CN104602444A - Automotive multilayer-structured circuit board and production method thereof - Google Patents
Automotive multilayer-structured circuit board and production method thereof Download PDFInfo
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- CN104602444A CN104602444A CN201510046216.6A CN201510046216A CN104602444A CN 104602444 A CN104602444 A CN 104602444A CN 201510046216 A CN201510046216 A CN 201510046216A CN 104602444 A CN104602444 A CN 104602444A
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Abstract
The invention relates to an automotive multilayer-structured circuit board and a production method thereof and belongs to the technical field of electronic device manufacturing. The automotive multilayer-structured circuit board comprises circuit layers and dielectric layers. One dielectric layer is arranged between adjacent two circuit layers. The circuit layers and the dielectric layers are arranged in a vertically symmetrical structure. A circuit layer I, a dielectric layer I, a circuit layer II, a dielectric layer II, a circuit layer III, a dielectric layer III, a circuit layer IV, a dielectric layer IV, a circuit layer V, a dielectric layer V and a circuit layer VI are sequentially arranged from top to bottom. The upper and lower surfaces of the circuit board are coated with photosensitive ink. A groove is arranged in the circuit board and the bottom of the groove penetrates to the dielectric layer III. No groove is arranged from the circuit layer IV to the circuit layer VI in the bottom of the circuit board. Flexible ink is arranged under the groove at the bottom surface of the circuit board. The automotive multilayer-structured circuit board is high in reliability, good in chemical resistance and high in complex circuit accommodating capability.
Description
Technical field
The present invention relates to a kind of automobile multi-laminate structure wiring board and preparation method thereof, belong to electronic device manufacturing technology field.
Background technology
Automotive-type electronic product is different from other electronic products, it comprises multiple central processing unit, the pcb board of network system, real-time data gathering system and complexity, therefore the reliability of wiring board is extremely important in automotive electronics, it requires that product is in limiting condition, as still kept good conductivity, endurance under the environment of high pressure, high humility and high-temperature.And due to the variation of electronic product function in automobile, wiring board need arrange more electronic devices and components, and wiring board can hold complicated circuit, and adapts to narrow space.
In addition publication number is the utility model patent flexible circuit board of 202979456U, although achieve the flexible effect of hardboard circuit, its flexible line layer number of plies is less, and can not carry comparatively complicated connection, functional realiey is more single.
Summary of the invention
In order to solve the problem, the invention provides a kind of automobile multi-laminate structure wiring board and preparation method thereof.
Technical solution of the present invention is as follows:
A kind of automobile multi-laminate structure wiring board, comprise line layer and dielectric layer, dielectric layer is provided with between adjacent two line layers, it is characterized in that: described line layer and dielectric layer are that upper and lower symmetrical structure is arranged, from top to bottom line layer one successively, dielectric layer one, line layer two, dielectric layer two, line layer three, dielectric layer three, line layer four, dielectric layer four, line layer five, dielectric layer five and line layer six, the upper and lower surface of described wiring board is coated with photosensitive-ink, described wiring board is provided with groove, described bottom portion of groove is deeply to dielectric layer three place, groove is not established between line layer four to line layer six bottom described wiring board, the bottom surface of described wiring board, flexible ink is provided with immediately below groove.
Described line layer one and line layer six are made up of Copper Foil, described dielectric layer one and dielectric layer five are made up of prepreg 106, described line layer two, dielectric layer two and line layer three are made up of copper-clad plate, described line layer four, dielectric layer five and line layer six are made up of copper-clad plate, described dielectric layer three is formed by trilaminate material pressing, and this trilaminate material is prepreg 7628, C rank epoxy resin and prepreg 7628 successively.
The thickness of described line layer one and line layer six is 35um.
The method step is as follows:
(1) pressing of multilayer circuit board and exposure: remove the grease on line layer surface, foreign material, and brown process is carried out to clean copper face form brown layer; From inside to outside, the line layer three of internal layer and line layer four, line layer two and line layer five and outer field line layer one and line layer six are covered photosensitive dry film or wet film and egative film respectively to expose as under light source; Utilize HTHP, line layer, the dielectric layer of carrying out figure are carried out pressing, form multilayer circuit board;
(2) graphic plating: extend electroplating time to 80 min during plating, reduce electroplating current to 17 ASF simultaneously, reach the effect promoting electro-coppering quality, line layer one and line layer six are passed through electrolytic method plated metal copper by original thickness 22.5um, makes it reach 35um.
