CN104449550A - Organic silicon composition and application thereof - Google Patents
Organic silicon composition and application thereof Download PDFInfo
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- CN104449550A CN104449550A CN201310750313.4A CN201310750313A CN104449550A CN 104449550 A CN104449550 A CN 104449550A CN 201310750313 A CN201310750313 A CN 201310750313A CN 104449550 A CN104449550 A CN 104449550A
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- 239000000203 mixture Substances 0.000 title claims abstract description 99
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 61
- 239000010703 silicon Substances 0.000 title claims abstract description 61
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 49
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 48
- 239000005543 nano-size silicon particle Substances 0.000 claims abstract description 20
- 238000007259 addition reaction Methods 0.000 claims abstract description 16
- 238000013006 addition curing Methods 0.000 claims abstract description 10
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 34
- 239000001257 hydrogen Substances 0.000 claims description 24
- 229910052739 hydrogen Inorganic materials 0.000 claims description 24
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 16
- 150000002431 hydrogen Chemical class 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000009998 heat setting Methods 0.000 claims description 11
- 239000003112 inhibitor Substances 0.000 claims description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 125000000962 organic group Chemical group 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 238000012856 packing Methods 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 35
- 229920000642 polymer Polymers 0.000 abstract description 12
- -1 vinyl siloxane Chemical class 0.000 abstract description 12
- 238000001723 curing Methods 0.000 abstract description 10
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 7
- 238000002834 transmittance Methods 0.000 abstract description 5
- 239000003054 catalyst Substances 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 230000003287 optical effect Effects 0.000 abstract description 3
- 230000032683 aging Effects 0.000 abstract description 2
- 238000005984 hydrogenation reaction Methods 0.000 abstract 3
- 230000002349 favourable effect Effects 0.000 abstract 2
- 239000005022 packaging material Substances 0.000 abstract 2
- 239000002683 reaction inhibitor Substances 0.000 abstract 1
- 238000004073 vulcanization Methods 0.000 abstract 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 27
- 239000000463 material Substances 0.000 description 13
- 229910052697 platinum Inorganic materials 0.000 description 13
- 239000000377 silicon dioxide Substances 0.000 description 13
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 10
- 229960001866 silicon dioxide Drugs 0.000 description 10
- 239000007788 liquid Substances 0.000 description 9
- 238000013459 approach Methods 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 7
- GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 description 5
- 101150065749 Churc1 gene Proteins 0.000 description 5
- 102100038239 Protein Churchill Human genes 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 3
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- OEOIWYCWCDBOPA-UHFFFAOYSA-N 6-methyl-heptanoic acid Chemical compound CC(C)CCCCC(O)=O OEOIWYCWCDBOPA-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- QDLYEPXRLHYMJV-UHFFFAOYSA-N propan-2-yloxyboronic acid Chemical compound CC(C)OB(O)O QDLYEPXRLHYMJV-UHFFFAOYSA-N 0.000 description 2
- 239000006254 rheological additive Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 230000003245 working effect Effects 0.000 description 2
- BVNZLSHMOBSFKP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxysilane Chemical compound CC(C)(C)O[SiH3] BVNZLSHMOBSFKP-UHFFFAOYSA-N 0.000 description 1
- QPKFVRWIISEVCW-UHFFFAOYSA-N 1-butane boronic acid Chemical compound CCCCB(O)O QPKFVRWIISEVCW-UHFFFAOYSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 125000003963 dichloro group Chemical group Cl* 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- FEHYCIQPPPQNMI-UHFFFAOYSA-N ethenyl(triphenoxy)silane Chemical compound C=1C=CC=CC=1O[Si](OC=1C=CC=CC=1)(C=C)OC1=CC=CC=C1 FEHYCIQPPPQNMI-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- RJMRIDVWCWSWFR-UHFFFAOYSA-N methyl(tripropoxy)silane Chemical compound CCCO[Si](C)(OCCC)OCCC RJMRIDVWCWSWFR-UHFFFAOYSA-N 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- HCOKJWUULRTBRS-UHFFFAOYSA-N propan-2-yloxysilane Chemical compound CC(C)O[SiH3] HCOKJWUULRTBRS-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003284 rhodium compounds Chemical class 0.000 description 1
- 102220275913 rs754497897 Human genes 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses an organic silicon composition and application thereof. The organic silicon composition comprises at least one vinyl siloxane polymer capable of curing by silicon hydrogenation addition reaction, at least one hydrogen-radical siloxane polymer, at least one vinyl POSS (polyhedral oligomeric silsesquioxane), organic-group-modified nano silicon dioxide, a silicon hydrogenation addition curing catalyst and other basic components, and can further comprise a silicon hydrogenation addition reaction inhibitor, a binding accelerator and the like. The organic silicon composition has favorable physical and chemical comprehensive properties (including favorable flowability, high curing speed, high curing ratio, high curing hardness, high light transmittance and the like), has the characteristics of high vulcanization resistance, low aging speed, stable performance and the like, is suitable to be used as binding and packaging materials for optical and electronic devices, and is especially suitable to be used as a packaging material for LEDs (light-emitting diodes) and other semiconductor light-emitting elements.
