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AU2001280684A1 - Vertically integrated chip on chip circuit stack - Google Patents

Vertically integrated chip on chip circuit stack

Info

Publication number
AU2001280684A1
AU2001280684A1 AU2001280684A AU8068401A AU2001280684A1 AU 2001280684 A1 AU2001280684 A1 AU 2001280684A1 AU 2001280684 A AU2001280684 A AU 2001280684A AU 8068401 A AU8068401 A AU 8068401A AU 2001280684 A1 AU2001280684 A1 AU 2001280684A1
Authority
AU
Australia
Prior art keywords
chip
vertically integrated
circuit stack
integrated chip
chip circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001280684A
Inventor
Marc E. Robinson
Alfons Vindasius
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vertical Circuits Inc
Original Assignee
Vertical Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vertical Circuits Inc filed Critical Vertical Circuits Inc
Publication of AU2001280684A1 publication Critical patent/AU2001280684A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
AU2001280684A 2000-07-20 2001-07-20 Vertically integrated chip on chip circuit stack Abandoned AU2001280684A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62001100A 2000-07-20 2000-07-20
US09620011 2000-07-20
PCT/US2001/023018 WO2002009181A1 (en) 2000-07-20 2001-07-20 Vertically integrated chip on chip circuit stack

Publications (1)

Publication Number Publication Date
AU2001280684A1 true AU2001280684A1 (en) 2002-02-05

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CN100411170C (en) * 2005-05-30 2008-08-13 矽品精密工业股份有限公司 Stack architecture of multiple chips
US7485969B2 (en) 2005-09-01 2009-02-03 Micron Technology, Inc. Stacked microelectronic devices and methods for manufacturing microelectronic devices
SG130073A1 (en) * 2005-09-01 2007-03-20 Micron Technology Inc Stacked microelectronic devices and methods for manufacturing microelectronic devices

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US5291061A (en) * 1993-04-06 1994-03-01 Micron Semiconductor, Inc. Multi-chip stacked devices
US5323060A (en) * 1993-06-02 1994-06-21 Micron Semiconductor, Inc. Multichip module having a stacked chip arrangement
US5442230A (en) * 1994-09-16 1995-08-15 National Semiconductor Corporation High density integrated circuit assembly combining leadframe leads with conductive traces
KR0147259B1 (en) * 1994-10-27 1998-08-01 김광호 Stack type semiconductor package and method for manufacturing the same
US6005778A (en) * 1995-06-15 1999-12-21 Honeywell Inc. Chip stacking and capacitor mounting arrangement including spacers

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