NL9500511A - Vormrunnerverwijdering van een substraat-gebaseerde, van een behuizing voorziene, elektronische bouwsteen. - Google Patents
Vormrunnerverwijdering van een substraat-gebaseerde, van een behuizing voorziene, elektronische bouwsteen. Download PDFInfo
- Publication number
- NL9500511A NL9500511A NL9500511A NL9500511A NL9500511A NL 9500511 A NL9500511 A NL 9500511A NL 9500511 A NL9500511 A NL 9500511A NL 9500511 A NL9500511 A NL 9500511A NL 9500511 A NL9500511 A NL 9500511A
- Authority
- NL
- Netherlands
- Prior art keywords
- substrate
- building block
- mold
- encapsulation
- encapsulant
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 224
- 239000000463 material Substances 0.000 claims description 157
- 239000008393 encapsulating agent Substances 0.000 claims description 114
- 238000005538 encapsulation Methods 0.000 claims description 72
- 238000000465 moulding Methods 0.000 claims description 55
- 238000000034 method Methods 0.000 claims description 38
- 229910000679 solder Inorganic materials 0.000 claims description 35
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- 238000012546 transfer Methods 0.000 claims description 11
- 230000002000 scavenging effect Effects 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 230000003373 anti-fouling effect Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 25
- 235000012431 wafers Nutrition 0.000 description 25
- 239000004065 semiconductor Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000011449 brick Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 150000001875 compounds Chemical group 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052782 aluminium Chemical group 0.000 description 2
- 238000005576 amination reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002537 cosmetic Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002648 laminated material Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 206010061619 Deformity Diseases 0.000 description 1
- 241000287462 Phalacrocorax carbo Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010107 reaction injection moulding Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4864—Cleaning, e.g. removing of solder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US21433994 | 1994-03-16 | ||
| US08/214,339 US5635671A (en) | 1994-03-16 | 1994-03-16 | Mold runner removal from a substrate-based packaged electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL9500511A true NL9500511A (nl) | 1995-11-01 |
Family
ID=22798687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL9500511A NL9500511A (nl) | 1994-03-16 | 1995-03-15 | Vormrunnerverwijdering van een substraat-gebaseerde, van een behuizing voorziene, elektronische bouwsteen. |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5635671A (ja) |
| JP (1) | JPH088283A (ja) |
| NL (1) | NL9500511A (ja) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6465743B1 (en) * | 1994-12-05 | 2002-10-15 | Motorola, Inc. | Multi-strand substrate for ball-grid array assemblies and method |
| US6130383A (en) * | 1995-05-31 | 2000-10-10 | Sgs-Thomson Microelectronics, S.A. | Solder ball array package and a method of encapsulation |
| US5852870A (en) * | 1996-04-24 | 1998-12-29 | Amkor Technology, Inc. | Method of making grid array assembly |
| US5776798A (en) * | 1996-09-04 | 1998-07-07 | Motorola, Inc. | Semiconductor package and method thereof |
| US5854512A (en) * | 1996-09-20 | 1998-12-29 | Vlsi Technology, Inc. | High density leaded ball-grid array package |
| KR100369386B1 (ko) * | 1996-12-27 | 2003-04-08 | 앰코 테크놀로지 코리아 주식회사 | 볼그리드어레이반도체패키지용인쇄회로기판및이를이용한볼그리드어레이반도체패키지의봉지방법 |
| US6432751B1 (en) * | 1997-04-11 | 2002-08-13 | Matsushita Electric Industrial Co., Ltd. | Resin mold electric part and producing method therefor |
| KR19990004211A (ko) * | 1997-06-27 | 1999-01-15 | 한효용 | 게이트슬롯이 형성된 서브스트레이트 |
| TW345709B (en) * | 1997-09-18 | 1998-11-21 | Siliconware Precision Industries Co Ltd | Method for encapsulating substrate-based electronic device |
| DE19756325A1 (de) * | 1997-12-18 | 1999-07-01 | Daimler Chrysler Ag | Halbleiterscheibe mit integrierten Einzelbauelementen, Verfahren und Vorrichtung zur Herstellung einer Halbleiterscheibe |
