JP5291178B2 - Cutting equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting apparatus that reduces the consumption of cleaning water while maintaining cleaning efficiency, in a cutting apparatus including a cleaning water feeding device that feeds the cleaning water to a workpiece when cutting the workpiece held on a chuck table. <P>SOLUTION: The cutting apparatus includes: the chuck table for holding the workpiece; a cutting device having a cutting blade for cutting the workpiece held on the chuck table; and the cleaning water feeding device for feeding the cleaning water to the workpiece held on the chuck table. The cleaning water feeding device includes: a cleaning water nozzle device with three nozzles for jetting the cleaning water toward the workpiece held on the chuck table; and a flow rate adjusting device for adjusting the flow rate of the cleaning water to be fed to each nozzle, respectively. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to a cutting apparatus for cutting a workpiece such as a semiconductor wafer.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and circuits such as ICs, LSIs, etc. are partitioned in these partitioned regions. Form. Then, by cutting the semiconductor wafer along the planned dividing line, the region where the circuit is formed is divided to manufacture individual semiconductor chips. In addition, an optical device wafer in which a gallium nitride compound semiconductor or the like is laminated on the surface of a sapphire substrate is also divided into optical devices such as individual light emitting diodes, laser diodes, CCDs, etc. Widely used.

  Cutting along the streets of the above-described semiconductor wafer, optical device wafer, or the like is usually performed by a cutting device called a dicer. This cutting apparatus includes a chuck table for holding a workpiece such as a semiconductor wafer, a cutting means having a cutting blade for cutting the workpiece held on the chuck table, and a cutting feed direction of the chuck table and the cutting means. A cutting feed means for moving the chuck table and the cutting means relative to each other in an index feed direction perpendicular to the cutting feed direction. In such a cutting apparatus, the cutting blade is rotated at a rotational speed of 20000 to 40,000 rpm, and cutting is performed while supplying cutting water to the processing area by the cutting blade, thereby causing surface burning at the processing point and chipping at the chip. Is preventing.

  As described above, the cutting water that has contributed to cutting contains cutting waste, and the cutting water in which the cutting waste is mixed flows on the surface of the wafer, and the cutting waste adheres to the surface of the wafer so that the wafer is removed. There is a problem of contamination. In particular, in the case of an optical device that captures light, such as a CCD, even a small amount of dirt significantly reduces the quality.

  In order to solve such a problem, a cleaning water nozzle is provided in the vicinity of the outer periphery of the chuck table, and when the wafer held on the chuck table is cut, the cleaning water is sprayed from the cleaning water nozzle to make the entire surface of the wafer. A cutting apparatus has been proposed in which a flow of washing water is formed. (For example, refer to Patent Document 1.)

JP 2002-329685 A

  The cleaning water nozzle disposed in the cutting apparatus disclosed in the above publication is configured to inject cleaning water over the entire region of the workpiece held on the chuck table. Accordingly, the same amount of cleaning water as that in the cutting region is supplied in a region other than the region where the cutting blade is cutting. In areas other than the cutting area, it is not always necessary to supply the same amount of cleaning water as in the cutting area. Supplying the cleaning water over the entire area of the work piece consumes cleaning water more than necessary. It will be.

  The present invention has been made in view of the above-mentioned facts, and its main technical problem is to provide a cleaning water supply means for supplying cleaning water to the workpiece when cutting the workpiece held on the chuck table. Another object of the present invention is to provide a cutting device that can reduce the consumption of cleaning water while maintaining the cleaning effect.