(3) etching and striping: be placed in etching solution by the whole plate after step (3) graphic plating and etch, leave the copper figure identical with substrate figure, then puts into striping liquid and removes dry film on copper figure.
(4) anti-welding: to reserve through hole to be welded on wiring board and weld pad, all circuits and copper face are covered photosensitive-ink by silk screen printing, and immediately below groove, wiring board bottom surface covers flexible ink.
(5) UV baking and brushing: strengthen the coagulation grade toasting ink layer through anti-postwelding further, removes production board owing to exposing in atmosphere at the low-level oxidation of copper face generation and the flaw of welding resisting layer,
(6) Z axis milling: utilize Z axis milling machine, by milling region milling cutter after pressing along the milling of Z-direction multitool, form groove, the degree of depth of management and control groove is to dielectric layer three place, and line layer four is not exposed.
Beneficial effect of the present invention is: 1) comprise six sandwich circuit layers, and line layer and dielectric layer is that symmetrical structure is arranged, wiring board offers groove, multilayer circuit board can be bent, the bottom of groove is deeply to dielectric layer three place, namely bottom three sandwich circuit layers are flexible, by bending, the arrangement of the components and parts on wiring board can imitate flexible circuit board, improve utilance, the shape of groove is not limited only to straight-line groove, also can make curved slot, reduces further when wiring board uses and taken up space; 2) six sandwich circuit board topology layouts are reasonable, line layer one and line layer six are made up of Copper Foil, described dielectric layer one and dielectric layer five are made up of prepreg 106, described line layer two, dielectric layer two and line layer three are made up of copper-clad plate, described line layer four, dielectric layer five and line layer six are made up of copper-clad plate, described dielectric layer three is formed by trilaminate material pressing, this trilaminate material is prepreg 7628, C rank epoxy resin and prepreg 7628 successively, coordinate Z axis milling technology, wiring board has higher reliability, endurance and electric durability.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is structural representation of the present invention.
Wherein: 1, line layer; 2, dielectric layer; 3, solder mask; 4, groove; 5, line layer five; 6, line layer six; 7, photosensitive-ink; 8, flexible ink; 9, dielectric layer one; 10, dielectric layer two; 11, dielectric layer three; 12, dielectric layer four; 13, dielectric layer five; 14, groove.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further detailed explanation.
Consult Fig. 1.
A kind of automobile multi-laminate structure wiring board, comprise line layer and dielectric layer, dielectric layer is provided with between adjacent two line layers, it is characterized in that: described line layer and dielectric layer are that upper and lower symmetrical structure is arranged, from top to bottom line layer 1 successively, dielectric layer 1, line layer 22, dielectric layer 2 10, line layer 33, dielectric layer 3 11, line layer 44, dielectric layer 4 12, line layer 55, dielectric layer 5 13 and line layer 66, the upper and lower surface of described wiring board is coated with photosensitive-ink 7, described wiring board is provided with groove 14, deeply to dielectric layer 3 11 place bottom described groove 14, groove 14 is not established between line layer 44 to line layer 66 bottom described wiring board, the bottom surface of described wiring board, flexible ink 8 is provided with immediately below groove 14.
Described line layer 1 and line layer 66 are made up of Copper Foil, described dielectric layer 1 and dielectric layer 5 13 are made up of prepreg 106, described line layer 22, dielectric layer 2 10 and line layer 33 are made up of copper-clad plate, described line layer 44, dielectric layer 5 13 and line layer 66 are made up of copper-clad plate, described dielectric layer 3 11 is formed by trilaminate material pressing, and this trilaminate material is prepreg 7628, C rank epoxy resin and prepreg 7628 successively.
The thickness of described line layer 1 and line layer 66 is 35um.
The automobile manufacture method of multi-laminate structure wiring board, is characterized in that, the method step is as follows:
(1) pressing of multilayer circuit board and exposure: remove the grease on line layer surface, foreign material, and brown process is carried out to clean copper face form brown layer; From inside to outside, the line layer three of internal layer and line layer four, line layer two and line layer five and outer field line layer one and line layer six are covered photosensitive dry film or wet film and egative film respectively to expose as under light source; Utilize HTHP, line layer, the dielectric layer of carrying out figure are carried out pressing, form multilayer circuit board;
(2) graphic plating: extend electroplating time to 80 min during plating, reduce electroplating current to 17 ASF simultaneously, reach the effect promoting electro-coppering quality, line layer one and line layer six are passed through electrolytic method plated metal copper by original thickness 22.5um, makes it reach 35um.
