WO2014207822A1 - Printed wiring board - Google Patents
Printed wiring board Download PDFInfo
- Publication number
- WO2014207822A1 WO2014207822A1 PCT/JP2013/067373 JP2013067373W WO2014207822A1 WO 2014207822 A1 WO2014207822 A1 WO 2014207822A1 JP 2013067373 W JP2013067373 W JP 2013067373W WO 2014207822 A1 WO2014207822 A1 WO 2014207822A1
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- WIPO (PCT)
- Prior art keywords
- copper foil
- wiring board
- printed wiring
- insulating base
- insulating
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
Definitions
- the present invention relates to a foldable printed wiring board having a laminated structure composed of a plurality of metal layers and insulating layers.
- a flexible substrate with flexibility In order to realize a structure (Flex to Install structure) that can be folded and incorporated in various electric / electronic devices, a flexible substrate with flexibility, a relatively hard rigid substrate without flexibility, and Various substrates such as a bonded substrate obtained by bonding a flexible substrate or a rigid flex substrate obtained by integrating the flexible substrate and the rigid substrate without forming a bonded portion have been used.
- a substrate used for limited bending applications, a substrate is known in which a rigid substrate is subjected to spot facing with a cutting tool such as an end mill and the opening formed by the spot facing is bent at a bending point. ing.
- a cutting tool such as an end mill
- the opening formed by the spot facing is bent at a bending point.
- a prepreg which is a base material in a state in which one glass cloth is impregnated in a thermosetting resin such as an epoxy resin and then heat-dried and semi-cured.
- Patent Document 1 discloses a printed circuit board using such a foldable structure.
- a specific material may have a specific thickness for the minimum thickness portion of the printed wiring board, which is a portion subjected to spot facing processing. It is requested.
- the prepreg in the UL (Underwriters Laboratories Inc) standard that guarantees the safety of electrical products in the United States, when the above-mentioned prepreg is used for the minimum thickness portion of a printed wiring board, the prepreg alone is about 200 ⁇ m. The thickness is required.
- the bent portion is constituted by only one prepreg having a thickness of about 200 ⁇ m, it becomes difficult to form a plurality of wiring layers in the bent portion.
- a signal layer and a ground layer made of a conductive material such as copper foil are provided on a printed wiring board as a plurality of wiring layers, a configuration in which two prepregs having a thickness of 100 ⁇ m are simply arranged in a bent portion. Then, the bending characteristic of the printed wiring board was deteriorated.
- the present invention has been made in view of such problems, and an object of the present invention is to provide a printed wiring board having a plurality of wiring layers and capable of improving bending characteristics.
- a printed wiring board of the present invention includes a first insulating base material made of resin alone, an insulator with a copper foil made of a copper foil formed on the surface of the first insulating base material, And a plurality of second insulating base materials made of glass cloth and resin covered by the glass cloth are alternately laminated on the first insulating base material, and the contact surface with the insulator with copper foil A laminate in which an opening is formed from the surface on the opposite side toward the inside, and one sheet is provided in a region between the bottom surface of the opening and the copper foil on the insulating resin body with the copper foil.
- the glass cloth and the resin constituting the plurality of second insulating bases only exist, and the distance from the bottom surface of the opening to the surface of the copper foil on the insulating resin body with copper foil is 170 ⁇ m or more and 230 ⁇ m It is characterized by the following.
- the distance from the bottom surface of the opening to the surface of the copper foil on the insulating resin body with the first copper foil is preferably 200 ⁇ m.
- the thickness of the first insulating base material is preferably 40 ⁇ m or more and 60 ⁇ m or less.
- the printed wiring board according to the present invention on the bottom surface side of the printed wiring board, copper foils are formed on the front and back surfaces of the first insulating base material not including the glass cloth. Therefore, in the printed wiring board, only two types of copper foil and resin having different elastic moduli exist between the two copper foils arranged on the bottom surface side of the printed wiring board. Compared with the case of using a prepreg including a glass cloth between two copper foils, it is possible to reduce stress strain caused by the difference in elastic modulus of various materials between the two copper foils.
- the resin layer present in the bent portion includes a resin layer made of the first insulating base material and a second insulating layer.
- the base material and the resin layer which consists of a part of 2nd insulating base material exist. That is, since only the resin layer including one glass cloth, the resin layer not including the glass cloth, and the two copper foils are present in the bent part, the bent part has 2 Compared with a structure in which one or more glass cloths are present, it is possible to reduce stress strain at the bent portion of the printed wiring board.
- the copper foil is peeled from the first insulating base material by reducing the stress strain caused by the difference in elastic modulus of various materials between the two copper foils. Can be prevented.
- the printed wiring board according to the present invention includes a plurality of wiring layers and can easily improve the bending characteristics.
- FIG. 3 is a partially enlarged view of a cross section taken along line III-III in FIG. It is a front view which shows the use condition of the printed wiring board which concerns on the Example of this invention.
- FIG. 1 is a plan view of the printed wiring board 1 according to the present embodiment.
- FIG. 2 is a front view of the printed wiring board 1 according to this embodiment.
- the printed wiring board 1 is a flat board having a rectangular planar shape. Further, in the printed wiring board 1, the opening 2 is formed in the central portion of the printed wiring board 1 so as to be parallel to the short side in the plan view of FIG. 1. As can be seen from FIGS. 1 and 2, the opening 2 extends from one of the long sides toward the other in the plan view of FIG. 1 and is formed on the first surface 1 a side of the printed wiring board 1. It does not reach the second surface 1b of the wiring board 1.
- the printed wiring board 1 has relatively hard characteristics as a whole, but the opening 2 is formed at the center of the board, so that the opening 2 is bent (the center of bending). And can be bent easily.
- the usage state of the printed wiring board 1 will be described later.
- the first surface 1 a of the printed wiring board 1 has a plurality of wiring patterns, various types of electricity such as resistors, capacitors, and semiconductor elements. -Terminals for mounting electronic parts are formed.
- the planar shape of the printed wiring board 1 is not limited to a rectangular shape, and can be appropriately changed according to the opening shape of the electric / electronic device in which the printed wiring board 1 is built.
- FIG. 3 is a partially enlarged view of a cross section taken along line III-III in FIG.
- the printed wiring board 1 includes a first insulating base 3 and a copper foil 4 formed on the first surface (front surface) 3 a of the first insulating base 3.
- 1 insulator 5 with copper foil laminate 17 in which copper foils 6 to 11 and second insulating substrates 12 to 16 are alternately laminated, and first insulating substrate 18 and first insulating substrate 18
- the first copper foil insulator 5 is obtained by coating an electrolytic copper foil that is the copper foil 4 with a resin such as an epoxy resin. Not included. That is, the 1st insulating base material 3 is comprised only from an epoxy resin, and the insulator 5 with a 1st copper foil is also generally called RCC (Resin
- the copper foil 4 is formed on the entire surface of the first surface 3a of the first insulating base 3 and functions as a ground layer (ground potential layer).
- the layer thickness of the copper foil 4 is about 30 to 40 ⁇ m, and the layer thickness of the first insulating substrate 3 is about 40 ⁇ m to 60 ⁇ m.
- a better impedance matching is achieved by setting the layer thickness of the first insulating base material 3 to about 50 ⁇ m.
- the first insulating base material 3 does not necessarily need to be composed of only a resin. If the base material does not include a glass cloth or the like, other insulating materials that improve the insulation and other characteristics are resin. It may be dispersed and held within.
