CN108811353A - A kind of engraving method of two sides different Cu thickness PCB - Google Patents
A kind of engraving method of two sides different Cu thickness PCB Download PDFInfo
- Publication number
- CN108811353A CN108811353A CN201810928466.6A CN201810928466A CN108811353A CN 108811353 A CN108811353 A CN 108811353A CN 201810928466 A CN201810928466 A CN 201810928466A CN 108811353 A CN108811353 A CN 108811353A
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- Prior art keywords
- thickness
- copper
- etched
- etching
- engraving method
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention relates to circuit board making technical field, specially a kind of engraving method of two sides different Cu thickness PCB.The present invention makes line pattern on the first surface and second surface of production plate by elder generation and carries out graphic plating; first surface is protected with Protection glue and second surface is etched after moving back film; then second surface is protected with Protection glue and first surface is etched again; two surfaces of production plate are separately etched; can according to the copper layer thickness on each surface be arranged etching parameter, to can avoid two sides simultaneously etch will appear copper layer thickness it is relatively thin occur the problem of over etching on one side.The method of the present invention can be used for the etching process up to the PCB of 2OZ to two copper layer thickness differences.
Description
Technical field
The present invention relates to circuit board making technical field more particularly to a kind of engraving methods of two sides different Cu thickness PCB.
Background technology
In order to realize different functional requirements, part PCB needs the copper thickness on its two sides being designed to different-thickness, to Mr. Yu
A little special requirements, or even the thickness difference of the two sides PCB copper thickness is required to be more than 1.5OZ (1OZ=0.035mm).It is different to make two sides
One of the technological difficulties of PCB of copper thickness are circuit etching, existing when making outer-layer circuit on the PCB of two sides different Cu thickness
Circuit etching mode is：Using the thicker one side of copper thickness as standard setting etching parameter, two sides is carried out at the same time etching.This circuit erosion
Quarter, mode was there are apparent defect and deficiency, this kind of etching mode requires the thick difference of the copper on two sides to be not more than 1OZ, also has to line-spacing tight
If a face copper thickness of PCB is 0.5OZ, another side 1Oz etching parameter is arranged according to 1OZ copper thickness, line-spacing must not in lattice requirement
Less than 0.13mm；For another example the copper thickness of PCB one sides is 1OZ, and the copper thickness of another side is 2OZ, and etching parameter is arranged according to 2OZ copper thickness,
Line-spacing must not drop below 0.19mm；Otherwise can cause copper it is thick it is relatively thin occur overetched problem on one side, and then PCB is caused to report
It is useless.
Invention content
The present invention requires the copper thickness difference on two sides that cannot be more than 1OZ for the engraving method of existing two sides different Cu thickness PCB, and
Line-spacing is required strictly, what otherwise copper thickness was relatively thin will appear overetched problem on one side, and it is thick poor to provide a kind of copper on the two sides PCB
Also engraving method applicatory when more than 1OZ.
To achieve the above object, the present invention uses following technical scheme.
A kind of engraving method of two sides different Cu thickness PCB, includes the following steps：
S1, pass sequentially through pad pasting, it is exposed and developed production plate first surface and second surface on be respectively formed circuit
Figure makes the copper face in the region to be produced for forming circuit expose；Then carry out graphic plating make on exposed copper face according to
Secondary formation copper coating and tin coating；Then the film decorporated on first surface and second surface；
Its thickness of the layers of copper of the first surface is more than the layers of copper of second surface.
S2, Protection glue is covered on the first surface of production plate, first surface is completely covered in the Protection glue；
S3, etching parameter is arranged with the copper thickness of second surface, second surface is etched, then to second surface
It carries out moving back tin processing, makes to form circuit in second surface；
S4, the Protection glue produced on plate first surface is removed, then covers Protection glue on the second surface of production plate, institute
It states Protection glue and second surface is completely covered；
S5, etching parameter is arranged with the copper thickness of first surface, first surface is etched, then to first surface
It carries out moving back tin processing, circuit is formed in first surface.
Preferably, the Protection glue is peelable blue gel.
