CN105436825B - Manufacturing method of LED constant current source driving circuit module - Google Patents
Manufacturing method of LED constant current source driving circuit module Download PDFInfo
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- CN105436825B CN105436825B CN201510845872.2A CN201510845872A CN105436825B CN 105436825 B CN105436825 B CN 105436825B CN 201510845872 A CN201510845872 A CN 201510845872A CN 105436825 B CN105436825 B CN 105436825B
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- shell
- circuit board
- dbc
- current source
- constant current
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Led Device Packages (AREA)
Abstract
A manufacturing method of an LED constant current source driving circuit module comprises a shell, a cover plate, a circuit board and a lead, and further comprises the following steps: 1) processing and manufacturing the circuit board; 2) processing and manufacturing the shell and the cover plate; 3) cleaning the circuit board and the shell; 4) pre-coating tin on the bottom surface of the cavity of the shell; 5) solder on a pad of the circuit board; 6) mounting components; 7) welding the circuit board and the shell in a large area and welding components; 8) the circuit board is welded with the lead; 9) cleaning pollutants generated by welding; 10) and (7) sealing the cover. The product has good heat dispersion and high reliability; the product has small volume, is packaged by all metals and has good electromagnetic compatibility; the manufacturing method is simple to operate and can be used for batch production.
Description
Technical field
The invention belongs to power supply product technical field, more particularly to constant-current source actuation techniques field is mainly used in LED photographs
Bright industry, is a kind of widely used circuit module.
Background technology
With the fast development of electronic product, energy-conservation turns into instantly very popular topic.In this context, LED is produced
Industry is developed rapidly, including the industry such as civilian and military illumination.
How to ensure that LED is normal, stably work
Constant current source driving circuit provides answer for above mentioned problem, and with the continuous progress of science and technology, electricity is driven to constant-current source
The design on road and the production process of product constantly propose new, higher requirement.
The content of the invention
, will it is an object of the invention to provide a kind of preparation method of LED constant current source drive circuit module according to above-mentioned requirements
Product circuit, structure design are combined closely, be it is a kind of have preferable electromagnetic compatibility characteristic, the LED constant current source of good heat radiating characteristic
The mass of drive circuit module provides powerful guarantee.
To achieve the above object, the present invention is realized by following technological means：
A kind of preparation method of LED constant current source drive circuit module, it is characterised in that：Including shell, cover plate, circuit board,
Wire, it is further comprising the steps of：
1）The processing and fabricating of circuit board；
2）The processing and fabricating of shell and cover plate；
3）Cleaning circuit plate and shell；
4）The pre-coated tin in enclosure cavity bottom surface；
5）Solder on the pad of circuit board；
6）Component is mounted；
7）Circuit board is welded with shell large area and component is welded；
8）Circuit board is welded with wire；
9）The pollutant cleaning that welding is produced；
10）Capping.
Further：
Described step 1）Including according to the PCB domains of circuit board, completing ceramics using DBC process for manufacturing circuit board and covering
The processing of copper DBC circuit boards.
Described step 2) include, from can valve nickel-plated metal as shell and cover plate materials, according to shell and cover plate
Structure chart, completes structural member processing.
Described step 3) include, DBC circuit boards and shell are separately put into the spirituous container of Sheng, distinguished with brush pen
DBC circuit boards and shell are scrubbed, is then placed in baking oven and is toasted, temperature setting is 100 ~ 120 DEG C, time 5 ~ 20
Minute.
Described step 4) include,
41) selection fusing point is the scolding tin that 183 DEG C of compositions are Pb37Sn63；
42) shell is positioned on heating platform, the temperature setting of heating platform is 230 DEG C ~ 250 DEG C, preheats 3 ~ 5 points
Clock；
43) it is 350 ~ 450 DEG C by the temperature setting of electric iron, solder horn is selected and splits type, it is ensured that solder horn and surface of shell
There is sufficient contact surface；
44) scaling powder is coated in enclosure cavity bottom surface, Xi Chu places solder on housing, using solder horn on upper tin face
Heating 10 ~ 20 seconds, is rapidly completed tin process on surface along a direction by the activation of scaling powder rapidly；
45) using solder unnecessary on the upper tin face of tin rope removal is inhaled, the desheathing from heating platform completes whole pre-coated
Tin process.
Described step 5) include,
51) selection fusing point is 183 DEG C, and composition is Pb37Sn63 solder(ing) paste；
52) silk-screen soldering paste is carried out to the weld of DBC back of circuit board, front component by means of frock screen printing net plate；
53) the DBC circuit boards that silk-screen has soldering paste are positioned in shell.
Described step 6) include, according to circuits assembly figure, drawing is marked with to C1, C2, R1, U1, D1, Q1, L1 member
Device is positioned on the DBC circuit boards in shell one by one.
