en) | 2015-04-30 | 2015-04-30 | Method and apparatus for dividing bonded substrate |
| JP2015-092931 | 2015-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106079115A true CN106079115A (en) | 2016-11-09 |
| CN106079115B CN106079115B (en) | 2020-08-25 |
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| CN201610149585.2A Active CN106079115B (en) | 2015-04-30 | 2016-03-16 | Method and apparatus for dividing bonded substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6561565B2 (en) |
| KR (1) | KR20160129700A (en) |
| CN (1) | CN106079115B (en) |
| TW (1) | TWI698329B (en) |
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| IT202100019604A1 (en) * | 2021-07-23 | 2023-01-23 | Studio Immagine S R L | METHOD AND EQUIPMENT FOR THE PRODUCTION OF CERAMIC PRODUCTS WITH IRREGULAR EDGES |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI698329B (en) | 2020-07-11 |
| JP2016213234A (en) | 2016-12-15 |
| JP6561565B2 (en) | 2019-08-21 |
| CN106079115B (en) | 2020-08-25 |
| TW201637856A (en) | 2016-11-01 |
| KR20160129700A (en) | 2016-11-09 |
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