- the second copper foil insulator 20 has the same configuration as the first copper foil insulator 5 and is the RCC described above. That is, the insulator 20 with the second copper foil is obtained by coating the copper foil 19 as an electrolytic copper foil with a resin (for example, epoxy resin), and the inside thereof includes a substrate such as a glass cloth. Not. As a difference between the insulator 20 with the second copper foil and the insulator 5 with the first copper foil, a desired wiring pattern is formed on the copper foil 19 constituting the insulator 20 with the second copper foil. In particular, the copper foil 19 is not formed in the opening 2 and its periphery.
- a resin for example, epoxy resin
- the printed wiring board 1 is not necessarily provided with the insulator 20 with the second copper foil.
- the insulator with the second copper foil is used depending on the use of the printed wiring board 1 and required dimensions. 20 may not be laminated. That is, the printed wiring board 1 may have a structure in which only the stacked body 17 is stacked on the first insulator 5 with copper foil.
- the laminated body 17 includes a copper foil 6, a second insulating base 12, a copper foil 7, a second insulating base 13, a copper foil 8, and a second insulating base on the second surface 3b of the first insulating base 3.
- Each component is laminated in the order of the material 14, the copper foil 9, the second insulating base material 15, the copper foil 10, the second insulating base material 16, and the copper foil 11.
- the second insulating base materials 12 to 16 are so-called one prepreg in which a glass cloth 21 is coated with a resin 22 (for example, epoxy resin).
- the copper foil 6 is formed on the entire surface of the second surface 3b of the first insulating base 3, and functions as a wiring for an electrical signal (that is, a signal layer) supplied from the outside of the printed wiring board 1.
- the copper foils 7 to 11 function as internal wiring of the printed wiring board 1 and are subjected to desired patterning.
- the copper foil 4 as a ground layer or the copper foil as a signal layer is formed by a conductive via (not shown). 6 is electrically connected.
- the copper foils 7 to 11 are not formed in the formation region of the opening 2 and the periphery thereof, and a desired opening (wiring pattern) is formed.
- the resin 22 constituting the adjacent second insulating base materials 12 to 16 is subjected to heating and pressurization by a vacuum press for fixing each layer. It flows and hardens, filling each of the openings.
- the number of laminated second insulating base materials and copper foils in the laminate 17 is not limited to that shown in FIG. 4, and is appropriately determined according to the use of the printed wiring board 1 and the required dimensions. Can be changed. Further, the copper foil 6 may function as a ground layer instead of a signal layer. In such a case, the copper foil 4 constituting the first insulator 5 with copper foil functions as a signal layer.
- the layer thickness of the second insulating substrate 12 is about 150 ⁇ m
- the layer thickness of the second insulating substrates 13 to 16 is about 70 to 200 ⁇ m.
- the layer thickness of the copper foils 6 to 11 is about 18 to 35 ⁇ m.
- an anchor of about 1 ⁇ m is formed on the first surface 6 a that contacts the first insulating substrate 3, and about 5 ⁇ m is formed on the second surface 6 b that contacts the second insulating substrate 12.
- An anchor is formed. That is, in the copper foil 6, the roughness of the first surface 6 a that contacts the first insulating substrate 3 is smaller than the roughness of the second surface 6 b that contacts the second insulating substrate 12.
- the opening 2 formed in the central portion of the printed wiring board 1 passes through the insulator 20 with the second copper foil and reaches the second insulating substrate 13 of the laminate 17.
- the opening 2 includes the first insulating base 18, the resins 22 of the second insulating bases 14 to 16, the glass cloths 21 of the second insulating bases 13 to 16, and the second insulating base. It is formed by removing a part of the resin of the material 13 and reaches the resin 22 located on the copper foil 7 and the second insulating base 12 side rather than the glass cloth 21 of the second insulating base 13. Yes.
- the distance from the bottom surface 2a of the opening 2 to the copper foil 6 is 170 ⁇ m or more and 230 ⁇ m or less.
- the copper foil 6 is formed from the bottom surface 2 a of the opening 2.
- the distance is preferably about 200 ⁇ m.
- the reason why the distance from the bottom surface 2a of the opening 2 to the copper foil 6 is about 200 ⁇ m is that the minimum laminated thickness (first insulation) of the printed wiring board 1 in the UL standard that guarantees the safety of electrical products in the United States. This is because the resin layer of only the epoxy resin such as the base material and the copper foil is defined as 200 ⁇ m.
- the layer thickness of the second insulating base material 12 that is a prepreg is about 150 ⁇ m, and the second insulating base material 13 in a portion where the opening 2 is not formed (that is, a region immediately below the opening 2).
- the layer thickness of the resin 22 filling the opening of the copper foil 7 is about 18 ⁇ m, which is the layer thickness of the copper foil 7.
- the second insulating base materials 12 to 16 which are prepregs and the copper foils 7 to 10 which have been subjected to desired patterning are sequentially laminated and laminated. These members are fixed by heating and pressurizing these members with a vacuum press. Thereafter, the copper foil 6 is affixed on the surface of the second insulating substrate 12, and the patterned copper foil 11 is affixed on the surface of the second insulating substrate 16. Thereby, formation of the laminated body 17 is completed. When forming the laminate 17, formation and patterning of conductive vias for the copper foils 6 to 11 are appropriately performed.
- the laminated body 17 is sandwiched between the insulator 5 with the first copper foil and the insulator 20 with the second copper foil, and is heated and pressurized by a vacuum press, whereby the first insulating base of the insulator 5 with the first copper foil.
- the material 3 and the copper foil 6 are fixed, the first insulating substrate 18 of the insulator 20 with the second copper foil and the copper foil 11 are fixed, and the laminated structure of the printed wiring board 1 is completed.
- spot facing is performed from the surface on which the copper foil 19 of the insulator 20 with the second copper foil is formed, and the opening 2 is formed.
- the place where the spot facing is performed is a central portion of the printed wiring board 1 where the copper foil 19 is not formed (exposed portion of the first insulating base material 18).
- the said spot facing process penetrates the glass cloth 21 of the 2nd insulating base material 13, removes a part of resin 22 of the 2nd insulating base material 13, and is completed.
- the amount of spot facing is adjusted so that the distance from the bottom surface 2a of the opening 2 to the surface of the copper foil 6 is about 200 ⁇ m.
- the printed wiring board 1 on the second surface 1 b side of the printed wiring board 1, the front and back surfaces (first surface) of the first insulating base material 3 that does not include the glass cloth 21.
- a copper foil 4 as a ground layer and a copper foil 6 as a signal layer are formed on 3a and the second surface 3b). Therefore, in the printed wiring board 1, only the copper foil and the resin, which are two kinds of materials having different elastic moduli, exist between the copper foils 4 and 6, and the glass cloth is interposed between the copper foils 4 and 6. Compared with the case where the prepreg containing 21 is used, the stress distortion resulting from the difference in the elastic modulus of the various materials between the copper foils 4 and 6 can be reduced.
- the resin layer existing in the bent portion in FIG. 4 the resin layer made of the first insulating base material 3, the second insulating base material 12, 2
- a resin layer made of a part of the insulating base material 13 That is, only the resin layer containing one glass cloth 21 (that is, one prepreg), the resin layer not containing glass cloth, and the copper foils 4 and 6 exist in the bent portion in FIG. Therefore, compared with a structure in which two or more glass cloths 21 exist in the bent part (that is, a structure in which two or more prepregs exist), the stress strain in the bent part of the printed wiring board 1 is reduced. Can be reduced.
