KR102065203B1 - Silicone composition for sealing optical semiconductor element, and optical semiconductor device - Google Patents

Abstract

This invention provides the silicone composition for optical-semiconductor element sealing which can satisfy both sufficient light transmittance and mechanical strength, when the obtained silicone hardened | cured material is used as the sealing material of an optical semiconductor element, and an optical semiconductor device. The present invention is 100 parts by weight of a linear polyorganosiloxane having at least two alkenyl groups in a molecule and a polyorganosiloxane having a dendritic structure having at least one alkenyl group in a molecule, and at least two hydro in the molecule. The amount of polyorganohydrogensiloxane having a silyl group (Si-H group) to 1 to 3 moles of hydrogen atoms per mole of alkenyl group, 5 to 20 parts by mass of silica powder, and a catalytic amount of the hydrosilylation reaction catalyst, respectively It contains, and the refractive index (25 degreeC, D line) is 1.41-1.44, The silicone composition for sealing an optical semiconductor element, and the optical semiconductor device by which the optical semiconductor element is sealed by the hardened | cured material of the said composition are provided.

Description

Silicon composition for optical semiconductor element sealing and optical semiconductor device {SILICONE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silicone composition for sealing an optical semiconductor element, and in particular, a silicone composition for sealing an optical semiconductor element having excellent light transmittance and mechanical strength thereof, and a light for sealing the optical semiconductor element with the cured product. A semiconductor device.

BACKGROUND OF THE INVENTION An optical semiconductor device, for example, an LED light emitting device, is known in which an LED chip mounted on a support substrate is sealed with a transparent resin. Epoxy resins have conventionally been used as sealing transparent resins, but the increase in the amount of heat generated due to the high brightness of LEDs and the shortening of light have caused a problem of lowering reliability due to cracking and yellowing.

Therefore, the silicone resin excellent in heat resistance became used as a sealing material of an optical semiconductor device. However, since the silicone resin used is inferior in thixotropy, it flows even if an appropriate amount is applied to the LED chip on the support substrate by using a dispenser to form and harden it, thereby forming a molded and hardened product having the desired shape. There was a problem of not losing. Moreover, as a result of insufficient thixotropy of a silicone resin, there also existed a problem that the manufacturing apparatus using this also became expensive.

Although silica microparticles | fine-particles are known as providing thixotropy to a silicone resin, it was a problem that transparency fell, for example, cloudiness generate | occur | produced by adding silica microparticles | fine-particles. In addition, the use of diphenyl dimethylsilicon for improving the optical properties has been examined, but there has been a problem in terms of transparency. As an attempt to achieve both thixotropy and transparency, Patent Literature 1 describes a technique of blending silica fine particles with a silicone resin composition adjusted so that the refractive index is equivalent to silica. Thereby, although thixotropy and transparency are maintained more than a predetermined level, there existed a problem of causing a fall of a mechanical characteristic as a sealing material of an optical semiconductor device.

Japanese Laid-Open Patent Publication No. 2009-235265

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and when the silicone cured product obtained is used as a sealing material for an optical semiconductor element, a silicone composition for sealing an optical semiconductor element and a cured product thereof capable of achieving both sufficient light transmittance and mechanical strength An object of the present invention is to provide an optical semiconductor device in which an optical semiconductor element is sealed.

Silicone composition for optical semiconductor element sealing of this invention,

(A) a polyorganosiloxane represented by the following formula (1);

(However, in the formula (1), each R ¹ independently represents an alkyl group which may be optionally substituted with an alkenyl group or halogen, R ² each independently represents an aryl group, at least two of R ¹ is an alkenyl group, and 0.01 <m / ( m + n) <0.10),

Of (B) at least one having an alkenyl group, x of R ¹ ₃ SiO _1/2 units, y of R ¹ ₂ SiO units, and z of SiO contain ₂ units (where each siloxane unit in the molecule, R ¹ each independently represents an alkenyl group or an alkyl group which may be substituted by halogen), and x, y, and z when converting the sum of x, y, and z into 1 are 0.3 ≦ x ≦ 0.5 and 0 <y ≦, respectively. 0.1, 0.4 <z <0.7, The polyorganosiloxane of the dendritic structure is 100 mass parts in total of (A) component and (B) component, and 100 mass parts of total amounts of (A) component and (B) component (B) the amount which a component becomes 10-40 mass parts;

(C) A polyorganohydrogensiloxane having a hydrogen atom bonded to at least two silicon atoms in one molecule is added to the silicon atom with respect to 1 mole of the total amount of the alkenyl groups each of the above-mentioned (A) component and (B) component. The amount of bonded hydrogen atoms of 1 to 3 moles;

(D) 5 to 20 parts by mass of silica powder; And

(E) catalytic amount of hydrosilylation reaction catalyst;

It contains respectively, and refractive index (25 degreeC, D line) is 1.41-1.44, It is characterized by the above-mentioned.

In addition, the optical semiconductor device of the present invention is characterized in that the optical semiconductor element is sealed by a cured product of the silicone composition for sealing an optical semiconductor element of the present invention.

According to the present invention, when the silicone cured product obtained using the same is used as a sealing material for an optical semiconductor element, the silicone composition for sealing an optical semiconductor element capable of achieving both sufficient light transmittance and mechanical strength, and sufficient light transmittance and mechanical strength The optical semiconductor device sealed by the silicone hardened | cured material which has is provided.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described.

Silicone composition for optical semiconductor element sealing of this invention,

(A) linear polyorganosiloxane having at least two alkenyl groups in one molecule represented by Formula 1;

Of (B) at least one having an alkenyl group, x of R ¹ ₃ SiO _1/2 units, y of R ¹ ₂ SiO units, and z of SiO contain ₂ units (where each siloxane unit in the molecule, R ¹ each independently represents an alkenyl group or an alkyl group which may be substituted by halogen), and x, y, and z when converting the sum of x, y, and z into 1 are 0.3 ≦ x ≦ 0.5, and 0 <y ≦, respectively. 0.1, 0.4 <z <0.7, The polyorganosiloxane of the dendritic structure is 100 mass parts in total of (A) component and (B) component, and 100 mass parts of total amounts of (A) component and (B) component (B) the amount which a component becomes 10-40 mass parts;

(C) Silicon atom with respect to 1 mol of total amounts of the alkenyl group which the said (A) component and (B) component have the polyorganohydrogensiloxane which has a hydrogen atom couple | bonded with at least 2 silicon atoms in 1 molecule, respectively An amount of hydrogen atoms bonded to 1 to 3 mol;

(D) 5-20 mass parts of silica powder; And

(E) catalytic amount of hydrosilylation reaction catalyst;

It contains respectively, and refractive index (25 degreeC, D line) is 1.4-1.44, It is characterized by the above-mentioned.