Description
Technical field
The present invention be more particularly directed to a kind of silicon composition, it is suitable for as the application such as cementing compositions, packaged material.
Background technology
LED material is on luminous efficiency, brightness, the power of LED and have work-ing life and important impact.Wherein, the packaged material of the resistance to ultraviolet/thermal ageing of high refractive index, high transmission rate and excellence can effectively improve LED light output rate and work-ing life.
Current conventional power type LED encapsulation material mainly organosilicon material, it has low-shrinkage and does not discharge the advantages such as by product in the curing process, but it still exists more deficiency in the performances such as specific refractory power, solidification hardness.For this reason, industry proposes kinds of schemes to promoting the respective performances of organosilicon encapsulating material, then although truly have lifting through modified material performance in some aspects, it can cause again the decline of some performances of other side simultaneously.
Such as, publication number is the modification technology involved by US7527871A, US2004116640A1, EP1424363B1, CN101066446A, CN102181159A, CN103022320A, CN101565535A etc., and it cannot realize the comprehensive lifting of organosilicon material in specific refractory power, weathering resistance, transmittance, mechanical property etc.
Summary of the invention
An object of the present invention is to provide a kind of silicon composition, and it has the over-all propertieies such as excellent optics, mechanics, to overcome deficiency of the prior art.
The basic components of a kind of silicon composition of the present invention comprises:
At least one vinyl silicone polymer and at least one hydrogen silicone polymer of hydrosilation addition (hydrosilylation reaction) reaction solidification can be passed through,
And, the nano silicon that at least one vinyl POSS, organic group are modified and hydrosilation addition curing catalyzer.
Further, in the basic components of described composition, the content of described vinyl silicone polymer and hydrogen silicone polymer is 60 ~ 99wt%, is preferably 75 ~ 99wt%, is especially preferably 85 ~ 95wt%.Further, in the basic components of described composition, contained by described hydrogen silicone polymer institute's silicon-hydrogen bond containing and described vinyl silicone polymer, the mol ratio of vinyl is 1:0.7 ~ 1:1.4.
Further, in the basic components of described composition, the content of described vinyl POSS is 0.1 ~ 20wt%, is preferably 1 ~ 10wt%, is especially preferably 1 ~ 6wt%.
Further, in the basic components of described composition, the content of described nano silicon is 0.1 ~ 20wt%, is preferably 1 ~ 10wt%.
Further, described composition also comprises addition reaction of silicon with hydrogen inhibitor,
Wherein, the content of described hydrosilation addition curing catalyzer is 0.1 ~ 1000ppm, is preferably 1 ~ 100ppm, is especially preferably 1 ~ 20ppm.
And 0.001 ~ 1wt% of component based on the consumption of described addition reaction of silicon with hydrogen inhibitor, be preferably 0.005 ~ 0.5wt%, be especially preferably 0.01 ~ 0.1wt%.
Further, described composition also comprises more than one adhesive accelerants, and the content of described adhesive accelerant is 0.001 ~ 10wt%, is preferably 0.01 ~ 5.0wt%, is especially preferably 0.01 ~ 1.0wt%, more preferably 0.01 ~ 0.05wt%.
