[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

AU2001236028A1 - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
AU2001236028A1
AU2001236028A1 AU2001236028A AU3602801A AU2001236028A1 AU 2001236028 A1 AU2001236028 A1 AU 2001236028A1 AU 2001236028 A AU2001236028 A AU 2001236028A AU 3602801 A AU3602801 A AU 3602801A AU 2001236028 A1 AU2001236028 A1 AU 2001236028A1
Authority
AU
Australia
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001236028A
Inventor
Koichi Kanemoto
Masachika Masuda
Hirotaka Nishizawa
Tamaki Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Solutions Technology Ltd
Original Assignee
Hitachi Ltd
Hitachi ULSI Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi ULSI Systems Co Ltd filed Critical Hitachi Ltd
Publication of AU2001236028A1 publication Critical patent/AU2001236028A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49575Assemblies of semiconductor devices on lead frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32135Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48253Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a potential ring of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73215Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/06555Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06562Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01021Scandium [Sc]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01028Nickel [Ni]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01032Germanium [Ge]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01039Yttrium [Y]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01056Barium [Ba]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01058Cerium [Ce]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/07802Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • H01L2924/143Digital devices
    • H01L2924/1433Application-specific integrated circuit [ASIC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19105Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19106Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30105Capacitance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Dram (AREA)
  • Semiconductor Memories (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AU2001236028A 2000-03-03 2001-03-01 Semiconductor device Abandoned AU2001236028A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000063285A JP3955712B2 (en) 2000-03-03 2000-03-03 Semiconductor device
JP2000-63285 2000-03-03
PCT/JP2001/001576 WO2001065605A1 (en) 2000-03-03 2001-03-01 Semiconductor device

Publications (1)

Publication Number Publication Date
AU2001236028A1 true AU2001236028A1 (en) 2001-09-12

Family

ID=18583176

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001236028A Abandoned AU2001236028A1 (en) 2000-03-03 2001-03-01 Semiconductor device

Country Status (8)

Country Link
US (4) US6501173B2 (en)
JP (1) JP3955712B2 (en)
KR (2) KR100842140B1 (en)
CN (1) CN1257552C (en)
AU (1) AU2001236028A1 (en)
MY (1) MY124929A (en)
TW (2) TW552667B (en)
WO (1) WO2001065605A1 (en)

