NL7019075A - - Google Patents
Info
- Publication number
- NL7019075A NL7019075A NL7019075A NL7019075A NL7019075A NL 7019075 A NL7019075 A NL 7019075A NL 7019075 A NL7019075 A NL 7019075A NL 7019075 A NL7019075 A NL 7019075A NL 7019075 A NL7019075 A NL 7019075A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5382—Adaptable interconnections, e.g. for engineering changes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/02—Contacts, special
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/055—Fuse
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/122—Polycrystalline
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/15—Silicon on sapphire SOS
Landscapes
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
- Emergency Lowering Means (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Read Only Memory (AREA)
- Fuses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1370A | 1970-01-02 | 1970-01-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7019075A true NL7019075A (fr) | 1971-07-06 |
Family
ID=21689487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7019075A NL7019075A (fr) | 1970-01-02 | 1970-12-31 |
Country Status (14)
Country | Link |
---|---|
US (1) | US3699395A (fr) |
JP (1) | JPS495599B1 (fr) |
AT (1) | AT311092B (fr) |
BE (1) | BE761172A (fr) |
CS (1) | CS163239B2 (fr) |
DE (1) | DE2063579C3 (fr) |
ES (1) | ES196297Y (fr) |
FR (1) | FR2075108A5 (fr) |
GB (1) | GB1309310A (fr) |
MY (1) | MY7600090A (fr) |
NL (1) | NL7019075A (fr) |
NO (1) | NO129878B (fr) |
SE (1) | SE370143B (fr) |
ZA (1) | ZA706960B (fr) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE794202A (fr) * | 1972-01-19 | 1973-05-16 | Intel Corp | Liaison fusible pour circuit integre sur substrat semi-conducteur pour memoires |
JPS5097286A (fr) * | 1973-12-25 | 1975-08-02 | ||
GB1445479A (en) * | 1974-01-22 | 1976-08-11 | Raytheon Co | Electrical fuses |
US4042950A (en) * | 1976-03-01 | 1977-08-16 | Advanced Micro Devices, Inc. | Platinum silicide fuse links for integrated circuit devices |
FR2422224A1 (fr) * | 1978-04-06 | 1979-11-02 | Radiotechnique Compelec | Memoire morte programmable a diodes semiconductrices |
DE2625089A1 (de) * | 1976-06-04 | 1977-12-15 | Bosch Gmbh Robert | Anordnung zum auftrennen von leiterbahnen auf integrierten schaltkreisen |
DE2842085A1 (de) * | 1978-09-27 | 1980-05-08 | Siemens Ag | Modular aufgebautes datenverarbeitungssystem fuer funktionsgebundenen einsatz |
DE3001522A1 (de) * | 1980-01-17 | 1981-07-30 | Bosch Gmbh Robert | Elektrisches verbindungssystem fuer gleichrichter |
JPS5763854A (en) * | 1980-10-07 | 1982-04-17 | Toshiba Corp | Semiconductor device |
JPS5846174B2 (ja) * | 1981-03-03 | 1983-10-14 | 株式会社東芝 | 半導体集積回路 |
US4442449A (en) * | 1981-03-16 | 1984-04-10 | Fairchild Camera And Instrument Corp. | Binary germanium-silicon interconnect and electrode structure for integrated circuits |
JPS5758783Y2 (fr) * | 1981-08-13 | 1982-12-15 | ||
EP0076967B1 (fr) * | 1981-10-09 | 1987-08-12 | Kabushiki Kaisha Toshiba | Dispositif semi-conducteur comprenant un élément fusible |
US4814853A (en) * | 1981-10-28 | 1989-03-21 | Tokyo Shibaura Denki Kabushiki Kaisha | Semiconductor device with programmable fuse |
US4598462A (en) * | 1983-04-07 | 1986-07-08 | Rca Corporation | Method for making semiconductor device with integral fuse |
US4454002A (en) * | 1983-09-19 | 1984-06-12 | Harris Corporation | Controlled thermal-oxidation thinning of polycrystalline silicon |
JPH0740101B2 (ja) * | 1985-04-23 | 1995-05-01 | 旭硝子株式会社 | 薄膜トランジスタ |
US5367208A (en) * | 1986-09-19 | 1994-11-22 | Actel Corporation | Reconfigurable programmable interconnect architecture |