Hereinafter, each component is demonstrated.

[(A) component]

(A) component is an alkenyl group containing polyorganosiloxane used as a base polymer of this invention with (B) component demonstrated next.

The component (A) is a linear polyorganosiloxane having at least two alkenyl groups in one molecule represented by the following formula (1). Hereinafter, the polyorganosiloxane represented by General formula (1) is also called polyorganosiloxane (1):

(Formula 1)

(However, in the general formula (1), each R ¹ is independently an alkenyl group or an alkyl group which may be halogen substituted, R ² each independently represents an aryl group, at least two of R ¹ is an alkenyl group, 0.01 <m /(m+n)<0.10).

In addition, Formula 1 does not necessarily mean a block copolymer. That is, m representing the number of -R ² ₂ SiO- in the middle unit and n representing the number of -R ¹ ₂ SiO- do not represent the number in the block, but the number of the respective intermediate units present in the entire molecule. Are represented by the sum. In other words, the polyorganosiloxane (1) may be a random copolymer.

The average degree of polymerization of the polyorganosiloxane (1), that is, the number of siloxane units, is represented by n + m + 2 in which n and m plus the number of terminal groups in Formula 1 are in the range of 100 to 500. desirable. As for average polymerization degree, 150-450 are more preferable, and 200-400 are especially preferable. If the average degree of polymerization of the polyorganosiloxane (1) is in the above range, there is no problem in the synthesis (polymerization) and the workability is also good.

It is preferable that the viscosity (25 degreeC) of the polyorganosiloxane (1) is 500-10000 mPa * s, and it is especially preferable that it is the range of 1000-5000 mPa * s. When the viscosity of the polyorganosiloxane (1) is in this range, the workability of the composition obtained is favorable and the physical characteristic of the silicone hardened | cured material obtained from this composition is favorable.

In addition, in this specification, a viscosity refers to the viscosity measured at 25 degreeC with the rotational viscometer unless there is particular notice. In addition, conditions, such as rotation speed at the time of a measurement, are suitably adjusted according to the viscosity of a sample and the measuring apparatus to be used.

In said Formula (1), R <^1> represents an alkenyl group or the alkyl group which may be substituted by halogen each independently. As an alkenyl group which the polyorganosiloxane (1) has, 2-8 carbon atoms, More preferably, 2-4 carbon atoms, such as a vinyl group, an allyl group, butenyl group, pentenyl group, hexenyl group, and heptenyl group, etc. It can be mentioned. Although the alkenyl group which the polyorganosiloxane (1) has may contain 2 or more types, it is preferable that it is comprised only 1 type. As an alkenyl group, a vinyl group and an allyl group are more preferable, and a vinyl group is especially preferable.

The number of containing of the alkenyl group in the said General formula (1) is two or more. Moreover, it is preferable that the number of containing of the alkenyl group in the said General formula (1) is 40 or less.

In Formula 1, at least two of R ¹ is an alkenyl group, and the alkenyl group may be bonded to a silicon atom at the terminal of the molecular chain, such as R ¹ represented by (R ¹ ₃ SiO _1/2 ), (R ¹ ₂ SiO) may be bonded to the silicon atom in the middle of the molecular chain, such as R ¹ . Furthermore, (R ¹ ₂ SiO) may be either the alkenyl group R ¹ in both of the two, either one may be an alkenyl group. The alkenyl group may be bonded to the silicon atom only at one of the terminal and the middle part of the molecular chain, but may be bonded to the silicon atom at both the terminal and the middle part of the molecular chain.

In the above formula (1), R ^{1 which} is not an alkenyl group represents an alkyl group which may be halogen substituted. As an alkyl group, a C1-C10 linear, branched, or cyclic alkyl group is mentioned. More preferable carbon atoms are 1-6. Specifically, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, cyclohexyl group, heptyl group, etc. are mentioned. As a halogen atom in halogen substitution, a chlorine atom and a fluorine atom are preferable. Specific examples of the halogen-substituted alkyl group include chloromethyl group, 3-chloropropyl group, 3,3,3-trifluoropropyl group, and the like. Although the halogen-substituted alkyl group which the polyorganosiloxane (1) may have may contain 2 or more types, it is preferable that it is comprised only 1 type. As an alkyl group which may be substituted by R <^1> , ie, halogen which is not an alkenyl group, a methyl group, an ethyl group, a 3,3, 3- trifluoropropyl group is more preferable, and a methyl group is especially preferable.

In Formula 1, R ² represents an aryl group. Examples of the aryl group include an aryl group having 6 to 14 carbon atoms. Specifically, a phenyl group, tolyl group, xylyl group, naphthyl group, etc. are mentioned. Although the aryl group which the polyorganosiloxane (1) has may contain 2 or more types, it is preferable that it is comprised only 1 type. As an aryl group, a phenyl group is especially preferable.

In the above formula 1, (R ^{₂ 2} SiO) the number of D units of the aryl group of two bonded to silicon atoms represented by m and, (R ¹ ₂ SiO) alkenyl group or a halogen substituted on the silicon atom represented by The relationship of the number n of D units which two good alkyl groups couple | bonded is a relationship which satisfy | fills 0.01 <m / (m + n) <0.10, Preferably it is a relationship of 0.04 <m / (m + n) <0.07 . When m / (m + n) is in the said range, both light transmittance and mechanical strength compatible with the silicone hardened | cured material obtained are attained. When m / (m + n) is 0.01 or less, transparency of a composition falls, and when 0.1 or more, mechanical strength, such as tensile strength and elongation, falls.

As (A) component, 1 type of polyorganosiloxane (1) may be used independently, and 2 or more types may be used together. In addition, when using 2 or more types together, it is not necessary to necessarily exist in the said range about the viscosity (25 degreeC) of each polyorganosiloxane (1), and viscosity (25 degreeC) as (A) component which mixed these is It is preferable to exist in the said range. The same applies to the average degree of polymerization. However, even when using 2 or more types of polyorganosiloxane (1) together, average degree of polymerization and a viscosity (25 degreeC) are the said range about each polyorganosiloxane (1) which comprises (A) component. It is more preferable that there is. As (A) component, when using combining 2 or more types of polyorganosiloxane (1), it is advantageous in viscosity adjustment.