In order to solve the above main technical problem, according to the present invention, a chuck table for holding a workpiece, a chuck table support base for supporting the chuck table, and a workpiece held by the chuck table are cut. A cutting blade provided with cutting water and a cutting water supply means for supplying cutting water to a processing region by the cutting blade; a cutting feed means for relatively moving the chuck table support base and the cutting means in a cutting feed direction; , Index feed means for moving the chuck table support base and the cutting means relative to each other in an index feed direction orthogonal to the cutting feed direction, and cleaning water for supplying cleaning water to the workpiece held on the chuck table A cutting device comprising a supply means;
The cleaning water supply means includes cleaning water nozzle means including a first nozzle, a second nozzle, and a third nozzle for ejecting cleaning water toward a workpiece held on the chuck table, and the first nozzle 1 nozzle, a flow rate adjusting means for adjusting the flow rate of the cleaning water supplied to each of the second nozzle and the third nozzle, and the cleaning water nozzle means in the cutting feed direction at the time of cutting The first nozzle is disposed in the center portion, the second nozzle is disposed on one side of the first nozzle in the index feed direction, and is disposed on the upstream side of the chuck table. No. 3 nozzle is disposed on the other side of the first nozzle, and the flow rate of the cleaning water ejected from the first nozzle, the second nozzle, and the third nozzle is cut by the cutting blade. Supply a lot of washing water to the area As is adjusted by the flow rate adjusting means,
A cutting device is provided.

  The washing water nozzle means is disposed on a chuck table cover that is supported by the chuck table support base and disposed around the chuck table. The washing water nozzle means includes a nozzle support that supports the first nozzle, the second nozzle, and the third nozzle, the nozzle support, the first nozzle, the second nozzle, Desirably, a height adjusting means for adjusting the height position of the third nozzle is provided. Further, it is desirable that the jet direction of the cleaning water jetted from the cleaning water nozzle means is set to the same direction as the direction in which the cutting water is scattered due to the rotation of the cutting blade.

  In the cutting apparatus according to the present invention, the first nozzle that causes the cleaning water supply means for supplying the cleaning water to the workpiece held on the chuck table to eject the cleaning water toward the workpiece held on the chuck table. The cleaning water nozzle means having the second nozzle and the third nozzle, and the flow rate adjusting means for adjusting the flow rate of the cleaning water supplied to each nozzle, respectively, are cut by the cutting blade. It is possible to supply a large amount of cleaning water to a certain area and reduce the amount of cleaning water supplied to the other areas as compared with the cutting area, and to reduce the consumption of cleaning water while maintaining the cleaning effect.

The perspective view of the cutting device comprised according to this invention. The principal part perspective view of the cutting device shown in FIG. The perspective view of the chuck table mechanism and spindle unit with which the cutting apparatus shown in FIG. 1 is equipped. The perspective view which shows the washing water supply means with which the cutting apparatus shown in FIG. 1 is equipped. Sectional drawing of the washing water nozzle means which comprises the washing water supply means shown in FIG.

  Hereinafter, a preferred embodiment of a cutting device configured according to the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 1 shows a perspective view of a cutting device constructed in accordance with the present invention.
The cutting device shown in FIG. 1 includes a device housing 1 having a substantially rectangular parallelepiped shape. In the apparatus housing 1, a stationary base 2 shown in FIG. 2 and a chuck table mechanism that is disposed on the stationary base 2 so as to be movable in a direction indicated by an arrow X that is a cutting feed direction and holds a workpiece. 3, a spindle support mechanism 4 disposed on the stationary base 2 so as to be movable in a direction indicated by an arrow Y that is an indexing feed direction (a direction perpendicular to a direction indicated by an arrow X that is a cutting feed direction), and the spindle A spindle unit 5 serving as a cutting means is disposed on the support mechanism 4 so as to be movable in a direction indicated by an arrow Z that is a cutting feed direction.