- the second insulating base material 13 is laminated via the copper foil 6 on the first insulating base material 3 made of only the resin not including the glass cloth 21. Therefore, a structure in which only one prepreg exists in the bent portion of the printed wiring board 1 while the ground layer and the signal layer are formed on the outer layer (that is, the second surface 1b side) of the printed wiring board 1 in a bent state. Has been realized.
- the roughness of the first surface 6 a that contacts the first insulating base 3 is the second surface 6 b that contacts the second insulating base 12. It is smaller than the roughness. From such a structure, the adhesion between the first insulating base 3 and the copper foil 6 not including the glass cloth 21 is weak, and the copper foil 6 may be peeled off from the first insulating base 3. Since the base material 3 does not include the glass cloth 21, the stress strain caused by the difference in elastic modulus of various materials in the first insulating base material 3 can be reduced, and the peeling of the copper foil 6 can be reduced.
- the printed wiring board 1 according to the present embodiment has the above-described structure, and thus includes a plurality of wiring layers and can easily improve the bending characteristics.
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Abstract
A printed wiring board has: an insulator (5) with copper foil, comprising a first insulator substrate (3), consisting of resin, and copper foil (4) formed on the surface of the first insulator substrate; and a laminate (17), in which a plurality of copper foils (6 to 11), and a plurality of second insulating substrates (12 to 16) comprising glass cloth (21) and resin (22) covered by the glass cloth, are alternatingly stacked upon the first insulating substrate, and an aperture portion (2) is formed toward the interior from the surface of the side opposite the surface of contact with the insulator with copper foil. In the area between the bottom of the aperture portion and the copper foil upon the insulating resin body with copper foil, only one sheet of the glass cloth and resin configuring a plurality of the second insulating substrates exist, and the distance from the bottom of the aperture portion to the surface of the copper foil upon the insulating resin body with copper foil is greater than or equal to 170 μm and less than or equal to 230 μm.
Description
本発明は、複数の金属層及び絶縁層からなる積層構造を有する折り曲げ可能なプリント配線基板に関する。
The present invention relates to a foldable printed wiring board having a laminated structure composed of a plurality of metal layers and insulating layers.
従来から、各種の電気・電子機器に折り曲げて内蔵させるための構造(Flex to Install 構造)を実現するため、可撓性を備えるフレキシブル基板、可撓性を備えない比較的に硬いリジット基板と当該フレキシブル基板とを接合した接合基板、又は当該フレキシブル基板と当該リジット基板とを接合部を形成することなく一体化したリジットフレックス基板等の各種の基板が用いられてきた。
Conventionally, in order to realize a structure (Flex to Install structure) that can be folded and incorporated in various electric / electronic devices, a flexible substrate with flexibility, a relatively hard rigid substrate without flexibility, and Various substrates such as a bonded substrate obtained by bonding a flexible substrate or a rigid flex substrate obtained by integrating the flexible substrate and the rigid substrate without forming a bonded portion have been used.
特に、限定された曲げ用途に用いられる基板として、リジット基板をエンドミル等の切削工具によって座グリ加工を施し、当該座グリ加工によって形成された開口部を屈曲点として折り曲げることができる基板が知られている。このような構造を採用することにより、基板自在のコスト低減を図ることができる。例えば、座グリ加工が施されるリジット基板としては、1枚のガラスクロスをエポキシ樹脂等の熱硬化性樹脂内に含浸し、その後に加熱乾燥して半硬化させた状態の基材であるプリプレグが使用されている。また、特許文献1には、このような折り曲げ可能な構造を用いたプリント回路基板が開示されている。
In particular, as a substrate used for limited bending applications, a substrate is known in which a rigid substrate is subjected to spot facing with a cutting tool such as an end mill and the opening formed by the spot facing is bent at a bending point. ing. By adopting such a structure, it is possible to reduce the cost of the substrate. For example, as a rigid substrate subjected to spot facing processing, a prepreg which is a base material in a state in which one glass cloth is impregnated in a thermosetting resin such as an epoxy resin and then heat-dried and semi-cured. Is used. Patent Document 1 discloses a printed circuit board using such a foldable structure.
ここで、電気・電子機器、及びプリント配線基板自体の規格によっては、座グリ加工が施された部分であるプリント配線基板の最少厚み部分について、特定の材料が特定の厚みを備えていることが要求されている。例えば、米国における電気製品の安全性を保証する規格であるUL(Underwriters Laboratories Inc)規格においては、プリント配線基板の最少厚み部分に上述したプリプレグが使用される場合には、当該プリプレグのみで約200μmの厚みが要求されている。
Here, depending on the standards of the electrical / electronic device and the printed wiring board itself, a specific material may have a specific thickness for the minimum thickness portion of the printed wiring board, which is a portion subjected to spot facing processing. It is requested. For example, in the UL (Underwriters Laboratories Inc) standard that guarantees the safety of electrical products in the United States, when the above-mentioned prepreg is used for the minimum thickness portion of a printed wiring board, the prepreg alone is about 200 μm. The thickness is required.
しかしながら、厚さが約200μmの1枚のプリプレグのみによって曲げ部分を構成すると、当該曲げ部分に複数の配線層を形成することが困難となる。また、複数の配線層として、銅箔等の導電材料からなる信号層及びグランド層をプリント配線基板に設ける場合に、曲げ部分に厚さが100μmの2枚のプリプレグを単純に配置するような構成では、プリント配線基板の曲げ特性が低下していた。
However, if the bent portion is constituted by only one prepreg having a thickness of about 200 μm, it becomes difficult to form a plurality of wiring layers in the bent portion. In addition, when a signal layer and a ground layer made of a conductive material such as copper foil are provided on a printed wiring board as a plurality of wiring layers, a configuration in which two prepregs having a thickness of 100 μm are simply arranged in a bent portion. Then, the bending characteristic of the printed wiring board was deteriorated.
本発明はこのような課題に鑑みてなされたものであり、その目的とするところは、複数の配線層を備えるとともに、曲げ特性の向上を図ることができるプリント配線基板を提供することにある。
The present invention has been made in view of such problems, and an object of the present invention is to provide a printed wiring board having a plurality of wiring layers and capable of improving bending characteristics.
上記目的を達成するため、本発明のプリント配線基板は、樹脂のみからなる第1絶縁基材、及び前記第1絶縁基材の表面に形成された銅箔からなる銅箔付き絶縁体と、複数の銅箔、並びにガラスクロス及び前記ガラスクロスの被覆する樹脂からなる複数の第2絶縁基材が前記第1絶縁基材上に交互に積層され、前記銅箔付き絶縁体との接触面とは反対側の表面から内部に向かって開口部が形成された積層体と、を有し、前記開口部の底面から前記銅箔付き絶縁樹脂体上の前記銅箔の間の領域には、1枚の前記ガラスクロス及び前記複数の第2絶縁基材を構成する樹脂のみが存在し、前記開口部の底面から前記銅箔付き絶縁樹脂体上の前記銅箔の表面までの距離は、170μm以上230μm以下であることを特徴とする。
In order to achieve the above object, a printed wiring board of the present invention includes a first insulating base material made of resin alone, an insulator with a copper foil made of a copper foil formed on the surface of the first insulating base material, And a plurality of second insulating base materials made of glass cloth and resin covered by the glass cloth are alternately laminated on the first insulating base material, and the contact surface with the insulator with copper foil A laminate in which an opening is formed from the surface on the opposite side toward the inside, and one sheet is provided in a region between the bottom surface of the opening and the copper foil on the insulating resin body with the copper foil. The glass cloth and the resin constituting the plurality of second insulating bases only exist, and the distance from the bottom surface of the opening to the surface of the copper foil on the insulating resin body with copper foil is 170 μm or more and 230 μm It is characterized by the following.