Families Citing this family (113)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033436A (en) * 2000-07-14 2002-01-31 Hitachi Ltd Semiconductor device
US7444575B2 (en) * 2000-09-21 2008-10-28 Inapac Technology, Inc. Architecture and method for testing of an integrated circuit device
US7006940B1 (en) * 2002-11-27 2006-02-28 Inapac Technology, Inc. Set up for a first integrated circuit chip to allow for testing of a co-packaged second integrated circuit chip
JP2002124626A (en) * 2000-10-16 2002-04-26 Hitachi Ltd Semiconductor device
US6843421B2 (en) * 2001-08-13 2005-01-18 Matrix Semiconductor, Inc. Molded memory module and method of making the module absent a substrate support
US7245141B2 (en) * 2002-11-27 2007-07-17 Inapac Technology, Inc. Shared bond pad for testing a memory within a packaged semiconductor device
US8286046B2 (en) 2001-09-28 2012-10-09 Rambus Inc. Integrated circuit testing module including signal shaping interface
US7404117B2 (en) * 2005-10-24 2008-07-22 Inapac Technology, Inc. Component testing and recovery
US7313740B2 (en) * 2002-07-25 2007-12-25 Inapac Technology, Inc. Internally generating patterns for testing in an integrated circuit device
US8166361B2 (en) 2001-09-28 2012-04-24 Rambus Inc. Integrated circuit testing module configured for set-up and hold time testing
US8001439B2 (en) 2001-09-28 2011-08-16 Rambus Inc. Integrated circuit testing module including signal shaping interface
US6778436B2 (en) * 2001-10-10 2004-08-17 Fong Piau Apparatus and architecture for a compact flash memory controller
JP4005813B2 (en) 2002-01-28 2007-11-14 株式会社東芝 Semiconductor device
US6617181B1 (en) * 2002-02-01 2003-09-09 Lsi Logic Corporation Flip chip testing
US6731011B2 (en) * 2002-02-19 2004-05-04 Matrix Semiconductor, Inc. Memory module having interconnected and stacked integrated circuits
US7941675B2 (en) 2002-12-31 2011-05-10 Burr James B Adaptive power control
US7180322B1 (en) 2002-04-16 2007-02-20 Transmeta Corporation Closed loop feedback control of integrated circuits
KR100458869B1 (en) * 2002-04-17 2004-12-03 삼성전자주식회사 Semiconductor chip package that direction of attaching is free
US7132311B2 (en) * 2002-07-26 2006-11-07 Intel Corporation Encapsulation of a stack of semiconductor dice
US8063650B2 (en) 2002-11-27 2011-11-22 Rambus Inc. Testing fuse configurations in semiconductor devices
US7466160B2 (en) * 2002-11-27 2008-12-16 Inapac Technology, Inc. Shared memory bus architecture for system with processor and memory units
US7309999B2 (en) * 2002-11-27 2007-12-18 Inapac Technology, Inc. Electronic device having an interface supported testing mode
US7673193B1 (en) * 2005-08-18 2010-03-02 Rambus Inc. Processor-memory unit for use in system-in-package and system-in-module devices
US7228242B2 (en) * 2002-12-31 2007-06-05 Transmeta Corporation Adaptive power control based on pre package characterization of integrated circuits
US7953990B2 (en) 2002-12-31 2011-05-31 Stewart Thomas E Adaptive power control based on post package characterization of integrated circuits
JP4149289B2 (en) * 2003-03-12 2008-09-10 株式会社ルネサステクノロジ Semiconductor device
KR100481184B1 (en) * 2003-03-26 2005-04-07 삼성전자주식회사 Semiconductor memory integrated circuit
JP4190961B2 (en) * 2003-06-26 2008-12-03 株式会社ルネサステクノロジ Multi-chip module
JP2005109086A (en) * 2003-09-30 2005-04-21 Matsushita Electric Ind Co Ltd Semiconductor device
US6977433B2 (en) * 2003-10-28 2005-12-20 Seagate Technology Llc Multi function package
US7287115B2 (en) * 2003-10-30 2007-10-23 Kabushiki Kaisha Toshiba Multi-chip package type memory system
US7649402B1 (en) 2003-12-23 2010-01-19 Tien-Min Chen Feedback-controlled body-bias voltage source
US7129771B1 (en) 2003-12-23 2006-10-31 Transmeta Corporation Servo loop for well bias voltage source
US7012461B1 (en) 2003-12-23 2006-03-14 Transmeta Corporation Stabilization component for a substrate potential regulation circuit
US7692477B1 (en) 2003-12-23 2010-04-06 Tien-Min Chen Precise control component for a substrate potential regulation circuit
TWI237889B (en) * 2004-01-16 2005-08-11 Optimum Care Int Tech Inc Chip leadframe module
JP4343727B2 (en) * 2004-02-13 2009-10-14 株式会社ルネサステクノロジ Semiconductor device
JP4885426B2 (en) * 2004-03-12 2012-02-29 ルネサスエレクトロニクス株式会社 Semiconductor memory device, semiconductor device and manufacturing method thereof
JP4157065B2 (en) * 2004-03-29 2008-09-24 株式会社東芝 Semiconductor memory device
KR100564621B1 (en) 2004-04-08 2006-03-28 삼성전자주식회사 Buffered memory module package and module-stacked package comprising the module package
