CN104449550B - Silicon composition and application thereof - Google Patents
Silicon composition and application thereof Download PDFInfo
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- CN104449550B CN104449550B CN201310750313.4A CN201310750313A CN104449550B CN 104449550 B CN104449550 B CN 104449550B CN 201310750313 A CN201310750313 A CN 201310750313A CN 104449550 B CN104449550 B CN 104449550B
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- 239000000203 mixture Substances 0.000 title claims abstract description 114
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 239000010703 silicon Substances 0.000 title claims abstract description 68
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 68
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 53
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 52
- 229920000642 polymer Polymers 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 25
- 229920005573 silicon-containing polymer Polymers 0.000 claims abstract description 21
- 239000005543 nano-size silicon particle Substances 0.000 claims abstract description 20
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000001257 hydrogen Substances 0.000 claims abstract description 19
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 19
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 19
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000003054 catalyst Substances 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 238000013006 addition curing Methods 0.000 claims abstract description 12
- 125000000962 organic group Chemical group 0.000 claims abstract description 10
- 238000005984 hydrogenation reaction Methods 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 238000007259 addition reaction Methods 0.000 claims abstract description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 13
- 239000003112 inhibitor Substances 0.000 claims description 12
- 238000013007 heat curing Methods 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 238000012856 packing Methods 0.000 claims description 2
- 238000007711 solidification Methods 0.000 abstract description 9
- 230000008023 solidification Effects 0.000 abstract description 9
- 238000001723 curing Methods 0.000 abstract description 7
- 238000012986 modification Methods 0.000 abstract description 7
- 230000004048 modification Effects 0.000 abstract description 7
- 238000002834 transmittance Methods 0.000 abstract description 5
- 230000032683 aging Effects 0.000 abstract description 4
- 230000003287 optical effect Effects 0.000 abstract description 3
- 239000002683 reaction inhibitor Substances 0.000 abstract 1
- 238000005987 sulfurization reaction Methods 0.000 abstract 1
- 238000003786 synthesis reaction Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 32
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 26
- -1 organic peroxide free radical Chemical class 0.000 description 22
- 239000000377 silicon dioxide Substances 0.000 description 14
- 229910052697 platinum Inorganic materials 0.000 description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 10
- 239000007788 liquid Substances 0.000 description 9
- 238000013459 approach Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 4
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 3
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 description 3
- 239000000413 hydrolysate Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229910002621 H2PtCl6 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000013530 defoamer Substances 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- QDLYEPXRLHYMJV-UHFFFAOYSA-N propan-2-yloxyboronic acid Chemical compound CC(C)OB(O)O QDLYEPXRLHYMJV-UHFFFAOYSA-N 0.000 description 2
- 239000006254 rheological additive Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- BVNZLSHMOBSFKP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxysilane Chemical compound CC(C)(C)O[SiH3] BVNZLSHMOBSFKP-UHFFFAOYSA-N 0.000 description 1
- QPKFVRWIISEVCW-UHFFFAOYSA-N 1-butane boronic acid Chemical compound CCCCB(O)O QPKFVRWIISEVCW-UHFFFAOYSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910019032 PtCl2 Inorganic materials 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 125000003963 dichloro group Chemical group Cl* 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- FEHYCIQPPPQNMI-UHFFFAOYSA-N ethenyl(triphenoxy)silane Chemical compound C=1C=CC=CC=1O[Si](OC=1C=CC=CC=1)(C=C)OC1=CC=CC=C1 FEHYCIQPPPQNMI-UHFFFAOYSA-N 0.000 description 1
- ARLJCLKHRZGWGL-UHFFFAOYSA-N ethenylsilicon Chemical compound [Si]C=C ARLJCLKHRZGWGL-UHFFFAOYSA-N 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002454 metastable transfer emission spectrometry Methods 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- VDGJOQCBCPGFFD-UHFFFAOYSA-N oxygen(2-) silicon(4+) titanium(4+) Chemical compound [Si+4].[O-2].[O-2].[Ti+4] VDGJOQCBCPGFFD-UHFFFAOYSA-N 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- SYKXNRFLNZUGAJ-UHFFFAOYSA-N platinum;triphenylphosphane Chemical compound [Pt].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 SYKXNRFLNZUGAJ-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- HCOKJWUULRTBRS-UHFFFAOYSA-N propan-2-yloxysilane Chemical compound CC(C)O[SiH3] HCOKJWUULRTBRS-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003284 rhodium compounds Chemical class 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 102220275913 rs754497897 Human genes 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 125000005401 siloxanyl group Chemical group 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of silicon composition and application thereof.Described silicon composition comprises the basic components such as at least one vinyl silicone polymer and at least one hydrogen-based siloxane polymer that can be solidified and at least one vinyl POSS, the nano silicon of organic group modification and silicon hydrogenation addition curing catalyst by hydrosilylation addition reaction, the most also can comprise the components such as hydrosilylation addition reaction inhibitor, adhesive accelerant.The silicon composition of the present invention has good physics, chemical synthesis performance, including good fluidity, curing rate is fast, curing degree is high, solidification hardness is high, light transmittance is high, and also there is the features such as sulfuration resistant performance is strong, aging speed slow, stable performance, being adapted as bonding, the encapsulating material application of optical, electrical sub-device, the encapsulating material especially as semiconductor light-emitting elements such as LED is applied.