上述したプリント配線基板において、前記開口部の底面から前記第1銅箔付き絶縁樹脂体上の前記銅箔の表面までの距離は、200μmであることが好ましい。
In the printed wiring board described above, the distance from the bottom surface of the opening to the surface of the copper foil on the insulating resin body with the first copper foil is preferably 200 μm.
また、上述したいずれかのプリント配線基板において、前記第1絶縁基材の厚みは、40μm以上60μm以下であることが好ましい。
In any of the printed wiring boards described above, the thickness of the first insulating base material is preferably 40 μm or more and 60 μm or less.
本発明に係るプリント配線基板において、プリント配線基板の底面側には、ガラスクロスを含まない第1絶縁基材の表裏面に銅箔が形成されている。従って、プリント配線基板においては、プリント配線基板の底面側に配置された2枚の銅箔の間には弾性率の異なる2種類の材料である銅箔及び樹脂のみが存在するだけであり、2枚の銅箔の間にガラスクロスを含むプリプレグを用いる場合と比較して、2枚の銅箔の間における各種材料の弾性率の相違に起因する応力歪みを軽減することができる。
In the printed wiring board according to the present invention, on the bottom surface side of the printed wiring board, copper foils are formed on the front and back surfaces of the first insulating base material not including the glass cloth. Therefore, in the printed wiring board, only two types of copper foil and resin having different elastic moduli exist between the two copper foils arranged on the bottom surface side of the printed wiring board. Compared with the case of using a prepreg including a glass cloth between two copper foils, it is possible to reduce stress strain caused by the difference in elastic modulus of various materials between the two copper foils.
また、本発明に係るプリント配線基板においては、開口部を屈曲点として屈曲させた場合、屈曲している部分に存在する樹脂層としては、第1絶縁基材からなる樹脂層と、第2絶縁基材及び第2絶縁基材の一部からなる樹脂層とが存在している。すなわち、当該屈曲している部分には、1枚のガラスクロスを含む樹脂層、ガラスクロスを含まない樹脂層、及び2枚の銅箔のみが存在しているため、屈曲している部分に2枚以上のガラスクロスが存在する構造と比較して、プリント配線基板の屈曲部分における応力歪みを軽減することができる。
In the printed wiring board according to the present invention, when the opening is bent at the bending point, the resin layer present in the bent portion includes a resin layer made of the first insulating base material and a second insulating layer. The base material and the resin layer which consists of a part of 2nd insulating base material exist. That is, since only the resin layer including one glass cloth, the resin layer not including the glass cloth, and the two copper foils are present in the bent part, the bent part has 2 Compared with a structure in which one or more glass cloths are present, it is possible to reduce stress strain at the bent portion of the printed wiring board.
更に、本発明に係るプリント配線基板においては、2枚の銅箔の間における各種材料の弾性率の相違に起因する応力歪みを軽減することにより、銅箔が第1絶縁基材から剥離することを防止することができる。
Furthermore, in the printed wiring board according to the present invention, the copper foil is peeled from the first insulating base material by reducing the stress strain caused by the difference in elastic modulus of various materials between the two copper foils. Can be prevented.
以上のことから、本発明に係るプリント配線基板は、複数の配線層を備えるとともに、曲げ特性の向上を容易に図ることができる。
From the above, the printed wiring board according to the present invention includes a plurality of wiring layers and can easily improve the bending characteristics.
以下、図面を参照し、本発明の実施の形態について、実施例に基づき詳細に説明する。なお、本発明は以下に説明する内容に限定されるものではなく、その要旨を変更しない範囲において任意に変更して実施することが可能である。また、実施例の説明に用いる図面は、いずれも本発明によるプリント配線基板及びその構成部材を模式的に示すものであって、理解を深めるべく部分的な強調、拡大、縮小、または省略などを行っており、プリント配線基板及びその構成部材の縮尺や形状等を正確に表すものとはなっていない場合がある。更に、実施例で用いる様々な数値は、一例を示す場合もあり、必要に応じて様々に変更することが可能である。
Hereinafter, with reference to the drawings, embodiments of the present invention will be described in detail based on examples. In addition, this invention is not limited to the content demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement. The drawings used to describe the embodiments schematically show the printed wiring board and its constituent members according to the present invention, and are partially emphasized, enlarged, reduced, omitted, etc., for better understanding. In some cases, it does not accurately represent the scale and shape of the printed wiring board and its constituent members. Furthermore, various numerical values used in the embodiments may be examples, and can be changed variously as necessary.
<実施例>
以下において、本発明の実施例に係るプリント配線基板1の全体構造について、図1及び図2を参照して説明する。ここで、図1は、本実施例に係るプリント配線基板1の平面図である。また、図2は、本実施例に係るプリント配線基板1の正面図である。 <Example>
Below, the whole structure of the printedwiring board 1 which concerns on the Example of this invention is demonstrated with reference to FIG.1 and FIG.2. Here, FIG. 1 is a plan view of the printed wiring board 1 according to the present embodiment. FIG. 2 is a front view of the printed wiring board 1 according to this embodiment.
以下において、本発明の実施例に係るプリント配線基板1の全体構造について、図1及び図2を参照して説明する。ここで、図1は、本実施例に係るプリント配線基板1の平面図である。また、図2は、本実施例に係るプリント配線基板1の正面図である。 <Example>
Below, the whole structure of the printed
図1及び図2に示すように、本実施例に係るプリント配線基板1は、平面形状が矩形ある平板状の基板である。また、プリント配線基板1においては、図1の平面図における短辺に対して平行となるように、開口部2がプリント配線基板1の中央部分に形成されている。図1及び図2から分かるように、開口部2は、図1の平面図における長辺の一方から他方に向かって延在し、プリント配線基板1の第1の面1a側に形成され、プリント配線基板1の第2の面1bには到達していない。
As shown in FIGS. 1 and 2, the printed wiring board 1 according to the present embodiment is a flat board having a rectangular planar shape. Further, in the printed wiring board 1, the opening 2 is formed in the central portion of the printed wiring board 1 so as to be parallel to the short side in the plan view of FIG. 1. As can be seen from FIGS. 1 and 2, the opening 2 extends from one of the long sides toward the other in the plan view of FIG. 1 and is formed on the first surface 1 a side of the printed wiring board 1. It does not reach the second surface 1b of the wiring board 1.
本実施例において、プリント配線基板1は、全体として比較的に硬い特性を備えているが、基板中央部に開口部2が形成されていることにより、開口部2を屈曲点(折り曲げの中心)とし、容易に折り曲げることができる。プリント配線基板1の使用状態については後述する。
In this embodiment, the printed wiring board 1 has relatively hard characteristics as a whole, but the opening 2 is formed at the center of the board, so that the opening 2 is bent (the center of bending). And can be bent easily. The usage state of the printed wiring board 1 will be described later.