TWI237883B (en) * 2004-05-11 2005-08-11 Via Tech Inc Chip embedded package structure and process thereof
JP4455158B2 (en) * 2004-05-20 2010-04-21 株式会社ルネサステクノロジ Semiconductor device
US7562233B1 (en) 2004-06-22 2009-07-14 Transmeta Corporation Adaptive control of operating and body bias voltages
US7774625B1 (en) 2004-06-22 2010-08-10 Eric Chien-Li Sheng Adaptive voltage control by accessing information stored within and specific to a microprocessor
JP4752369B2 (en) * 2004-08-24 2011-08-17 ソニー株式会社 Semiconductor device and substrate
JP4003780B2 (en) 2004-09-17 2007-11-07 カシオ計算機株式会社 Semiconductor device and manufacturing method thereof
US20060095622A1 (en) * 2004-10-28 2006-05-04 Spansion, Llc System and method for improved memory performance in a mobile device
KR100588337B1 (en) 2005-02-11 2006-06-09 삼성전자주식회사 Semiconductor device with multiple pads of common functionality, and multi chip package using the same
KR100699838B1 (en) 2005-04-13 2007-03-27 삼성전자주식회사 A semiconductor device including the ROM interface PAD
JP2007019415A (en) 2005-07-11 2007-01-25 Renesas Technology Corp Semiconductor device and its manufacturing method
US7602050B2 (en) * 2005-07-18 2009-10-13 Qualcomm Incorporated Integrated circuit packaging
KR100631959B1 (en) * 2005-09-07 2006-10-04 주식회사 하이닉스반도체 Stack type semiconductor package and manufacture method thereof
US7779311B2 (en) * 2005-10-24 2010-08-17 Rambus Inc. Testing and recovery in a multilayer device
JP4626490B2 (en) * 2005-11-07 2011-02-09 ソニー株式会社 Circuit equipment
US7631152B1 (en) * 2005-11-28 2009-12-08 Nvidia Corporation Determining memory flush states for selective heterogeneous memory flushes
US7443011B2 (en) * 2006-02-10 2008-10-28 Marvell International Technology Ltd. System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices
US7990727B1 (en) * 2006-04-03 2011-08-02 Aprolase Development Co., Llc Ball grid array stack
JP2007335809A (en) * 2006-06-19 2007-12-27 Nec Electronics Corp Semiconductor device and method for controlling operation of semiconductor device
US8949555B1 (en) 2007-08-30 2015-02-03 Virident Systems, Inc. Methods for sustained read and write performance with non-volatile memory
US8806116B2 (en) * 2008-02-12 2014-08-12 Virident Systems, Inc. Memory modules for two-dimensional main memory
US8074022B2 (en) * 2006-09-28 2011-12-06 Virident Systems, Inc. Programmable heterogeneous memory controllers for main memory with different memory modules
US7761626B2 (en) * 2006-09-28 2010-07-20 Virident Systems, Inc. Methods for main memory in a system with a memory controller configured to control access to non-volatile memory, and related technologies
US20080082750A1 (en) * 2006-09-28 2008-04-03 Okin Kenneth A Methods of communicating to, memory modules in a memory channel
US8051253B2 (en) * 2006-09-28 2011-11-01 Virident Systems, Inc. Systems and apparatus with programmable memory control for heterogeneous main memory
US7761624B2 (en) * 2006-09-28 2010-07-20 Virident Systems, Inc. Systems and apparatus for main memory with non-volatile type memory modules, and related technologies
US9984012B2 (en) 2006-09-28 2018-05-29 Virident Systems, Llc Read writeable randomly accessible non-volatile memory modules
US7761625B2 (en) * 2006-09-28 2010-07-20 Virident Systems, Inc. Methods for main memory with non-volatile type memory modules, and related technologies
US7761623B2 (en) * 2006-09-28 2010-07-20 Virident Systems, Inc. Main memory in a system with a memory controller configured to control access to non-volatile memory, and related technologies
US20080079148A1 (en) * 2006-09-30 2008-04-03 Silicon Laboratories Inc. Package for mixed signal mcu with minimal pin count
US7466603B2 (en) 2006-10-03 2008-12-16 Inapac Technology, Inc. Memory accessing circuit system
WO2008051940A2 (en) 2006-10-23 2008-05-02 Virident Systems, Inc. Methods and apparatus of dual inline memory modules for flash memory
US7561027B2 (en) * 2006-10-26 2009-07-14 Hewlett-Packard Development Company, L.P. Sensing device
KR100850204B1 (en) * 2006-11-04 2008-08-04 삼성전자주식회사 Method and apparatus for generating high-frequency command and address signals for high-speed semiconductor memory device testing
KR100845527B1 (en) * 2006-12-06 2008-07-10 삼성전자주식회사 Memory device and method of contolling clock cycle of Memory Controller
KR100843718B1 (en) * 2007-01-25 2008-07-04 삼성전자주식회사 Semiconductor packages having immunity against void due to adhesive material and methods of forming the same