Description
Technical field
The present invention be more particularly directed to a kind of silicon composition, it is adapted as the application such as cementing compositions, encapsulating material.
Background technology
Luminous efficiency, brightness, power and the service life of LED are had and important shadow by LED encapsulation material
Ring.Wherein, the encapsulating material of the resistance to ultraviolet/heat ageing of high index of refraction, high transmission rate and excellence can be effectively improved
LED light output rating and service life.
Current conventional power type LED encapsulation material is mainly organosilicon material, and it has low-shrinkage and in solidification
During do not discharge the advantages such as by-product, but, it still suffers from relatively in refractive index, the solidification performance such as hardness
The most not enough.To this end, industry proposes kinds of schemes to promoting the respective performances of organosilicon encapsulating material, so
Then, although truly having lifting through modified material performance in some aspects, but it can cause again it simultaneously
The decline of some performances in terms of it.
Such as, Publication No. US7527871A, US2004116640A1, EP1424363B1, CN101066446A,
The modification technology that CN102181159A, CN103022320A, CN101565535A etc. are involved, its
The organosilicon material comprehensive lifting at aspects such as refractive index, weatherability, light transmittance, mechanical properties cannot be realized.
Summary of the invention
An object of the present invention is to provide a kind of silicon composition, and it has excellent optics, mechanics etc. and combines
Close performance, to overcome deficiency of the prior art.
The basic components of a kind of silicon composition of the present invention comprises:
Can be by least one ethylene of silicon hydrogenation addition (hydrosilylation reaction) reaction solidification
Silicone polymer and at least one hydrogen-based siloxane polymer,
And, nano silicon and silicon that at least one vinyl POSS, organic group are modified hydrogenate addition curing
Catalyst.
Further, in the basic components of described compositions, described vinyl silicone polymer and hydrogen-based silica
The content of alkane polymer is 60～99wt%, preferably 75～99wt%, especially preferably 85～95wt%.
Further, in the basic components of described compositions, described hydrogen-based siloxane polymer institute silicon-hydrogen bond containing with
The mol ratio of vinyl contained by described vinyl silicone polymer is 1:0.7～1:1.4.
Further, in the basic components of described compositions, the content of described vinyl POSS is 0.1～20wt%,
It is preferably 1～10wt%, especially preferably 1～6wt%.
Further, in the basic components of described compositions, the content of described nano silicon be 0.1～
20wt%, preferably 1～10wt%.
Further, described compositions also comprises hydrosilylation inhibitor,
Wherein, the content of described silicon hydrogenation addition curing catalyst is 0.1～1000ppm, preferably 1～100ppm,
Especially preferably 1～20ppm.
And based on the consumption of described hydrosilylation inhibitor component 0.001～1wt%, preferably 0.005～
0.5wt%, especially preferably 0.01～0.1wt%.
Further, described compositions also comprises more than one adhesive accelerants, and the containing of described adhesive accelerant
Amount is 0.001～10wt%, preferably 0.01～5.0wt%, and especially preferably 0.01～1.0wt% are the most excellent
Elect 0.01～0.05wt% as.
Further, described compositions the solidfied material formed for the index of refraction of visible ray between 1.35～1.60,
Preferably more than 1.5.
Another object of the present invention is to provide aforementioned organic silicon compositions bonding article or at least packaged articles local
Application in surface.
It is still another object of the present invention to provide a kind of article adhering method, including:
First article and the second article are provided,
Aforementioned organic silicon compositions is applied between the first article and the second article,
And, under the conditions of selected temperature, make the complete heat cure of described silicon composition, thus by the first article with
Second article are adhesively fixed.
