CN107498126B - Method for enameling tin on deep cavity or narrow cavity - Google Patents
Method for enameling tin on deep cavity or narrow cavity Download PDFInfo
- Publication number
- CN107498126B CN107498126B CN201710491567.7A CN201710491567A CN107498126B CN 107498126 B CN107498126 B CN 107498126B CN 201710491567 A CN201710491567 A CN 201710491567A CN 107498126 B CN107498126 B CN 107498126B
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- Prior art keywords
- cavity
- tin
- copper sheet
- gold
- cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses a method for enameling tin on a deep cavity or a narrow cavity, which comprises the following steps of manufacturing a gold-plated copper sheet; secondly, removing oxides in advance before tin coating; preheating on a hot table, spraying soldering flux, wherein the type of the soldering flux is as follows: EF-9301, solder is added, the cavity is placed on a hot table with the temperature of 240 +/-5 ℃ for preheating, and then a layer of soldering flux is sprayed on the area to be enameled of the cavity, wherein the type of the soldering flux is as follows: EF-9301, and then adding solder wires to the area of the cavity to be subjected to tin coating; fourthly, clamping a gold-plated copper sheet by using tweezers, placing the gold-plated copper sheet on the molten solder, and rubbing the gold-plated copper sheet in the area to be tin-plated in the cavity back and forth to enable the cavity to be tin-plated; and step five, cleaning the cavity after tin coating. Compared with the traditional electric iron mode, the invention has the advantages of simpler operation, convenience, high efficiency and no dead angle of tin coating. The invention is suitable for mass production and is worth popularizing.
Description
Technical Field
The invention relates to a method for enameling tin on a deep cavity or a narrow cavity, belonging to the technical field of electronic product processing.
Background
With the development of microwave technology, the frequency of the microwave module is higher and higher, and the cavity used by the microwave module gradually has a deep cavity or narrow cavity structure, so that the cavity of the deep cavity or narrow cavity structure effectively shields electromagnetic interference, and the transmission quality of microwave signals is improved. In the prior art, in order to improve the burn-in and weld penetration rate of the cavity and the microwave circuit board, a common electric soldering iron is used for coating tin on the cavity, the occurrence of the cavity with a deep cavity or a narrow cavity structure is limited by a cavity structural member, the electric soldering iron cannot coat tin on the edge of the deep cavity or the narrow cavity, the tin coating is not in place, the burn-in and weld penetration rate of the cavity and the microwave circuit board is influenced, the quality of a product is finally influenced, in addition, the electric soldering iron is inconvenient to operate on the deep cavity or the narrow cavity, and the working difficulty is increased.
In order to solve the defects of the prior art, the invention provides a method for enameling tin on a deep cavity or a narrow cavity, which enables the edge of the deep cavity or the narrow cavity to be completely enameling tin by setting a reasonable and effective tin enameling process flow and by means of a gold-plated copper sheet with a proper size, thereby providing guarantee for the burn-in and penetration rate of a subsequent cavity and a microwave circuit board and ensuring the quality of products. The method has simple steps, is easy to operate, can be used for mass production, and improves the quality of products without increasing the equipment investment.
Disclosure of Invention
In order to solve the defect that the electric iron used in the prior art cannot effectively enamel tin in a cavity with a deep cavity or narrow cavity structure, the invention provides a method for enameling tin in the deep cavity or the narrow cavity. The method mainly comprises the following steps:
step one, manufacturing a gold-plated copper sheet. According to the structure and the size of the deep cavity or the narrow cavity, a copper sheet matched with the structure and the size of the cavity is manufactured, and then the surface of the copper sheet is plated with gold.
And step two, removing the oxide in advance before tin coating. And placing the cavity in a plasma cleaning machine, setting cleaning parameters, and removing the oxide on the surface of the to-be-enameled area of the cavity by strong cleaning.