KR100877609B1 (en) * 2007-01-29 2009-01-09 삼성전자주식회사 Semiconductor memory system performing data error correction using flag cell array of buffer memory and driving method thereof
ITMI20070933A1 (en) * 2007-05-08 2008-11-09 St Microelectronics Srl MULTI PIASTRINA ELECTRONIC SYSTEM
JP4469877B2 (en) * 2007-07-12 2010-06-02 株式会社東芝 Electronic equipment
US9921896B2 (en) 2007-08-30 2018-03-20 Virident Systems, Llc Shutdowns and data recovery to avoid read errors weak pages in a non-volatile memory system
US7898091B2 (en) * 2007-10-02 2011-03-01 Sandisk Corporation Multi-host interface controller with USB PHY/analog functions integrated in a single package
JP2009134573A (en) * 2007-11-30 2009-06-18 Nec Corp Multi-chip semiconductor device and data transfer method
WO2009102821A2 (en) * 2008-02-12 2009-08-20 Virident Systems, Inc. Methods and apparatus for two-dimensional main memory
US8307180B2 (en) 2008-02-28 2012-11-06 Nokia Corporation Extended utilization area for a memory device
WO2009142630A1 (en) * 2008-05-21 2009-11-26 Hewlett-Packard Development Company, L.P. Strain measurement chips for printed circuit boards
US8745314B1 (en) 2008-06-24 2014-06-03 Virident Systems, Inc. Methods for a random read and read/write block accessible memory
US9513695B2 (en) 2008-06-24 2016-12-06 Virident Systems, Inc. Methods of managing power in network computer systems
JP2010021449A (en) * 2008-07-11 2010-01-28 Toshiba Corp Semiconductor device
JP2010185677A (en) * 2009-02-10 2010-08-26 Toshiba Corp Device and method for measuring power supply current
US8874824B2 (en) 2009-06-04 2014-10-28 Memory Technologies, LLC Apparatus and method to share host system RAM with mass storage memory RAM
JP5218319B2 (en) * 2009-07-27 2013-06-26 富士通セミコンダクター株式会社 Semiconductor substrate
JP5581627B2 (en) * 2009-08-05 2014-09-03 セイコーエプソン株式会社 Integrated circuit device and electronic apparatus
JP2011129894A (en) * 2009-11-18 2011-06-30 Toshiba Corp Semiconductor device
EP2339476B1 (en) * 2009-12-07 2012-08-15 STMicroelectronics (Research & Development) Limited Interface connecting dies in an IC package
EP2330514B1 (en) 2009-12-07 2018-12-05 STMicroelectronics (Research & Development) Limited An integrated circuit package
EP2339795B1 (en) * 2009-12-07 2013-08-14 STMicroelectronics (Research & Development) Limited Inter-chip communication interface for a multi-chip package
EP2333830B1 (en) * 2009-12-07 2014-09-03 STMicroelectronics (Research & Development) Limited a package comprising a first and a second die coupled by a multiplexed bus
EP2339475A1 (en) * 2009-12-07 2011-06-29 STMicroelectronics (Research & Development) Limited Inter-chip communication interface for a multi-chip package
EP2333673B1 (en) * 2009-12-07 2014-04-16 STMicroelectronics (Research & Development) Limited Signal sampling and transfer
TW201134317A (en) * 2010-03-29 2011-10-01 Hon Hai Prec Ind Co Ltd Pins assignment for circuit board
TWI496161B (en) * 2010-08-06 2015-08-11 Phison Electronics Corp Memory identification code generating method, management method, controller and storage system
TW201225249A (en) 2010-12-08 2012-06-16 Ind Tech Res Inst Stacked structure and stacked method for three-dimensional integrated circuit
US8521937B2 (en) 2011-02-16 2013-08-27 Stmicroelectronics (Grenoble 2) Sas Method and apparatus for interfacing multiple dies with mapping to modify source identity
WO2012163100A1 (en) * 2011-05-30 2012-12-06 深圳市江波龙电子有限公司 Semiconductor chip and storage device
US9417998B2 (en) 2012-01-26 2016-08-16 Memory Technologies Llc Apparatus and method to provide cache move with non-volatile mass memory system
KR20130092110A (en) 2012-02-10 2013-08-20 삼성전자주식회사 Embeded solid state disk and solid state disk
US9311226B2 (en) 2012-04-20 2016-04-12 Memory Technologies Llc Managing operational state data of a memory module using host memory in association with state change
KR102104060B1 (en) 2013-04-29 2020-04-23 삼성전자 주식회사 POP(Package On Package) semiconductor structure
US20150075849A1 (en) * 2013-09-17 2015-03-19 Jia Lin Yap Semiconductor device and lead frame with interposer
WO2015089488A1 (en) 2013-12-12 2015-06-18 Memory Technologies Llc Channel optimized storage modules
KR102219296B1 (en) 2014-08-14 2021-02-23 삼성전자 주식회사 Semiconductor package
CN109525237B (en) * 2017-09-18 2020-10-09 华为技术有限公司 Interface unit and interface module and chip with same
KR102605145B1 (en) 2018-07-13 2023-11-24 에스케이하이닉스 주식회사 Semiconductor apparatus including a plurality of dies operating as a plurality of channels
TWI763070B (en) * 2020-10-05 2022-05-01 新唐科技股份有限公司 Semiconductor device and controlling method thereof