The copper layer thickness of the first surface is more than or equal to 108.6 μm, and the copper layer thickness of the second surface is more than or equal to
35 μm, the difference of the thickness of the thickness of the layers of copper of first surface and the layers of copper of second surface is more than or equal to 70 μm.
Preferably, in step S3, it is to the etching parameter that second surface is etched：Etch temperature is 50 ± 2 DEG C,
The transmission speed for producing plate is 3.0 ± 1.0m/min, and it is 2.0 ± 0.5 that power is sprayed in etching solution, and it is 1.9 that power is sprayed under etching solution
±0.5。
Preferably, in step S5, it is to the etching parameter that first surface is etched：Etch temperature is 50 ± 2 DEG C,
The transmission speed for producing plate is 1.5 ± 1.0m/min, and it is 2.0 ± 0.5 that power is sprayed in etching solution, and it is 1.9 that power is sprayed under etching solution
±0.5。
Compared with prior art, the beneficial effects of the invention are as follows：The present invention by elder generation production plate first surface and the
Line pattern is made on two surfaces and carries out graphic plating, and first surface is protected with Protection glue after moving back film and second surface is carried out
Then etching process is protected second surface with Protection glue again and is etched to first surface, two surfaces point of plate are produced
It opens and is etched, can etching parameter be set according to the copper layer thickness on each surface, etch and can go out simultaneously to can avoid two sides
There is the problem of over etching on one side in what now copper layer thickness was relatively thin.The method of the present invention can be used for two copper layer thickness differences up to 2OZ's
The etching process of PCB.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme of the present invention
It is described further and illustrates.
Embodiment
The present embodiment provides the erosions of the preparation method of two sides different Cu thickness PCB a kind of more particularly to two sides different Cu thickness PCB
Carving method, two outer surfaces, that is, first surface of the PCB described in the present embodiment is different with the thickness of the layers of copper of second surface, and first
Its thickness >=108.6 μm of the layers of copper on surface, its thickness >=35 μm of the layers of copper of second surface, the difference of the copper layer thickness on two surfaces reach
2OZ, line width/line-spacing on first surface and second surface is 4/4mil.It is as follows：
(1), sawing sheet：Buried capacitor core plate, core thickness 0.8mm, outer copper foil thickness are outputed by jigsaw size 520mm × 620mm
Degree is 0.5OZ.
(2), internal layer circuit is made：Internal layer circuit is made on core plate using negative film technique, obtains internal layer circuit plate.
(3), it presses：Internal layer circuit plate, prepreg and outer copper foil are superimposed together in advance, then selected according to plate Tg
With pressing condition, the lamination of each plate is integrated, forms production plate.
(4), outer layer drills：It is drilled on production plate using the mode of machine drilling according to borehole data.
(5), heavy copper：One layer of thin copper is deposited by way of chemical reaction on hole wall, is provided for subsequent electric plating of whole board
Basis, backlight test 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(6), electric plating of whole board：According to the mechanism of electrochemical reaction, last layer copper is electroplated on the basis of heavy copper, ensures hole copper
Thickness reaches product requirement, and electroplating parameter is set according to hole copper thickness is completed.
(7), it makes outer-layer circuit (positive blade technolgy) and includes the following steps S1-S6：
S1, pass sequentially through pad pasting, it is exposed and developed production plate first surface and second surface on be respectively formed circuit
Figure makes the copper face in the region to be produced for forming circuit expose；Then carry out graphic plating make on exposed copper face according to
Secondary formation copper coating and tin coating；Then the film decorporated on first surface and second surface.
S2, silk-screen peelable blue gel and make its solidification on the first surface of production plate, the first table is completely covered in peelable blue gel
Face.
S3, etching parameter is arranged with the copper thickness of second surface, second surface is etched, then to second surface
It carries out moving back tin processing, makes to form circuit in second surface.
Etching parameter is：Etch temperature is 50 ± 2 DEG C, produces the transmission speed of plate for 3.0 ± 1.0m/min, in etching solution
It is 2.0 ± 0.5 to spray power, and it is 1.9 ± 0.5 that power is sprayed under etching solution.