なお、図1及び図2には図示されていないものの、本実施例に係るプリント配線基板1の第1の面1aには、複数の配線パターンや、抵抗、コンデンサ、半導体素子等の各種の電気・電子的な部品を実装するための端子等が形成されている。また、プリント配線基板1の平面形状は、矩形に限定されることなく、プリント配線基板1を内蔵することになる電気・電子機器の開口形状に応じて適宜変更することができる。
Although not shown in FIGS. 1 and 2, the first surface 1 a of the printed wiring board 1 according to the present embodiment has a plurality of wiring patterns, various types of electricity such as resistors, capacitors, and semiconductor elements. -Terminals for mounting electronic parts are formed. Moreover, the planar shape of the printed wiring board 1 is not limited to a rectangular shape, and can be appropriately changed according to the opening shape of the electric / electronic device in which the printed wiring board 1 is built.
次に、図3を参照しつつ、本実施例に係るプリント配線基板1の詳細な構造について説明する。ここで、図3は、図1の線III-IIIに沿った断面の部分拡大図である。
Next, the detailed structure of the printed wiring board 1 according to the present embodiment will be described with reference to FIG. Here, FIG. 3 is a partially enlarged view of a cross section taken along line III-III in FIG.
図4に示すように、本実施例に係るプリント配線基板1は、第1絶縁基材3及び第1絶縁基材3の第1の面(表面)3aに形成された銅箔4からなる第1銅箔付き絶縁体5と、銅箔6~11及び第2絶縁基材12~16が交互に積層された積層体17と、第1絶縁基材18及び第1絶縁基材18の第1の面18aに形成された銅箔19からなる第1銅箔付き絶縁体20と、が積層された構造を有している。より具体的には、第1銅箔付き絶縁体5と第2銅箔付き絶縁体20とによって積層体17が挟まれるように、各構成部材が積層されている。
As shown in FIG. 4, the printed wiring board 1 according to the present embodiment includes a first insulating base 3 and a copper foil 4 formed on the first surface (front surface) 3 a of the first insulating base 3. 1 insulator 5 with copper foil, laminate 17 in which copper foils 6 to 11 and second insulating substrates 12 to 16 are alternately laminated, and first insulating substrate 18 and first insulating substrate 18 And an insulator 20 with a first copper foil made of a copper foil 19 formed on the surface 18a. More specifically, the constituent members are laminated so that the laminate 17 is sandwiched between the insulator 5 with the first copper foil and the insulator 20 with the second copper foil.
本実施例において、第1銅箔付き絶縁体5は、銅箔4である電解銅はく上にエポキシ樹脂等の樹脂をコーティングしたものであり、その内部には、ガラスクロス等の基材は含まれていない。すなわち、第1絶縁基材3はエポキシ樹脂のみから構成され、第1銅箔付き絶縁体5は、一般的にRCC(Resin Coated Copper)とも称される。銅箔4は、第1絶縁基材3の第1の面3aの全面に形成されており、グランド層(接地電位層)として機能する。
In the present embodiment, the first copper foil insulator 5 is obtained by coating an electrolytic copper foil that is the copper foil 4 with a resin such as an epoxy resin. Not included. That is, the 1st insulating base material 3 is comprised only from an epoxy resin, and the insulator 5 with a 1st copper foil is also generally called RCC (Resin | Coated * Copper). The copper foil 4 is formed on the entire surface of the first surface 3a of the first insulating base 3 and functions as a ground layer (ground potential layer).
また、銅箔4の層厚は、約30~40μmであり、第1絶縁基材3の層厚は約40μm以上60μm以下である。特に、本実施例においては、第1絶縁基材3の層厚を約50μmとして、より良好なインピーダンス整合を図っている。
The layer thickness of the copper foil 4 is about 30 to 40 μm, and the layer thickness of the first insulating substrate 3 is about 40 μm to 60 μm. In particular, in the present embodiment, a better impedance matching is achieved by setting the layer thickness of the first insulating base material 3 to about 50 μm.
なお、第1絶縁基材3は、必ずしも樹脂のみから構成されている必要はなく、ガラスクロス等の基材を含まなければ、絶縁性及びその他の特性を向上させるような他の絶縁材料が樹脂内に分散保持されていてもよい。
The first insulating base material 3 does not necessarily need to be composed of only a resin. If the base material does not include a glass cloth or the like, other insulating materials that improve the insulation and other characteristics are resin. It may be dispersed and held within.
本実施例において、第2銅箔付き絶縁体20は、第1銅箔付き絶縁体5と同様の構成であり、上述したRCCである。すなわち、第2銅箔付き絶縁体20は、銅箔19である電解銅はく上に樹脂(例えば、エポキシ樹脂)をコーティングしたものであり、その内部には、ガラスクロス等の基材は含まれていない。第2銅箔付き絶縁体20と、第1銅箔付き絶縁体5との相違点としては、第2銅箔付き絶縁体20を構成する銅箔19には所望の配線パターンが形成されており、特に開口部2及びその周囲には銅箔19が形成されていない。
In this embodiment, the second copper foil insulator 20 has the same configuration as the first copper foil insulator 5 and is the RCC described above. That is, the insulator 20 with the second copper foil is obtained by coating the copper foil 19 as an electrolytic copper foil with a resin (for example, epoxy resin), and the inside thereof includes a substrate such as a glass cloth. Not. As a difference between the insulator 20 with the second copper foil and the insulator 5 with the first copper foil, a desired wiring pattern is formed on the copper foil 19 constituting the insulator 20 with the second copper foil. In particular, the copper foil 19 is not formed in the opening 2 and its periphery.
なお、プリント配線基板1としては、第2銅箔付き絶縁体20を必ず備えている必要性はなく、プリント配線基板1の用途、及び要求される寸法等に応じて第2銅箔付き絶縁体20を積層しなくてもよい。すなわち、プリント配線基板1は、第1銅箔付き絶縁体5上に積層体17のみを積層した構造であってもよい。
The printed wiring board 1 is not necessarily provided with the insulator 20 with the second copper foil. The insulator with the second copper foil is used depending on the use of the printed wiring board 1 and required dimensions. 20 may not be laminated. That is, the printed wiring board 1 may have a structure in which only the stacked body 17 is stacked on the first insulator 5 with copper foil.