| US5969427A (en) * | 1998-02-05 | 1999-10-19 | Micron Technology, Inc. | Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device |
| US6117708A (en) | 1998-02-05 | 2000-09-12 | Micron Technology, Inc. | Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device |
| US6111324A (en) | 1998-02-05 | 2000-08-29 | Asat, Limited | Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package |
| TW432550B (en) * | 1998-02-07 | 2001-05-01 | Siliconware Precision Industries Co Ltd | Method of encapsulating a chip |
| JPH11307689A (ja) * | 1998-02-17 | 1999-11-05 | Seiko Epson Corp | 半導体装置、半導体装置用基板及びこれらの製造方法並びに電子機器 |
| US6096250A (en) * | 1998-03-06 | 2000-08-01 | Caesar International, Inc. | Process for releasing a runner from an electronic device package on a laminate plate |
| US6057179A (en) * | 1998-03-17 | 2000-05-02 | Compeq Manufacturing Company Limited | Method and structure for packaging an integrated circuit with readily removed excess encapsulant on degating region |
| US5982625A (en) * | 1998-03-19 | 1999-11-09 | Advanced Semiconductor Engineering, Inc. | Semiconductor packaging device |
| TW381329B (en) | 1998-04-03 | 2000-02-01 | Silicom Ware Prec Ind Co Ltd | Packaging method for chips |
| US6372553B1 (en) * | 1998-05-18 | 2002-04-16 | St Assembly Test Services, Pte Ltd | Disposable mold runner gate for substrate based electronic packages |
| JP3020201B2 (ja) | 1998-05-27 | 2000-03-15 | 亜南半導体株式会社 | ボールグリッドアレイ半導体パッケージのモールディング方法 |
| JP2997746B2 (ja) | 1998-05-27 | 2000-01-11 | 亜南半導体株式会社 | 印刷回路基板 |
| US6252309B1 (en) * | 1999-01-08 | 2001-06-26 | Advanced Semiconductor Engineering, Inc. | Packaged semiconductor substrate |
| US6355199B1 (en) | 1999-02-12 | 2002-03-12 | St. Assembly Test Services Pte Ltd | Method of molding flexible circuit with molded stiffener |
| KR200291282Y1 (ko) * | 1999-04-14 | 2002-10-14 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지용 인쇄회로기판 |
| US6232551B1 (en) * | 1999-08-18 | 2001-05-15 | Subtron Technology Co., Ltd. | Substrate board for semiconductor package |
| US6262490B1 (en) | 1999-11-05 | 2001-07-17 | Advanced Semiconductor Engineering, Inc. | Substrate strip for use in packaging semiconductor chips |
| US6566741B2 (en) | 1999-10-21 | 2003-05-20 | Intel Corporation | Grounding of package substrates |
| US6291882B1 (en) | 2000-06-02 | 2001-09-18 | Siliconware Precision Industries Co., Letd. | Packaging process and structure of electronic device |
| US6544812B1 (en) | 2000-11-06 | 2003-04-08 | St Assembly Test Service Ltd. | Single unit automated assembly of flex enhanced ball grid array packages |
| US6632704B2 (en) * | 2000-12-19 | 2003-10-14 | Intel Corporation | Molded flip chip package |
| US6441503B1 (en) | 2001-01-03 | 2002-08-27 | Amkor Technology, Inc. | Bond wire pressure sensor die package |
| US6420201B1 (en) | 2001-01-03 | 2002-07-16 | Amkor Technology, Inc. | Method for forming a bond wire pressure sensor die package |
| US6432737B1 (en) | 2001-01-03 | 2002-08-13 | Amkor Technology, Inc. | Method for forming a flip chip pressure sensor die package |
| TW473947B (en) | 2001-02-20 | 2002-01-21 | Siliconware Precision Industries Co Ltd | Substrate structure of semiconductor packaging article |
| US7148561B2 (en) | 2001-03-29 | 2006-12-12 | Siliconware Precision Industries Co., Ltd. | Ball grid array substrate strip with warpage-preventive linkage structure |
| US20020170897A1 (en) * | 2001-05-21 | 2002-11-21 | Hall Frank L. | Methods for preparing ball grid array substrates via use of a laser |
| TW508769B (en) * | 2001-06-07 | 2002-11-01 | Advanced Semiconductor Eng | Packaging substrate protected against electrostatic discharge |
| US6660559B1 (en) | 2001-06-25 | 2003-12-09 | Amkor Technology, Inc. | Method of making a chip carrier package using laser ablation |
| KR100415281B1 (ko) * | 2001-06-29 | 2004-01-16 | 삼성전자주식회사 | 양면 실장형 회로 기판 및 이를 포함하는 멀티 칩 패키지 |
| US20040053447A1 (en) * | 2001-06-29 | 2004-03-18 | Foster Donald Craig | Leadframe having fine pitch bond fingers formed using laser cutting method |
| US6617680B2 (en) * | 2001-08-22 | 2003-09-09 | Siliconware Precision Industries Co., Ltd. | Chip carrier, semiconductor package and fabricating method thereof |
