CN104375389A - Multi-workpiece table collaboration direct-writing photoetching method - Google Patents
Multi-workpiece table collaboration direct-writing photoetching method Download PDFInfo
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- CN104375389A CN104375389A CN201410539501.7A CN201410539501A CN104375389A CN 104375389 A CN104375389 A CN 104375389A CN 201410539501 A CN201410539501 A CN 201410539501A CN 104375389 A CN104375389 A CN 104375389A
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Abstract
The invention discloses a multi-workpiece table collaboration direct-writing photoetching method, adopts a parallel exposure control technology, and belongs to the direct-writing photoetching machine exposure technical field. Firstly, a workpiece table A is subjected to board loading and alignment operations, then the workpiece table A is moved to an exposure starting position and is subjected to scanning exposure; at the same time, a workpiece table B is subjected to board loading and alignment operations, then the workpiece table B is moved to the exposure starting position and waits for scanning exposure; after the scanning exposure of the workpiece table A is finished, the workpiece table A is exited and is subjected to scanning exposure preparatory works of board discharge, new board loading and alignment, and at the same time, the workpiece table B begins to be subjected to a scanning exposure process. The method greatly reduces the structure complexity, and a plurality of workpiece tables are at respective work areas and do not interfere with each other, so that a conventional exposure process serially performed in sequence is changed to the parallel exposure process, so as to greatly shorten the exposure time. In addition, the method improves the exposure quality and the production yield, and does not increase any time consumption while ensuring photoetching accuracy.
Description
Technical field
The present invention relates to a kind of direct-writing photo-etching method, specifically a kind of multi-work piece platform cooperation direct-writing photo-etching method, belongs to direct-write type lithography machine exposure technique field.
Background technology
Write-through photoetching technique be development in recent years faster, to substitute the direct transfer techniques of image of the traditional board-like photoetching technique of mask, in semiconductor and PCB production field, have more and more consequence.This technology can shortened process, and reduces manufacturing cost.Main flow direct-write type lithography machine in the market carries out scan exposure mainly with single work stage mode greatly.In single workpiece table system, carry out successively for the upper plate of the substrate that exposes, aligning, exposure, lower plate.According to current structural system, each operating process has reached the upper limit consuming time, is difficult to the running time shortening certain operation steps again, and namely the direct-write type lithography machine of single work stage is due to the continuity of each operating process, has been difficult to improve production capacity again.So there has been double-workpiece-table scanning technique, a work stage carries out scan exposure, and another work stage carries out the operation such as upper and lower plates, aligning, significantly can improve equipment capacity.
The direct-write type lithography machine of current employing double-workpiece-table design is all that at right angle setting mode carries out designing.Namely two work stage are up-down structure, due to two work stage drop in vertical direction, require that focus module and alignment modules must move up and down, which increase structural design difficulty, and move up and down frequently, the reduction of alignment precision can be caused and increase aligning consuming time.Too compact lifting workpiece platform structure also causes vacuum system to be difficult to install, and the substrate that the warpage of substrate itself and work stage cause in high-speed motion moves and all can reduce exposure quality and yield.
Summary of the invention
For above-mentioned prior art Problems existing, the invention provides a kind of multi-work piece platform cooperation direct-writing photo-etching method, significantly reduce the complicacy of structure, the exposure process that serial is carried out in order is originally made to become parallel exposure process, greatly shorten the time shutter, improve exposure quality and produce yield, while guarantee lithographic accuracy, can not increase any consuming time.
To achieve these goals, the concrete steps that adopt of this multi-work piece platform cooperation direct-writing photo-etching method are as follows:
1), first upper plate, alignment function are carried out to A work stage, after completing, A work stage is moved to exposure reference position and carry out scan exposure;
2), while A work stage carries out scan exposure, upper plate, alignment function are carried out to B work stage;
3), after B work stage carries out upper plate, alignment function completes, B work stage is moved to exposure reference position, waits for scan exposure;
4), after A work stage completes scan exposure, exit A work stage, and the scan exposure preliminary work of lower plate, upper new plate, aligning is carried out to A work stage, start to carry out scan exposure flow process to B work stage simultaneously;
5), above-mentioned steps moves in circles and carries out, and forms the upper and lower plates of complete machine operation, aims at and synchronously the carrying out of scan exposure flow process.
Further, be arranged on two scan axises described A work stage and B work stage side by side parallel, move with respective scan axis respectively in exposure process, complete aligning, scan exposure action respectively.
Compared with existing direct-writing photo-etching method, this multi-work piece platform cooperation direct-writing photo-etching method significantly reduces the complicacy of structure, two work stage do not interfere with each other in respective perform region, a work stage is in the process of scan exposure, another work stage carries out the operating process such as upper and lower plates, aligning, make the exposure process that serial is carried out in order originally become parallel exposure process, highly shortened the time shutter.In addition this multi-work piece platform cooperation direct-writing photo-etching method improves exposure quality and produces yield, while guarantee lithographic accuracy, can not increase any consuming time.
Accompanying drawing explanation
Fig. 1 is workflow diagram of the present invention;
Fig. 2 is a kind of fundamental diagram of the present invention;
Fig. 3 is another kind of fundamental diagram of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described.
