AU2001280684A1 - Vertically integrated chip on chip circuit stack - Google Patents
Vertically integrated chip on chip circuit stackInfo
- Publication number
- AU2001280684A1 AU2001280684A1 AU2001280684A AU8068401A AU2001280684A1 AU 2001280684 A1 AU2001280684 A1 AU 2001280684A1 AU 2001280684 A AU2001280684 A AU 2001280684A AU 8068401 A AU8068401 A AU 8068401A AU 2001280684 A1 AU2001280684 A1 AU 2001280684A1
- Authority
- AU
- Australia
- Prior art keywords
- chip
- vertically integrated
- circuit stack
- integrated chip
- chip circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US62001100A | 2000-07-20 | 2000-07-20 | |
US09620011 | 2000-07-20 | ||
PCT/US2001/023018 WO2002009181A1 (en) | 2000-07-20 | 2001-07-20 | Vertically integrated chip on chip circuit stack |
Publications (1)
Publication Number | Publication Date |
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AU2001280684A1 true AU2001280684A1 (en) | 2002-02-05 |
Family
ID=24484224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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AU2001280684A Abandoned AU2001280684A1 (en) | 2000-07-20 | 2001-07-20 | Vertically integrated chip on chip circuit stack |
Country Status (2)
Country | Link |
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AU (1) | AU2001280684A1 (en) |
WO (1) | WO2002009181A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100411170C (en) * | 2005-05-30 | 2008-08-13 | 矽品精密工业股份有限公司 | Stack architecture of multiple chips |
US7485969B2 (en) | 2005-09-01 | 2009-02-03 | Micron Technology, Inc. | Stacked microelectronic devices and methods for manufacturing microelectronic devices |
SG130073A1 (en) * | 2005-09-01 | 2007-03-20 | Micron Technology Inc | Stacked microelectronic devices and methods for manufacturing microelectronic devices |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5291061A (en) * | 1993-04-06 | 1994-03-01 | Micron Semiconductor, Inc. | Multi-chip stacked devices |
US5323060A (en) * | 1993-06-02 | 1994-06-21 | Micron Semiconductor, Inc. | Multichip module having a stacked chip arrangement |
US5442230A (en) * | 1994-09-16 | 1995-08-15 | National Semiconductor Corporation | High density integrated circuit assembly combining leadframe leads with conductive traces |
KR0147259B1 (en) * | 1994-10-27 | 1998-08-01 | 김광호 | Stack type semiconductor package and method for manufacturing the same |
US6005778A (en) * | 1995-06-15 | 1999-12-21 | Honeywell Inc. | Chip stacking and capacitor mounting arrangement including spacers |
-
2001
- 2001-07-20 WO PCT/US2001/023018 patent/WO2002009181A1/en active Application Filing
- 2001-07-20 AU AU2001280684A patent/AU2001280684A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2002009181A1 (en) | 2002-01-31 |
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