| US7264456B2 (en) * | 2001-10-10 | 2007-09-04 | Micron Technology, Inc. | Leadframe and method for reducing mold compound adhesion problems |
| CN1327520C (zh) * | 2002-09-16 | 2007-07-18 | 日月光半导体制造股份有限公司 | 具有静电放电防护的封装基板 |
| JP2004186460A (ja) * | 2002-12-04 | 2004-07-02 | Sanyo Electric Co Ltd | 回路装置の製造方法 |
| US7169345B2 (en) * | 2003-08-27 | 2007-01-30 | Texas Instruments Incorporated | Method for integrated circuit packaging |
| CN100426477C (zh) * | 2004-01-09 | 2008-10-15 | 威宇科技测试封装有限公司 | 扁平塑封球栅阵列封装所用的载板的制造方法及其载板 |
| AU2006207933B2 (en) | 2005-01-28 | 2010-11-18 | Duke University | Apparatuses and methods for manipulating droplets on a printed circuit board |
| US7863761B2 (en) * | 2006-08-03 | 2011-01-04 | Stats Chippac Ltd. | Integrated circuit package system with molding vents |
| US8751178B2 (en) * | 2008-07-31 | 2014-06-10 | King Yuan Electronics Co., Ltd. | Method and apparatus for determining disposition of via hole on printed circuit board |
| EP2353179A4 (en) * | 2008-10-17 | 2012-10-03 | Occam Portfolio Llc | SOLDER-FREE FLEXIBLE CIRCUIT ARRANGEMENTS AND METHODS OF MANUFACTURING THE SAME |
| US8280544B2 (en) * | 2009-11-02 | 2012-10-02 | Mold Masters (2007) Limited | System for use in performance of injection molding operations |
| US20110106284A1 (en) * | 2009-11-02 | 2011-05-05 | Mold-Masters (2007) Limited | System for use in performance of injection molding operations |
| US20110106285A1 (en) * | 2009-11-02 | 2011-05-05 | Mold-Masters (2007) Limited | System for use in performance of injection molding operations |
| CN103021902A (zh) * | 2011-09-21 | 2013-04-03 | 国碁电子(中山)有限公司 | 半导体封装铸模装置及方法 |
| CN106653727A (zh) * | 2015-10-30 | 2017-05-10 | 飞思卡尔半导体公司 | 用于封装集成电路的基板阵列 |
| US11469149B2 (en) | 2019-11-15 | 2022-10-11 | Semtech Corporation | Semiconductor device and method of forming mold degating structure for pre-molded substrate |
| US11735554B2 (en) * | 2020-08-14 | 2023-08-22 | Sj Semiconductor (Jiangyin) Corporation | Wafer-level chip scale packaging structure having a rewiring layer and method for manufacturing the wafer-level chip scale packaging structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310553A (ja) * | 1986-07-01 | 1988-01-18 | Nec Corp | 半導体装置用リ−ドフレ−ム |
| JPH04177753A (ja) * | 1990-11-13 | 1992-06-24 | Citizen Watch Co Ltd | 樹脂封止型半導体装置 |
| US5241133A (en) * | 1990-12-21 | 1993-08-31 | Motorola, Inc. | Leadless pad array chip carrier |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4954308A (en) * | 1988-03-04 | 1990-09-04 | Citizen Watch Co., Ltd. | Resin encapsulating method |
| US5099101A (en) * | 1989-02-27 | 1992-03-24 | National Semiconductor Corporation | Laser trimming system for semiconductor integrated circuit chip packages |
| US5324474A (en) * | 1991-10-18 | 1994-06-28 | Texas Instruments Incorporated | Method of making a printed wiring board spacer |
| US5311402A (en) * | 1992-02-14 | 1994-05-10 | Nec Corporation | Semiconductor device package having locating mechanism for properly positioning semiconductor device within package |
| US5317196A (en) * | 1992-08-28 | 1994-05-31 | At&T Bell Laboratories | Encapsulant method and apparatus |
| US5478517A (en) * | 1994-02-28 | 1995-12-26 | Gennum Corporation | Method for molding IC chips |
-
1994
- 1994-03-16 US US08/214,339 patent/US5635671A/en not_active Expired - Lifetime
-
1995
- 1995-03-15 NL NL9500511A patent/NL9500511A/nl not_active Application Discontinuation
- 1995-03-15 JP JP7083247A patent/JPH088283A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310553A (ja) * | 1986-07-01 | 1988-01-18 | Nec Corp | 半導体装置用リ−ドフレ−ム |
| JPH04177753A (ja) * | 1990-11-13 | 1992-06-24 | Citizen Watch Co Ltd | 樹脂封止型半導体装置 |
| US5241133A (en) * | 1990-12-21 | 1993-08-31 | Motorola, Inc. | Leadless pad array chip carrier |
Non-Patent Citations (2)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 012, no. 215 (E - 623) 18 June 1988 (1988-06-18) * |
| PATENT ABSTRACTS OF JAPAN vol. 016, no. 486 (E - 1276) 8 October 1992 (1992-10-08) * |
Also Published As
| Publication number | Publication date |
|---|---|
| US5635671A (en) | 1997-06-03 |
| JPH088283A (ja) | 1996-01-12 |
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