Further, the cured article formed by described composition for the refractive index of visible ray between 1.35 ~ 1.60, preferably more than 1.5.
Another object of the present invention is to provide aforementioned organic silicon composition in bonding article or the application at least in packaged articles local surfaces.
Another object of the present invention is to provide a kind of article adhering method, comprising:
First article and the second article are provided,
Aforementioned organic silicon composition is applied between the first article and the second article,
And, under selected temperature condition, make the complete thermofixation of described silicon composition, thus the first article and the second article are adhesively fixed.
Another object of the present invention is to provide a kind of method for packing, comprising:
At least select regional area as packaging area at article surface and/or inside,
And, apply described silicon composition at described packaging area,
And, under selected temperature condition, make the complete thermofixation of described silicon composition, realize the encapsulation to article.Such as, as one of comparatively preferred embodiment, at room temperature ~ 260 DEG C, the complete thermofixation of described silicon composition can be made within the time of 1min ~ 24h, realize the encapsulation of article or be adhesively fixed.
Another object of the present invention is to provide a kind of electron device or photoelectric device, comprises the cured article that described silicon composition is formed.
Wherein, described photoelectric device comprises semiconductor light-emitting elements, and described semiconductor light-emitting elements comprises LED, but is not limited thereto.
In the present invention, aforesaid " encapsulation " (packaging) should be understood at least comprise following connotation, as, by described silicon composition by bonding for two or more article (adhesive), or, by described silicon composition some regions curing formation protective layer (coating) at article surface, or, the local of one or more article is immersed in the cured article formed by described silicon composition, or, by one or more article entirety embedding sealing (encapsulation) in the cured article formed by described silicon composition, certainly, also can realize aforesaid bonding simultaneously, coating, the functions such as sealing.
Compared with prior art, as previously mentioned, silicon composition provided by the invention has excellent thing, voltinism energy, includes but not limited to good mobility, have good optical, electrical performance and mechanical property etc. after hardening, and its application method is also very simple.
Embodiment
One aspect of the present invention provides a kind of silicon composition, its basic components comprises: can pass through at least one vinyl silicone polymer (vinylsiloxane polymer) that hydrosilylation addition reaction (hydrosilylation reaction) solidifies and at least one hydrogen silicone polymer (Si-H siloxane polymer), and, at least one vinyl POSS(vinyl POSS) and organic group modify nano silicon (vinyl-orphenyl-modified nano-sized silica).
Further, described composition also can comprise hydrosilation addition curing catalyzer, by its katalysis, can realize the thermofixation of said composition.
And further, addition reaction of silicon with hydrogen inhibitor also can be inserted, then by the kind, consumption etc. of adjustment hydrosilation addition curing catalyzer and addition reaction of silicon with hydrogen inhibitor, the state of cure of said composition and solidification rate etc. can be regulated and controled.
Aforesaid hydrosilylation addition reaction means and is added on unsaturated organic compound by the hydride of silicon, thus generates the reaction of various silicoorganic compound, and it can adopt three kinds of modes: (1) directly synthesizes under heating with alkene or alkynes.(2) ultraviolet, gamma-rays or organo-peroxide free radical is utilized to cause.(3) by transition metal and coordination compound catalyzed reaction thereof.Especially plant mode for (3), its reaction conditions is gentle, and selectivity is good, and productive rate is high.
In the present invention, described silicon composition can be simple linear polymer, branched polymers or network polymer.
Obvious, composition of the present invention should comprise at least one liquid component, being the liquid with good fluidity with all the other combinations of materials in said composition, thus makes to be transported by the conventional equipment such as syringe or pump, send.
For vinyl silicone polymer of the present invention, it can select any one siloxane polymer containing vinyl group, and knows the approach known by industry, comprises the various ways such as commercially available or self-control and obtains.