Preheating on a hot table, spraying soldering flux, and making the model: EF-9301, soldering flux, wherein the solder comprises the following components in percentage by weight: sn96.5%, Ag3%, and Cu0.5%. Placing the cavity on a hot table at the temperature of 240 +/-5 ℃ for preheating, and then spraying a layer of soldering flux to a to-be-tin-lined area of the cavity, wherein the model is as follows: EF-9301, and then adding a proper amount of solder wires to the area of the cavity to be subjected to tin coating.
And step four, clamping the gold-plated copper sheet by using tweezers, placing the gold-plated copper sheet on the molten solder, and rubbing the gold-plated copper sheet in the area to be tin-plated in the cavity back and forth to enable the cavity to be tin-plated.
And step five, cleaning the cavity after tin coating. And putting the cavity after tin coating into a vapor-phase cleaning tank containing an ABZOL CEG CLEANER cleaning agent, carrying out hot boiling, soaking and cleaning for 350s, carrying out ultrasonic cleaning for 120s and 100s, finally putting into absolute ethyl alcohol, brushing and cleaning with a brush, and naturally drying.
Has the advantages that: the method for enameling tin on the deep cavity or the narrow cavity has the advantages that before the tin enameling of the cavity, oxides in the cavity are removed in advance in a strong cleaning mode of a plasma cleaning machine, the adhesion of the cavity is improved, the wettability of soldering tin is improved, an optimal environment is provided for the subsequent tin enameling of the cavity, and adverse factors influencing the tin enameling quality of the cavity are eliminated; in addition, the method for clamping the gold-plated copper sheet by using the tweezers to perform cavity tin enameling is simpler, more convenient and more efficient to operate and has no dead angle in tin enameling compared with the traditional electric iron method. The invention is suitable for mass production and is worth popularizing.
Drawings
FIG. 1 is a flow chart of the method of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in figure 1, the method for enameling the tin on the deep cavity or the narrow cavity comprises the following steps:
step one, manufacturing a gold-plated copper sheet. According to the structure and the size of the deep cavity or the narrow cavity, a copper sheet matched with the structure and the size of the cavity is manufactured, and then the surface of the copper sheet is plated with gold.
And step two, removing the oxide in advance before tin coating. And placing the cavity in a plasma cleaning machine, setting cleaning parameters, and removing the oxide on the surface of the to-be-enameled area of the cavity by strong cleaning.
Preheating on a hot table, spraying soldering flux, and making the model: EF-9301, soldering flux, wherein the solder comprises the following components in percentage by weight: sn96.5%, Ag3%, and Cu0.5%. Placing the cavity on a hot table at 245 ℃ for preheating, and then spraying a layer of soldering flux to the area to be tin-lined of the cavity, wherein the model is as follows: EF-9301, and then adding a proper amount of solder wires to the area of the cavity to be subjected to tin coating.
And step four, clamping the gold-plated copper sheet by using tweezers, placing the gold-plated copper sheet on the molten solder, and rubbing the gold-plated copper sheet in the area to be tin-plated in the cavity back and forth to enable the cavity to be tin-plated.
And step five, cleaning the cavity after tin coating. Putting the cavity after tin coating into a vapor-phase cleaning tank containing an ABZOL CEG CLEANER cleaning agent, carrying out hot-boiling, soaking and cleaning for 300s, carrying out ultrasonic cleaning for 100s, finally putting into absolute ethyl alcohol, carrying out brush scrubbing, and naturally drying.
The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention and these are intended to be within the scope of the invention.