  The chuck table mechanism 3 includes two guide rails 31, 31 disposed in parallel along the direction indicated by the arrow X on the stationary base 2, and the direction indicated by the arrow X on the guide rails 31, 31. A chuck table support base 32 movably disposed on the chuck table, a support cylinder 33 disposed on the chuck table support base 32, and a chuck table 34 rotatably supported on the support cylinder 33 The chuck table cover 35 is disposed around the chuck table 34 and fixed to the upper end of the support cylinder 33. The chuck table support base 32 is formed with two guided rails 32 a and 32 a that are fitted to the guide rails 31 and 31. The guided rails 32 a and 32 a are fitted to the guide rails 31 and 31. Thus, the chuck table support base 32 is configured to be movable along the guide rails 31, 31. A pulse motor (not shown) is disposed in the support cylinder 33, and the chuck table 34 is rotated by a predetermined angle by the pulse motor. The chuck table 34 is connected to a suction means (not shown) and appropriately holds the workpiece placed on the holding surface, which is the upper surface thereof. The chuck table 34 is provided with four clamps 341 for fixing a support frame that supports a workpiece via a protective tape. A hole 35 a into which the chuck table 34 is inserted is provided at the center of the chuck table cover 35, and the chuck table cover 35 surrounds the chuck table 34 by inserting the hole 35 a into the chuck table 34. Configured to state. The chuck table cover 35 configured in this manner is provided with a cleaning water nozzle means 21 of a cleaning water supply means 20 for supplying cleaning water to the workpiece held on the chuck table 34. The washing water supply means 20 will be described in detail later.

  Continuing the description with reference to FIG. 2, the chuck table mechanism 3 in the illustrated embodiment moves to move the chuck table 34 along the two guide rails 31, 31 in the cutting feed direction indicated by the arrow X. Means 36 are provided. The moving means 36 includes a male screw rod 361 disposed in parallel between the two guide rails 31 and 31, and a drive source such as a servo motor 362 for rotationally driving the male screw rod 361. One end of the male screw rod 361 is rotatably supported by a bearing block 363 fixed to the stationary base 2, and the other end is connected to the output shaft of the servo motor 362 via a reduction gear (not shown). ing. The male screw rod 361 is screwed into a penetrating female screw hole formed in a female screw block (not shown) provided on the lower surface of the central portion of the support base 32. Therefore, when the male screw rod 361 is driven to rotate forward and backward by the servo motor 362, the chuck table 34 is moved along the guide rails 31 and 31 in the cutting feed direction indicated by the arrow X. Accordingly, the servo motor 362, the male screw rod 361, and the bearing block 363 function as cutting feed means that relatively moves the chuck table and a spindle unit described later in the direction indicated by the arrow X that is the cutting feed direction.

  The spindle support mechanism 4 includes two guide rails 41 and 41 arranged in parallel along the indexing feed direction indicated by the arrow Y on the stationary base 2, and the arrow Y on the guide rails 41 and 41. A movable support base 42 is provided so as to be movable in the direction shown. The movable support base 42 includes a movement support portion 421 that is movably disposed on the guide rails 41, 41, and a mounting portion 422 that is attached to the movement support portion 421. Two guided rails 421a and 421a that are fitted to the guide rails 41 and 41 are formed on the lower surface of the movement support portion 421, and the guided rails 421a and 421a are fitted to the guide rails 41 and 41. Thus, the movable support base 42 is configured to be movable along the guide rails 41 and 41. In addition, the mounting portion 422 is provided with two guide rails 422a and 422a extending in the direction indicated by the arrow Z on one side surface in parallel.

  The spindle support mechanism 4 in the illustrated embodiment includes a moving means 43 for moving the movable support base 42 along the two guide rails 41, 41 in the index feed direction indicated by the arrow Y. The moving means 43 includes a male screw rod 431 disposed in parallel between the two guide rails 41, 41, and a drive source such as a pulse motor 432 for rotationally driving the male screw rod 431. One end of the male screw rod 431 is rotatably supported by a bearing block (not shown) fixed to the stationary base 2 and the other end is connected to the output shaft of the pulse motor 432 via a reduction gear (not shown). Has been. The male screw rod 431 is screwed into a female screw hole formed in a female screw block (not shown) provided on the lower surface of the central portion of the moving support portion 421 constituting the movable support base 42. For this reason, when the male screw rod 431 is driven to rotate forward and backward by the pulse motor 432, the movable support base 42 is moved along the guide rails 41, 41 in the index feed direction indicated by the arrow Y. Accordingly, the pulse motor 432, the male screw rod 431, and the like function as index feeding means for relatively moving the chuck table and a spindle unit described later in the index feeding direction indicated by the arrow Y perpendicular to the cutting feed direction (arrow X direction). To do.

