CL2007002527A1 - Compuesto con superficie de contacto termica que comprende mezcla de matriz polimera y relleno de conduccion termica, la matriz incluye organopolisiloxano, organohidrogenpolisiloxano y catalizador de hidrosililacion compuesto por metal de transicion; - Google Patents
Compuesto con superficie de contacto termica que comprende mezcla de matriz polimera y relleno de conduccion termica, la matriz incluye organopolisiloxano, organohidrogenpolisiloxano y catalizador de hidrosililacion compuesto por metal de transicion;Info
- Publication number
- CL2007002527A1 CL2007002527A1 CL200702527A CL2007002527A CL2007002527A1 CL 2007002527 A1 CL2007002527 A1 CL 2007002527A1 CL 200702527 A CL200702527 A CL 200702527A CL 2007002527 A CL2007002527 A CL 2007002527A CL 2007002527 A1 CL2007002527 A1 CL 2007002527A1
- Authority
- CL
- Chile
- Prior art keywords
- matrix
- organohydrogenpolisiloxano
- organopolisiloxane
- thermal
- composite
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/54—Inorganic substances
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/566,102 US20070219312A1 (en) | 2006-03-17 | 2006-12-01 | Silicone adhesive composition and method for preparing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
CL2007002527A1 true CL2007002527A1 (es) | 2008-02-15 |
Family
ID=39760245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CL200702527A CL2007002527A1 (es) | 2006-12-01 | 2007-08-30 | Compuesto con superficie de contacto termica que comprende mezcla de matriz polimera y relleno de conduccion termica, la matriz incluye organopolisiloxano, organohidrogenpolisiloxano y catalizador de hidrosililacion compuesto por metal de transicion; |
Country Status (9)
Country | Link |
---|---|
US (1) | US20070219312A1 (es) |
EP (1) | EP2094805A2 (es) |
JP (1) | JP2010511738A (es) |
KR (1) | KR20090086425A (es) |
CN (1) | CN101627077A (es) |
AR (1) | AR063473A1 (es) |
CL (1) | CL2007002527A1 (es) |
TW (1) | TW200831628A (es) |
WO (1) | WO2008111953A2 (es) |
Families Citing this family (58)
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US20070099006A1 (en) * | 2005-11-02 | 2007-05-03 | Ers Company | Highly compliant bonding compound and structure |
JP5377846B2 (ja) * | 2007-11-09 | 2013-12-25 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 熱硬化性シリコーンゴム組成物 |
US7808099B2 (en) * | 2008-05-06 | 2010-10-05 | International Business Machines Corporation | Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method |
KR101263905B1 (ko) * | 2008-07-22 | 2013-05-13 | 덴끼 가가꾸 고교 가부시키가이샤 | 수지조성물 |
JP5534837B2 (ja) * | 2010-01-28 | 2014-07-02 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
WO2011125753A1 (ja) * | 2010-04-02 | 2011-10-13 | 株式会社カネカ | 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード |
TWI522423B (zh) * | 2010-08-31 | 2016-02-21 | 道康寧東麗股份有限公司 | 聚矽氧烷組合物及其硬化物 |
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KR20140075865A (ko) * | 2012-12-07 | 2014-06-20 | 삼성정밀화학 주식회사 | 태양전지 모듈용 접착 조성물, 이로부터 형성된 태양전지 모듈용 접착부재 및 이를 구비한 태양전지 모듈 |
TW201439264A (zh) * | 2012-12-20 | 2014-10-16 | Dow Corning | 製造電子裝置的方法 |
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US9236085B1 (en) * | 2013-02-28 | 2016-01-12 | Western Digital Technologies, Inc. | Method and apparatus for performing a defect process on a data storage device |
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FR3060601B1 (fr) * | 2016-12-20 | 2018-12-07 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Composition adhesive et son utilisation dans l'electronique |
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US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
US11059971B2 (en) | 2017-09-29 | 2021-07-13 | Dow Silicones Corporation | Thermally conductive composition |