Such as, the general molecular formula of described vinyl silicone polymer monomer can be:
(R
5)
m(R
6)
nSi(OR
7)
4-m-n
Wherein, R
5for vinyl, allyl group or vinyl benzyl; R
6for methyl, ethyl or phenyl; R
7for methyl or ethyl, m is 0,1 or 2; N is 0,1 or 2, and m+n<4, such as, it can be selected from CH
2=CHSi (OCH
3)
3, CH
2=CHSi (OC
2h
5)
3, CH
2=CHSi (OCH (CH
3)
2)
3, CH
2=CHSi (OC
4h
9)
3, (CH
2=CH) (C
2h
5) Si (OC
2h
5)
2, (CH
2=CH) (C
6h
5) Si (OC
2h
5)
2, CH
2=CHCH
2si (OCH
3)
3, CH
2=CHCH
2si (OC
2h
5)
3, (CH
2=CHCH
2)
2(CH
3) SiOC
2h
5, (CH
2=CHCH
2) (CH
3)
2siOC
2h
5, (CH
2=CHCH
2)
2si (OC
2h
5)
2, (CH
2=CHCH
2)
3siOC
2h
5or CH
2=CHC
6h
4si (OCH
3)
3etc..
Or described vinyl silicone polymer molecular structural formula can be:
Me
2R
1SiO(Me
2SiO)
a(MeViSiO)
b(MePhSiO)
cSiR
1Me
2，
In formula, Me represents methyl, and Vi represents vinyl, and Ph represents phenyl, the positive integer of a=3 ~ 3000, and b is the positive integer of the positive integer of 1 ~ 300, c=0 or 1 ~ 3000, and meets 0≤c/ (a+b+c)≤0.99, R
1for Me or Vi.For hydrogen silicone polymer of the present invention, it can select any one siloxane polymer containing Si-H group, and knows the approach known by industry, comprises the various ways such as commercially available or self-control and obtains.
Such as, the general structure of described hydrogen radical siloxane monomer can be:
(R
4’)
m’(R
5’)
n’Si(H)
p’(OR
6’)
(4-m’-n’-p’)
Wherein, R
4', R
5' be methyl, ethyl or phenyl; R
6' be methyl or ethyl; M ', n ', p ' they are 0,1 or 2, and m '+n '+p ' <4.
Again such as, the molecular structure of described hydrogen silicone polymer can be:
Me
2R
2SiO(Me
2SiO)
d(MeHSiO)
e(MePhSiO)
fSiR
2Me
2,
In formula, Me represents methyl, and Ph represents phenyl, the positive integer of d=3 ~ 900, the positive integer of e=3 ~ 600, the positive integer of f=0 or 1 ~ 900, and meets 0≤f/ (d+e+f)≤0.99, R
2for Me or H.
Further, in the basic components of composition of the present invention, vinyl silicone polymer and hydrogen silicone polymer content can between 60 ~ 99wt%, preferably at 75 ~ 99wt%, more preferably 85 ~ 95wt%, solidifies transparent afterwards to make said composition and has good mobility.
Further, in the present compositions, the mol ratio of the si-h bond in hydrogen silicone polymer and the vinyl in vinyl silicone polymer is between 1:0.7 ~ 1:1.4.
For vinyl POSS(polyhedral oligomeric silsesquioxane of the present invention), it can select any one POSS containing vinyl group, and the approach known is known by industry, comprise the various ways such as commercially available or self-control (such as, can with reference to CN100503757A, CN101906116B etc.) and obtain.
Such as, described POSS can react prefabricated by one or more in vinyl trichloro silane, vinyltrimethoxy silane, vinyltriethoxysilane, vinyl triisopropyl TMOS, vinyl three normal-butyl silane, vinyl tri-tert silane, vinyltriphenoxysilane and obtain; Or one or more and METHYL TRICHLORO SILANE in them, methyltrimethoxy silane, Union carbide A-162, methyl tripropoxy silane, methyl three normal-butyl silane, methyl tri-tert silane, phenyl-trichloro-silicane, phenyltrimethoxysila,e, phenyl triethoxysilane, phenyl three isopropoxy silane, one or more in phenyl three tert-butoxy silane are reacted prefabricated and obtain, but being not limited thereto.
Further, in the basic components of the present composition, the content of described vinyl POSS can between 0.1 ~ 20wt%, and preferably at 1 ~ 10wt%, more preferably 1 ~ 6wt%, its energy uniform dissolution is in composition and solidification is rear transparent.