In other embodiments, specific etching parameter is determined by the surface copper thickness of required etching, with the prior art
Used parameter is identical when copper thick identical wiring board in two sides is etched, and is not required to special consideration should be given to the production plate be that two sides copper is thick
Different plates.Such as, etch temperature is 50 ± 2 DEG C, and it is 2.0 ± 0.5 that power is sprayed in etching solution, spray under etching solution power be 1.9 ±
0.5, when being following thickness for the surface copper layer thickness, the transmission speed for producing plate is as shown in the table.
| Copper layer thickness | Produce the transmission speed of plate |
| H OZ | 6.0±1.5m/min |
| 1.5OZ | 1.5±1.0m/min |
| 2OZ | 1.0±0.5m/min |
| 2.5OZ | 0.8±0.5m/min |
| 4OZ | 1.1±0.5m/min |
| 5OZ | 0.8±0.5m/min |
| 6OZ | 0.5±0.5m/min |
S4, the peelable blue gel produced on plate first surface is removed, then the peelable indigo plant of silk-screen on the second surface of production plate
Glue simultaneously makes its solidification, peelable blue gel that second surface be completely covered.
S5, etching parameter is arranged with the copper thickness of first surface, first surface is etched, then to first surface
It carries out moving back tin processing, circuit is formed in first surface.
Etching parameter is：Etch temperature is 50 ± 2 DEG C, produces the transmission speed of plate for 1.5 ± 1.0m/min, in etching solution
It is 2.0 ± 0.5 to spray power, and it is 1.9 ± 0.5 that power is sprayed under etching solution.
S6, outer layer AOI, using automatic optical detecting system, by the comparison with CAM data, whether detection outer-layer circuit
There is the defects of open circuit, notch, not clean, short-circuit etching.
100 blocks of production plates that method is etched through this embodiment are without overetched problem.
(8), welding resistance, silk-screen character：By making green oil layer and silk-screen character in production plate outer layer, green oil thickness is：10-
50 μm, so as to so that production plate can reduce influence of the environmental change to it during subsequent use.
(9), surface treatment (heavy nickel gold)：Principle is learned in pad copper face Tonghua of welding resistance windowing position, and uniform deposition centainly requires
The nickel layer and layer gold of thickness, nickel layer thickness are：3-5μm；Layer gold thickness is：0.05-0.1μm.
(10), it is molded：According to the prior art and design requirement gong shape is pressed, the +/- 0.05mm of external form tolerance is made in multilayer
Bury inductance PCB printed boards.
(11), electrical testing：The electrically conducting performance of production board is tested, this plate is using test method：Flying probe.
(12),FQC：Whether check appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of production board etc.
Meet the requirement of client.
(13), it packs：According to the manner of packing and packaging quantity of customer requirement, packaging is sealed to production board, and
It is allowed to dry drying prescription and humidity card, then shipment.
It is described above only with embodiment come the technology contents that further illustrate the present invention, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (5)
1. a kind of engraving method of two sides different Cu thickness PCB, which is characterized in that include the following steps：
S1, pass sequentially through pad pasting, it is exposed and developed production plate first surface and second surface on be respectively formed line pattern,
The copper face in the region to be produced for forming circuit is set to expose；Then carrying out graphic plating makes to sequentially form on exposed copper face
Copper coating and tin coating；Then the film decorporated on first surface and second surface；
Its thickness of the layers of copper of the first surface is more than the layers of copper of second surface；
S2, Protection glue is covered on the first surface of production plate, first surface is completely covered in the Protection glue；
S3, etching parameter is arranged with the copper thickness of second surface, second surface is etched, then second surface is carried out
Tin processing is moved back, makes to form circuit in second surface；
S4, the Protection glue produced on plate first surface is removed, then covers Protection glue, the guarantor on the second surface of production plate
Second surface is completely covered in shield glue；
S5, etching parameter is arranged with the copper thickness of first surface, first surface is etched, then first surface is carried out
Tin processing is moved back, circuit is formed in first surface.
2. the engraving method of two sides different Cu thickness PCB according to claim 1, which is characterized in that the Protection glue is can
The blue glue of stripping.
3. the engraving method of two sides different Cu thickness PCB according to claim 1, which is characterized in that the first surface
Copper layer thickness is more than or equal to 108.6 μm, and the copper layer thickness of the second surface is more than or equal to 35 μm, the thickness of the layers of copper of first surface
The difference of the thickness of the layers of copper of degree and second surface is more than or equal to 70 μm.