A further object of the present invention is to provide a kind of method for packing, including:
At least at the selected regional area of article surface and/or inside as packaging area,
And, apply described silicon composition at described packaging area,
And, under the conditions of selected temperature, make the complete heat cure of described silicon composition, it is achieved the encapsulation to article.
Such as, as more one of preferred embodiment, can be in the time of 1min～24h at room temperature～260 DEG C
Inside make the complete heat cure of described silicon composition, it is achieved to the encapsulation of article or be adhesively fixed.
A further object of the present invention is to provide a kind of electronic device or photoelectric device, comprises described silicon composition
The solidfied material formed.
Wherein, described photoelectric device includes that semiconductor light-emitting elements, described semiconductor light-emitting elements include LED, but
It is not limited to this.
In the present invention, aforesaid " encapsulation " (packaging) should be understood including at least following connotation, e.g.,
By described silicon composition by bonding for two or more article (adhesive), or, by described organic
Silicon composition some regions curing formation protective layer (coating) of article surface, or, by one or many
The local of individual article is immersed in the solidfied material formed by described silicon composition, or, by one or more
Article entirety embedding seal (encapsulation) in the solidfied material formed by described silicon composition, when
So, it is possible to realize simultaneously aforesaid bonding, coat, the function such as sealing.
Compared with prior art, as it was previously stated, the silicon composition that the present invention provides has excellent thing, changes performance,
Include but not limited to good mobility, there are good optical, electrical performance and mechanical property etc. after hardening,
And its application process is the simplest.
Detailed description of the invention
One aspect of the present invention provides a kind of silicon composition, and its basic components includes: can pass through silicon hydrogen
Change at least one vinyl silicone polymer (vinyl that additive reaction (hydrosilylation reaction) solidifies
Siloxane polymer) and at least one hydrogen-based siloxane polymer (Si-H siloxane polymer), and,
At least one vinyl POSS(vinyl POSS) and the nano silicon (vinyl-or of organic group modification
Phenyl-modified nano-sized silica).
Further, described compositions also can bag silyl hydride addition curing catalyst, by its catalytic action, can
Realize the heat cure of said composition.
And further, also can insert hydrosilylation inhibitor, then be catalyzed by adjusting silicon hydrogenation addition curing
Agent and the kind of hydrosilylation inhibitor, consumption etc., can regulate and control the state of cure of said composition with solid
Change speed etc..
Aforesaid hydrosilylation addition reaction means and is added on unsaturated organic compound by the hydride of silicon, thus generates
The reaction of various organo-silicon compound, it can be to use three kinds of modes: (1) is the most straight with alkene or alkynes
It is bonded into.(2) ultraviolet, gamma-rays or organic peroxide free radical is utilized to cause.(3) with transition metal and
Its coordination compound catalytic reaction.Planting mode particularly with (3rd), its reaction condition is gentle, and selectivity is good,
Productivity is high.
In the present invention, described silicon composition can be linear polymer, branched polymers or network polymerization
Thing.
Obvious, the compositions of the present invention should comprise at least one liquid component, with remaining material in said composition
Material is combined as the liquid with good fluidity, so that can be transported by the conventional equipment such as syringe or pump,
Dispensing.
For the vinyl silicone polymer of the present invention, it can select any one siloxanes containing vinyl group
Polymer, and the approach that can be noted by industry, including commercially available or self-control etc., various ways obtains.
Such as, the general molecular formula of described vinyl silicone polymer monomer can be:
(R5)m(R6)nSi(OR7)4-m-n
Wherein, R5For vinyl, pi-allyl or vinyl benzyl；R6For methyl, ethyl or phenyl；R7For methyl
Or ethyl, m is 0,1 or 2；N is 0,1 or 2, and m+n < 4, and such as, it can be selected from
CH2=CHSi(OCH3)3、CH2=CHSi(OC2H5)3、CH2=CHSi(OCH(CH3)2)3、
CH2=CHSi(OC4H9)3、(CH2=CH)(C2H5)Si(OC2H5)2、(CH2=CH)(C6H5)Si(OC2H5)2、
CH2=CHCH2Si(OCH3)3、CH2=CHCH2Si(OC2H5)3、(CH2=CHCH2)2(CH3)SiOC2H5、
(CH2=CHCH2)(CH3)2SiOC2H5、(CH2=CHCH2)2Si(OC2H5)2、(CH2=CHCH2)3SiOC2H5
Or CH2=CHC6H4Si(OCH3)3Etc..
