CN105489734A - Chip on board (COB) production process free from wire binding - Google Patents
Chip on board (COB) production process free from wire binding Download PDFInfo
- Publication number
- CN105489734A CN105489734A CN201510166843.3A CN201510166843A CN105489734A CN 105489734 A CN105489734 A CN 105489734A CN 201510166843 A CN201510166843 A CN 201510166843A CN 105489734 A CN105489734 A CN 105489734A
- Authority
- CN
- China
- Prior art keywords
- chip
- substrate
- tin
- cob
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000006071 cream Substances 0.000 claims description 18
- 238000005516 engineering process Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 8
- 238000010411 cooking Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000004070 electrodeposition Methods 0.000 claims description 3
- 239000012943 hotmelt Substances 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 abstract 1
- 239000004831 Hot glue Substances 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H01L33/48—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H01L33/62—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H01L2933/0033—
-
- H01L2933/0066—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a chip on board (COB) production process free from wire binding. The COB production process comprises the following steps of 1, printing a tin paste on bonding pads of a substrate; 2, checking whether the tin paste suffers from leakage cementation or tin insufficiency or not; 3, placing chips on the substrate, wherein the positions of chip electrodes are in correspondence to the position of the tin paste, and a plurality of chips are uniformly arranged to form a light-emitting region; 4, checking whether the positions of the chip and the positions of the bonding pas of the substrate are aligned or not; 5, hot-melting the tin paste at a high temperature to make the chips and the substrate welded and fixed; 6, checking whether the chips give out light normally or not through energization; 7, encircling a dam edge at the periphery of the light-emitting region and placing the dam edge in a baking oven for baking; and 8, encapsulating a package liquid in the light-emitting region encircled by the dam edge, and placing the package liquid in the baking oven for baking. By the process, the wire binding process is reduced, the production efficiency is greatly improved, and the production period is effectively shortened; and moreover, the chip electrode and a substrate circuit are hot-melted and connected through the tin paste, and high stability and reliability are achieved.
Description
Technical field
The present invention relates to LED technology, specifically a kind of COB production technology exempting from wiring.
Background technology
COB is exactly the integrated area source technology of specular removal that LED chip is directly attached on the mirror metal substrate of high reflecting rate, this technology eliminates support concept, electroless plating, without Reflow Soldering, without paster operation, therefore operation reduce nearly 1/3rd, cost also saves 1/3rd.COB in the market generally adopts positive cartridge chip, positive cartridge chip is exactly the chip that chip electrode is positioned at chip front side, production method is: first use crystal-bonding adhesive to be fixed on substrate by chip, then toast 2 hours, re-use metallic bond zygonema to be communicated with base plate line by the electrode of chip front side, be finally energized checking chip whether normal luminous.This production method exists that production efficiency is low, reliability is poor, cost is high, to auxiliary material and the defect such as production equipment requirement is high, radiating treatment difficulty is large.
Summary of the invention
The object of the present invention is to provide a kind of COB production technology exempting from wiring, to solve the problem proposed in above-mentioned background technology.
For achieving the above object, the invention provides following technical scheme:
Exempt from a COB production technology for wiring, its step is as follows:
The first step: print solder paste onto on the pad of substrate;
Second step: whether inspection tin cream has the solid or few tin of leakage to lack tin, leaks if having admittedly or tin lacks tin phenomenon less, repeats the first step, otherwise, carry out next step;
3rd step: chip is placed on substrate, and chip electrode position is corresponding with the position of tin cream, multiple chip is evenly arranged formation light-emitting zone;
4th step: check whether the position of chip is aimed at the position of substrate pads, if the position of chip is not aimed at the position of substrate pads, repeats the 3rd step, otherwise, carry out next step;
5th step: high temperature hot melt tin cream, makes chip and substrate welding fix;
6th step: energising checking chip whether normal luminous, if chip normal luminous, carries out next step, if chip cannot normal luminous, repeat second step and the 4th step, after entering process, if chip normal luminous, carry out next step, if chip still can not normal luminous, then discard;
7th step: enclose limit, dam in light-emitting zone periphery, and put into oven cooking cycle;
8th step: filling encapsulation liquid in the light-emitting zone that Ba Biansuo encloses, and put into oven cooking cycle.
As the further scheme of the present invention: described chip is flip-chip.
As the present invention's further scheme: described encapsulation liquid is the temper of fluorescent material and silica gel.
Compared with prior art, the invention has the beneficial effects as follows: 1, decrease and use metallic bond zygonema that the electrode of chip front side is communicated with this wiring operation with base plate line, substantially increase production efficiency, effectively shorten the production cycle; 2, traditional COB, its chip electrode is connected by metallic bond zygonema with substrate circuit, reliability is poor, this exempts from the COB production technology chips electrode of wiring and substrate circuit by tin cream hot-melt adhesive paste, resistance to mechanical power and the power performance of expanding with heat and contract with cold improve greatly, the adaptive capacity of corresponding adverse circumstances (high temperature, high humidity, vibration large etc.) promotes greatly, and reliability is strong; 3, eliminate the material of this costliness of metallic bond zygonema, greatly reduce Material Cost; 4, this technique is similar to the processing mode of SMT, flexibly and easily, does not need there is too much rigors to auxiliary material; 5, tin cream heat conductivility is much better than die bond glue, effectively reduces product thermal resistance.