Described step 7) include,
71) prepare two heating platforms, the temperature setting of one is 210 DEG C ~ 220 DEG C, in addition one be set to 120 DEG C ~
150℃；
72) by step 6) in the shell equipped with the first device DBC circuit boards of attachment be positioned over 210 DEG C ~ 220 DEG C of heating platform
On；
73) welding process, when solder paste melts, the DBC circuit boards that " rub pressure " back and forth using tweezers are observed and is ajusted eventually, first device
What offseting occurred in part is also ajusted using tweezers；
74) by step 73) obtained module removes from 210 DEG C ~ 220 DEG C of heating platform, is positioned over 120 DEG C ~ 150 DEG C
Heating platform on.
Described step 8) include, it is 300 ~ 400 DEG C by the temperature setting of electric iron, in 120 DEG C ~ 150 DEG C of heated flat
On platform, required according to installation diagram, utilize " hook weldering " technique to complete " bridge line " welding of DBC circuit boards and wire.
Described step 10) include, soldering and sealing housing and cover plate are carried out using parallel seam welding technique.
The beneficial effects of the invention are as follows：It is product perfect heat-dissipating, highly reliable；Small product size is small, and metal package, electromagnetism is simultaneous
Hold characteristic good；Preparation method is simple to operate, can mass production.
Brief description of the drawings
Fig. 1 is LED constant current source drive circuit module schematic diagram of the present invention；Fig. 2 is LED constant current of the present invention
Source driving circuit module housing structure chart, wherein,（1）For front view,（2）For left view；Fig. 3 is LED of the present invention permanent
Source driving circuit module cover structure chart is flowed, wherein,（1）For front view,（2）For top view；Fig. 4 is LED of the present invention
Constant current source driving circuit module board figure, wherein,（1）For the back side,（2）For front；Fig. 5 is LED constant current of the present invention
Source driving circuit module assembling schematic diagram.
Embodiment
Below in conjunction with Figure of description, the present invention is further illustrated.
A kind of preparation method of LED constant current source drive circuit module, it is characterised in that：Including shell 1, cover plate 2, circuit board
3rd, wire 4, it is further comprising the steps of：
1）The processing and fabricating of circuit board 3；
2）The processing and fabricating of shell 1 and cover plate 2；
3）Cleaning circuit plate 3 and shell 1；
4）The pre-coated tin in cavity bottom surface of shell 1；
5）Solder on the pad of circuit board 3；
6）Component is mounted；
7）Circuit board 3 is welded with the large area of shell 1 and component is welded；
8）Circuit board 3 is welded with wire 4；
9）The pollutant cleaning that welding is produced；
10）Capping.
Further：
Described step 1）Including according to the PCB domains of circuit board 3, completing ceramics using DBC process for manufacturing circuit board and covering
The processing of copper DBC circuit boards 3.Compared with traditional FR-4 circuit board, the perfect heat-dissipating of the circuit board；While and thick film circuit
Plate is compared, and the circuit board processing cost is low.
Described step 2) include, from can valve nickel-plated metal as shell 1 and the material of cover plate 2, according to shell 1 and cover plate
2 structure chart, completes structural member processing.
Described step 3) include, DBC circuit boards 3 and shell 1 are separately put into the spirituous container of Sheng, fine arts brush is used
Pen is scrubbed to DBC circuit boards 3 and shell 1 respectively, is then placed in baking oven and is toasted, and temperature setting is 100 ~ 120 DEG C,
5 ~ 20 minutes time.
Described step 4) include,
41) selection fusing point is the scolding tin that 183 DEG C of compositions are Pb37Sn63；
42) shell 1 is positioned on heating platform, the temperature setting of heating platform is 230 DEG C ~ 250 DEG C, preheats 3 ~ 5 points
Clock；
43) it is 350 ~ 450 DEG C by the temperature setting of electric iron, solder horn is selected and splits type, it is ensured that solder horn and surface of shell
There is sufficient contact surface；
44) scaling powder is coated in the cavity bottom surface of shell 1, Xi Chu places solder on housing, using solder horn in upper tin face
Upper heating 10 ~ 20 seconds, is rapidly completed tin process on surface along a direction by the activation of scaling powder rapidly；
45) using solder unnecessary on the upper tin face of tin rope removal is inhaled, desheathing 1 from heating platform completes whole pre-
Cover tin process.
Described step 5) include,
51) selection fusing point is 183 DEG C, and composition is Pb37Sn63 solder(ing) paste；
52) silk-screen soldering paste is carried out to the weld of the back side of DBC circuit boards 3, front component by means of frock screen printing net plate；
53) the DBC circuit boards 3 that silk-screen has soldering paste are positioned in shell 1.