Or, described vinyl silicone polymer molecular structural formula can be:
Me2R1SiO(Me2SiO)a(MeViSiO)b(MePhSiO)cSiR1Me2,
In formula, Me represents methyl, and Vi represents vinyl, and Ph represents phenyl, the positive integer of a=3～3000, and b is 1～300
Positive integer, the positive integer of c=0 or 1～3000, and meet 0≤c/ (a+b+c)≤0.99, R1For Me or Vi.
For the hydrogen-based siloxane polymer of the present invention, it can select any one siloxanes containing Si--H to gather
Compound, and the approach that can be noted by industry, including commercially available or self-control etc., various ways obtains.
Such as, the general structure of described hydrogen-based siloxanyl monomers can be:
(R4’)m’(R5’)n’Si(H)p’(OR6’)(4-m’-n’-p’)
Wherein, R4’、R5' it is methyl, ethyl or phenyl；R6' it is methyl or ethyl；M ', n ', p ' are 0,1
Or 2, and m '+n '+p ' < 4.
The most such as, the molecular structure of described hydrogen-based siloxane polymer can be:
Me2R2SiO(Me2SiO)d(MeHSiO)e(MePhSiO)fSiR2Me2,
In formula, Me represents methyl, and Ph represents phenyl, the positive integer of d=3～900, the positive integer of e=3～600, f=0
Or the positive integer of 1～900, and meet 0≤f/ (d+e+f)≤0.99, R2For Me or H.
Further, in the basic components of the compositions of the present invention, vinyl silicone polymer and hydrogen-based silica
Alkane polymer content can be between 60～99wt%, preferably 75～99wt%, more preferably
85～95wt%, so that transparent and there is good mobility after said composition solidification.
Further, in the present compositions, the si-h bond in hydrogen-based siloxane polymer and vinyl silicon
The mol ratio of the vinyl in oxygen alkane polymer is between 1:0.7～1:1.4.
Vinyl POSS(polyhedral oligomeric silsesquioxane for the present invention), it can be selected containing vinyl
Any one POSS of group, and the approach that can be noted by industry, (such as, referred to including commercially available or self-control
CN100503757A, CN101906116B etc.) etc. various ways obtain.
Such as, described POSS can be by vinyl trichlorosilane, vinyltrimethoxy silane, vinyl three second
TMOS, vinyl triisopropyl TMOS, vinyl three normal-butyl silane, vinyl tri-tert
One or more reactions in silane, vinyltriphenoxysilane are prefabricated and obtain；Or in them
Plant or several and methyl trichlorosilane, MTMS, MTES, methyl 3 third
TMOS, methyl three normal-butyl silane, methyl tri-tert silane, phenyl trichlorosilane, phenyl front three
In TMOS, phenyl triethoxysilane, phenyl three isopropoxy silane, phenyl three tert-butoxy silane
One or more reactions prefabricated and obtain, but be not limited to this.
Further, in the basic components of the present composition, the content of described vinyl POSS can 0.1～
Between 20wt%, preferably 1～10wt%, more preferably 1～6wt%, its can uniform dissolution in combination
In thing and solidification after transparent.
In the present invention, the nano silicon that described organic group is modified refers to that surface should be modified with at least one
The nano-silicon dioxide particle of organic group, it can be scattered in silicon composition of the present invention institute by good
Among the liquid component comprised, wherein, described organic group preferably is selected from vinyl or phenyl, wherein the former energy
Enough refering to curing reaction, and the latter can increase the phase of nano-silicon dioxide particle and the organosilicon containing aromatic group
Capacitive.
The nano-silicon dioxide particle that this surface is modified by organic group also can be obtained by approach such as commercially available or self-controls,
Such as, following Access to publication at least it is referred to:
1, Zhang Xinmeng, " surface modification of silica ", Shenyang University of Technology's master thesis, 2006 12
Month.
2, remaining east liter etc., " nano-silica surface modification of graft progress ", coatings industry, 2010 years
The 7th phase of volume 40 July.
Again and, the mean diameter of the nano-silicon dioxide particle in the present invention is not more than 500nm, particularly preferably
1nm-100 nanometer, and visible ray should be able to be made much more as far as possible to transmit from described compositions.
Further, in the composition, the content of described nano silicon can be 0.1～20wt%, excellent
It is selected in 1～10wt%, so that can be the most transparent after compositions solidification.