[(B) component]

(B) component is at least one having an alkenyl group, x of R ¹ ₃ SiO _1/2 units, y of R ¹ ₂ SiO units, and z of SiO containing ₂ units (where each siloxane unit in the molecule In which each R ¹ independently represents an alkenyl group or an alkyl group which may be substituted by halogen), and x, y and z when converting the total of x, y and z into 1 are 0.3 ≦ x ≦ 0.5 and 0, respectively. A dendritic structure of <y ≦ 0.1, 0.4 ≦ z <0.7, that is, a polyorganosiloxane of a three-dimensional network structure. Hereinafter, the polyorganosiloxane of the said structure is called polyorganosiloxane (2).

Polyorganosiloxane (2) is (the same as in the case of single, R ¹ is the other siloxane units) within the range not impairing the effects of the present invention as necessary in addition to the siloxane units,, R ¹ SiO _3/2 units May be contained in the molecule. It is preferable that the mass mean molecular weight of the polyorganosiloxane (2) measured by the gel permeation chromatography method exists in the range of 1000-10000, and 3000-6000 are more preferable. If the mass average molecular weight of the polyorganosiloxane (2) is in the said range, there will be no operational problem by remarkable high viscosity of a composition, and the mechanical strength after hardening will also be favorable.

In addition, as long as the polyorganosiloxane (2) has the composition of a siloxane unit in the said range, regardless of property, it may be solid at normal temperature (25 degreeC), or may be a liquid with a relatively high viscosity, for example, 200 Pa * s or more.

In each of the siloxane units which the polyorganosiloxane (2) contains, about the kind and preferable aspect of the alkenyl group which R <^1> represents, or the alkyl group which may be substituted by halogen, the alkenyl group or halogen substitution which R <^1> in General formula (1) represents It is the same as the alkyl group which may be provided.

The polyorganosiloxane (2) has at least 1 alkenyl group in 1 molecule. The polyorganosiloxane (2) preferably has two or more alkenyl groups. Moreover, as for the number of containing of the alkenyl group in the polyorganosiloxane (2), 10 or less are preferable.

Polyorganosiloxane ^{_{(2) R 1 3 SiO 1}} /2 units, and siloxane units (hereinafter also referred to as "Mb unit") of the M unit combines three two R ¹ on the silicon atom, R ^1, which is contained in the molecule ₂ SiO units and siloxane units (hereinafter also referred to as "Db unit") of the R ¹ 2-deployed bond D unit to the silicon atom, SiO ₂ units are siloxane units of the Q unit it is not binding R ¹ to the silicon atom to be. The alkenyl group which one or more polyorganosiloxane (2) has in 1 molecule may be in the said Mb unit, and may be in the Db unit. In addition, a plurality of alkenyl groups may be present in Mb units, a plurality of alkenyl groups may be present, or may be present in each of Mb units and Db units.

The relationship between the number x of Mb units, the number y of Db units, and the number z of Q units that the polyorganosiloxane (2) has in one molecule is x, y when the sum of x, y, z is converted to 1; , z are in a relationship of 0.3 ≦ x ≦ 0.5, 0 <y ≦ 0.1, and 0.4 ≦ z <0.7, respectively. In this relation, y is more preferably 0.04 to 0.09. In addition, x is more preferably 0.36 to 0.44, and z is more preferably 0.45 to 0.60.

When the relationship of x, y, z calculated as x + y + z = 1 is the said relationship, both of sufficient light transmittance and mechanical strength in the silicone hardened | cured material obtained are attained. Moreover, when sealing is performed using the silicone composition for optical semiconductor element sealing, a cure rate can be suitably adjusted so that the shape at the time of supplying the said composition can be maintained. For example, even when the optical semiconductor element is to be sealed so as to be covered with a dome-shaped sealing material, curing can be completed while maintaining the dome shape when the composition is supplied when the relationship of x, y, and z is the above relationship. .

As (B) component, 1 type of polyorganosiloxane (2) may be used independently, and 2 or more types may be used together.

In the silicone composition for sealing optical semiconductor elements of the present invention, component (A) and component (B) are alkenyl group-containing polyorganosiloxanes serving as base polymers and contain 100 parts by mass in total. As a ratio of content of (A) component and (B) component, it is the quantity which (B) component becomes 10-40 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component, Preferably it is 15 It is -35 mass parts. If the ratio of content of (A) component and (B) component is the said range, the optimal hardness and sufficient mechanical strength will be provided to hardened | cured material.

[(C) component]

The polyorganohydrogensiloxane which has at least 2 hydrogen atoms couple | bonded with the silicon atom in 1 molecule which is (C) component acts as a crosslinking component which reacts with the said (A) component and (B) component. There is no restriction | limiting in particular in the molecular structure of (C) component, For example, various polyorganohydrogensiloxanes, such as a linear, cyclic, branched, three-dimensional network structure (resin structure), can be used.

The polyorganohydrogensiloxane of (C) component has a hydrogen atom couple | bonded with 2 or more, preferably 3 or more silicon atoms in 1 molecule, ie, a hydroxylyl group (Si-H group). When the polyorganohydrogensiloxane which is (C) component is linear, these Si-H groups may be located only in either one of the terminal and the middle part of a molecular chain, and may be located in both. The average number (average degree of polymerization) of the silicon atoms in one molecule of the component (C) is preferably 2 to 1,000, and more preferably about 3 to 100. It is preferable that the viscosity (25 degreeC) of (C) component is 500 mPa * s or less, and it is especially preferable that it is the range of 10-100 mPa * s. When the viscosity of (C) component exists in this range, the workability of the composition obtained is favorable and the physical characteristic of the silicone hardened | cured material obtained from this composition is favorable.

As (C) component, the polyorganohydrogensiloxane represented by General formula (3) which is the following average composition formula is used, for example.