  The spindle unit 5 in the illustrated embodiment includes a unit holder 51, a spindle housing 52 attached to the unit holder 51, and a rotating spindle 53 that is rotatably supported by the spindle housing 52. The unit holder 51 is provided with two guided rails 51a and 51a slidably fitted to the two guide rails 422a and 422a provided in the mounting portion 422, and the guided rail 51a. , 51a is fitted to the guide rails 422a, 422a so as to be movable in the cutting feed direction indicated by the arrow Z. The rotary spindle 53 is disposed so as to protrude from the tip of the spindle housing 52, and a cutting blade 54 is attached to the tip of the rotary spindle 53. The rotating spindle 53 with the cutting blade 54 mounted thereon is driven to rotate by a driving source such as a servo motor 55.

  The spindle unit 5 in the illustrated embodiment includes a moving means 56 for moving the holder 51 along the two guide rails 422a and 422a in the direction indicated by the arrow Z. The moving means 56 is driven by a male screw rod (not shown) disposed between the guide rails 422a and 422a and a pulse motor 562 for rotationally driving the male screw rod, as in the moving means 36 and 43. The unit holder 51, the spindle housing 52, and the rotary spindle 53 are fed along the guide rails 422a and 422a by an arrow Z by driving a male screw rod (not shown) forward and backward by a pulse motor 562. Move in the direction. Accordingly, the pulse motor 562, a male screw rod (not shown), and the like function as a cutting feed means that moves the spindle unit 5 in the cutting feed direction indicated by the arrow Z.

Here, the cutting water supply means for supplying the cutting water to the processing area by the cutting blade 54 will be described with reference to FIG.
A blade cover 57 that covers the outer periphery of the cutting blade 54 is attached to the tip of the spindle housing 52 that constitutes the spindle unit 5. Two cutting water nozzles 58 and 59 are disposed on the blade cover 57. The cutting water nozzles 58 and 59 are disposed on both sides of the cutting blade 54 and are connected to a cutting water supply source (not shown).

  Returning to FIG. 1, in the cassette mounting area 7 a of the apparatus housing 1, a cassette mounting table 7 for mounting a cassette for storing a workpiece is disposed. The cassette mounting table 7 is configured to be movable in the vertical direction by lifting means (not shown). On the cassette mounting table 7, a cassette 8 for storing the workpiece 10 is mounted. The workpiece 10 accommodated in the cassette 8 has a grid-like street formed on the surface of the wafer. Capacitors, LEDs, and circuits are arranged in a plurality of rectangular areas partitioned by the grid-like division lines (streets). Etc. are formed. The workpiece 10 formed in this way is accommodated in the cassette 8 in a state of being adhered to the surface of the protective tape 12 attached to the annular frame 11.

  In the illustrated embodiment, the cutting device is supported by a workpiece 10 (an annular frame 11 supported via a protective tape 12) accommodated in a cassette 8 placed on a cassette placement table 7. ) To the temporary table 13, the conveyance unit 15 to convey the workpiece 10 conveyed to the temporary table 13 onto the chuck table 34, and the workpiece cut on the chuck table 34. A cleaning unit 16 for cleaning the workpiece 10 and a cleaning / conveying unit 17 for transporting the workpiece 10 cut on the chuck table 34 to the cleaning unit 16 are provided. Further, the illustrated cutting apparatus includes an imaging unit 18 configured with a microscope, a CCD camera, or the like for imaging a street or the like formed on the workpiece 10 held on the chuck table 34, and an image is captured by the imaging unit 18. The display means 19 which displays the displayed image etc. is provided.