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513662A (en) * 1991-07-03 1993-01-22 Nippondenso Co Ltd Multichip module
JP2817486B2 (en) * 1991-11-29 1998-10-30 日本電気株式会社 Logic integrated circuit
JPH065386A (en) 1992-06-19 1994-01-14 Kobe Steel Ltd Electronic cyclotron resonance device
JPH06250799A (en) * 1993-02-26 1994-09-09 Toshiba Corp Semiconductor disk device and computer system using the same
JPH06333848A (en) 1993-05-27 1994-12-02 Hitachi Ltd Plasma generating device
TW354859B (en) * 1994-02-07 1999-03-21 Siemens Ag A storage unit of semiconductor assembled of multi-memory chips and its manufacturing method a semiconductor memory system is composed with several single memory chips or different designed memory units
JPH08316407A (en) * 1995-05-15 1996-11-29 Nec Corp Manufacture of composite semiconductor package
US5917242A (en) * 1996-05-20 1999-06-29 Micron Technology, Inc. Combination of semiconductor interconnect
US5754567A (en) * 1996-10-15 1998-05-19 Micron Quantum Devices, Inc. Write reduction in flash memory systems through ECC usage
JPH10198608A (en) * 1997-01-08 1998-07-31 Mitsubishi Electric Corp Memory card
JPH10207726A (en) * 1997-01-23 1998-08-07 Oki Electric Ind Co Ltd Semiconductor disk device
JPH1119370A (en) 1997-07-08 1999-01-26 Akiko Shinoda Foldable auxiliary table for sewing machine
JP3938617B2 (en) 1997-09-09 2007-06-27 富士通株式会社 Semiconductor device and semiconductor system
JP3937265B2 (en) 1997-09-29 2007-06-27 エルピーダメモリ株式会社 Semiconductor device
JPH11219984A (en) * 1997-11-06 1999-08-10 Sharp Corp Semiconductor device package, its manufacture and circuit board therefor
US6119254A (en) * 1997-12-23 2000-09-12 Stmicroelectronics, N.V. Hardware tracing/logging for highly integrated embedded controller device
JP3481444B2 (en) * 1998-01-14 2003-12-22 シャープ株式会社 Semiconductor device and manufacturing method thereof
KR100277438B1 (en) * 1998-05-28 2001-02-01 윤종용 Multi Chip Package
JP3813741B2 (en) 1998-06-04 2006-08-23 尚久 後藤 Plasma processing equipment
US6084308A (en) * 1998-06-30 2000-07-04 National Semiconductor Corporation Chip-on-chip integrated circuit package and method for making the same
JP3670853B2 (en) * 1998-07-30 2005-07-13 三洋電機株式会社 Semiconductor device
US6307256B1 (en) * 1998-10-26 2001-10-23 Apack Technologies Inc. Semiconductor package with a stacked chip on a leadframe
JP3437107B2 (en) * 1999-01-27 2003-08-18 シャープ株式会社 Resin-sealed semiconductor device
US6291881B1 (en) * 1999-03-04 2001-09-18 United Microelectronics Corp. Dual silicon chip package
JP4164192B2 (en) * 1999-05-12 2008-10-08 株式会社ルネサステクノロジ Memory device equipped with semiconductor device
JP3606124B2 (en) * 1999-08-19 2005-01-05 セイコーエプソン株式会社 Semiconductor integrated circuit device and electronic device