In the present compositions, aforementioned silicon hydrogenation addition curing catalyst is preferably noble metal catalyst, such as
Platinum and rhodium compound.Especially with patent US-A-3159601, US-A-3159602 and US-A-3220972
And platinum described in European patent EP-A-0057459, EP-A-0188978 and EP-A-0190530 and having
The complex of machine product, or patent US-A-3419593, US-A-3715334, US-A-3377432 and
Platinum described in US-A-3814730 and the complex of vinylated organosilicon oxygen alkane.This catalyst is generally preferable
For the coordination compound of platinum catalyst, i.e. platinum, particularly platinum complex, including chloroplatinic acid, H2PtCl6、Pt(PPh3)4、
Cp2PtCl2, methyl vinyl silicone polymer coordination platinum complex, diethyl phthalate coordination
The platinum complex etc. of platinum complex, dichloro double (triphenylphosphine), preferably platinum complex is chloroplatinic acid, H2PtCl6、
The platinum complex of methyl vinyl silicone polymer coordination, more preferably methyl vinyl silicone polymer
The platinum complex of coordination.
In the present compositions, silicon hydrogenation addition curing catalyst content can between 0.1～1000ppm,
Preferably at 1-100ppm, more preferably at 1-50ppm, more preferably 1～20ppm.
In the present compositions, aforementioned hydrosilylation inhibitor refers to cause hydrosilylation not
Good material, this kind of material include alkynol compound, alkene-alkine compounds, siloxanes or benzotriazole and
His hydrosilanes reaction suppressor.Wherein, alkynol compound inhibitor be selected from 2-phenyl-3-butyne-2-alcohol,
2-methyl-3-butyne-2-alcohol, 3,5-dimethyl-1-hexin-3-alcohol etc.；Alkene-alkine compounds is selected from such as 3-methyl
-pirylene etc., siloxanes is selected from 1,3,5,7-tetramethyl-1,3,5,7-tetra-hexenyl cyclotetrasiloxanes,
1,3,5,7-tetramethyl-1,3,5,7-tetravinyl cyclotetrasiloxane etc..Wherein preferred alkynol compound, the most excellent
Select 2-phenyl-3-butyne-2-alcohol.
In the present invention, for basic components (if setting it as 100 weight portions), this hydrosilylation presses down
The content of preparation can be preferably at 0.005～0.5 weight portion, the most excellent between 0.001～1 weight portion
Elect 0.01～0.1 weight portion as.
Additionally, in the present compositions, a kind of applicable adhesion promotor or multiple adhesion promotor can also be comprised
Mixture, it is selected from defoamer (defoamer), rheology modifier (rheology modifier), ink
Water (ink) and/or pigment (pigments), infrared absorbent (IR absorber) etc..
Such as, in the composition, described adhesive accelerant can be selected from tetraethyl orthosilicate, vinyl trimethoxy
Base silane, n-butyl boronate, boric acid isopropyl ester, isooctyl acid titanium, zirconium iso-octoate, tetrabutyl titanate, metatitanic acid
One or several mixture in isopropyl ester, KH-171, KH-560 and KH-570 or they in
The hydrolysate of one or more, preferred vinyl trimethoxy silane, boric acid isopropyl ester, isooctyl acid titanium,
One or several mixture in tetrabutyl titanate, KH-560 and KH-570, or one or more
Hydrolysate；Particularly preferably in vinyltrimethoxy silane, tetrabutyl titanate, KH-560 one or more
Mixture, or their hydrolysate.
Such as, the adhesive accelerant that can be obtained by commercially available approach can be Dow Corning Corporation produce JCR6101,
JCR6101UP, EG6301, OE6336, JCR6175, JCR6109, Hipec4939, Hipec1-9224,
OE6250, SR7010, SE9207, SE1740, SE9187L etc., but it is not limited to this.
In the present compositions, the content of described adhesive accelerant can be 0.001～10wt%, is preferably
0.01～5.0wt%, especially preferably 0.01～1.0wt%, more preferably 0.01～0.05wt%
Although as it was previously stated, having some bonding agents at present is by by polytype siloxane polymer, micron
Or nano silicon and corresponding activator etc. assemble, it is achieved the modification to siloxane polymer, but thus
Although the binding agent obtained is promoted at some aspect of performance, can cause again under other side performance simultaneously
Fall or disappearance so that its combination property cannot meet the demand of actual application.And for light and/or electrical part,
For the semiconductor light-emitting elements such as the most such as LED, for convenience of its bonding, packaging technology, it usually needs
Use and there is the adhesive composite of good fluidity so that its can to pass through syringe, pump, printer etc. general
Some select location leading to equipment and accurately inject or be coated on device, and in order to make between device or device
Good isolation can be kept with the external world, including physics and chemical isolation, and/or make device can keep good light
Output or take in efficiency, and/or make device produce the most voluntarily or the passive heat accepted etc. can be quick
Dissipate, and other is not limited to this target, also requires that the solidfied material formed by adhesive composite should have concurrently
Good bonding force, hardness, pliability, light transmittance (the most under visible light), dielectric constant, heat conduction
The performance such as efficiency, aging resistance.