(Formula 3)

(In the formula (3), R ³ is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 14 carbon atoms, more preferably 1 to 10 carbon atoms, having no aliphatic unsaturated group. A and b are 0.7 ≦ a ≦ 2.1). , 0.001≤b≤1.0, and 0.8≤a + b≤3.0, more preferably 1.0≤a + b≤2.5

As said R <^3> , a methyl group, an ethyl group, a propyl group, isopropyl group, a butyl group, isobutyl group, t-butyl group, a pentyl group, neopentyl group, hexyl group, cyclohexyl group, octyl group, nonyl group, for example Alkyl groups, such as a decyl group; Aryl groups such as phenyl group, tolyl group, xylyl group and naphthyl group; Aralkyl groups such as benzyl, phenylethyl and phenylpropyl groups; Groups in which some or all of the hydrogen atoms in these hydrocarbon groups are substituted with halogen atoms, for example, chloromethyl group, 3-chloropropyl group, bromoethyl group, 3,3,3-trifluoropropyl group, and the like. It is preferable that R <^3> is an alkyl group or an aryl group, More preferably, it is a methyl group or a phenyl group, Especially preferably, it is a methyl group.

As a specific example of (C) component, Molecular-chain sock end trimethylsiloxy group blocking methylhydrogen polysiloxane; Molecular chain sock end trimethylsiloxy group blocking dimethylsiloxane / methylhydrogensiloxane copolymer; Molecular chain sock end trimethylsiloxy group blockade dimethylsiloxane / methylhydrogensiloxane / diphenylsiloxane copolymer; Molecular chain sock end dimethylhydrogensiloxy group blockade dimethylpolysiloxane; Molecular chain sock end dimethylhydrogensiloxy group blockade dimethylpolysiloxane / methylhydrogensiloxane copolymer; Molecular chain sock end dimethylhydrogensiloxy group blocking dimethylsiloxane / diphenylsiloxane copolymer; Molecular chain sock end dimethylhydrogensiloxy group blocking diphenylpolysiloxane; ^{_{R 3 3 SiO 1/2 (}} R 3 are as defined above, R ³ is the same or less) a polyorganosiloxane copolymer consisting of units and R ³ ₂ HSiO _1/2 units and SiO ₂ units; R ³ polyorganosiloxane copolymer consisting of ₂ HSiO _1/2 units and SiO ₂ units; R ³ HSiO units, and the like polyorganosiloxane copolymer composed of R _³ SiO _^3/2 units or HSiO _3/2 units. These can be used individually by 1 type or in combination of 2 or more type.

As the component (C), among the above polyorganohydrogensiloxanes, in particular, a polymethylhydrogensiloxane having only a methyl group as an organic group bonded to a silicon atom, specifically R ³ in the above formula ( ³⁾ is a methyl group. Preference is given to polymethylhydrogensiloxanes.

Content of the polyorganohydrogensiloxane which is (C) component is hardening effective amount of the said (A) component and (B) component, The Si-H group which especially (C) component has, (A) component and (B) It is an amount which will be 1-3 mol with respect to 1 mol of total amounts of the alkenyl group (for example, vinyl group) which a component has, respectively, Preferably it is an amount which will be 1.2-2.5 mol. By containing (C) component in the said content, hardening reaction fully advances and unreacted Si-H group does not remain in a large amount in hardened | cured silicone, and the physical property of the silicone hardened | cured material obtained changes with time, none.

[(D) component]

The silica powder of (D) component may be a well-known thing generally mix | blended with a silicone hardened | cured material. (D) component has the effect | action which gives a suitable fluidity | liquidity and thixotropy property to the composition before bridge | crosslinking, and gives the high mechanical strength required according to the use to the crosslinked body of the polyorganosiloxane obtained by bridge | crosslinking.

In order to perform the above functions by adding the silica powder of component (D) to the composition of the present invention, the specific surface area (hereinafter referred to as BET specific surface area) by the BET method is preferably 50 m 2 / g or more, and 50 to 600 m <2> / g is more preferable, and 100-400 m <2> / g is especially preferable. Although there is no limitation in particular in the kind of silica, Precipitated silica, aerosol silica (fumed silica), calcined silica, etc. are used suitably. In view of reinforcement and thixotropy provision, fumed silica is preferred.

Although the silica powder of (D) component is an essential component in the composition of this invention, since many silanol groups (Si-OH group) exist in the untreated silica surface, when a silica powder is added as it is, thickening and remarkable plasticization return etc. Is prone to problems. Therefore, it is preferable to hydrophobize the surface of the silica powder. It is preferable that surface treatment amount is an amount which makes carbon amount of a silica surface 2.0 mass% or more, More preferably, it is 3.0 mass% or more. If it is less than 2.0 mass%, there is little effect on the thickening of a composition and the improvement of pot life. The upper limit of the amount of carbon is not particularly limited, but is usually 20% by mass or less, preferably 12% by mass or less, particularly 8% by mass or less. As silica powder of (D) component, what was surface-treated previously in the state of powder may be used, or you may surface-treat in a kneading process.

As the surface treatment method of the silica powder, a surface treatment technique well-known in general can be adopted. As an organosilicon compound used as a surface treating agent, hexaorgano disilazane, such as 1, 3- divinyl tetramethyl disilazane, 1, 3- dimethyl tetravinyl disilazane, hexamethyl disilazane, and octamethyl tri Organosilazanes such as octaorganotrisilazane such as silazane and 1,5-divinylhexamethyltrisilazane; Alkyltrialkoxysilanes such as methyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane and butyltrimethoxysilane; Dialkyl dialkoxysilanes such as dimethyldimethoxysilane, diethyldimethoxysilane, dimethyldiethoxysilane and diethyldiethoxysilane; Alkenyltrialkoxysilanes such as vinyltriethoxysilane, vinyltrimethoxysilane and vinyltris (methoxyethoxy) silane; Diallkenyl dialkoxysilanes, such as divinyl dimethoxysilane and divinyl diethoxysilane; Trialkylalkoxysilanes such as trimethylmethoxysilane and triethylmethoxysilane; Trialkenyl alkoxysilane, such as trivinyl methoxysilane and trivinyl ethoxysilane; Organochlorosilanes such as trimethylchlorosilane, dimethyldichlorosilane, methyltrichlorosilane, vinyltrichlorosilane, divinyldichlorosilane and trivinylchlorosilane; And silane coupling agents such as chloropropyltrimethoxysilane; Dimethyl polysiloxane (including a cyclic structure), organohydrogen polysiloxane, etc. are mentioned, These partial hydrolysis reactants may be sufficient. Among these, silane coupling agents, cyclic dimethylpolysiloxanes, and organosilazanes in which substituents bonded to silicon atoms other than hydrolyzable groups are methyl groups are preferable.