The operation of the cutting apparatus configured as described above will be briefly described.
The workpiece 10 accommodated in a predetermined position of the cassette 8 placed on the cassette placement table 7 is positioned at the carry-out position by the vertical movement of the cassette placement table 7 by a lifting means (not shown). Next, the unloading means 14 moves forward and backward to unload the workpiece 10 positioned at the unloading position onto the temporary placement table 13. The workpiece 10 carried out to the temporary placement table 13 is conveyed onto the chuck table 34 by the conveying means 15. When the workpiece 10 is placed on the chuck table 34, suction means (not shown) is operated to suck and hold the workpiece 10 on the chuck table 34. The annular frame 11 that supports the workpiece 10 via the protective tape 12 is fixed by the four clamps 341. In this way, the chuck table 34 holding the workpiece 10 is moved to a position directly below the imaging means 18. When the chuck table 34 is positioned immediately below the imaging means 18, the street formed on the workpiece 10 is detected by the imaging means 18, and the spindle unit 5 is moved and adjusted in the arrow Y direction as the indexing direction to adjust the street. A precision alignment operation with the cutting blade 54 is performed.

  Thereafter, the cutting blade 54 is cut and fed by a predetermined amount in the direction indicated by the arrow Z, and the chuck table 34 holding the workpiece 10 is cut while being rotated at a rotational speed of 20000 to 40000 rpm in the direction indicated by the arrow V in FIG. The semiconductor wafer 10 held on the chuck table 34 is cut along a predetermined street by the cutting blade 54 by moving at a predetermined cutting feed speed in the direction indicated by the arrow X1 which is the feed direction. At this time, cutting water is supplied to the cutting area by the cutting blade 54 from the cutting water ejection nozzles 58 and 59. When the workpiece 10 is cut along a predetermined street in this way, the chuck table 34 is indexed and fed in the direction indicated by the arrow Y by the street interval, and the above cutting operation is performed. When the cutting operation is performed along all the streets extending in the predetermined direction of the workpiece 10, the chuck table 34 is rotated 90 degrees to extend in a direction orthogonal to the predetermined direction of the workpiece 10. By performing the cutting operation along existing streets, all the streets formed in a lattice shape on the workpiece 10 are cut and divided into individual chips. The divided chips do not fall apart due to the action of the protective tape 12, and the state of the wafer supported by the annular frame 11 is maintained.

  As described above, when the cutting operation is completed along the street of the workpiece 10, the chuck table 34 holding the workpiece 10 is returned to the position where the workpiece 10 is first sucked and held. Then, the suction holding of the workpiece 10 is released. Next, the workpiece 10 is transferred to the cleaning unit 16 by the cleaning transfer unit 17. The workpiece 10 conveyed to the cleaning means 16 is cleaned and dried here. The workpiece 10 thus cleaned and dried is carried out to the temporary table 13 by the conveying means 15. Then, the workpiece 10 is stored in a predetermined position of the cassette 8 by the unloading means 14.

  At the time of the cutting operation described above, cutting water is supplied from the cutting water jet nozzles 58 and 59 to a processing region by the cutting blade 54, and the processing portion is cooled. Cutting waste that has contributed to the cutting is mixed with cutting waste. The cutting water in which the cutting waste is mixed flows on the surface of the workpiece 10, and the cutting waste adheres to the surface of the workpiece 10. There is a problem of contamination. In order to solve such a problem, in the illustrated embodiment, there is provided cleaning water supply means for supplying cleaning water to the workpiece 10 held on the chuck table 34. This washing water supply means will be described with reference to FIG.

  The cleaning water supply means 20 shown in FIG. 4 includes cleaning water nozzle means 21 disposed on the chuck table cover 35. The washing water nozzle means 21 includes a nozzle support base 22 fixed on the chuck table cover 35, a first nozzle 23a, a second nozzle 23b, and a third nozzle 23c supported on the nozzle support base 22. I have. The nozzle support base 22 is formed in an arc shape, and is disposed upstream of the chuck table 34 in the cutting feed direction X1 during cutting. The first nozzle 23 a is disposed at the center of the nozzle support base 22 and includes a plurality of ejection holes 231 a for ejecting cleaning water to the center area in the index feed direction Y of the workpiece held on the chuck table 34. Yes. The second nozzle 23b is disposed on one side with respect to the index feed direction Y of the first nozzle 23a, and is on one side with respect to the index feed direction Y from the central region of the workpiece held on the chuck table 34. Are provided with a plurality of ejection holes 231b for injecting cleaning water. The third nozzle 23c is disposed on the other side with respect to the index feed direction Y of the first nozzle 23a, and is located on the other side with respect to the index feed direction Y from the central region of the workpiece held on the chuck table 34. Are provided with a plurality of ejection holes 231c for injecting cleaning water. The ejection holes 231a of the first nozzle 23a, the ejection holes 231b of the second nozzle 23b, and the ejection holes 231c of the third nozzle 23c configured in this way are each washed in parallel with the cutting feed direction indicated by the arrow X1. Is configured to inject fuel. Therefore, the ejection direction of the washing water ejected from the first nozzle 23a, the second nozzle 23b, and the third nozzle 23c is due to the cutting blade 54 rotating in the direction indicated by the arrow V in FIG. The direction is the same as the direction in which the cutting water is scattered.