積層体17は、第1絶縁基材3の第2の面3b上に、銅箔6、第2絶縁基材12、銅箔7、第2絶縁基材13、銅箔8、第2絶縁基材14、銅箔9、第2絶縁基材15、銅箔10、第2絶縁基材16、及び銅箔11の順序で各構成部材が積層された構造を有している。第2絶縁基材12~16は、第1絶縁基材3、18とは異なり、ガラスクロス21に樹脂22(例えば、エポキシ樹脂)を被覆させた、いわゆる1枚のプリプレグである。また、銅箔6は、第1絶縁基材3の第2の面3bの全面に形成されており、プリント配線基板1の外部から供給される電気信号用の配線(すなわち、信号層)として機能する。銅箔7~11は、プリント配線基板1の内部配線と機能し、所望のパターニングが施されており、導通ビア(図示せず)によってグランド層である銅箔4、又は信号層である銅箔6に電気的に接続されている。ここで、開口部2を形成する観点から、開口部2の形成領域及びその周囲には銅箔7~11は形成されておらず、所望の開口(配線パターン)が形成されている。そして、銅箔7~11に形成された当該開口のそれぞれには、隣接する第2絶縁基材12~16を構成する樹脂22が、各層を固着するための真空プレスによる加熱加圧の際に流れ込み且つ硬化し、当該開口のそれぞれを充填している。
The laminated body 17 includes a copper foil 6, a second insulating base 12, a copper foil 7, a second insulating base 13, a copper foil 8, and a second insulating base on the second surface 3b of the first insulating base 3. Each component is laminated in the order of the material 14, the copper foil 9, the second insulating base material 15, the copper foil 10, the second insulating base material 16, and the copper foil 11. Unlike the first insulating base materials 3 and 18, the second insulating base materials 12 to 16 are so-called one prepreg in which a glass cloth 21 is coated with a resin 22 (for example, epoxy resin). Further, the copper foil 6 is formed on the entire surface of the second surface 3b of the first insulating base 3, and functions as a wiring for an electrical signal (that is, a signal layer) supplied from the outside of the printed wiring board 1. To do. The copper foils 7 to 11 function as internal wiring of the printed wiring board 1 and are subjected to desired patterning. The copper foil 4 as a ground layer or the copper foil as a signal layer is formed by a conductive via (not shown). 6 is electrically connected. Here, from the viewpoint of forming the opening 2, the copper foils 7 to 11 are not formed in the formation region of the opening 2 and the periphery thereof, and a desired opening (wiring pattern) is formed. In each of the openings formed in the copper foils 7 to 11, the resin 22 constituting the adjacent second insulating base materials 12 to 16 is subjected to heating and pressurization by a vacuum press for fixing each layer. It flows and hardens, filling each of the openings.
なお、積層体17における第2絶縁基材及び銅箔の積層数は、図4に示されたものに限定されることなく、プリント配線基板1の用途、及び要求される寸法等に応じて適宜変更することができる。また、銅箔6を信号層ではなくグランド層として機能させてもよい。このよう場合には、第1銅箔付き絶縁体5を構成する銅箔4を信号層と機能させることになる。
Note that the number of laminated second insulating base materials and copper foils in the laminate 17 is not limited to that shown in FIG. 4, and is appropriately determined according to the use of the printed wiring board 1 and the required dimensions. Can be changed. Further, the copper foil 6 may function as a ground layer instead of a signal layer. In such a case, the copper foil 4 constituting the first insulator 5 with copper foil functions as a signal layer.
本実施例においては、第2絶縁基材12の層厚は約150μmであり、第2絶縁基材13~16の層厚は約70~200μmである。また、銅箔6~11の層厚は約18~35μmである。また、銅箔6において、第1絶縁基材3に接触する第1の面6aには約1μmのアンカーが形成され、第2絶縁基材12に接触する第2の面6bには約5μmのアンカー形成されている。すなわち、銅箔6において、第1絶縁基材3に接触する第1の面6aの粗さは、第2絶縁基材12に接触する第2の面6bの粗さよりも小さくなっている。
In this embodiment, the layer thickness of the second insulating substrate 12 is about 150 μm, and the layer thickness of the second insulating substrates 13 to 16 is about 70 to 200 μm. The layer thickness of the copper foils 6 to 11 is about 18 to 35 μm. Further, in the copper foil 6, an anchor of about 1 μm is formed on the first surface 6 a that contacts the first insulating substrate 3, and about 5 μm is formed on the second surface 6 b that contacts the second insulating substrate 12. An anchor is formed. That is, in the copper foil 6, the roughness of the first surface 6 a that contacts the first insulating substrate 3 is smaller than the roughness of the second surface 6 b that contacts the second insulating substrate 12.
図4に示すように、プリント配線基板1の中央部に形成されている開口部2は、第2銅箔付き絶縁体20を貫通し、積層体17の第2絶縁基材13まで到達している。より詳細には、開口部2は、第1絶縁基材18、第2絶縁基材14~16の各樹脂22、及び第2絶縁基材13~16の各ガラスクロス21、及び第2絶縁基材13の一部の樹脂を除去することで形成されており、第2絶縁基材13のガラスクロス21よりも銅箔7及び第2絶縁基材12側に位置する樹脂22にまで到達している。すなわち、開口部2の底面2aから銅箔6までの間の領域には、第2絶縁基材12、13を構成する樹脂22、及び第2絶縁基材12のガラスクロス21のみが存在していることになる。換言すれば、開口部2の底面2aから銅箔6までの間の領域には、樹脂22と1枚のガラスクロス21からなる1枚のプリプレグのみが存在していると想定することができる。
As shown in FIG. 4, the opening 2 formed in the central portion of the printed wiring board 1 passes through the insulator 20 with the second copper foil and reaches the second insulating substrate 13 of the laminate 17. Yes. More specifically, the opening 2 includes the first insulating base 18, the resins 22 of the second insulating bases 14 to 16, the glass cloths 21 of the second insulating bases 13 to 16, and the second insulating base. It is formed by removing a part of the resin of the material 13 and reaches the resin 22 located on the copper foil 7 and the second insulating base 12 side rather than the glass cloth 21 of the second insulating base 13. Yes. That is, only the resin 22 constituting the second insulating base materials 12 and 13 and the glass cloth 21 of the second insulating base material 12 exist in the region between the bottom surface 2 a of the opening 2 and the copper foil 6. Will be. In other words, it can be assumed that only one prepreg composed of the resin 22 and one glass cloth 21 exists in the region between the bottom surface 2 a of the opening 2 and the copper foil 6.
本実施例においては、開口部2の底面2aから銅箔6までの距離は170μm以上230μm以下である。ここで、プリント配線基板1の薄型化及び小型化を効率よく図るためには、プリント配線基板1を構成する構成部材をできる限り薄くすることが好ましいため、開口部2の底面2aから銅箔6までの距離は、約200μmにすることが特に好ましい。開口部2の底面2aから銅箔6までの距離を約200μmとする理由は、米国における電気製品の安全性を保証する規格であるUL規格において、プリント配線基板1の最小積層厚み(第1絶縁基材等のエポキシ樹脂のみの樹脂層及び銅箔を除く)が200μmと規定されているからである。
In this embodiment, the distance from the bottom surface 2a of the opening 2 to the copper foil 6 is 170 μm or more and 230 μm or less. Here, in order to efficiently reduce the thickness and size of the printed wiring board 1, it is preferable to make the constituent members constituting the printed wiring board 1 as thin as possible. Therefore, the copper foil 6 is formed from the bottom surface 2 a of the opening 2. The distance is preferably about 200 μm. The reason why the distance from the bottom surface 2a of the opening 2 to the copper foil 6 is about 200 μm is that the minimum laminated thickness (first insulation) of the printed wiring board 1 in the UL standard that guarantees the safety of electrical products in the United States. This is because the resin layer of only the epoxy resin such as the base material and the copper foil is defined as 200 μm.
本実施例においては、プリプレグである第2絶縁基材12の層厚は約150μmであり、開口部2が形成されていない部分(すなわち、開口部2の直下領域)の第2絶縁基材13の層厚は約32μmであり、銅箔7の開口部分を充填する樹脂22の層厚は、銅箔7の層厚である約18μmである。
In this embodiment, the layer thickness of the second insulating base material 12 that is a prepreg is about 150 μm, and the second insulating base material 13 in a portion where the opening 2 is not formed (that is, a region immediately below the opening 2). The layer thickness of the resin 22 filling the opening of the copper foil 7 is about 18 μm, which is the layer thickness of the copper foil 7.