As a silica powder of (D) component, you may use a commercial item. Commercially available aerosol silica is a surface untreated aerosol 200 (trade name, product of EVONIC, BET specific surface area: 200 m 2 / g), aerosil 300 (product name, product of EVONIC, BET specific surface area: 300 m 2 / g) Etc. can be mentioned. Moreover, in this invention, it is preferable to use the silica powder which surface-treated these commercial items with octamethylcyclo tetrasiloxane, hexamethyldisilazane, etc. (D) A component may use 1 type or may use 2 or more types together.

Content of (D) component in the composition of this invention is 5-20 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component, and 10-15 mass parts is preferable. When content of the silica powder which is (D) component exists in the said range, the viscosity of a composition will become suitable, the workability at the time of shaping | molding will be maintained favorable, and the characteristics, such as mechanical strength of the silicone hardened | cured material obtained, are also fully maintained.

[(E) component]

The hydrosilylation reaction catalyst as the component (E) is a catalyst that promotes the addition reaction (hydrosilylation reaction) of the alkenyl group contained in the component (A) and the component (B) to the Si—H group in the component (C). to be. Examples of the component (E) include a platinum catalyst, a palladium catalyst, a rhodium catalyst, and the like, but from the viewpoint of economical efficiency, a platinum catalyst is preferable. As the platinum-based catalyst, for example, a chloroplatinic acid, an alcohol-modified platinum chloride, a chloroplatinic acid and a coordination compound of olefins, vinylsiloxane, or acetylene compound can be used. These can be used individually by 1 type or in combination of 2 or more type.

The content of the component (E) is not particularly limited as long as it is an amount effective as a catalyst for the hydrosilylation reaction, but is converted into platinum element based on the total amount (mass) of the component (A), the component (B) and the component (C). 0.1-1,000 ppm, More preferably, it is 1-500 ppm, More preferably, it is the range of 1-20 ppm. When the content is in this range, the addition reaction is sufficiently promoted, and as a result, sufficient curing is obtained and economically advantageous.

[Arbitrary component- (F) component]

The silicone composition for encapsulating the optical semiconductor element of the present invention further provides adhesiveness comprising at least two selected from epoxy groups, hydrosilyl groups (Si-H groups), crosslinkable vinyl groups, and alkoxysilyl groups as (F) components. It is preferable to contain an agent.

As an adhesive imparting agent of (F) component, the silane coupling agent (F1) represented by following General formula (4) is mentioned, for example.

(Formula 4)

(Wherein R ¹¹ is an alkyl group having 1 to 5 carbon atoms, X is an alkoxy group having 1 to 5 carbon atoms, Y is an epoxy group or a vinyl group which may be substituted, and Q is a single bond, -O-,- Each C1-C10 divalent hydrocarbon group which may have a C (= O) -O- bond, p is 0 or 1, and some X may be same or different)

As YQ-, specifically, a vinyl group, a vinylphenyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, 2- (3, 4- epoxycyclohexyl) ethyl group, 3-glycidoxy propyl group, etc. Can be mentioned. As R ¹¹ , a methyl group is preferable. As X, a methoxy group and an ethoxy group are preferable.

As an adhesive imparting agent of (F) component, for example, the organosiloxane oligomer which has at least 2 Si-H groups in 1 molecule, the functional group and epoxy group which can react with a Si-H group, a crosslinkable vinyl group, The compound (F2) obtained by making the compound which has at least 1 sort (s) chosen from an alkoxy silyl group react is also used preferably.

The organosiloxane oligomer having a Si—H group is preferably 2 to 10 silicon atoms, more preferably 2 to 6 silicon atoms. As an organosiloxane oligomer which has a Si-H group, the organosiloxane oligomer represented by (S1)-(S4) of the following general formula is mentioned, for example. Among these, the organosiloxane oligomer represented by (S1) is preferable.

(However, in the above formula (S4), q is an integer of 0-8.)

As a compound which has a functional group which can react with the Si-H group of the organosiloxane oligomer which has the said Si-H group, and at least 1 sort (s) chosen from an epoxy group, a crosslinkable vinyl group, and an alkoxy silyl group, For example, (Formula 4) The silane coupling agent (F1) which has a vinyl group which has a vinyl group, a vinylphenyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, etc. as YQ- is mentioned among the silane coupling agents represented by these.

More specifically, 1: 1 reaction product is mentioned by molar ratio of the organosiloxane oligomer represented by (S1) and the silane coupling agent (F1) which has 3-methacryloxy propyl group. The obtained reaction product is a compound (F2) which has an alkoxysilyl group and Si-H group.

As an adhesive imparting agent of (F) component, 1 type of hydrogen of the 1,3,5 position of isocyanuric acid is respectively independently chosen from an epoxy group, a Si-H group, a crosslinkable vinyl group, and an alkoxysilyl group. You may use the isocyanuric acid derivative (F3) substituted by the monovalent organic group which has these. As the isocyanuric acid derivative (F3), an isocyanuric acid derivative having an alkoxysilyl group is preferable.

(F) A component may use 1 type or may use 2 or more types together. Preferable combination is a combination of at least one of the silane coupling agents (F1) having an epoxy group and at least one of the compounds (F2) having an alkoxysilyl group and a Si—H group. Moreover, it is preferable to contain (F) component in the ratio of 0.1-10 mass parts with respect to a total of 100 mass of (A) component and (B) component, and 1-5 mass parts is more preferable.

[Arbitrary component- (G) component]

It is preferable that the silicone composition for optical semiconductor element sealing of this invention further contains a liquid thixotropic imparting agent as (G) component. (G) A component is a liquid compound which expresses thixotropy by forming a hydrogen bond and pseudo crosslinking with the hydroxyl group which the silica powder of (D) component has. In addition, in this specification, a liquid state means a liquid state, ie, the state which has fluidity, for example, a state whose viscosity is 1000 mPa * s or less at least at room temperature (25 degreeC).

As a liquid thixotropy-imparting agent, the silane and silicone compound (organopolysiloxane) which has either polar groups, such as organooxy groups, such as a hydroxyl group (-OH group), an alkoxy group, an alkenyloxy group, and an aryloxy group, and an epoxy group And organic resin components such as polyether. Specifically, polyoxypropylene glycol, alkoxysilanes, cyclic siloxane containing the said functional group, etc. are mentioned.