(3) etching and striping: be placed in etching solution by the whole plate after step (3) graphic plating and etch, leave the copper figure identical with substrate figure, then puts into striping liquid and removes dry film on copper figure.
(4) anti-welding: to reserve through hole to be welded on wiring board and weld pad, all circuits and copper face are covered photosensitive-ink by silk screen printing, and immediately below groove, wiring board bottom surface covers flexible ink.
(5) UV baking and brushing: strengthen the coagulation grade toasting ink layer through anti-postwelding further, removes production board owing to exposing in atmosphere at the low-level oxidation of copper face generation and the flaw of welding resisting layer,
(6) Z axis milling: utilize Z axis milling machine, by milling region milling cutter after pressing along the milling of Z-direction multitool, form groove, the degree of depth of management and control groove is to dielectric layer three place, and line layer four is not exposed.
Product of the present invention is tested, experiment test 1:
1) use two-box type cold cycling case to carry out thermal shock to wiring board, 125 DEG C high temperature, continue 30min, subzero 40 DEG C of low temperature, continue 30min, high/low temperature iterative cycles 1000 hours, detect the base material of sample, in through hole, electro-coppering and welding resisting layer can not produce fracture.
Experiment test 2:
2) use climatic chamber to carry out electrocorrosion-resisting test to wiring board, voltage uses 100 V voltages, and temperature is 40 DEG C, 92% humidity, continues 21 days, detects the resistance >500M Ω between non-conduction circuit;
Experiment test 3:
3) CAF (Conductive anodic filament test, resistance to electromigration) test, after wiring board sample is aging by Reflow Soldering, add 100V voltage, at 85 DEG C, in 85% humidity environment, continue 1000 hours, and the resistance >100M Ω between non-conduction circuit.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention, General Principle defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Scope of the present invention is by claim and equivalents thereof.
Claims (7)
1. an automobile multi-laminate structure wiring board, comprise line layer and dielectric layer, dielectric layer is provided with between adjacent two line layers, it is characterized in that: described line layer and dielectric layer are that upper and lower symmetrical structure is arranged, from top to bottom line layer one (1) successively, dielectric layer one (9), line layer two (2), dielectric layer two (10), line layer three (3), dielectric layer three (11), line layer four (4), dielectric layer four (12), line layer five (5), dielectric layer five (13) and line layer six (6), the upper and lower surface of described wiring board is coated with photosensitive-ink (7), described wiring board is provided with groove (14), described groove (14) bottom is deeply to dielectric layer three (11) place, groove (14) is not established between line layer four (4) to line layer six (6) bottom described wiring board, the bottom surface of described wiring board, flexible ink (8) is provided with immediately below groove (14).
2. a kind of automobile multi-laminate structure wiring board according to claim 1, it is characterized in that: described line layer one (1) and line layer six (6) are made up of Copper Foil, described dielectric layer one (9) and dielectric layer five (13) are made up of prepreg 106, described line layer two (2), dielectric layer two (10) and line layer three (3) are made up of copper-clad plate, described line layer four (4), dielectric layer five (13) and line layer six (6) are made up of copper-clad plate, described dielectric layer three (11) is formed by trilaminate material pressing, this trilaminate material is prepreg 7628 successively, C rank epoxy resin, with prepreg 7628.
3. a kind of automobile multi-laminate structure wiring board according to claim 2, is characterized in that: the thickness of described line layer one (1) and line layer six (6) is 35um.
4. the manufacture method of automobile multi-laminate structure wiring board as claimed in any of claims 1 to 3, it is characterized in that, the method comprises the steps:
The exposure of multilayer circuit board and pressing: from inside to outside, cover photosensitive dry film or wet film and egative film respectively by the line layer three of internal layer and line layer four, line layer two and line layer five and outer field line layer one and line layer six and expose as under light source; Remove grease, the foreign material on line layer surface, and brown process formation brown layer is carried out to clean copper face; Utilize HTHP, line layer, the dielectric layer of carrying out figure are carried out pressing, form multilayer circuit board;
Graphic plating: extend electroplating time to 80 min during plating, reduces electroplating current to 17 ASF simultaneously, line layer one and line layer six is passed through electrolytic method plated metal copper by original thickness 22.5um, makes it reach 35um.