本実施例に係るプリント配線基板1の製造方法としては、先ず、プリプレグである第2絶縁基材12~16、及び所望のパターニングが施された銅箔7~10を順次積層し、積層した状態の部材を真空プレスによって加熱加圧することで、各部材を固着させる。その後、銅箔6を第2絶縁基材12の表面上に貼り付けるとともに、パターニングされた銅箔11を第2絶縁基材16の表面上に貼り付ける。これにより、積層体17の形成が完了する。なお、当該積層体17の形成時において、銅箔6~11用の導通ビアの形成及びパターニングが適宜施されることになる。
As a manufacturing method of the printed wiring board 1 according to the present embodiment, first, the second insulating base materials 12 to 16 which are prepregs and the copper foils 7 to 10 which have been subjected to desired patterning are sequentially laminated and laminated. These members are fixed by heating and pressurizing these members with a vacuum press. Thereafter, the copper foil 6 is affixed on the surface of the second insulating substrate 12, and the patterned copper foil 11 is affixed on the surface of the second insulating substrate 16. Thereby, formation of the laminated body 17 is completed. When forming the laminate 17, formation and patterning of conductive vias for the copper foils 6 to 11 are appropriately performed.
次に、第1銅箔付き絶縁体5及び第2銅箔付き絶縁体20によって、積層体17を挟み込み、真空プレスによって加熱加圧することで、第1銅箔付き絶縁体5の第1絶縁基材3と銅箔6とを固着させ、第2銅箔付き絶縁体20の第1絶縁基材18と銅箔11とを固着させ、プリント配線基板1の積層構造を完成させる。
Next, the laminated body 17 is sandwiched between the insulator 5 with the first copper foil and the insulator 20 with the second copper foil, and is heated and pressurized by a vacuum press, whereby the first insulating base of the insulator 5 with the first copper foil. The material 3 and the copper foil 6 are fixed, the first insulating substrate 18 of the insulator 20 with the second copper foil and the copper foil 11 are fixed, and the laminated structure of the printed wiring board 1 is completed.
続いて、エンドミル等の切削工具を用いて、第2銅箔付き絶縁体20の銅箔19の形成面側から座グリ加工を施し、開口部2を形成する。この際、座グリ加工を施す箇所は、図1及び図4に示すように、プリント配線基板1の中央部分であって銅箔19が形成されていない部分(第1絶縁基材18の露出部分)となる。そして、当該座グリ加工は、第2絶縁基材13のガラスクロス21を貫通し、第2絶縁基材13の樹脂22の一部を除去して完了する。具体的には、開口部2の底面2aから銅箔6の表面までの距離が約200μmとなるように、座グリ量を調整することになる。
Subsequently, using a cutting tool such as an end mill, spot facing is performed from the surface on which the copper foil 19 of the insulator 20 with the second copper foil is formed, and the opening 2 is formed. At this time, as shown in FIG. 1 and FIG. 4, the place where the spot facing is performed is a central portion of the printed wiring board 1 where the copper foil 19 is not formed (exposed portion of the first insulating base material 18). ) And the said spot facing process penetrates the glass cloth 21 of the 2nd insulating base material 13, removes a part of resin 22 of the 2nd insulating base material 13, and is completed. Specifically, the amount of spot facing is adjusted so that the distance from the bottom surface 2a of the opening 2 to the surface of the copper foil 6 is about 200 μm.
上述した工程を経て、折り曲げることができるプリント配線基板1が完成することになる。
Through the above-described steps, the printed wiring board 1 that can be bent is completed.
<実施例の効果>
本実施例に係るプリント配線基板1を電気・電子機器に収納するために、図4に示すように開口部2を屈曲の中心として折り曲げると、グランド層である銅箔4には引っ張りの応力がかかり、信号層である銅箔6には圧縮の応力がかかり、銅箔4と銅箔6とに挟まれた第1絶縁基材3には応力歪みが集中しやすくなる。また、プリント配線基板1を折り曲げると、1枚のガラスクロス21に対して開口部2側に位置する樹脂には圧縮の応力がかかり、開口部2側とは反対側に位置する樹脂には引っ張りの応力がかかり、当該1枚のガラスクロス21には応力歪みが集中しやすくなる。しかしながら、本実施例に係るプリント配線基板1では、以下の理由により、当該応力歪みによる基板の破損及び銅箔4、6の剥がれ等にともなう信頼性の低下が抑制されている。 <Effect of Example>
When the printedwiring board 1 according to the present embodiment is housed in an electric / electronic device, when the opening 2 is bent as shown in FIG. 4, the copper foil 4 serving as the ground layer has a tensile stress. As a result, compressive stress is applied to the copper foil 6 that is the signal layer, and stress strain tends to concentrate on the first insulating base material 3 sandwiched between the copper foil 4 and the copper foil 6. In addition, when the printed wiring board 1 is bent, the resin located on the opening 2 side with respect to one glass cloth 21 is subjected to compressive stress, and the resin located on the side opposite to the opening 2 is pulled. Therefore, stress strain tends to concentrate on the single glass cloth 21. However, in the printed wiring board 1 according to the present embodiment, a decrease in reliability due to the breakage of the board and the peeling of the copper foils 4 and 6 due to the stress strain is suppressed for the following reason.
本実施例に係るプリント配線基板1を電気・電子機器に収納するために、図4に示すように開口部2を屈曲の中心として折り曲げると、グランド層である銅箔4には引っ張りの応力がかかり、信号層である銅箔6には圧縮の応力がかかり、銅箔4と銅箔6とに挟まれた第1絶縁基材3には応力歪みが集中しやすくなる。また、プリント配線基板1を折り曲げると、1枚のガラスクロス21に対して開口部2側に位置する樹脂には圧縮の応力がかかり、開口部2側とは反対側に位置する樹脂には引っ張りの応力がかかり、当該1枚のガラスクロス21には応力歪みが集中しやすくなる。しかしながら、本実施例に係るプリント配線基板1では、以下の理由により、当該応力歪みによる基板の破損及び銅箔4、6の剥がれ等にともなう信頼性の低下が抑制されている。 <Effect of Example>
When the printed
具体的には、本実施例に係るプリント配線基板1において、プリント配線基板1の第2の面1b側には、ガラスクロス21を含まない第1絶縁基材3の表裏面(第1の面3a及び第2の面3b)にグランド層である銅箔4及び信号層である銅箔6が形成されている。従って、プリント配線基板1においては、銅箔4、6の間には弾性率の異なる2種類の材料である銅箔及び樹脂のみが存在するだけであり、銅箔4、6の間にガラスクロス21を含むプリプレグを用いる場合と比較して、銅箔4、6の間における各種材料の弾性率の相違に起因する応力歪みを軽減することができる。
Specifically, in the printed wiring board 1 according to the present embodiment, on the second surface 1 b side of the printed wiring board 1, the front and back surfaces (first surface) of the first insulating base material 3 that does not include the glass cloth 21. A copper foil 4 as a ground layer and a copper foil 6 as a signal layer are formed on 3a and the second surface 3b). Therefore, in the printed wiring board 1, only the copper foil and the resin, which are two kinds of materials having different elastic moduli, exist between the copper foils 4 and 6, and the glass cloth is interposed between the copper foils 4 and 6. Compared with the case where the prepreg containing 21 is used, the stress distortion resulting from the difference in the elastic modulus of the various materials between the copper foils 4 and 6 can be reduced.