(G) A component may use 1 type or may use 2 or more types together. Moreover, it is preferable to contain (G) component in the ratio of 0.005-5 mass parts with respect to a total of 100 mass parts of (A) component and (B) component, and 0.01-3 mass parts is more preferable.

Moreover, in the compound of the said (F) component, there exist many compounds which have a function of providing adhesiveness, and are liquid and have a function of providing thixotropy. In the silicone composition for optical semiconductor element sealing of this invention, when (F) component which is an arbitrary component is not mix | blended, or even if it mix | blends, (F) component does not have the function of providing thixotropy, (G) component is used. By adjusting within said range, it is preferable to make thixotropy into sufficient level, for example in the index ((eta) ₂ / (eta) ₂₀ ) mentioned later.

Further, when the compound used as the component (F) for imparting adhesion as described above is blended into the composition of the present invention in a sufficient amount functioning as the component (F) (adhesiveness), thixotropy is thereby achieved. For example, when sufficient level is not reached by the below-mentioned index, the amount which reaches the level with sufficient thixotropy for (G) component which does not function as a component (G) component, Preferably an adhesive agent is provided separately. It is preferable to mix | blend with. For example, when the component like (F1), (F2), (F3) is mix | blended in the said preferable quantity as (F) component, As a compounding quantity of (G) component, it depends also on the kind of (G) component, (A The ratio of 0.005-1 mass part is preferable with respect to 100 mass of the sum total of a component and (B) component, and 0.01-0.5 mass part is more preferable. In addition, as (G) component in this case, polyether like polyoxypropylene glycol is used preferably.

Moreover, when mix | blending the compound used as (F) component for the provision of adhesiveness with the composition of this invention in sufficient quantity which functions as (F) component (adhesiveness-imparting agent), thixotropy property is given by this, for example. When sufficient level is reached by the below-mentioned index, it is not necessary to mix | blend (G) component further separately. Thus, in the silicone composition for optical semiconductor element sealing of this invention, when using combining (F) component and (G) component, both adhesiveness and thixotropy are obtained about a required level, for example adhesiveness, is obtained. It is good to mix | blend so that the hardened | cured material may correspond to the level which ensures sufficient adhesiveness with an optical semiconductor element or a support substrate, and thixotropy is sufficient level with the index mentioned later.

[Other Optional Ingredients]

The silicone composition for optical semiconductor element sealing of this invention contains each component of said (A)-(E) as an essential component in the said content, and as these optional components to these (F) component, (G) A component is contained in said content. Moreover, you may add the reaction inhibitor which suppresses a hydrosilylation reaction as an optional component.

As a reaction inhibitor, For example, phosphorus containing compounds, such as triphenylphosphine; Nitrogen-containing compounds such as tributylamine, tetramethylethylenediamine and benzotriazole; Sulfur-containing compounds, acetylene compounds, compounds containing two or more alkenyl groups, hydroperoxy compounds, maleic acid derivatives, and the like, and the like, and preferably 3-methyl-1-butyn-3-ol and 1- It is an acetylene type compound which has hydroxyl groups, such as a thynyl- 1-cyclohexanol.

In addition, the silicone composition for optical semiconductor element sealing of the present invention includes inorganic fillers other than the silica powder of the above-mentioned (D) component, such as polyorganosiloxane, crushed silica (quartz micropowder), aluminum oxide, etc. other than the above-mentioned. Conductive fillers, phosphors for obtaining the desired emission color in the optical semiconductor device used, organic solvents such as toluene, xylene, hexane, heptane, ethanol, isopropyl alcohol, acetone, methyl ethyl ketone, dyes, pigments, flame retardant Ranges that do not impair the properties of the composition of the present invention and the cured product described below, the heat resistance improver, the oxidation deteriorating agent, the wavelength adjusting agent and the like, and the range which does not impair the object of the present invention. You may add from.

As a manufacturing method of the silicone composition for optical semiconductor element sealing of this invention, the addition order of each component is not specifically limited, The (F) component as an essential component of (A)-(E) and the arbitrary component added preferably And (G) component and the method of kneading the other arbitrary components mentioned above with a well-known kneader. As the kneader, for example, a planetary mixer, a three roll, a kneader, a Shinagawa mixer, etc., provided with heating means and cooling means, may be used.

It is preferable that the silicone composition for optical semiconductor element sealing of this invention is liquid, and the viscosity (eta) ₂₀ of ₂₀ rpm in 25 degreeC by a rotational viscometer is 10-50 Pa.s. When the viscosity exceeds 50 Pa · s, clogging of the dispenser is likely to occur, for example, when potting to LEDs. On the other hand, if it is less than 10 Pa.s, liquid dripping is likely to occur when potting.

As for the silicone composition for optical semiconductor element sealing of this invention, it is preferable that ratio (eta) ₂ / (eta) ₂₀ of the viscosity (eta) ₂ of 2 rpm at 25 degreeC and the viscosity (eta) _{20 of} 20 rpm by 25 degreeC with a rotational viscometer is 1.8-6.0, and (eta) _2. / η _20, it is more preferably 2.0 ~ 5.0. The value of (eta) ₂ / (eta) ₂₀ can be used as an index which evaluates the thixotropy of the silicone composition for optical semiconductor element sealing of this invention. By having? ₂ / η ₂₀ in the above range, the discharged composition can maintain an appropriate dome shape. The appropriate dome shape indicates that the ratio of height / diameter is 0.2 to 0.5. As the rotational viscometer, for example, bismetrone VDH type (manufactured by Shibaura Systems Co., Ltd.) is preferable.

As for the silicone composition for optical semiconductor element sealing of this invention, refractive index (25 degreeC, D line) is 1.41-1.44, and refractive index (25 degreeC, D line) has preferable 1.42-1.43. In addition, the refractive index of the composition can be measured using, for example, an Abbe refractometer. In addition, in this specification, a refractive index is the refractive index measured by 25 degreeC and D line | wire unless there is particular notice. Since the refractive index in this composition exists in the said range, the silicone hardened | cured material obtained is high in light, for example, light of wavelength 400nm, and is excellent in mechanical strength, such as tensile strength and elongation.