In the present invention, the nano silicon that described organic group is modified refers to that surface should be modified with the nano-silicon dioxide particle of at least one organic group, its can by good be scattered in silicon composition of the present invention among the liquid component that comprises, wherein, described organic group is preferably from vinyl or phenyl, wherein the former can consult curing reaction, and the latter can increase nano-silicon dioxide particle and the organosilyl consistency containing aromatic group.
This surface is also obtained by approach such as commercially available or self-controls by the nano-silicon dioxide particle that organic group is modified, such as, and at least can with reference to following Access to publication:
1, Zhang Xinmeng, " surface modification of silica ", Shenyang University of Technology's master thesis, in December, 2006.
2, Yu Dongsheng etc., " nano-silica surface modification of graft progress ", coatings industry, volume the 7th phase July the 40th in 2010.
Again and, the median size of the nano-silicon dioxide particle in the present invention is not more than 500nm, is particularly preferably 1nm-100 nanometer, and should be able to make that visible ray is many as far as possible to be transmitted from described composition.
Further, in the composition, the content of described nano silicon can be 0.1 ~ 20wt%, preferably at 1 ~ 10wt%, and can be more transparent after solidifying to make composition.
In the present compositions, aforementioned hydrosilation addition curing catalyzer is preferably noble metal catalyst, such as platinum and rhodium compound.Particularly use the mixture of platinum and the organic product described in patent US-A-3159601, US-A-3159602 and US-A-3220972 and European patent EP-A-0057459, EP-A-0188978 and EP-A-0190530, or the mixture of patent US-A-3419593, the platinum described in US-A-3715334, US-A-3377432 and US-A-3814730 and vinylated organosilicon oxygen alkane.This catalyzer is preferably platinum catalyst, the i.e. title complex of platinum, particularly platinum complex usually, comprises Platinic chloride, H
2ptCl
6, Pt (PPh
3)
4, Cp
2ptCl
2, the platinum complex of methyl vinyl silicone polymer coordination, the platinum complex of diethyl phthalate coordination, the platinum complex etc. of dichloro two (triphenylphosphine), preferred platinum complex is Platinic chloride, H
2ptCl
6, methyl vinyl silicone polymer coordination platinum complex, be more preferably the platinum complex of methyl vinyl silicone polymer coordination.
In the present compositions, the content of hydrosilation addition curing catalyzer can between 0.1 ~ 1000ppm, preferably at 1-100ppm, more preferably at 1-50ppm, and more preferably 1 ~ 20ppm.
In the present compositions, aforementioned addition reaction of silicon with hydrogen inhibitor refers to the material that addition reaction of silicon with hydrogen can be caused bad, and this kind of material comprises alkynol compound, alkene-alkine compounds, siloxanes or benzotriazole and other hydrosilanes reaction suppressors.Wherein, alkynol compound inhibitor can be selected from 2-phenyl-3-butyne-2-alcohol, 2-methyl-3-butyne-2-alcohol, 3,5-dimethyl-1-hexin-3-alcohol etc.; Alkene-alkine compounds can be selected from such as 3-methyl-pirylene etc., and siloxanes can be selected from 1,3,5,7-tetramethyl--1,3,5,7-tetra-hexenyl cyclotetrasiloxane, 1,3,5,7-tetramethyl--1,3,5,7-tetravinyl cyclotetrasiloxane etc.Wherein preferred alkynol compound, especially preferably 2-phenyl-3-butyne-2-alcohol.
In the present invention, for basic components (if setting it as 100 weight parts), the content of this addition reaction of silicon with hydrogen inhibitor can between 0.001 ~ 1 weight part, preferably at 0.005 ~ 0.5 weight part, and more preferably 0.01 ~ 0.1 weight part.
In addition, in the present compositions, also can comprise a kind of mixture being suitable for adhesion promotor or multiple adhesion promotor, its optional self-defoaming agent (defoamer), rheology modifier (rheology modifier), ink (ink) and/or pigment (pigments), infrared absorbent (IR absorber) etc.