Claims (1)
1. A method for enameling tin on a deep cavity or a narrow cavity is characterized by comprising the following steps: the method comprises the following steps:
step one, manufacturing a gold-plated copper sheet;
the first step comprises the following steps: manufacturing a copper sheet matched with the structure and the size of the cavity according to the structure and the size of the deep cavity or the narrow cavity, and then plating gold on the surface of the copper sheet;
secondly, removing oxides in advance before tin coating;
the second step comprises the following steps: placing the cavity in a plasma cleaning machine, setting cleaning parameters, and removing oxides on the surface of a region to be enameled with tin in the cavity by strong cleaning;
preheating on a hot table, spraying soldering flux, wherein the type of the soldering flux is as follows: EF-9301, solder is added, the cavity is placed on a hot table at the temperature of 245 ℃ for preheating, and then a layer of soldering flux is sprayed on the area to be tin-lined of the cavity, wherein the type of the soldering flux is as follows: EF-9301, and then adding solder wires to the area of the cavity to be subjected to tin coating;
the solder comprises the following components in percentage by weight: 96.5% of Sn96, 3% of Ag and 0.5% of Cu0;
fourthly, clamping a gold-plated copper sheet by using tweezers, placing the gold-plated copper sheet on the molten solder, and rubbing the gold-plated copper sheet in the area to be tin-plated in the cavity back and forth to enable the cavity to be tin-plated;
step five, cleaning the cavity after tin coating;
and putting the cavity after tin coating into a vapor-phase cleaning tank containing an ABZOL CEG CLEANER cleaning agent, carrying out hot boiling, soaking and cleaning for 350s, carrying out ultrasonic cleaning for 120s and 100s, finally putting into absolute ethyl alcohol, brushing and cleaning with a brush, and naturally drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710491567.7A CN107498126B (en) | 2017-06-26 | 2017-06-26 | Method for enameling tin on deep cavity or narrow cavity |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710491567.7A CN107498126B (en) | 2017-06-26 | 2017-06-26 | Method for enameling tin on deep cavity or narrow cavity |
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| Publication Number | Publication Date |
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| CN107498126A CN107498126A (en) | 2017-12-22 |
| CN107498126B true CN107498126B (en) | 2020-02-21 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108971681A (en) * | 2017-06-02 | 2018-12-11 | 特变电工沈阳变压器集团有限公司 | Shield lead welding technique to a kind of transformer copper |
| CN110369822B (en) * | 2019-06-27 | 2021-05-11 | 中国航天时代电子有限公司 | Efficient and reliable small deep hole rotary tin-coating and gold-removing method |
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| JP2001144401A (en) * | 1999-11-12 | 2001-05-25 | Denso Corp | Controlling device |
| CN103369857B (en) * | 2012-03-30 | 2017-01-04 | 北大方正集团有限公司 | Processing method to test board before conductive anodic filament experiment |
| CN103447646B (en) * | 2013-09-05 | 2015-09-02 | 中国电子科技集团公司第十研究所 | The welding method of soft chip circuit plate and metallic matrix is realized without special tooling |
| CN103737135B (en) * | 2013-12-09 | 2016-01-13 | 成都赛英科技有限公司 | A kind of metal shell soldering method |
| CN103934534B (en) * | 2014-04-15 | 2016-03-30 | 北京卫星制造厂 | The vacuum welding method of a kind of thick film substrate and power shell |
| CN105436825B (en) * | 2015-11-26 | 2017-09-29 | 安徽华东光电技术研究所 | Manufacturing method of LED constant current source driving circuit module |
| CN106572607B (en) * | 2016-06-23 | 2019-03-12 | 安徽华东光电技术研究所 | Process manufacturing method of solid-state microwave source |
| CN106413285A (en) * | 2016-11-22 | 2017-02-15 | 株洲天微技术有限公司 | Microcircuit module back side pre-soldering and pre-soldering heating device |
| CN107350585A (en) * | 2017-06-26 | 2017-11-17 | 安徽华东光电技术研究所 | A kind of method of flat gold plated lead manual welding |
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Address after: 241002 Huaxia science and Technology Park, hi tech Development Zone, Yijiang District, Wuhu, Anhui Patentee after: ANHUI HUADONG PHOTOELECTRIC TECHNOLOGY INSTITUTE Co.,Ltd. Address before: 241002 Huaxia science and Technology Park, hi tech Development Zone, Yijiang District, Wuhu, Anhui Patentee before: Anhui Huadong Polytechnic Institute |
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