As for the silicone composition for optical semiconductor element sealing of this invention, when the silicone hardened | cured material obtained by hardening this is measured as a sheet of thickness 2mm, it is preferable that the transmittance | permeability of the light of wavelength 400nm at 25 degreeC is 90% or more, 93% It is more preferable that it is above. If the transmittance | permeability of the light of wavelength 400nm is the said range, it can be said that it has sufficient light transmittance as a sealing material at the time of sealing the photoconductor element. In addition, the transmittance | permeability of light can be measured, for example with an ultraviolet-visible, near-infrared spectrophotometer.

In the silicone cured product obtained by curing the silicone composition for optical semiconductor element sealing according to the present invention, the hardness at 25 ° C. measured by a TYPE A type hardness tester based on JIS K6249 is preferably 30 to 80, and is 50 to 50 It is more preferable that it is 70. If the hardness in 25 degreeC measured with a TYPE A-type hardness meter is the said range, it can be said that it has sufficient mechanical strength as a sealing material at the time of sealing an optical semiconductor element.

The silicone composition for sealing an optical semiconductor element of the present invention is also preferably a silicone cured product obtained by curing the same, and the tensile strength at 25 ° C. measured by a tensile tester based on JIS K6249 and measured by a tensile tester is preferably 4 MPa or more. It is more preferable that it is 6 Mpa or more. In addition, the elongation measured at the same time as the tensile strength is preferably 70% or more, more preferably 100% or more. When the tensile strength and the elongation are within the above ranges, it can be said to have sufficient mechanical strength as a sealing material when the optical semiconductor element is sealed.

In hardening the silicone composition for optical semiconductor element sealing of this invention, hardening is mainly performed by making a hydrosilylation reaction to (A) component, (B) component, and (C) component. At this time, the curing reaction can be appropriately adjusted according to the type of the reaction inhibitor and the amount thereof added. As conditions for preferable hardening, the conditions etc. which heat for 60 to 300 minutes at 50-200 degreeC are mentioned. The silicone hardened | cured material obtained in this way is a hard rubber shape or the resin shape which has flexibility, and has favorable light transmittance and mechanical strength as mentioned above.

The hardened | cured material of the silicone composition for optical semiconductor element sealing of this invention is used as a sealing material which seals optical semiconductor elements, such as LED mounted on the board | substrate. When the silicone composition for sealing an optical semiconductor element of the present invention is used, for example, for COB (chip on board), first, the silicone composition for sealing an optical semiconductor element is formed on an optical semiconductor element mounted on a substrate. The predetermined amount is supplied so that the whole may be covered. Sealing is then effected by curing the composition. The silicone composition for sealing an optical semiconductor element of the present invention is particularly capable of maintaining a predetermined shape, for example, a dome shape, from supplying on the optical semiconductor element until the completion of curing, and particularly COB (chip on Board).

The optical semiconductor device of this invention is made by sealing an optical semiconductor element using the silicone composition for optical semiconductor element sealing of the said invention. In the optical semiconductor device of the present invention, the optical semiconductor element to be sealed is not particularly limited. The support structure on which the optical semiconductor element is mounted is not particularly limited and may be a package, and may be a package-less support substrate such as a ceramic substrate, a silicon substrate, a glass epoxy substrate, a bakelite (epoxy resin), or a package. ), A metal substrate, or the like. The method of sealing is not particularly limited, and according to various sealing methods, a predetermined amount of the silicone composition for sealing an optical semiconductor element of the present invention is supplied so that the optical semiconductor element is sealed, and the optical semiconductor device is cured under predetermined conditions. It can manufacture. Moreover, as a sealing method, COB is preferable as mentioned above. Moreover, as an optical semiconductor device of this invention, general-purpose optical semiconductor devices, such as a photodiode, CCD, CMOS, are mentioned.

Example

Hereinafter, although the Example of this invention is described, this invention is not limited to these Examples.

In addition, in the following Examples, for the measurement of the viscosity of each component, Bismetron VDH type (manufactured by Shibaura Systems Co., Ltd.) was used as the rotational viscometer for the measurement at the rotational speeds of 20 rpm and 2 rpm, and for the measurement at the rotational speed of 60 rpm Bismetron VDA type (made by Shibaura Systems Co., Ltd.) was used.

In the following examples and comparative examples, the polyorganosiloxane shown in the following Table 1 was used as (A) component, (B) component, and (C) component. Table 1 shows the polyorganosiloxane abbreviation, average molecular formula or average unit formula (expressed in unit formula only for average unit formula), viscosity [mPa · s] or mass average for each component in Table 1. The molecular weight (Mw) is shown. In addition, in Table 1, except a component (B), a viscosity is shown. In addition, about the (A) component and the following (Ac) components, the viscosity was measured on 60 rpm rotation conditions by the No. 4 rotor, and about (C) component was measured on the rotation conditions of 60 rpm by No. 1 rotor.

In addition, in Table 1, linear polymer (A1) and (A2) are linear polyorganosiloxane classified into (A) component used for the composition of this invention, and linear polymer (Ac1)-(Ac4) are this invention. It is a linear polyorganosiloxane used for the comparative example which is not classified into (A) component used for the composition of this. Linear polymers (Ac1) to (Ac4) are called (Ac) components.

Further, (A) in the component, (Ac) component, and the number of Ph ₂ SiO units to the number n m, Me ₂ SiO units, was calculated m / (m + n). The results are shown in Table 1 together. Linear polymer (A1) and (A2) are in the range of 0.01 <m / (m + n) <0.10 which is the range of (A) component of the composition of this invention, and linear polymer (Ac1)-(Ac4) are the said Out of range

Moreover, when the ratio of each siloxane unit in the dendritic polymer (B1) of (B) component is represented by said x, y, z, it is x = 0.40, y = 0.07, z = 0.53.

  In Table 1, Vi represents a vinyl group, Me represents a methyl group, and Ph represents a phenyl group.

In addition, the following compounds etc. were used as (D) component-(G) component.

(D) component: silica powder

Silica powder (D1): Aerosol silica with a specific surface area of about 140 m 2 / g, with the surface treated with hexamethyldisilazane. 4 mass% of carbon on a silica surface.

Silica powder (D2): Aerosol silica having a specific surface area of about 200 m 2 / g, with the surface treated with hexamethyldisilazane. 3.5 mass% of carbon on silica surface.

(E) Component: Hydrosilylation Reaction Catalyst

Vinyl dimer coordination platinum catalyst (simply called "platinum catalyst")

(F) Component: Adhesion Imparting Agent

Adhesion imparting agent 1: the formula (S1) (HMeSiO), based on 1 mol of ₃ (Me ₂ SiO) shown in Fig., 3-methacryloxypropyl trimethoxysilane reaction product obtained by reacting one mole of the silane.