Inventor is after numerous studies, and helps and assemble test with substantial amounts of, has been found out the skill of the present invention
Art scheme, that is, by gathering because of at least one vinylsiloxane of hydrosilylation addition reaction solidification
Compound, at least one hydrogen-based siloxane polymer, at least one vinyl POSS and organic group are modified
Nano silicon assemble, and be aided with curing catalysts and hydrosilylation inhibitor, it is thus achieved that a kind of
There is the compositions of good fluidity.Further, inventor is found surprisingly that and determines the most very much, this
Bright compositions have concurrently good bonding force, hardness, pliability, light transmittance (the most under visible light),
The performances such as dielectric constant, heat transfer efficiency, aging resistance.
Such as, the silicon composition of the present invention index of refraction of the solidfied material formed is between 1.35～1.60, excellent
It is selected in more than 1.5.Therefore, the compositions of the present invention is particularly suited for electronic installation, Optical devices, photoelectricity
Device carries out bonding or encapsulation, especially as light emitting semiconductor device, such as the encapsulating material of LED.
Below in conjunction with some more specifically embodiments and corresponding comparative example, technical scheme is made specifically
Explanation.But still it is emphasized that these embodiments are not to be construed as protection scope of the present invention structure
Become any restriction.Postscript, except as otherwise noted, otherwise all numbers in description of the invention, percent,
Ratios etc. are by weight.
Is the composition of the silicon composition involved by reference examples 1-16 and embodiment 1-2 as shown in table 1-table 2,
And prepared by the method that these silicon compositions all can use industry to note, such as, uniformly mixed by each component
After conjunction, corresponding compositions can be obtained.
Further, in the embodiment as involved by table 1-table 2 and comparative example, involved vinylsiloxane
Polymer, Si-H siloxanes, vinyl POSS, micron silica or hydrophilic nanoscale titanium dioxide
Silicon or vinyl or the content of phenyl modified nano silicon, refer to that it is being polymerized by vinylsiloxane
Thing, Si-H siloxanes, vinyl POSS and micron silica or hydrophilic nano grade silicon dioxide or
Content in the basis composition of the silicon composition of vinyl or phenyl modified nano silicon composition,
Rather than as the content in the silicon composition of finished product.And adhesive accelerant, catalyst, inhibitor
Content then refers to its content in finished product silicon composition.
It should be noted that, in reference examples 1-16 and embodiment 1-2, for each reference examples and each embodiment
In each component of relating to, it is in fact to have chosen many kinds of substance to be assembled with other component, then
Carry out correlated performance test.Such as, for vinyl silicone polymer therein, it is to have selected above
Multiple the vinyl silicone polymer be applicable to the present invention addressed is tested.For other
Component, including Si-H siloxanes, vinyl POSS, vinyl or phenyl modified nano silicon etc.,
Also it is such.
And for micron silica therein, be to be respectively adopted hydrophilic micron silica, hydrophilic
Property micron silica be tested, its all can by commercially available (SHENNA that such as, receives produce
SQ-1, SQ-2, SQ-5, SQ-10) or self-control approach (such as, refer to " micron-size spherical titanium dioxide
The preparation of silicon powder and Technology research thereof ", Bu Xiangmei, Institutes Of Technology Of Nanjing, master thesis, 2008
June in year；J.AM.CHEM.SOC.2010, vol.132, p4834 4842) obtain.
For hydrophilic nano grade silicon dioxide therein, it is to be respectively adopted to modify and the most modified nanoscale two
Silicon oxide is tested, its also can through commercially available approach (R972 that such as, Degussa (EVONIK) is produced,
R974, R104, R106, R20, R812, R812S, R816, R7200, R8200, R711, R719,
H13L, H15, H17, H18, H20, H30, H2000 that Wa Ke (WACKER) produces, Cabot (CABOT)
F01, SD10, F08, F09 that TS-530, TS-610, the TS-720 produced, the SHENNA that receives produce,
The DM-10 produced in moral mountain (TOKUYAMA)) and self-control approach obtain and (such as, refer to that " single dispersing is received
The preparation of rice silicon dioxide microsphere and carboxylated modification " (" functional material ", 2009,11 phases, volume 40),
CN101428807A, WO2009/088250A, Polyethylene Glycol/nano silicon dioxide hybridization material preparation with
Characterize " document such as (" Chinese science and technology paper online fine work paper ", volume 2 the 22nd phase in November, 2009).)