Described step 6) include, according to circuits assembly figure, drawing is marked with to C1, C2, R1, U1, D1, Q1, L1 member
Device is positioned on the DBC circuit boards 3 in shell one by one.
Described step 7) include,
71) prepare two heating platforms, the temperature setting of one is 210 DEG C ~ 220 DEG C, in addition one be set to 120 DEG C ~
150℃；
72) by step 6) in the shell 1 equipped with attachment member device DBC circuit boards 3 be positioned over 210 DEG C ~ 220 DEG C of heated flat
On platform；
73) welding process, when solder paste melts, the DBC circuit boards 3 that " rub pressure " back and forth using tweezers are observed and is ajusted eventually, it is first
What offseting occurred in device is also ajusted using tweezers；
74) by step 73) obtained module removes from 210 DEG C ~ 220 DEG C of heating platform, is positioned over 120 DEG C ~ 150 DEG C
Heating platform on.
Described step 8) include, it is 300 ~ 400 DEG C by the temperature setting of electric iron, in 120 DEG C ~ 150 DEG C of heated flat
On platform, required according to installation diagram, " the bridge line " for utilizing " hook weldering " technique to complete DBC circuit boards 3 and wire 4 is welded.
Described step 10) include, soldering and sealing housing 1 and cover plate 2 are carried out using parallel seam welding technique.The shell 1 and cover plate 2
Carry out have four leads being fixed using glass sintering on soldering and sealing, shell 1 using parallel seam welding technique, it is contemplated that the housing later stage has
Welding requirements, shell 1 and the equal Nickel Plating Treatment of cover plate 2；Shell 1 and cover plate 2 can external coordination in the factory for specially making parallel seam welding housing
Family is customized.
General principle, principal character and the advantage of the present invention has been shown and described above.The technical staff of the industry should
Understand, the design is not restricted to the described embodiments, the original for simply illustrating the design described in above-described embodiment and specification
Reason, on the premise of the design spirit and scope are not departed from, the design also has various changes and modifications, these changes and improvements
Both fall within the range of claimed the design.Scope is claimed by appended claims and its equivalent circle in the design
It is fixed.
Claims (8)
1. a kind of preparation method of LED constant current source drive circuit module, it is characterised in that：Including shell, cover plate, circuit board, lead
Line, it is further comprising the steps of：
1）The processing and fabricating of circuit board；
2）The processing and fabricating of shell and cover plate；
3）Cleaning circuit plate and shell；
4）The pre-coated tin in enclosure cavity bottom surface；
5）Solder on the pad of circuit board；
6）Component is mounted；
7）Circuit board is welded with shell large area and component is welded；
8）Circuit board is welded with wire；
9）The pollutant cleaning that welding is produced；
10）Capping；
Described step 4) include,
41) selection fusing point is the scolding tin that 183 DEG C of compositions are Pb37Sn63；
42) shell is positioned on heating platform, the temperature setting of heating platform is 230 DEG C ~ 250 DEG C, is preheated 3 ~ 5 minutes；
43) it is 350 ~ 450 DEG C by the temperature setting of electric iron, solder horn is selected and splits type, it is ensured that solder horn has with surface of shell to be filled
The contact surface divided；
44) scaling powder is coated in enclosure cavity bottom surface, Xi Chu places solder on housing, is heated using solder horn on upper tin face
10 ~ 20 seconds, it is rapidly completed tin process on surface by the activation of scaling powder along a direction rapidly；
45) using solder unnecessary on the upper tin face of tin rope removal is inhaled, the desheathing from heating platform completes whole pre-coated tin mistake
Journey；
Described step 7) include,
71) two heating platforms are prepared, the temperature setting of one is 210 DEG C ~ 220 DEG C, and one is set to 120 DEG C ~ 150 in addition
℃；
72) shell that will be equipped with mounting component DBC circuit boards is positioned on 210 DEG C ~ 220 DEG C of heating platform；
73) welding process, when solder paste melts, the DBC circuit boards that " rub pressure " back and forth using tweezers are observed and is finally ajusted, component
What appearance was offset is also ajusted using tweezers；
74) by step 73) obtained module removes from 210 DEG C ~ 220 DEG C of heating platform, be positioned over 120 DEG C ~ 150 DEG C plus
On hot platform.
2. a kind of preparation method of LED constant current source drive circuit module as claimed in claim 1, it is characterised in that：Described
Step 1）Including according to the PCB domains of circuit board, adding for ceramic copper-clad DBC circuit boards is completed using DBC process for manufacturing circuit board
Work.
3. a kind of preparation method of LED constant current source drive circuit module as claimed in claim 1, it is characterised in that：Described
Step 2) include, from can valve nickel-plated metal as shell and cover plate materials, according to shell and the structure chart of cover plate, complete structure
Part is processed.
