BR9702641A - Multilayer connection plate - Google Patents

Multilayer connection plate

Info

Publication number: BR9702641A
Authority: BR; Brazil
Prior art keywords: connection plate; multilayer connection; multilayer; plate; connection
Prior art date: 1996-07-23

Application number

BR9702641A

Other languages

Portuguese (pt)

Inventor

Takashi Watanabe

Original Assignee

Nec Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1996-07-23

Filing date

1997-07-22

Publication date

1998-06-30

1997-07-22 Application filed by Nec Corp filed Critical Nec Corp

1998-06-30 Publication of BR9702641A publication Critical patent/BR9702641A/en

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Structure Of Printed Boards (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)

BR9702641A 1996-07-23 1997-07-22 Multilayer connection plate BR9702641A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP8193318A JPH1041637A (en)	1996-07-23	1996-07-23	High-density multilayer wiring board

Publications (1)

Publication Number	Publication Date
BR9702641A true BR9702641A (en)	1998-06-30

Family

ID=16305917

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BR9702641A BR9702641A (en)	1996-07-23	1997-07-22	Multilayer connection plate

Country Status (5)

Country	Link
JP (1)	JPH1041637A (en)
KR (1)	KR980013577A (en)
CN (1)	CN1171718A (en)
BR (1)	BR9702641A (en)
SE (2)	SE9702725D0 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US9054094B2 (en)	1997-04-08	2015-06-09	X2Y Attenuators, Llc	Energy conditioning circuit arrangement for integrated circuit
US7321485B2 (en)	1997-04-08	2008-01-22	X2Y Attenuators, Llc	Arrangement for energy conditioning
US7336468B2 (en)	1997-04-08	2008-02-26	X2Y Attenuators, Llc	Arrangement for energy conditioning
JP3617388B2 (en) *	1999-10-20	2005-02-02	日本電気株式会社	Printed wiring board and manufacturing method thereof
JP4680410B2 (en) *	2001-04-24	2011-05-11	日本特殊陶業株式会社	Wiring board
JP4630517B2 (en) *	2001-05-16	2011-02-09	パナソニック株式会社	Multilayer filter, multilayer composite device, and communication apparatus
JP2002368353A (en) *	2001-06-04	2002-12-20	Ibiden Co Ltd	Printed wiring board
JP4834937B2 (en) *	2001-08-22	2011-12-14	凸版印刷株式会社	Multi-layer wiring board for high-frequency circuits
US6933599B2 (en) *	2003-10-27	2005-08-23	Freescale Semiconductor, Inc.	Electromagnetic noise shielding in semiconductor packages using caged interconnect structures
WO2006093830A2 (en)	2005-03-01	2006-09-08	X2Y Attenuators, Llc	Internally overlapped conditioners
JP4916300B2 (en) *	2006-12-19	2012-04-11	新光電気工業株式会社	Multilayer wiring board
KR101385094B1 (en)	2007-09-11	2014-04-14	삼성디스플레이 주식회사	Printed circuit board, display apparatus having the same and method of manufacturing the printed circuit board
CN102665375B (en) *	2012-05-31	2014-12-17	昆山市线路板厂	System and method for welding flexible printed circuit made of polyester material at low temperature
JP2014011169A (en)	2012-06-27	2014-01-20	Ps4 Luxco S A R L	Silicon interposer and semiconductor device with the same
JP6392107B2 (en) *	2014-12-18	2018-09-19	株式会社フジクラ	High frequency transmission board
CN106409701A (en) *	2016-10-26	2017-02-15	中国科学院半导体研究所	Electrode structure for gold wire bonding
CN107995776A (en) *	2017-12-14	2018-05-04	武汉电信器件有限公司	A kind of circuit board and crosstalk eliminating method for being used to shield crosstalk
JP6468379B2 (en) *	2018-02-15	2019-02-13	セイコーエプソン株式会社	LIQUID DISCHARGE DEVICE, DRIVE CIRCUIT, AND LIQUID DISCHARGE DEVICE CONTROL METHOD
DE102018204108A1 (en) *	2018-03-19	2019-09-19	BSH Hausgeräte GmbH	Test coupon and method for checking a printed circuit board
CN110719689A (en) *	2019-10-15	2020-01-21	上海中航光电子有限公司	Circuit board and wiring method thereof
JPWO2022219709A1 (en) *	2021-04-13	2022-10-20
WO2023238376A1 (en) *	2022-06-10	2023-12-14	日本電信電話株式会社	Impedance converter

1996
- 1996-07-23 JP JP8193318A patent/JPH1041637A/en active Pending
1997
- 1997-07-15 SE SE9702725A patent/SE9702725D0/en not_active IP Right Cessation
- 1997-07-15 SE SE516368D patent/SE516368C2/en not_active IP Right Cessation
- 1997-07-16 CN CN97112232A patent/CN1171718A/en active Pending
- 1997-07-22 BR BR9702641A patent/BR9702641A/en not_active IP Right Cessation
- 1997-07-23 KR KR1019970035520A patent/KR980013577A/en active Search and Examination

Also Published As

Publication number	Publication date
CN1171718A (en)	1998-01-28
SE9702725D0 (en)	1997-07-15
KR980013577A (en)	1998-04-30
SE516368C2 (en)	2002-01-08
JPH1041637A (en)	1998-02-13
SE9702725L (en)	2002-01-08

Publication	Publication Date	Title
BR9702641A (en)	1998-06-30	Multilayer connection plate
BR9710838A (en)	1999-08-17	High barrier multilayer laminate
DE69837110D1 (en)	2007-03-29	MULTILAYER CONDUCTOR PLATE
DE69738424D1 (en)	2008-02-07	Multilayer structure
DE59700099D1 (en)	1999-04-08	Bone plate
DE69740068D1 (en)	2011-01-13	laminate floor
BR9705683A (en)	1999-06-08	Basic board
DE69710940D1 (en)	2002-04-18	Laminate gasket
ID17759A (en)	1998-01-22	PLATE PRINTING
DE69508218D1 (en)	1999-04-15	Laminated fiberglass plate
DE69627023D1 (en)	2003-04-30	PLATE UNIT
ATA8095A (en)	1996-07-15	LAMINATE COMPONENT
DE69825481D1 (en)	2004-09-09	PLATE UNIT
BR9500928A (en)	1995-11-07	Connection plate
BR9704785A (en)	1998-12-22	Pressure plate set
ID23810A (en)	2000-05-11	SLIDING PLATE
KR960017560U (en)	1996-06-17	Dorumarine Plate
KR960036598U (en)	1996-12-16	Interior laminate
ITBO950183A0 (en)	1995-04-26	MULTILAYER CONNECTION PLATE
DE69505678D1 (en)	1998-12-03	DAMP-FREE PRINTING PLATE
PT9435T (en)	1998-07-31	ROOF PLATE
BR9605688A (en)	1998-08-18	Deodorant plate
BR9503993A (en)	1997-10-14	Solid state cooling plate
BR7400092U (en)	1995-10-10	Multivideo board
KR960033374U (en)	1996-11-19	Side plate structure for prefabricated desk

Legal Events

Date	Code	Title	Description
2002-05-28	FB34	Technical and formal requirements: requirement - article 34 of industrial property law
2007-06-26	B08F	Application fees: application dismissed [chapter 8.6 patent gazette]	Free format text: REFERENTE A 8A, 9A E 10A ANUIDADES.
2011-12-06	B08K	Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]	Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1903 DE 26/06/2007.