Refering to table 3, it is clear that it will be seen that the silicon composition of the present invention has good combination property, including stream
Dynamic property is good, curing rate is fast, curing degree is high, solidification hardness is high, light transmittance is high.
Such as, in the more specifically case of in embodiment 1, its operation may include that
In a planet strrier special plastic cup, add 76.3 parts of vinyl silicone polymer polymer,
14.5 parts of Si-H siloxane polymers, 4.6 parts of vinyl POSS, the nano-silica of 4.6 parts of modified by vinyl
SiClx, 0.008 part of 2-phenyl-3-butyne-2-alcohol, the platinum (0)-1 of 5.2ppm, 3-divinyl-1,1,3,3-tetramethyl two
Siloxanes etc., and make vinyl and the Si-H siloxane polymerization of wherein vinyl silicone polymer polymer
The mol ratio of the si-h bond of thing is 1.1:1.0, and after mix homogeneously, the viscosity of obtained liquid is 1000cPs.
Obtained liquid is injected in 0.8mm thickness mould, 150 degrees Celsius of lower heat cures 4 hours, obtains one
Individual solid transparent, that 0.8mm is thick.The index of refraction of gained silicon composition is 1.41.
The liquid stirred is injected in 2mm thickness mould, 150 degrees Celsius of lower heat cures 4 hours,
To a solid thick for 2mm, its hardness is Shao A37.5.
Being injected into by obtained liquid in 2mm thickness mould, heat cure 24 hours, obtain one at 200 degrees celsius
The solid that individual 2mm is thick, its hardness is Shao A61.0.
Obtained liquid is injected in 6mm thickness mould, 150 degrees Celsius of lower heat cures 4 hours, obtains one
The solid that 6mm is thick, its hardness is Shao A33.5.
Being injected into by obtained liquid in 6mm thickness mould, heat cure 24 hours, obtain one at 200 degrees celsius
The solid that individual 6mm is thick, its hardness is Shao A42.4.
Additionally, it is surprising that the shelf-life of the silicon composition of the present invention than existing silicone adhesive
Agent is also significantly improved, and this characteristic is allowed to the encapsulation field being also very suitable at electronic device and applies.Example
As, the compositions involved by reference examples 16 i.e. can form gel within the time less than one day, and embodiment 2
Steady-state viscosity still can be kept after the experience time of more than two weeks.
Below it is only the concrete exemplary applications of the present invention, protection scope of the present invention is not constituted any limitation.All adopt
The technical scheme replaced with equivalents or equivalence and formed, within the scope of all falling within rights protection of the present invention.
Table 1: reference examples 1-14 and the composition of embodiment 1 compositions
Table 2: reference examples 15-16 and the composition of embodiment 2 compositions
Table 3: the performance of the compositions of reference examples 1-16 and embodiment 1-2
Claims (21)
1. a silicon composition, it is characterised in that the basic components of described compositions comprises:
At least one vinyl silicone polymer that can be solidified by hydrosilylation addition reaction and at least one hydrogen-based siloxane polymer,
And, nano silicon and silicon that at least one vinyl POSS, organic group are modified hydrogenate addition curing catalyst, and wherein said organic group includes that vinyl or phenyl, the mean diameter of described nano silicon are 1nm～100nm；
In the basic components of described compositions, described vinyl silicone polymer is 60～99wt% with the content of hydrogen-based siloxane polymer, and the content of described vinyl POSS is 0.1～20wt%, and the content of described nano silicon is 0.1～20wt%；
Further, the mol ratio of vinyl contained by described hydrogen-based siloxane polymer institute silicon-hydrogen bond containing and described vinyl silicone polymer is 1:0.7～1:1.4.
Silicon composition the most according to claim 1, it is characterised in that in the basic components of described compositions, described vinyl silicone polymer is 75～99wt% with the content of hydrogen-based siloxane polymer.
Silicon composition the most according to claim 2, it is characterised in that in the basic components of described compositions, described vinyl silicone polymer is 85～95wt% with the content of hydrogen-based siloxane polymer.
Silicon composition the most according to claim 1, it is characterised in that in the basic components of described compositions, the content of described vinyl POSS is 1～10wt%.
Silicon composition the most according to claim 4, it is characterised in that in the basic components of described compositions, the content of described vinyl POSS is 1～6wt%.