4. a kind of preparation method of LED constant current source drive circuit module as claimed in claim 2, it is characterised in that：Described
Step 3) include, DBC circuit boards and shell are separately put into the spirituous container of Sheng, with brush pen respectively to DBC circuit boards and
Shell is scrubbed, and is then placed in baking oven and is toasted, and temperature setting is 100 ~ 120 DEG C, 5 ~ 20 minutes time.
5. a kind of preparation method of LED constant current source drive circuit module as claimed in claim 2, it is characterised in that：Described
Step 5) include,
51) selection fusing point is 183 DEG C, and composition is Pb37Sn63 solder(ing) paste；
52) silk-screen soldering paste is carried out to the weld of DBC back of circuit board, front component by means of frock screen printing net plate；
53) the DBC circuit boards that silk-screen has soldering paste are positioned in shell.
6. a kind of preparation method of LED constant current source drive circuit module as claimed in claim 2, it is characterised in that：Described
Step 6) include, according to circuits assembly figure, the component that drawing is marked with into C1, C2, R1, U1, D1, Q1, L1 is positioned over one by one
On DBC circuit boards in shell.
7. a kind of preparation method of LED constant current source drive circuit module as claimed in claim 2, it is characterised in that：Described
Step 8) include, it is 300 ~ 400 DEG C by the temperature setting of electric iron, on 120 DEG C ~ 150 DEG C of heating platform, according to installation diagram
It is required that, utilize " hook weldering " technique to complete " bridge line " welding of DBC circuit boards and wire.
8. a kind of preparation method of LED constant current source drive circuit module as claimed in claim 1, it is characterised in that：Described
Step 10) include, soldering and sealing housing and cover plate are carried out using parallel seam welding technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510845872.2A CN105436825B (en) | 2015-11-26 | 2015-11-26 | Manufacturing method of LED constant current source driving circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510845872.2A CN105436825B (en) | 2015-11-26 | 2015-11-26 | Manufacturing method of LED constant current source driving circuit module |
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| Publication Number | Publication Date |
|---|---|
| CN105436825A CN105436825A (en) | 2016-03-30 |
| CN105436825B true CN105436825B (en) | 2017-09-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110767645A (en) * | 2019-10-25 | 2020-02-07 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Hybrid integrated circuit module and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106017602B (en) * | 2016-06-20 | 2018-10-23 | 安徽华东光电技术研究所 | Manufacturing method of liquid level sensor |
| CN107498126B (en) * | 2017-06-26 | 2020-02-21 | 安徽华东光电技术研究所 | Method for enameling tin on deep cavity or narrow cavity |
| CN109688725B (en) * | 2018-12-10 | 2021-08-24 | 安徽华东光电技术研究所有限公司 | Manufacturing method of K1 waveband frequency source module |
| CN110213925A (en) * | 2019-06-04 | 2019-09-06 | 安徽华东光电技术研究所有限公司 | A kind of frequency pressure conversion module production method and its frequency pressure conversion module |
| CN113808964B (en) * | 2021-09-23 | 2024-04-26 | 华东光电集成器件研究所 | Heterogeneous eutectic method based on multiple chips and small size |
| CN116197477B (en) * | 2023-03-22 | 2024-08-09 | 北京中科飞鸿科技股份有限公司 | Method and device for assembling circuit board |
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| DE2940029C2 (en) * | 1979-10-03 | 1984-03-29 | Klein, Schanzlin & Becker Ag, 6710 Frankenthal | Centrifugal pump housing |
| CN101662889A (en) * | 2009-08-18 | 2010-03-03 | 深圳和而泰智能控制股份有限公司 | Post-soldering-free tin-coating method, printed circuit board and device thereof |
| CN102157498B (en) * | 2010-12-15 | 2013-04-17 | 安徽华东光电技术研究所 | Hybrid integrated circuit module and manufacturing method thereof |
| TW201306685A (en) * | 2011-07-28 | 2013-02-01 | Nichepac Technology Inc | A circuit board module stack |
| CN103551690B (en) * | 2013-11-01 | 2016-05-25 | 安徽华东光电技术研究所 | Manufacturing method of amplitude limiter |
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Cited By (1)
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| CN110767645A (en) * | 2019-10-25 | 2020-02-07 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Hybrid integrated circuit module and manufacturing method thereof |
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| CN105436825A (en) | 2016-03-30 |
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Address after: 241002 Huaxia science and Technology Park, high tech Development Zone, gejiang District, Wuhu City, Anhui Province Patentee after: ANHUI HUADONG PHOTOELECTRIC TECHNOLOGY INSTITUTE Co.,Ltd. Address before: 241002 Huaxia science and Technology Park, high tech Development Zone, gejiang District, Wuhu City, Anhui Province Patentee before: Anhui Huadong Polytechnic Institute |