As shown in Figure 1, the concrete steps that adopt of this multi-work piece platform cooperation direct-writing photo-etching method are as follows:
1), first upper plate, alignment function are carried out to A work stage, after completing, A work stage is moved to exposure reference position and carry out scan exposure;
2), while A work stage carries out scan exposure, upper plate, alignment function are carried out to B work stage;
3), after B work stage carries out upper plate, alignment function completes, B work stage is moved to exposure reference position, waits for scan exposure;
4), after A work stage completes scan exposure, exit A work stage, and the scan exposure preliminary work of lower plate, upper new plate, aligning is carried out to A work stage, start to carry out scan exposure flow process to B work stage simultaneously;
5), above-mentioned steps moves in circles and carries out, and forms the upper and lower plates of complete machine operation, aims at and synchronously the carrying out of scan exposure flow process.
As shown in Figures 2 and 3, be arranged on two scan axises described A work stage and B work stage side by side parallel, move with respective scan axis respectively in exposure process, complete aligning, scan exposure action respectively.Described workflow moves in circles and carries out, and forms the work flow of ping-pong type, to walk abreast the object of carrying out to reach operating process.
As shown in Figure 2, when A work stage is while carrying out normal scan exposure, B work stage carries out the lower plate of last piece of substrate, and the upper plate of front substrate also carries out aligning preliminary work, and then to move to exposure reference position etc. to be exposed for B work stage.
As shown in Figure 3, after A work stage has exposed, light path system has moved on B work stage table top with stepping axle, starts to carry out scan exposure to B work stage.Meanwhile, A work stage exits carries out the work such as lower plate, upper next block substrate, aligning to home, then moves to exposure reference position etc. to be exposed.
In sum, this multi-work piece platform cooperation direct-writing photo-etching method significantly reduces the complicacy of structure, two work stage do not interfere with each other in respective perform region, a work stage is in the process of scan exposure, another work stage carries out the operating process such as upper and lower plates, aligning, make the exposure process that serial is carried out in order originally become parallel exposure process, highly shortened the time shutter.In addition this multi-work piece platform cooperation direct-writing photo-etching method improves exposure quality and produces yield, while guarantee lithographic accuracy, can not increase any consuming time.
Claims (2)
1. a multi-work piece platform cooperation direct-writing photo-etching method, it is characterized in that, concrete steps are as follows:
1), first upper plate, alignment function are carried out to A work stage, after completing, A work stage is moved to exposure reference position and carry out scan exposure;
2), while A work stage carries out scan exposure, upper plate, alignment function are carried out to B work stage;
3), after B work stage carries out upper plate, alignment function completes, B work stage is moved to exposure reference position, waits for scan exposure;
4), after A work stage completes scan exposure, exit A work stage, and the scan exposure preliminary work of lower plate, upper new plate, aligning is carried out to A work stage, start to carry out scan exposure flow process to B work stage simultaneously;
5), above-mentioned steps moves in circles and carries out, and forms the upper and lower plates of complete machine operation, aims at and synchronously the carrying out of scan exposure flow process.
2. a kind of multi-work piece platform cooperation direct-writing photo-etching method according to claim 1, is characterized in that,
Be arranged on two scan axises described A work stage and B work stage side by side parallel, move with respective scan axis respectively in exposure process, complete aligning, scan exposure action respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410539501.7A CN104375389A (en) | 2014-10-13 | 2014-10-13 | Multi-workpiece table collaboration direct-writing photoetching method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410539501.7A CN104375389A (en) | 2014-10-13 | 2014-10-13 | Multi-workpiece table collaboration direct-writing photoetching method |
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| CN104375389A true CN104375389A (en) | 2015-02-25 |
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| CN201410539501.7A Pending CN104375389A (en) | 2014-10-13 | 2014-10-13 | Multi-workpiece table collaboration direct-writing photoetching method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105487345A (en) * | 2016-01-14 | 2016-04-13 | 哈尔滨工业大学 | Electric-refrigeration-chip-based dynamic-magnetic-steel magnetic levitation dual-stage vector arc switching method and device |
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| WO2003032038A1 (en) * | 2001-10-09 | 2003-04-17 | Teraxion Inc. | Method and apparatus for recording an optical grating in a photosensitive medium |
| CN1977144A (en) * | 2004-04-27 | 2007-06-06 | 住友重机械工业株式会社 | Sensor device and stage device |
| CN101226343A (en) * | 2008-01-29 | 2008-07-23 | 芯硕半导体（中国）有限公司 | Method for improving photolithography exposure energy homogeneity using grey level compensation |
| CN101587306A (en) * | 2009-04-09 | 2009-11-25 | 上海微电子装备有限公司 | Alignment signal processing method in photoetching technology |
| CN103576463A (en) * | 2012-07-20 | 2014-02-12 | 上海微电子装备有限公司 | Workbench of lithography machine and working method thereof |
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2014
- 2014-10-13 CN CN201410539501.7A patent/CN104375389A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003032038A1 (en) * | 2001-10-09 | 2003-04-17 | Teraxion Inc. | Method and apparatus for recording an optical grating in a photosensitive medium |
| CN1977144A (en) * | 2004-04-27 | 2007-06-06 | 住友重机械工业株式会社 | Sensor device and stage device |
| CN101226343A (en) * | 2008-01-29 | 2008-07-23 | 芯硕半导体（中国）有限公司 | Method for improving photolithography exposure energy homogeneity using grey level compensation |
| CN101587306A (en) * | 2009-04-09 | 2009-11-25 | 上海微电子装备有限公司 | Alignment signal processing method in photoetching technology |
| CN103576463A (en) * | 2012-07-20 | 2014-02-12 | 上海微电子装备有限公司 | Workbench of lithography machine and working method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105487345A (en) * | 2016-01-14 | 2016-04-13 | 哈尔滨工业大学 | Electric-refrigeration-chip-based dynamic-magnetic-steel magnetic levitation dual-stage vector arc switching method and device |
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Application publication date: 20150225 |
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