  In the illustrated embodiment, the first nozzle 23a, the second nozzle 23b, and the third nozzle 23c are integrally formed by a nozzle housing 230 formed of synthetic resin as shown in FIG. Yes. The first nozzle 23a, the second nozzle 23b, and the third nozzle 23c that are integrally configured in this manner are supported such that their height positions can be adjusted. That is, in the illustrated embodiment, the integrally formed nozzle housing 230 is supported via the height adjusting means 24 disposed between the nozzle support base 22 and the nozzle housing 230. The height adjusting means 24 includes two adjusting screws 240 in the illustrated embodiment. The adjustment screw 240 includes a male screw portion 241 formed at the lower end portion, a ball joint portion 242 formed at the upper end, and a rotating portion 243 provided at the intermediate portion. The adjustment screw 240 configured as described above fits the ball joint portion 242 into the spherical concave portion 230 a formed in the nozzle housing 230, and the male screw portion 241 is screwed into the female screw hole 22 a formed in the nozzle support base 22. Match. Therefore, the nozzle housing 230 is moved upward or downward with respect to the nozzle support base 22 by grasping the rotation portion 243 of the adjustment screw 240 and rotating in one direction or the other direction. As described above, in the cleaning water nozzle means 21 in the illustrated embodiment, the first nozzle 23 a is corresponding to the thickness of the workpiece 10 held on the chuck table 34 by rotating the adjustment screw 240. And the height position of the 2nd nozzle 23b and the 3rd nozzle 23c can be adjusted suitably.

  The first nozzle 23a, the second nozzle 23b, and the third nozzle 23c described above are connected to the cleaning water supply source 27 by the cleaning water supply pipes 25a, 25b, 25c and the water supply pipe 26, respectively, as shown in FIG. ing. The cleaning water supply unit 20 in the illustrated embodiment includes a flow rate adjusting unit 28 that adjusts the flow rate of the cleaning water supplied to the first nozzle 23a, the second nozzle 23b, and the third nozzle 23c. The flow rate adjusting means 28 is composed of proportional electromagnetic flow rate adjusting valves 28a, 28b, 28c disposed in the washing water supply pipes 25a, 25b, 25c, respectively. Accordingly, by adjusting the voltages applied to the proportional electromagnetic flow rate adjusting valves 28a, 28b, and 28c, the flow rates of the cleaning water ejected from the first nozzle 23a, the second nozzle 23b, and the third nozzle 23c are appropriately set. Can be adjusted. Further, in the cleaning water supply means 20 in the illustrated embodiment, an electromagnetic switching valve 29 is disposed in the water supply pipe 26.