Silicon composition the most according to claim 1, it is characterised in that in the basic components of described compositions, the content of described nano silicon is 1～10wt%.
Silicon composition the most according to claim 1, it is characterized in that, described compositions also bag silyl hydride addition curing catalyst and hydrosilylation inhibitor, the content of wherein said silicon hydrogenation addition curing catalyst is 0.1～1000ppm, and based on the consumption of described hydrosilylation inhibitor the 0.001～1wt% of component.
Silicon composition the most according to claim 7, it is characterised in that the content of the hydrogenation addition curing catalyst of silicon described in described compositions is 1～100ppm.
Silicon composition the most according to claim 8, it is characterised in that the content of the hydrogenation addition curing catalyst of silicon described in described compositions is 1～20ppm.
Silicon composition the most according to claim 7, it is characterised in that based on the consumption of described hydrosilylation inhibitor the 0.005～0.5wt% of component.
11. silicon compositions according to claim 10, it is characterised in that based on the consumption of described hydrosilylation inhibitor the 0.01～0.1wt% of component.
12. silicon compositions according to claim 1, it is characterised in that described compositions also comprises more than one adhesive accelerants, and the content of described adhesive accelerant is 0.001～10wt%.
13. silicon compositions according to claim 12, it is characterised in that the content of adhesive accelerant described in described compositions is 0.01～5.0wt%.
14. silicon compositions according to claim 13, it is characterised in that the content of adhesive accelerant described in described compositions is 0.01～1.0wt%.
15. silicon compositions according to claim 14, it is characterised in that the content of adhesive accelerant described in described compositions is 0.01～0.05wt%.
16. silicon compositions according to claim 1, it is characterised in that the solidfied material formed by described compositions for the index of refraction of visible ray between 1.35～1.60.
17. silicon compositions according to claim 16, it is characterised in that the solidfied material formed by described compositions is 1.5～1.60 for the index of refraction of visible ray.
Silicon composition according to any one of 18. claim 1-17 is in bonding article or at least application in packaged articles local surfaces.
19. 1 kinds of article adhering methods, it is characterised in that including:
First article and the second article are provided,
The silicon composition according to any one of claim 1-17 is applied between the first article and the second article,
And, under the conditions of selected temperature, make described silicon composition heat cure, thus the first article and the second article are adhesively fixed.
20. 1 kinds of method for packing, it is characterised in that including:
At least at the selected regional area of article surface and/or inside as packaging area,
And, apply the silicon composition according to any one of claim 1-17 at described packaging area,
And, in described silicon composition heat cure under the conditions of selected temperature, complete the encapsulation to article.
21. 1 kinds of electronic devices or photoelectric device, it is characterised in that it comprises the solidfied material that silicon composition according to any one of claim 1-17 is formed, and wherein said photoelectric device includes that semiconductor light-emitting elements, described semiconductor light-emitting elements include LED.
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| HUE061592T2 (en) | 2014-07-07 | 2023-07-28 | Honeywell Int Inc | Thermal interface material with ion scavenger |
| KR102470083B1 (en) | 2014-12-05 | 2022-11-23 | 허니웰 인터내셔널 인코포레이티드 | High performance thermal interface materials with low thermal impedance |
| CN104927403B (en) * | 2015-06-18 | 2017-06-06 | 合肥工业大学 | A kind of preparation method of high perofmrnace lubricating oils additive |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| WO2017152353A1 (en) | 2016-03-08 | 2017-09-14 | Honeywell International Inc. | Phase change material |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| CN109651615A (en) * | 2017-10-12 | 2019-04-19 | 弗洛里光电材料（苏州）有限公司 | Nano hybridization molecular compound and application containing multiple si-h bonds and phenyl |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| CN108865029A (en) * | 2018-05-29 | 2018-11-23 | 滁州君越高分子新材料有限公司 | A kind of super-low-hardness glue |
| US12129341B2 (en) * | 2019-02-22 | 2024-10-29 | Zhejiang Third Age Material Technology Co., Ltd. | Preparation method for polysiloxane powder filler, polysiloxane powder filler obtained thereby and application thereof |
| CN111819247A (en) * | 2019-02-22 | 2020-10-23 | 浙江三时纪新材科技有限公司 | Preparation method of spherical or angular powder filler, spherical or angular powder filler obtained by preparation method and application of spherical or angular powder filler |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| KR20210147747A (en) * | 2020-05-29 | 2021-12-07 | 동우 화인켐 주식회사 | Photocurable Ink Composition, Encapsulation Layer and Display Device |
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