Also Published As

Publication number Publication date
US6531773B2 (en) 2003-03-11
MY124929A (en) 2006-07-31
TW552667B (en) 2003-09-11
US6492727B2 (en) 2002-12-10
KR100842140B1 (en) 2008-06-27
US20020030270A1 (en) 2002-03-14
US20020017720A1 (en) 2002-02-14
CN1257552C (en) 2006-05-24
US20020011650A1 (en) 2002-01-31
KR20030036130A (en) 2003-05-09
US6501173B2 (en) 2002-12-31
US20030151134A1 (en) 2003-08-14
JP2001250908A (en) 2001-09-14
KR100828855B1 (en) 2008-05-09
JP3955712B2 (en) 2007-08-08
KR20080008426A (en) 2008-01-23
TW497199B (en) 2002-08-01
WO2001065605A1 (en) 2001-09-07
CN1398431A (en) 2003-02-19

Similar Documents

Publication Publication Date Title
AU2000224587A1 (en) Semiconductor device
AU2001236028A1 (en) Semiconductor device
AU2319600A (en) Semiconductor device
AU2001234973A1 (en) Semiconductor devices
AU2002316979A1 (en) Semiconductor device
AU2459200A (en) Semiconductor device
SG99939A1 (en) Semiconductor device
EP1231640A4 (en) Semiconductor device
GB2373634B (en) Semiconductor device
AU2001228310A1 (en) Rear-projecting device
AU2001250477A1 (en) Schottky-diode semiconductor device
EP1193765A3 (en) Power semiconductor device
AU3837200A (en) Semiconductor device
AU2002222154A1 (en) Semiconductor diode device
AU1648801A (en) Semiconductor device
AU6071501A (en) Semiconductor light-emitting device
GB2370916B (en) Semiconductor device
EP1215780A3 (en) Semiconductor optical device
GB2365621B (en) Semiconductor device
AU2001236025A1 (en) Semiconductor laser device
AU2000274531A1 (en) Semiconductor device
SG109474A1 (en) Semiconductor device
AU2001241311A1 (en) Cap-signaling device
EP1049168A3 (en) Semiconductor device
AU2001254745A1 (en) Pellet-freezing device