Such as, in the composition, described adhesive accelerant can be selected from one or several the mixture in tetraethoxy, vinyltrimethoxy silane, n-butyl boronate, boric acid isopropyl ester, isocaprylic acid titanium, zirconium iso-octoate, tetrabutyl titanate, isopropyl titanate, KH-171, KH-560 and KH-570 or the hydrolyzate of one or more in them, one or several mixture in preferred vinyl Trimethoxy silane, boric acid isopropyl ester, isocaprylic acid titanium, tetrabutyl titanate, KH-560 and KH-570, or the hydrolyzate of one or more; Especially one or more mixture in preferred vinyl Trimethoxy silane, tetrabutyl titanate, KH-560, or their hydrolyzate.
Such as, JCR6101, JCR6101UP, EG6301, OE6336, JCR6175, JCR6109, Hipec4939, Hipec1-9224, OE6250, SR7010, SE9207, SE1740, SE9187L etc. that the adhesive accelerant that can be obtained by commercially available approach can be produced for Dow Corning Corporation, but be not limited thereto.
In the present compositions, the content of described adhesive accelerant can be 0.001 ~ 10wt%, is preferably 0.01 ~ 5.0wt%, is especially preferably 0.01 ~ 1.0wt%, more preferably 0.01 ~ 0.05wt%
As previously mentioned, although at present more existing caking agents are by by assembly such as polytype siloxane polymer, micron or nano silicon and corresponding activators, realize the modification to siloxane polymer, although but thus obtained binding agent is promoted at some aspect of performance, decline or the disappearance of other side performance can be caused again simultaneously, make its over-all properties cannot meet the demand of practical application.And for light and/or electrical part, the particularly semiconductor light-emitting elements such as such as LED, bonding for convenience of it, packaging process, usual needs adopt the adhesive composite with good fluidity, to make it by syringe, pump, common equipments such as printer and accurately inject or be coated to some select location on device, and in order to make between device or device and extraneous can keep good isolation, comprise physics and chemistry isolation, and/or make device can keep good light output or take in efficiency, and/or device is operationally produced voluntarily or the heat etc. of passive acceptance can dissipate fast, and other target be not limited thereto, also require that the cured article formed by adhesive composite should have good bonding force concurrently, hardness, snappiness, transmittance (particularly under visible light), specific inductivity, heat transfer efficiency, the performance such as anti-aging.
Inventor is after large quantity research, and assistant is tested with a large amount of assembly, found out technical scheme of the present invention, that is, by at least one vinyl silicone polymer, at least one hydrogen silicone polymer that can solidify because of hydrosilylation addition reaction, the nano silicon assembly that at least one vinyl POSS and organic group are modified, and be aided with curing catalysts and addition reaction of silicon with hydrogen inhibitor, obtain a kind of composition with good fluidity.Further, inventor also finds very unexpectedly and determines, composition of the present invention has good bonding force, hardness, snappiness, transmittance (particularly under visible light), specific inductivity, heat transfer efficiency, the performance such as anti-aging concurrently.
Such as, the refractive index of the cured article formed by silicon composition of the present invention between 1.35 ~ 1.60, preferably more than 1.5.Therefore, composition of the present invention is particularly useful for carrying out bonding or encapsulation, particularly as light emitting semiconductor device, as the packaged material of LED to electronic installation, Optical devices, photoelectric device.
Below in conjunction with some more specifically embodiments and corresponding comparative example, explanation explanation is specifically done to technical scheme of the present invention.But still it is emphasized that these embodiments should not be considered form any restriction to protection scope of the present invention.Postscript, except as otherwise noted, otherwise all numbers, percentage ratio, ratio etc. in specification sheets of the present invention are all by weight.
As shown to be the composition of silicon composition involved by reference examples 1-16 and embodiment 1-2 shown in 1-table 2, and the method preparation that these silicon compositions all can adopt industry to know to know, such as, after each component Homogeneous phase mixing, corresponding composition can be obtained.
Further, in the embodiment such as shown involved by 1-table 2 and comparative example, involved vinyl silicone polymer, Si-H siloxanes, vinyl POSS, the content of micron silica or hydrophilic nano grade silicon dioxide or vinyl or phenyl modified nano silicon, refer to that it is by vinyl silicone polymer, Si-H siloxanes, content during the basis of the silicon composition that vinyl POSS and micron silica or hydrophilic nano grade silicon dioxide or vinyl or phenyl modified nano silicon form forms, but not as the content in the silicon composition of finished product.The content of adhesive accelerant, catalyzer, inhibitor then refers to its content in finished product silicon composition.