  The cleaning water supply means 20 in the illustrated embodiment is configured as described above, and the electromagnetic switching valve 29 is energized (ON) during the above-described cutting operation, and the first nozzle 23a, the second nozzle 23b, and the second nozzle The cleaning water is ejected from the third nozzle 23 c toward the surface of the workpiece 10 held on the chuck table 34. At this time, for example, 2 liters per minute (2 liters / minute) is supplied to the area cut by the cutting blade 54, and 1 liter per minute (1 liters / minute) is supplied to the other areas. The voltage applied to the proportional electromagnetic flow control valves 28a, 28b, 28c is controlled. As described above, the cleaning water ejected from the first nozzle 23a, the second nozzle 23b, and the third nozzle 23c is supplied to the entire surface of the workpiece 10 during the cutting operation. The generated cutting waste can be washed away. In addition, the direction in which the cleaning water is ejected from the first nozzle 23a, the second nozzle 23b, and the third nozzle 23c is the same as the direction in which the cutting water is scattered due to the rotation of the cutting blade 54. Therefore, the washing water flows smoothly and the washing effect is improved. In the illustrated embodiment, since the proportional electromagnetic flow control valves 28a, 28b, and 28c are disposed in the cleaning water supply pipes 25a, 25b, and 25c, respectively, the first nozzle 23a, the second nozzle 23b, and the second nozzle The flow rate of the washing water ejected from the three nozzles 23c can be adjusted. Accordingly, it is possible to supply a large amount of cleaning water to the area that is being cut by the cutting blade 54, and to reduce the amount of cleaning water supplied to the other areas as compared with the cutting area. Can be saved.

1: device housing 2: stationary base 3: chuck table mechanism 34: chuck table 35: chuck table cover 4: spindle support mechanism 42: movable support base 5: spindle unit 51: unit holder 52: spindle housing 53: rotating spindle 54: Cutting blade 57: Blade cover 58, 59: Cutting water nozzle 7: Cassette mounting table 8: Cassette 10: Workpiece 11: Annular frame 12: Protection tape 13: Temporary placing table 14: Unloading means 15: Transport Means 16: Washing means 17: Washing and conveying means 18: Imaging means 19: Display means 20: Washing water supply means 21: Washing water nozzle means 22: Nozzle support 23a: First nozzle 23b: Second nozzle 23c: First No. 3 nozzle 24: Height adjusting means 240: Adjustment screw 27 Cleaning water supply source 28: flow rate adjusting means 28a, 28b, 28c: proportional electromagnetic flow control valve 29: solenoid selector valve

Claims (4)

A chuck table that holds a workpiece, a chuck table support base that supports the chuck table, a cutting blade that cuts the workpiece held on the chuck table, and a cutting water that is supplied to a machining area by the cutting blade Cutting means provided with cutting water supply means, cutting feed means for relatively moving the chuck table support base and the cutting means in the cutting feed direction, the chuck table support base and the cutting means In a cutting apparatus comprising: an indexing feed unit that is relatively moved in an indexing feed direction orthogonal to the feed direction; and a cleaning water supply unit that supplies cleaning water to a workpiece held on the chuck table.
The cleaning water supply means includes cleaning water nozzle means including a first nozzle, a second nozzle, and a third nozzle for ejecting cleaning water toward a workpiece held on the chuck table, and the first nozzle 1 nozzle, and a flow rate adjusting means for adjusting the flow rate of the cleaning water supplied to each of the second nozzle and the third nozzle,
The cleaning water nozzle means is disposed upstream of the chuck table in the cutting feed direction during cutting,
In the index feed direction, the first nozzle is disposed in the center, the second nozzle is disposed on one side of the first nozzle, and the third nozzle is disposed on the other side of the first nozzle. Arranged,
The flow rate of the cleaning water ejected from the first nozzle, the second nozzle, and the third nozzle is adjusted by the flow rate adjusting means so as to supply a large amount of cleaning water to the area cut by the cutting blade. Adjusted,
The cutting device characterized by the above.   The cutting apparatus according to claim 1, wherein the cleaning water nozzle means is disposed on a chuck table cover that is supported by the chuck table support base and disposed around the chuck table.   The washing water nozzle means includes a nozzle support that supports the first nozzle, the second nozzle, and the third nozzle, the nozzle support, the first nozzle, the second nozzle, and the The cutting apparatus according to claim 1, further comprising a height adjusting unit that adjusts a height position of the third nozzle.   The direction in which the washing water ejected from the washing water nozzle means is set to the same direction as the direction in which the cutting water is scattered due to the rotation of the cutting blade. The cutting device described.

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