Accompanying drawing explanation
Fig. 1 is the structural representation of the COB exempting from wiring.
In figure: 1-tin cream, 2-chip, 3-substrate, limit, 4-dam, 5-encapsulate liquid.
Embodiment
Be described in more detail below in conjunction with the technical scheme of embodiment to this patent.
Fig. 1 is the structural representation of the COB exempting from wiring, described in exempt from the COB of wiring, comprise tin cream 1, chip 2, substrate 3 and limit, dam 4; Limit, described dam 4 is established on the substrate 3, and surrounded on the substrate 3 region, limit, dam 4 is light-emitting zone, described chip 2 is flip-chip, flip chip and chip electrode are positioned at the chip of chip bottom, multiple chip 2 is evenly located in light-emitting zone, and chip 2 is electrically connected substrate 3 by tin cream 1, be filled with encapsulation liquid 5 in the light-emitting zone that limit, dam 4 surrounds, described encapsulation liquid 5 is the temper of fluorescent material and silica gel.
The described COB production technology exempting from wiring is as follows:
The first step: tin cream 1 is printed onto on the pad of substrate 3;
Second step: whether inspection tin cream 1 has the solid or few tin of leakage to lack tin, leaks if having admittedly or tin lacks tin phenomenon less, repeats the first step, otherwise, carry out next step;
3rd step: chip 2 is placed on the substrate 3, multiple chip 2 evenly arrangement forms light-emitting zone, and chip 2 electrode position is corresponding with the position of tin cream 1;
4th step: check whether the position of chip 2 is aimed at the position of substrate 3 pad, if the position of chip 2 is not aimed at the position of substrate 3 pad, repeats the 3rd step, otherwise, carry out next step;
5th step: high temperature hot melt tin cream 1, makes chip 2 and substrate 3 welding fix;
6th step: energising checking chip 2 whether normal luminous, if chip 2 normal luminous, carries out next step, if chip 2 cannot normal luminous, repeat second step and the 4th step, after entering process, if chip 2 normal luminous, carry out next step, if chip 2 still can not normal luminous, then discard;
7th step: enclose limit, dam 4 in light-emitting zone periphery, and put into oven cooking cycle;
8th step: filling encapsulation liquid 5 in the light-emitting zone that limit, dam 4 is enclosed, and put into oven cooking cycle, encapsulation liquid 5 is the temper of fluorescent material and silica gel.
The described COB production technology exempting from wiring has following advantage: 1, decrease and use metallic bond zygonema that the electrode of chip front side is communicated with this wiring operation with base plate line, substantially increase production efficiency, effectively shorten the production cycle; 2, traditional COB, its chip electrode is connected by metallic bond zygonema with substrate circuit, reliability is poor, this exempts from COB production technology chips 2 electrode of wiring and substrate 3 circuit by tin cream 1 hot-melt adhesive paste, resistance to mechanical power and the power performance of expanding with heat and contract with cold improve greatly, the adaptive capacity of corresponding adverse circumstances (high temperature, high humidity, vibration large etc.) promotes greatly, and reliability is strong; 3, eliminate the material of this costliness of metallic bond zygonema, greatly reduce Material Cost; 4, this technique is similar to the processing mode of SMT, flexibly and easily, does not need there is too much rigors to auxiliary material; 5, tin cream heat conductivility is much better than die bond glue, effectively reduces product thermal resistance.
Above the better embodiment of this patent is explained in detail, but this patent is not limited to above-mentioned execution mode, in the ken that one skilled in the relevant art possesses, various change can also be made under the prerequisite not departing from this patent aim.
Claims (3)
1. exempt from a COB production technology for wiring, it is characterized in that:
The first step: tin cream (1) is printed onto on the pad of substrate (3);
Second step: whether inspection tin cream (1) has the solid or few tin of leakage to lack tin, leaks if having admittedly or tin lacks tin phenomenon less, repeats the first step, otherwise, carry out next step;
3rd step: chip (2) is placed on substrate (3), and chip (2) electrode position is corresponding with the position of tin cream (1), multiple chip (2) evenly arrangement forms light-emitting zone;
4th step: check whether the position of chip (2) is aimed at the position of substrate (3) pad, if the position of chip (2) is not aimed at the position of substrate (3) pad, repeat the 3rd step, otherwise, carry out next step;
5th step: high temperature hot melt tin cream (1), makes chip (2) and substrate (3) welding fix;
6th step: energising checking chip (2) whether normal luminous, if chip (2) normal luminous, carry out next step, if chip (2) cannot normal luminous, repeat second step and the 4th step, after entering process, if chip (2) normal luminous, carry out next step, if chip (2) still can not normal luminous, then discard;
7th step: enclose limit, dam (4) in light-emitting zone periphery, and put into oven cooking cycle;
8th step: filling encapsulation liquid 5 in the light-emitting zone that limit, dam 4 is enclosed, and put into oven cooking cycle.
