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BR9702641A - Placa de ligação multicamadas - Google Patents

Placa de ligação multicamadas

Info

Publication number
BR9702641A
BR9702641A BR9702641A BR9702641A BR9702641A BR 9702641 A BR9702641 A BR 9702641A BR 9702641 A BR9702641 A BR 9702641A BR 9702641 A BR9702641 A BR 9702641A BR 9702641 A BR9702641 A BR 9702641A
Authority
BR
Brazil
Prior art keywords
connection plate
multilayer connection
multilayer
plate
connection
Prior art date
Application number
BR9702641A
Other languages
English (en)
Inventor
Takashi Watanabe
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Publication of BR9702641A publication Critical patent/BR9702641A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
BR9702641A 1996-07-23 1997-07-22 Placa de ligação multicamadas BR9702641A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8193318A JPH1041637A (ja) 1996-07-23 1996-07-23 高密度多層配線基板

Publications (1)

Publication Number Publication Date
BR9702641A true BR9702641A (pt) 1998-06-30

Family

ID=16305917

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9702641A BR9702641A (pt) 1996-07-23 1997-07-22 Placa de ligação multicamadas

Country Status (5)

Country Link
JP (1) JPH1041637A (pt)
KR (1) KR980013577A (pt)
CN (1) CN1171718A (pt)
BR (1) BR9702641A (pt)
SE (2) SE9702725D0 (pt)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
JP3617388B2 (ja) * 1999-10-20 2005-02-02 日本電気株式会社 プリント配線板及びその製造方法
JP4680410B2 (ja) * 2001-04-24 2011-05-11 日本特殊陶業株式会社 配線基板
JP4630517B2 (ja) * 2001-05-16 2011-02-09 パナソニック株式会社 積層フィルタ、積層複合デバイス、および通信装置
JP2002368353A (ja) * 2001-06-04 2002-12-20 Ibiden Co Ltd プリント配線板
JP4834937B2 (ja) * 2001-08-22 2011-12-14 凸版印刷株式会社 高周波回路用多層配線板
US6933599B2 (en) * 2003-10-27 2005-08-23 Freescale Semiconductor, Inc. Electromagnetic noise shielding in semiconductor packages using caged interconnect structures
WO2006093830A2 (en) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Internally overlapped conditioners
JP4916300B2 (ja) 2006-12-19 2012-04-11 新光電気工業株式会社 多層配線基板
KR101385094B1 (ko) * 2007-09-11 2014-04-14 삼성디스플레이 주식회사 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법
CN102665375B (zh) * 2012-05-31 2014-12-17 昆山市线路板厂 一种聚酯材料挠性电路板低温焊接系统及焊接方法
JP2014011169A (ja) 2012-06-27 2014-01-20 Ps4 Luxco S A R L シリコンインターポーザ及びこれを備える半導体装置
JP6392107B2 (ja) * 2014-12-18 2018-09-19 株式会社フジクラ 高周波伝送基板
CN106409701A (zh) * 2016-10-26 2017-02-15 中国科学院半导体研究所 一种用于金丝键合的电极结构
CN107995776A (zh) * 2017-12-14 2018-05-04 武汉电信器件有限公司 一种用于屏蔽串扰的电路板及串扰消除方法
JP6468379B2 (ja) * 2018-02-15 2019-02-13 セイコーエプソン株式会社 液体吐出装置、駆動回路および液体吐出装置の制御方法
DE102018204108A1 (de) * 2018-03-19 2019-09-19 BSH Hausgeräte GmbH Testcoupon und Verfahren zur Überprüfung einer Leiterplatte
CN110719689A (zh) * 2019-10-15 2020-01-21 上海中航光电子有限公司 线路板及其布线方法
JPWO2022219709A1 (pt) * 2021-04-13 2022-10-20
WO2023238376A1 (ja) * 2022-06-10 2023-12-14 日本電信電話株式会社 インピーダンス変換器

Also Published As

Publication number Publication date
KR980013577A (ko) 1998-04-30
SE9702725L (pt) 2002-01-08
CN1171718A (zh) 1998-01-28
JPH1041637A (ja) 1998-02-13
SE516368C2 (en) 2002-01-08
SE9702725D0 (sv) 1997-07-15

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Legal Events

Date Code Title Description
FB34 Technical and formal requirements: requirement - article 34 of industrial property law
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A, 9A E 10A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1903 DE 26/06/2007.