また、本実施例に係るプリント配線基板1においては、図4において屈曲している部分に存在する樹脂層としては、第1絶縁基材3からなる樹脂層と、第2絶縁基材12及び第2絶縁基材13の一部からなる樹脂層とが存在している。すなわち、図4において屈曲している部分には、1枚のガラスクロス21を含む樹脂層(すなわち、1枚のプリプレグ)、ガラスクロスを含まない樹脂層、及び銅箔4、6のみが存在しているため、屈曲している部分に2枚以上のガラスクロス21が存在する構造(すなわち、2枚以上のプリプレグを存在する構造)と比較して、プリント配線基板1の屈曲部分における応力歪みを軽減することができる。
Further, in the printed wiring board 1 according to the present embodiment, as the resin layer existing in the bent portion in FIG. 4, the resin layer made of the first insulating base material 3, the second insulating base material 12, 2 There is a resin layer made of a part of the insulating base material 13. That is, only the resin layer containing one glass cloth 21 (that is, one prepreg), the resin layer not containing glass cloth, and the copper foils 4 and 6 exist in the bent portion in FIG. Therefore, compared with a structure in which two or more glass cloths 21 exist in the bent part (that is, a structure in which two or more prepregs exist), the stress strain in the bent part of the printed wiring board 1 is reduced. Can be reduced.
ここで、本実施例に係るプリント配線基板1においては、ガラスクロス21を含まない樹脂のみからなる第1絶縁基材3上に銅箔6を介して第2絶縁基材13を積層しているため、プリント配線基板1の折り曲げた状態の外層(すなわち、第2の面1b側)にグランド層及び信号層を形成しつつ、プリント配線基板1の屈曲部分に1枚のプリプレグのみを存在する構造を実現できている。
Here, in the printed wiring board 1 according to the present embodiment, the second insulating base material 13 is laminated via the copper foil 6 on the first insulating base material 3 made of only the resin not including the glass cloth 21. Therefore, a structure in which only one prepreg exists in the bent portion of the printed wiring board 1 while the ground layer and the signal layer are formed on the outer layer (that is, the second surface 1b side) of the printed wiring board 1 in a bent state. Has been realized.
更に、本実施例に係るプリント配線基板1の銅箔6において、第1絶縁基材3に接触する第1の面6aの粗さは、第2絶縁基材12に接触する第2の面6bの粗さよりも小さくなっている。このような構造から、ガラスクロス21を含まない第1絶縁基材3と銅箔6との密着性が弱く、銅箔6が第1絶縁基材3から剥がれる可能性があるが、第1絶縁基材3にはガラスクロス21が含まれないため、第1絶縁基材3における各種材料の弾性率の相違に起因する応力歪みを軽減して、銅箔6の剥離を軽減することができる。
Further, in the copper foil 6 of the printed wiring board 1 according to the present embodiment, the roughness of the first surface 6 a that contacts the first insulating base 3 is the second surface 6 b that contacts the second insulating base 12. It is smaller than the roughness. From such a structure, the adhesion between the first insulating base 3 and the copper foil 6 not including the glass cloth 21 is weak, and the copper foil 6 may be peeled off from the first insulating base 3. Since the base material 3 does not include the glass cloth 21, the stress strain caused by the difference in elastic modulus of various materials in the first insulating base material 3 can be reduced, and the peeling of the copper foil 6 can be reduced.
以上のように、本実施例に係るプリント配線基板1は、上述した構造を有することにより、複数の配線層を備えるとともに、曲げ特性の向上を容易に図ることができる。
As described above, the printed wiring board 1 according to the present embodiment has the above-described structure, and thus includes a plurality of wiring layers and can easily improve the bending characteristics.
1 プリント配線基板
1a 第1の面
1b 第2の面
2 開口部
2a 底面
3 第1絶縁基材
3a 第1の面
3b 第2の面
4 銅箔
5 第1銅箔付き絶縁体
6、7、8、9、10、11 銅箔
6a 第1の面
6b 第2の面
12、13、14、15、16 第2絶縁基材
17 積層体
18 第1絶縁基材
18a 第1の面
19 銅箔
20 第2銅箔付き絶縁体
21 ガラスクロス
22 樹脂 DESCRIPTION OFSYMBOLS 1 Printed wiring board 1a 1st surface 1b 2nd surface 2 Opening part 2a Bottom surface 3 1st insulating base material 3a 1st surface 3b 2nd surface 4 Copper foil 5 Insulator 6, 7 with 1st copper foil, 8, 9, 10, 11 Copper foil 6a First surface 6b Second surface 12, 13, 14, 15, 16 Second insulating substrate 17 Laminated body 18 First insulating substrate 18a First surface 19 Copper foil 20 Insulator with 2nd copper foil 21 Glass cloth 22 Resin
1a 第1の面
1b 第2の面
2 開口部
2a 底面
3 第1絶縁基材
3a 第1の面
3b 第2の面
4 銅箔
5 第1銅箔付き絶縁体
6、7、8、9、10、11 銅箔
6a 第1の面
6b 第2の面
12、13、14、15、16 第2絶縁基材
17 積層体
18 第1絶縁基材
18a 第1の面
19 銅箔
20 第2銅箔付き絶縁体
21 ガラスクロス
22 樹脂 DESCRIPTION OF
Claims (3)
- 樹脂のみからなる第1絶縁基材、及び前記第1絶縁基材の表面に形成された銅箔からなる銅箔付き絶縁体と、
複数の銅箔、並びにガラスクロス及び前記ガラスクロスの被覆する樹脂からなる複数の第2絶縁基材が前記第1絶縁基材上に交互に積層され、前記銅箔付き絶縁体との接触面とは反対側の表面から内部に向かって開口部が形成された積層体と、を有し、
前記開口部の底面から前記銅箔付き絶縁樹脂体上の前記銅箔の間の領域には、1枚の前記ガラスクロス及び前記複数の第2絶縁基材を構成する樹脂のみが存在し、
前記開口部の底面から前記銅箔付き絶縁樹脂体上の前記銅箔の表面までの距離は、170μm以上230μm以下であることを特徴とするプリント配線基板。 A first insulating base material made of resin alone, and an insulator with a copper foil made of a copper foil formed on the surface of the first insulating base material;
A plurality of copper foils, and a plurality of second insulating base materials made of glass cloth and a resin covered by the glass cloth are alternately laminated on the first insulating base material, and a contact surface with the insulator with copper foil, Has a laminate in which openings are formed from the opposite surface toward the inside, and
In the region between the bottom surface of the opening and the copper foil on the insulating resin body with the copper foil, there is only one resin that constitutes the glass cloth and the plurality of second insulating substrates,
A printed wiring board having a distance from a bottom surface of the opening to a surface of the copper foil on the insulating resin body with the copper foil is 170 μm or more and 230 μm or less. - 前記開口部の底面から前記銅箔付き絶縁樹脂体上の前記銅箔の表面までの距離は、200μmであることを特徴とする請求項1に記載のプリント配線基板。 The printed wiring board according to claim 1, wherein a distance from a bottom surface of the opening to a surface of the copper foil on the insulating resin body with the copper foil is 200 µm.
- 前記第1絶縁基材の厚みは、40μm以上60μm以下であることを特徴とする請求項1又は2に記載のプリント配線基板。
The printed wiring board according to claim 1, wherein the first insulating base has a thickness of 40 μm or more and 60 μm or less.
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CN104602444A (en) * | 2015-01-29 | 2015-05-06 | 高德(苏州)电子有限公司 | Automotive multilayer-structured circuit board and production method thereof |
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