Also it should be noted that, in reference examples 1-16 and embodiment 1-2, for each component related in each reference examples and each embodiment, it is in fact have chosen many kinds of substance and other component has carried out assembly, has then carried out correlated performance test.Such as, for vinyl silicone polymer wherein, be selected that addressed to be applicable in vinyl silicone polymer of the present invention multiple tests above.For other component, comprising Si-H siloxanes, vinyl POSS, vinyl or phenyl modified nano silicon etc., is also like this.
And for micron silica wherein, system have employed hydrophilic micron silica respectively, hydrophilic micron silica is tested, its all by commercially available (such as, Son receive SHENNA produce SQ-1, SQ-2, SQ-5, SQ-10) or self-control approach (such as, can with reference to " preparation of micron-size spherical silicon-dioxide powdery and Study on Process thereof ", Bu Xiangmei, Institutes Of Technology Of Nanjing, master thesis, in June, 2008; J.AM.CHEM.SOC.2010, vol.132, p4834 – 4842) obtain.
For hydrophilic nano grade silicon dioxide wherein, be have employed respectively to modify and not modified nanometer grade silica is tested, it also can be passed through commercially available approach (such as, the R972 that produces of Degussa (EVONIK), R974, R104, R106, R20, R812, R812S, R816, R7200, R8200, R711, the H13L that R719, Wa Ke (WACKER) produce, H15, H17, H18, H20, H30, H2000, the TS-530 that Cabot (CABOT) is produced, TS-610, TS-720, Son receive SHENNA produce F01, SD10, F08, F09, the DM-10 that moral mountain (TOKUYAMA) produces) and self-control approach obtain (such as, can with reference to " preparation of monodisperse nano silicon dioxide microballoon and carboxylated modification " (" functional materials ", 11 phases, 40 volumes in 2009), CN101428807A, WO2009/088250A, the UV absorber of polyoxyethylene glycol/nano silicon dioxide hybridization material " document such as (" the online fine work paper of Chinese science and technology paper ", volume the 22nd phase November the 2nd in 2009).) consult table 3, obviously can see, silicon composition of the present invention has good over-all properties, comprises good fluidity, curing speed is fast, curing degree is high, solidification hardness is high, transmittance is high.
Such as, in embodiment 1 one more specifically in case, and its operation can comprise:
In a planetary stirrer special plastic cup, add 76.3 parts of vinyl silicone polymer polymkeric substance, 14.5 parts of Si-H siloxane polymers, 4.6 parts of vinyl POSS, the nano silicon of 4.6 parts of modified by vinyl, 0.008 part of 2-phenyl-3-butyne-2-alcohol, the platinum (0)-1 of 5.2ppm, 3-divinyl-1,1,3,3-tetramethyl disiloxane etc., and the mol ratio making the vinyl of wherein vinyl silicone polymer polymkeric substance and the si-h bond of Si-H siloxane polymer is 1.1:1.0, the viscosity mixing rear obtained liquid is 1000cPs.
Obtained liquid is injected in 0.8mm thickness mould, 150 degrees Celsius of lower thermofixations 4 hours, obtains transparent, that 0.8mm is a thick solid.The refractive index of gained silicon composition is 1.41.
Be injected into by the liquid stirred in 2mm thickness mould, 150 degrees Celsius of lower thermofixations 4 hours, obtain the solid that a 2mm is thick, its hardness is Shao A37.5.
Be injected into by obtained liquid in 2mm thickness mould, thermofixation 24 hours, obtains the solid that a 2mm is thick at 200 degrees celsius, and its hardness is Shao A61.0.
Be injected into by obtained liquid in 6mm thickness mould, 150 degrees Celsius of lower thermofixations 4 hours, obtain the solid that a 6mm is thick, its hardness is Shao A33.5.
Be injected into by obtained liquid in 6mm thickness mould, thermofixation 24 hours, obtains the solid that a 6mm is thick at 200 degrees celsius, and its hardness is Shao A42.4.