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US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
CN108949056B (zh) * | 2018-07-17 | 2020-12-25 | 德阳中碳新材料科技有限公司 | 一种导热界面材料的制备方法及其产品 |
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US20220064381A1 (en) * | 2020-09-03 | 2022-03-03 | Illinois Tool Works Inc. | Silicone potting composition and uses thereof |
US20220384304A1 (en) * | 2021-05-27 | 2022-12-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | High Efficiency Heat Dissipation Using Discrete Thermal Interface Material Films |
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CN114015412A (zh) * | 2021-10-21 | 2022-02-08 | 纳派化学(上海)有限公司 | 一种高导热有机硅脂及其制备方法 |
JP2023112673A (ja) * | 2022-02-01 | 2023-08-14 | 旭化成ワッカーシリコーン株式会社 | 熱伝導性シリコーン組成物および該組成物を使用する熱伝導性部材の製造方法 |
CN115287037B (zh) * | 2022-08-16 | 2023-08-22 | 西卡(江苏)工业材料有限公司 | 一种环保型单组分有机硅高导热胶黏剂及其制备方法和应用 |
CN115806800B (zh) * | 2022-11-17 | 2024-01-16 | 烟台德邦科技股份有限公司 | 一种半导体芯片围框粘接有机硅密封胶及其制备方法 |
CN116606608B (zh) * | 2023-05-23 | 2024-04-05 | 江西天永诚高分子材料有限公司 | 一种导热填料、包含其的双组份有机硅灌封胶及其制备方法 |
CN118459912A (zh) * | 2024-05-17 | 2024-08-09 | 上海交通大学 | 一种聚合物基复合材料热界面材料及其制备方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0297559A (ja) * | 1988-10-03 | 1990-04-10 | Toshiba Silicone Co Ltd | 熱伝導性シリコーン組成物 |
JP3676544B2 (ja) * | 1997-08-05 | 2005-07-27 | ジーイー東芝シリコーン株式会社 | 難燃性放熱性シート用シリコーンゲル組成物および難燃性放熱性シリコーンシート |
JP3444199B2 (ja) * | 1998-06-17 | 2003-09-08 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及びその製造方法 |
US6169155B1 (en) * | 1999-01-14 | 2001-01-02 | Dow Corning Corporation | Silicone gel composition and silicone gel produced therefrom |
JP3580358B2 (ja) * | 2000-06-23 | 2004-10-20 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
JP3580366B2 (ja) * | 2001-05-01 | 2004-10-20 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
DE10204893A1 (de) * | 2002-02-06 | 2003-08-14 | Ge Bayer Silicones Gmbh & Co | Selbsthaftende additionsvernetzende Silikonkautschukmischungen, ein Verfahren zu deren Herstellung, Verfahren zur Herstellung von Verbund-Formteilen und deren Verwendung |
ATE448276T1 (de) * | 2003-04-15 | 2009-11-15 | Dow Corning Toray Co Ltd | Wärmeleitende, additionsvernetzende, flüssige silikonkautschukmischung und beschichtete fixierwalze |
JP4565491B2 (ja) * | 2003-04-15 | 2010-10-20 | 東レ・ダウコーニング株式会社 | 熱伝導性付加硬化型液状シリコーンゴム組成物 |
US20050049350A1 (en) * | 2003-08-25 | 2005-03-03 | Sandeep Tonapi | Thin bond-line silicone adhesive composition and method for preparing the same |
JP4557136B2 (ja) * | 2004-05-13 | 2010-10-06 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及び成型品 |
-
2006
- 2006-12-01 US US11/566,102 patent/US20070219312A1/en not_active Abandoned
-
2007
- 2007-08-28 TW TW096131872A patent/TW200831628A/zh unknown
- 2007-08-30 WO PCT/US2007/019111 patent/WO2008111953A2/en active Application Filing
- 2007-08-30 CN CN200780050337A patent/CN101627077A/zh active Pending
- 2007-08-30 KR KR1020097011333A patent/KR20090086425A/ko not_active Application Discontinuation
- 2007-08-30 EP EP07873954A patent/EP2094805A2/en not_active Withdrawn
- 2007-08-30 CL CL200702527A patent/CL2007002527A1/es unknown
- 2007-08-30 JP JP2009539239A patent/JP2010511738A/ja active Pending
- 2007-10-17 AR ARP070104600A patent/AR063473A1/es unknown
Also Published As
Publication number | Publication date |
---|---|
CN101627077A (zh) | 2010-01-13 |
AR063473A1 (es) | 2009-01-28 |
EP2094805A2 (en) | 2009-09-02 |
US20070219312A1 (en) | 2007-09-20 |
TW200831628A (en) | 2008-08-01 |
WO2008111953A2 (en) | 2008-09-18 |
WO2008111953A3 (en) | 2009-08-27 |
KR20090086425A (ko) | 2009-08-12 |
JP2010511738A (ja) | 2010-04-15 |
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