2. the COB production technology exempting from wiring according to claim 1, is characterized in that: described chip (2) is flip-chip.
3. the COB production technology exempting from wiring according to claim 1 and 2, is characterized in that: the temper that described encapsulation liquid (5) is fluorescent material and silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510166843.3A CN105489734A (en) | 2015-04-10 | 2015-04-10 | Chip on board (COB) production process free from wire binding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510166843.3A CN105489734A (en) | 2015-04-10 | 2015-04-10 | Chip on board (COB) production process free from wire binding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105489734A true CN105489734A (en) | 2016-04-13 |
Family
ID=55676592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510166843.3A Pending CN105489734A (en) | 2015-04-10 | 2015-04-10 | Chip on board (COB) production process free from wire binding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105489734A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108258103A (en) * | 2018-03-16 | 2018-07-06 | 宁波升谱光电股份有限公司 | A kind of multi color temperature COB light source and its packaging method |
| CN108417684A (en) * | 2018-02-01 | 2018-08-17 | 中山市荣新照明电器有限公司 | Mosquito-repelling lamp production process based on flip Chip On Board (COB) technology |
| CN111490041A (en) * | 2020-04-17 | 2020-08-04 | 宁波升谱光电股份有限公司 | Mini L ED dot matrix lighting equipment and manufacturing method thereof |
Citations (8)
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|---|---|---|---|---|
| CN102779923A (en) * | 2012-07-09 | 2012-11-14 | 厦门飞德利照明科技有限公司 | Manufacturing method of patch type LED (Light-Emitting Diode) module |
| CN103400833A (en) * | 2013-07-29 | 2013-11-20 | 深圳市天电光电科技有限公司 | Led module and manufacturing method thereof |
| CN203536467U (en) * | 2013-09-30 | 2014-04-09 | 佛山市国星光电股份有限公司 | LED device having transition substrate |
| CN203686694U (en) * | 2014-01-20 | 2014-07-02 | 福建省德化福杰陶瓷有限公司 | Novel ceramic substrate LED lamp |
| CN203733839U (en) * | 2014-03-06 | 2014-07-23 | 深圳市九洲光电科技有限公司 | Cob light source module |
| CN104037314A (en) * | 2014-05-21 | 2014-09-10 | 深圳市格天光电有限公司 | Stage light flip-chip chip-on-board (COB) light source and production process thereof |
| CN204130588U (en) * | 2014-07-18 | 2015-01-28 | 惠州雷通光电器件有限公司 | A kind of COB light source without packaged chip |
| CN104409616A (en) * | 2014-11-14 | 2015-03-11 | 易美芯光（北京）科技有限公司 | Flip chip LED integrated light source structure and preparation method thereof |
-
2015
- 2015-04-10 CN CN201510166843.3A patent/CN105489734A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102779923A (en) * | 2012-07-09 | 2012-11-14 | 厦门飞德利照明科技有限公司 | Manufacturing method of patch type LED (Light-Emitting Diode) module |
| CN103400833A (en) * | 2013-07-29 | 2013-11-20 | 深圳市天电光电科技有限公司 | Led module and manufacturing method thereof |
| CN203536467U (en) * | 2013-09-30 | 2014-04-09 | 佛山市国星光电股份有限公司 | LED device having transition substrate |
| CN203686694U (en) * | 2014-01-20 | 2014-07-02 | 福建省德化福杰陶瓷有限公司 | Novel ceramic substrate LED lamp |
| CN203733839U (en) * | 2014-03-06 | 2014-07-23 | 深圳市九洲光电科技有限公司 | Cob light source module |
| CN104037314A (en) * | 2014-05-21 | 2014-09-10 | 深圳市格天光电有限公司 | Stage light flip-chip chip-on-board (COB) light source and production process thereof |
| CN204130588U (en) * | 2014-07-18 | 2015-01-28 | 惠州雷通光电器件有限公司 | A kind of COB light source without packaged chip |
| CN104409616A (en) * | 2014-11-14 | 2015-03-11 | 易美芯光（北京）科技有限公司 | Flip chip LED integrated light source structure and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417684A (en) * | 2018-02-01 | 2018-08-17 | 中山市荣新照明电器有限公司 | Mosquito-repelling lamp production process based on flip Chip On Board (COB) technology |
| CN108258103A (en) * | 2018-03-16 | 2018-07-06 | 宁波升谱光电股份有限公司 | A kind of multi color temperature COB light source and its packaging method |
| CN111490041A (en) * | 2020-04-17 | 2020-08-04 | 宁波升谱光电股份有限公司 | Mini L ED dot matrix lighting equipment and manufacturing method thereof |
| CN111490041B (en) * | 2020-04-17 | 2022-05-17 | 宁波升谱光电股份有限公司 | Mini LED dot matrix lighting equipment and manufacturing method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160413 |
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| RJ01 | Rejection of invention patent application after publication |