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CN104254911B - 芯片分类装置和芯片分类方法 - Google Patents

芯片分类装置和芯片分类方法 Download PDF

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Publication number
CN104254911B
CN104254911B CN201380021965.2A CN201380021965A CN104254911B CN 104254911 B CN104254911 B CN 104254911B CN 201380021965 A CN201380021965 A CN 201380021965A CN 104254911 B CN104254911 B CN 104254911B
Authority
CN
China
Prior art keywords
classification
grade
chip
sheet
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380021965.2A
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English (en)
Chinese (zh)
Other versions
CN104254911A (zh
Inventor
佐藤刚
内田练
五十殿宏二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of CN104254911A publication Critical patent/CN104254911A/zh
Application granted granted Critical
Publication of CN104254911B publication Critical patent/CN104254911B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201380021965.2A 2012-04-27 2013-03-18 芯片分类装置和芯片分类方法 Expired - Fee Related CN104254911B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-103500 2012-04-27
JP2012103500 2012-04-27
PCT/JP2013/001844 WO2013161173A1 (ja) 2012-04-27 2013-03-18 チップソーティング装置およびチップソーティング方法、制御プログラム、可読記憶媒体

Publications (2)

Publication Number Publication Date
CN104254911A CN104254911A (zh) 2014-12-31
CN104254911B true CN104254911B (zh) 2016-07-06

Family

ID=49482531

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380021965.2A Expired - Fee Related CN104254911B (zh) 2012-04-27 2013-03-18 芯片分类装置和芯片分类方法

Country Status (4)

Country Link
JP (1) JP5941982B2 (ja)
CN (1) CN104254911B (ja)
TW (1) TWI601224B (ja)
WO (1) WO2013161173A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018163388A1 (ja) * 2017-03-09 2018-09-13 株式会社Ｆｕｊｉ 部品装着機
JP6698213B2 (ja) * 2017-03-09 2020-05-27 株式会社Ｆｕｊｉ ウエハ供給装置
CN109830447B (zh) * 2019-01-17 2020-11-27 深圳赛意法微电子有限公司 半导体晶圆芯片分选方法、半导体产品的封装方法及系统
CN112612660B (zh) * 2020-12-16 2024-02-13 海光信息技术股份有限公司 规格信息数据库创建方法、芯片挑选方法及装置和系统
CN113387167B (zh) * 2021-06-18 2023-04-28 上海金东唐科技有限公司 激光芯片的处理方法、装置及电子设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01172536A (ja) * 1987-12-25 1989-07-07 Daihatsu Motor Co Ltd 断熱、耐熱性セラミックス多孔体複合金属材料
JPH04343485A (ja) * 1991-05-21 1992-11-30 Dowa Mining Co Ltd 半導体ペレット選別装置
JPH0936203A (ja) * 1995-07-20 1997-02-07 Canon Inc 移動体装置及びその制御方法
JPH10144741A (ja) * 1996-11-07 1998-05-29 Rohm Co Ltd Ｉｃチップの性能分類方法および装置
JP3605009B2 (ja) * 2000-08-03 2004-12-22 三洋電機株式会社 半導体装置の製造方法
AT6405U1 (de) * 2002-06-05 2003-10-27 Card Casinos Austria Res & Dev Chipsortiervorrichtung
TW200848722A (en) * 2007-06-15 2008-12-16 King Yuan Electronics Co Ltd Automatic optical inspection device
JP4931710B2 (ja) * 2007-06-29 2012-05-16 株式会社リコー ウエハにおける良品チップ分類方法、それを用いたチップ品質判定方法、ならびにチップ分類プログラム、チップ品質判定プログラム、マーキング機構及び半導体装置の製造方法

Also Published As

Publication number Publication date
TW201351539A (zh) 2013-12-16
WO2013161173A1 (ja) 2013-10-31
TWI601224B (zh) 2017-10-01
JPWO2013161173A1 (ja) 2015-12-21
CN104254911A (zh) 2014-12-31
JP5941982B2 (ja) 2016-06-29

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160706

Termination date: 20210318

CF01 Termination of patent right due to non-payment of annual fee