5. etching and striping: the whole plate after step (3) graphic plating is put into striping liquid and remove dry film on copper figure, be then placed in etching solution and etch, leave the copper figure identical with substrate figure.
6. anti-welding: to reserve through hole to be welded on wiring board and weld pad, all circuits and copper face are covered photosensitive-ink by silk screen printing, and immediately below groove, wiring board bottom surface covers flexible ink.
7.UV baking and brushing: strengthen the coagulation grade toasting ink layer through anti-postwelding further, remove production board owing to exposing in atmosphere at the low-level oxidation of copper face generation and the flaw of welding resisting layer,
Z axis milling: utilize Z axis milling machine, by milling region milling cutter after pressing along the milling of Z-direction multitool, form groove, the degree of depth of management and control groove is to dielectric layer three place, and line layer four is not exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510046216.6A CN104602444A (en) | 2015-01-29 | 2015-01-29 | Automotive multilayer-structured circuit board and production method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510046216.6A CN104602444A (en) | 2015-01-29 | 2015-01-29 | Automotive multilayer-structured circuit board and production method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116997079A (en) * | 2023-06-29 | 2023-11-03 | 昆山沪利微电有限公司 | PCB bending plate and processing method thereof |
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| JPH0717177A (en) * | 1993-07-02 | 1995-01-20 | Toppan Printing Co Ltd | Ic card |
| CN1759641A (en) * | 2003-03-19 | 2006-04-12 | 赫希曼电子有限及两合公司 | Domed circuit board of an antenna amplifier for a vehicle antenna device |
| CN101252817A (en) * | 2008-03-26 | 2008-08-27 | 中兴通讯股份有限公司 | Design producing method of multi-layer printed circuit board |
| CN201869434U (en) * | 2010-11-25 | 2011-06-15 | 沈李豪 | Flexible shapable circuit board |
| CN102281726A (en) * | 2011-07-16 | 2011-12-14 | 中山市达进电子有限公司 | Multilayer circuit board method with high density interconnection and high reliability combination |
| CN202503812U (en) * | 2012-03-20 | 2012-10-24 | 宜兴硅谷电子科技有限公司 | Semi-flexible printed circuit board used for static bending |
| CN102946688A (en) * | 2012-11-22 | 2013-02-27 | 高德(苏州)电子有限公司 | Flexible circuit board |
| CN104202930A (en) * | 2014-09-17 | 2014-12-10 | 四川海英电子科技有限公司 | High-density multilayer circuit board production method |
| WO2014207822A1 (en) * | 2013-06-25 | 2014-12-31 | 株式会社メイコー | Printed wiring board |
| JP2015012099A (en) * | 2013-06-27 | 2015-01-19 | 住友電工プリントサーキット株式会社 | Flexible printed wiring board and method for manufacturing flexible printed wiring board |
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2015
- 2015-01-29 CN CN201510046216.6A patent/CN104602444A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0717177A (en) * | 1993-07-02 | 1995-01-20 | Toppan Printing Co Ltd | Ic card |
| CN1759641A (en) * | 2003-03-19 | 2006-04-12 | 赫希曼电子有限及两合公司 | Domed circuit board of an antenna amplifier for a vehicle antenna device |
| CN101252817A (en) * | 2008-03-26 | 2008-08-27 | 中兴通讯股份有限公司 | Design producing method of multi-layer printed circuit board |
| CN201869434U (en) * | 2010-11-25 | 2011-06-15 | 沈李豪 | Flexible shapable circuit board |
| CN102281726A (en) * | 2011-07-16 | 2011-12-14 | 中山市达进电子有限公司 | Multilayer circuit board method with high density interconnection and high reliability combination |
| CN202503812U (en) * | 2012-03-20 | 2012-10-24 | 宜兴硅谷电子科技有限公司 | Semi-flexible printed circuit board used for static bending |
| CN102946688A (en) * | 2012-11-22 | 2013-02-27 | 高德(苏州)电子有限公司 | Flexible circuit board |
| WO2014207822A1 (en) * | 2013-06-25 | 2014-12-31 | 株式会社メイコー | Printed wiring board |
| JP2015012099A (en) * | 2013-06-27 | 2015-01-19 | 住友電工プリントサーキット株式会社 | Flexible printed wiring board and method for manufacturing flexible printed wiring board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116997079A (en) * | 2023-06-29 | 2023-11-03 | 昆山沪利微电有限公司 | PCB bending plate and processing method thereof |
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Application publication date: 20150506 |
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