Adhesion Imparting Agent 2: 3-glycidoxypropyltrimethoxysilane

(G) Component: Liquid Thixotropy Imparting Agent

Polyoxypropylene glycol (Mw: 2000, viscosity (25 degreeC, No. 3 rotor, 60 rpm) 300 [mPa * s])

[Examples 1-6, Comparative Examples 1-3]

Each component was mixed by the composition shown in Table 2, and the silicone composition for optical semiconductor element sealing of Examples 1-6 and Comparative Examples 1-3 was manufactured. In addition, the following method was used in order to contain (B) component which is a solid component uniformly in a composition. First, after mixing (B) component with (A) component as a xylene solution of a suitable density | concentration, the mixture of (A) component and (B) component was produced by removing xylene by heating and / or reduced pressure. . The composition of each example was produced by mixing the said mixture with another component.

In addition, in Table 2, content of (E) component is content (ppm) of platinum element conversion with respect to the total mass of (A) component, (B) component, and (C) component.

[evaluation]

The silicone composition for optical semiconductor element sealing obtained above and the silicone hardened | cured material obtained by hardening this were evaluated about the following evaluation items. The results are shown in Table 2 together.

(1) Evaluation of composition

Refractive index

About each composition, the refractive index of D line | wire was measured at 25 degreeC using the Abbe refractometer.

(Viscosity, thixotropy evaluation (viscosity ratio η ₂ / η ₂₀ ))

For each composition, using a rotational viscometer, and measured the 2rpm viscosity η ₂ and 20rpm Viscosity η ₂₀ of the rotor according to No.6, and the viscosity rating the trophy thixo property by calculating the ratio η ₂ / η _20.

(2) Evaluation of the Cured Product

(Production of test piece by hardened material)

Each composition obtained above was hardened on conditions of 150 degreeC and 60 minutes, and the sheet-like test piece of thickness 2mm for transmissivity measurement was obtained. Moreover, the dumbbell type No. 2 was produced as the test piece for mechanical characteristics measurement based on JISK6249 from the sheet-like hardened | cured material hardened | cured similarly.

Transmittance

Using the sheet-shaped test piece of thickness 2mm for transmittance measurement, the light transmittance [%] with respect to the light of wavelength 400nm was measured with the spectrophotometer at 25 degreeC.

(Mechanical strength)

Using the test piece for measuring mechanical properties, hardness (TYPE A), tensile strength [MPa], and elongation [%] at 25 ° C. were measured according to JIS K6249.

As is clear from Table 2, the silicone composition for optical semiconductor element sealing of the present invention has a high transmittance of 400 nm light required for the optical semiconductor device in the cured silicone product, and is also excellent in mechanical strength. Moreover, in the composition of Comparative Examples 1-3 which are outside the range of the composition of this invention, the transmittance | permeability and / or mechanical strength of wavelength 400nm light are not enough in the silicone hardened | cured material obtained.

Claims (8)

(A) a polyorganosiloxane represented by the following formula (1);
(Formula 1)

(However, in the formula (1), each R ¹ independently represents an alkyl group which may be optionally substituted with an alkenyl group or halogen, R ² each independently represents an aryl group, at least two of R ¹ is an alkenyl group, and 0.01 <m / ( m + n) <0.10),
(B) has at least one alkenyl group in one molecule, and contains x R ¹ ₃ SiO _1/2 units, y R ¹ ₂ SiO units, and z SiO ₂ units (but, in each siloxane unit, R ¹ is each independently an alkenyl group, or a halogen may be substituted represents an alkyl group, and at least one of R ¹ in R ¹ ₂ SiO units is an alkenyl group.), x, y, when converting the sum of z to 1, 100 mass of the polyorganosiloxane of dendritic structure whose x, y, and z are 0.3 <= x <0.5, 0 <y <0.1, and 0.4 <z <0.7, respectively, in the sum total of (A) component and (B) component In addition, the amount which (B) component becomes 10-40 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component further;
(C) Silicon atom with respect to 1 mol of total amounts of the polyorganohydrogensiloxane which has a hydrogen atom couple | bonded with at least 2 silicon atoms in 1 molecule, respectively with the said alkenyl group which (A) component and (B) component have, respectively The amount of hydrogen atoms bonded to 1 to 3 mol;
(D) 5-20 mass parts of silica powder; And
(E) catalytic amount of hydrosilylation reaction catalyst;
And a refractive index (25 degreeC, D line) are respectively 1.41-1.44, The silicone composition for optical semiconductor element sealing characterized by the above-mentioned. The method of claim 1,
Furthermore, the optical semiconductor containing 0.1-10 mass parts of adhesion | attachment imparting agents containing at least 2 sort (s) chosen from (F) an epoxy group, a hydrosilyl group (Si-H group), a crosslinkable vinyl group, and an alkoxy silyl group. Silicone composition for sealing the device. The method of claim 1,
Furthermore, (G) Silicone composition for optical semiconductor element sealing containing 0.005-5 mass parts of liquid thixotropy-imparting agents. The method of claim 1,
A silicone composition for sealing an optical semiconductor element, wherein a silicone cured product having a transmittance of light having a wavelength of 400 nm at 25 ° C. of 90% or more at 25 ° C. is provided. The method of claim 1,
Silicone composition for optical-semiconductor element sealing whose ratio (eta) ₂ / (eta) ₂₀ of the viscosity (eta) ₂ of 2 rpm at 25 degreeC, and the viscosity (eta) ₂₀ of ₂₀ rpm by a rotational viscometer are 1.8-6.0. The method of claim 1,
The silicone composition for optical-semiconductor element sealing provided with the silicone hardened | cured material whose hardness by a TYPE A-type hardness tester measured at 25 degreeC based on JISK6249 is 30-80, and tensile strength is 4 Mpa or more. The method of claim 1,
The silicone composition for optical semiconductor element sealing whose polyorganohydrogensiloxane of the said (C) component is polymethylhydrogensiloxane which has only a methyl group as an organic group couple | bonded with a silicon atom. The optical semiconductor device by which the optical semiconductor element is sealed by the hardened | cured material of the silicone composition for optical semiconductor element sealing in any one of Claims 1-7.