4. the engraving method of two sides different Cu thickness PCB according to claim 3, which is characterized in that in step S3, to second
The etching parameter that surface is etched is：Etch temperature is 50 ± 2 DEG C, and the transmission speed for producing plate is 3.0 ± 1.0m/
Min, it is 2.0 ± 0.5 that power is sprayed in etching solution, and it is 1.9 ± 0.5 that power is sprayed under etching solution.
5. the engraving method of two sides different Cu thickness PCB according to claim 3, which is characterized in that in step S5, to first
The etching parameter that surface is etched is：Etch temperature is 50 ± 2 DEG C, and the transmission speed for producing plate is 1.5 ± 1.0m/
Min, it is 2.0 ± 0.5 that power is sprayed in etching solution, and it is 1.9 ± 0.5 that power is sprayed under etching solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810928466.6A CN108811353A (en) | 2018-08-15 | 2018-08-15 | A kind of engraving method of two sides different Cu thickness PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810928466.6A CN108811353A (en) | 2018-08-15 | 2018-08-15 | A kind of engraving method of two sides different Cu thickness PCB |
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| Publication Number | Publication Date |
|---|---|
| CN108811353A true CN108811353A (en) | 2018-11-13 |
Family
ID=64080109
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|---|---|---|---|
| CN201810928466.6A Pending CN108811353A (en) | 2018-08-15 | 2018-08-15 | A kind of engraving method of two sides different Cu thickness PCB |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275268A (en) * | 2018-11-14 | 2019-01-25 | 江门崇达电路技术有限公司 | A kind of PCB back drill production method being less than 0.15mm for medium thickness |
| CN110913583A (en) * | 2019-10-23 | 2020-03-24 | 广州陶积电电子科技有限公司 | Method for improving warping of asymmetric copper thick substrate and substrate |
| CN111479401A (en) * | 2020-04-28 | 2020-07-31 | 景德镇市宏亿电子科技有限公司 | Manufacturing method of thick copper printed circuit board |
| CN113675166A (en) * | 2021-09-18 | 2021-11-19 | 江苏芯德半导体科技有限公司 | Passive element for fan-out type packaging, preparation method thereof and fan-out type packaging method |
| CN114615828A (en) * | 2020-12-08 | 2022-06-10 | 深南电路股份有限公司 | HDI circuit board, manufacturing method thereof and millimeter wave radar sensor |
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| CN103796437A (en) * | 2014-01-27 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Method for manufacturing negative and positive copper foil circuit board |
| CN104427776A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Manufacturing method of yin-yang copper-thickness printed circuit board |
| CN106852033A (en) * | 2017-04-06 | 2017-06-13 | 昆山苏杭电路板有限公司 | High precision part very high current printed circuit board processing method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US5108541A (en) * | 1991-03-06 | 1992-04-28 | International Business Machines Corp. | Processes for electrically conductive decals filled with inorganic insulator material |
| CN104427776A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Manufacturing method of yin-yang copper-thickness printed circuit board |
| CN103796437A (en) * | 2014-01-27 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Method for manufacturing negative and positive copper foil circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275268A (en) * | 2018-11-14 | 2019-01-25 | 江门崇达电路技术有限公司 | A kind of PCB back drill production method being less than 0.15mm for medium thickness |
| CN110913583A (en) * | 2019-10-23 | 2020-03-24 | 广州陶积电电子科技有限公司 | Method for improving warping of asymmetric copper thick substrate and substrate |
| CN111479401A (en) * | 2020-04-28 | 2020-07-31 | 景德镇市宏亿电子科技有限公司 | Manufacturing method of thick copper printed circuit board |
| CN114615828A (en) * | 2020-12-08 | 2022-06-10 | 深南电路股份有限公司 | HDI circuit board, manufacturing method thereof and millimeter wave radar sensor |
| CN113675166A (en) * | 2021-09-18 | 2021-11-19 | 江苏芯德半导体科技有限公司 | Passive element for fan-out type packaging, preparation method thereof and fan-out type packaging method |
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| PB01 | Publication | ||
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Application publication date: 20181113 |