US5909049A (en) * | 1997-02-11 | 1999-06-01 | Actel Corporation | Antifuse programmed PROM cell |
JPH1125829A (ja) * | 1997-07-04 | 1999-01-29 | Yazaki Corp | 温度ヒューズ及び車両用ワイヤハーネスの異常検出装置 |
US6549035B1 (en) | 1998-09-15 | 2003-04-15 | Actel Corporation | High density antifuse based partitioned FPGA architecture |
US6507264B1 (en) | 2000-08-28 | 2003-01-14 | Littelfuse, Inc. | Integral fuse for use in semiconductor packages |
US6709980B2 (en) * | 2002-05-24 | 2004-03-23 | Micron Technology, Inc. | Using stabilizers in electroless solutions to inhibit plating of fuses |
US7485944B2 (en) * | 2004-10-21 | 2009-02-03 | International Business Machines Corporation | Programmable electronic fuse |
DE102005024347B8 (de) * | 2005-05-27 | 2010-07-08 | Infineon Technologies Ag | Elektrisches Bauteil mit abgesichertem Stromzuführungsanschluss |
US7986212B2 (en) * | 2007-05-15 | 2011-07-26 | Yazaki Corporation | Fuse |
US20100164677A1 (en) * | 2008-12-29 | 2010-07-01 | Chin-Chi Yang | Fuse |
CN106794717B (zh) | 2014-09-05 | 2019-05-14 | 横滨橡胶株式会社 | 充气轮胎 |
US9837770B2 (en) * | 2014-11-25 | 2017-12-05 | Honeywell International Inc. | Fusible link cable harness and systems and methods for addressing fusible link cable harnesses |
CN109311351B (zh) | 2017-03-07 | 2021-07-30 | 横滨橡胶株式会社 | 充气轮胎 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA752985A (en) * | 1967-02-14 | J. Rayno Paul | Fuse device | |
US3028659A (en) * | 1957-12-27 | 1962-04-10 | Bosch Arma Corp | Storage matrix |
US3378920A (en) * | 1966-01-26 | 1968-04-23 | Air Force Usa | Method for producing an interconnection matrix |
US3377513A (en) * | 1966-05-02 | 1968-04-09 | North American Rockwell | Integrated circuit diode matrix |
US3401317A (en) * | 1966-07-11 | 1968-09-10 | Int Rectifier Corp | Fused semiconductor device |
FR1529672A (fr) * | 1967-03-24 | 1968-06-21 | Lignes Telegraph Telephon | Perfectionnements aux éléments de protection du type fusible |
YU32377B (en) * | 1967-05-30 | 1974-10-31 | Olivetti General Electric Spa | Integralni sklop za elektronska strujna kola u cvrstom stanju |
US3564354A (en) * | 1968-12-11 | 1971-02-16 | Signetics Corp | Semiconductor structure with fusible link and method |
-
1970
- 1970-01-02 US US13A patent/US3699395A/en not_active Expired - Lifetime
- 1970-10-13 ZA ZA706960A patent/ZA706960B/xx unknown
- 1970-12-17 JP JP11496070A patent/JPS495599B1/ja active Pending
- 1970-12-22 GB GB6077970A patent/GB1309310A/en not_active Expired
- 1970-12-23 DE DE2063579A patent/DE2063579C3/de not_active Expired
- 1970-12-26 ES ES1970196297U patent/ES196297Y/es not_active Expired
- 1970-12-28 NO NO04963/70A patent/NO129878B/no unknown
- 1970-12-29 FR FR7046961A patent/FR2075108A5/fr not_active Expired
- 1970-12-30 CS CS8884A patent/CS163239B2/cs unknown
- 1970-12-30 SE SE17732/70A patent/SE370143B/xx unknown
- 1970-12-31 BE BE761172A patent/BE761172A/fr unknown
- 1970-12-31 NL NL7019075A patent/NL7019075A/xx unknown
-
1971
- 1971-01-04 AT AT2371A patent/AT311092B/de not_active IP Right Cessation
-
1976
- 1976-12-30 MY MY90/76A patent/MY7600090A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
GB1309310A (en) | 1973-03-07 |
CS163239B2 (fr) | 1975-08-29 |
SE370143B (fr) | 1974-09-30 |
ZA706960B (en) | 1971-07-28 |
FR2075108A5 (fr) | 1971-10-08 |
DE2063579A1 (de) | 1971-07-15 |
DE2063579C3 (de) | 1980-01-24 |
NO129878B (fr) | 1974-06-04 |
BE761172A (fr) | 1971-05-27 |
SU362553A3 (fr) | 1972-12-13 |
DE2063579B2 (de) | 1979-05-31 |
JPS495599B1 (fr) | 1974-02-07 |
ES196297U (es) | 1975-03-01 |
ES196297Y (es) | 1975-08-01 |
MY7600090A (en) | 1976-12-31 |
AT311092B (de) | 1973-10-25 |
US3699395A (en) | 1972-10-17 |