In addition, unexpectedly, the quality guaranteed period of silicon composition of the present invention is also significantly improved than existing silicone adhesive, and this characteristic makes it the encapsulation field be also very suitable at electron device applies.Such as, namely the composition involved by reference examples 16 can form gel less than in the time of one day, and embodiment 2 still can keep steady-state viscosity after the experience time of more than two weeks.
Below be only embody rule example of the present invention, protection scope of the present invention is not constituted any limitation.The technical scheme that all employing equivalents or equivalence are replaced and formed, all drops within rights protection scope of the present invention.The composition of table 1: reference examples 1-14 and embodiment 1 composition
The composition of table 2: reference examples 15-16 and embodiment 2 composition
The performance of the composition of table 3: reference examples 1-16 and embodiment 1-2
Claims (12)
1. a silicon composition, is characterized in that, the basic components of described composition comprises:
At least one vinyl silicone polymer that can be solidified by hydrosilylation addition reaction and at least one hydrogen silicone polymer,
And, the nano silicon that at least one vinyl POSS, organic group are modified and hydrosilation addition curing catalyzer.
2. silicon composition according to claim 1, it is characterized in that, in the basic components of described composition, the content of described vinyl silicone polymer and hydrogen silicone polymer is 60 ~ 99wt%, be preferably 75 ~ 99wt%, be especially preferably 85 ~ 95wt%.
3. silicon composition according to claim 1, is characterized in that, in the basic components of described composition, contained by described hydrogen silicone polymer institute's silicon-hydrogen bond containing and described vinyl silicone polymer, the mol ratio of vinyl is 1:0.7 ~ 1:1.4.
4. silicon composition according to claim 1, is characterized in that, in the basic components of described composition, the content of described vinyl POSS is 0.1 ~ 20wt%, is preferably 1 ~ 10wt%, is especially preferably 1 ~ 6wt%.
5. silicon composition according to claim 1, is characterized in that, in the basic components of described composition, the content of described nano silicon is 0.1 ~ 20wt%, is preferably 1 ~ 10wt%.
6. silicon composition according to claim 1, is characterized in that, described composition also comprises hydrosilation addition curing catalyzer and addition reaction of silicon with hydrogen inhibitor,
Wherein, the content of described hydrosilation addition curing catalyzer is 0.1 ~ 1000ppm, is preferably 1 ~ 100ppm, is especially preferably 1 ~ 20ppm,
0.001 ~ 1wt% of component based on the consumption of silicon composition and described addition reaction of silicon with hydrogen inhibitor, is preferably 0.005 ~ 0.5wt%, is especially preferably 0.01 ~ 0.1wt%.
7. silicon composition according to claim 1, it is characterized in that, described composition also comprises more than one adhesive accelerants, and the content of described adhesive accelerant is 0.001 ~ 10wt%, be preferably 0.01 ~ 5.0wt%, especially 0.01 ~ 1.0wt%, more preferably 0.01 ~ 0.05wt% is preferably.
8. the silicon composition according to any one of claim 1-7, is characterized in that, the cured article formed by described composition for the refractive index of visible ray between 1.35 ~ 1.60, preferably more than 1.5.
9. silicon composition according to any one of claim 1-8 is in bonding article or the application at least in packaged articles local surfaces.
10. an article adhering method, is characterized in that, comprising:
First article and the second article are provided,
The silicon composition according to any one of claim 1-8 is applied between the first article and the second article,
And, under selected temperature condition, make described silicon composition thermofixation, thus the first article and the second article are adhesively fixed.
11. 1 kinds of method for packing, is characterized in that, comprising:
At least select regional area as packaging area at article surface and/or inside,
And, apply the silicon composition according to any one of claim 1-8 at described packaging area,
And, in described silicon composition thermofixation under selected temperature condition, complete the encapsulation to article.
12. 1 kinds of electron devices or photoelectric device, is characterized in that, it comprises the cured article that silicon composition according to any one of claim 1-8 is formed, and wherein said photoelectric device comprises semiconductor light-emitting elements, and described semiconductor light-emitting elements comprises LED.
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