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MX2021012763A - Composición de dispersión acuosa. - Google Patents

Composición de dispersión acuosa.

Info

Publication number
MX2021012763A
MX2021012763A MX2021012763A MX2021012763A MX2021012763A MX 2021012763 A MX2021012763 A MX 2021012763A MX 2021012763 A MX2021012763 A MX 2021012763A MX 2021012763 A MX2021012763 A MX 2021012763A MX 2021012763 A MX2021012763 A MX 2021012763A
Authority
MX
Mexico
Prior art keywords
extruder
mixture
feeding
dispersion composition
waterborne dispersion
Prior art date
Application number
MX2021012763A
Other languages
English (en)
Inventor
Yinzhong Guo
Joseph Jacobs
Ludwik S Cygan
Marin Carlos A Escobar
James M Lipovsky
Douglas J Hasso
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of MX2021012763A publication Critical patent/MX2021012763A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/03—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in aqueous media
    • C08J3/05—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in aqueous media from solid polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D131/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Coating compositions based on derivatives of such polymers
    • C09D131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C09D131/04—Homopolymers or copolymers of vinyl acetate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2331/00—Characterised by the use of copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, or carbonic acid, or of a haloformic acid
    • C08J2331/02—Characterised by the use of omopolymers or copolymers of esters of monocarboxylic acids
    • C08J2331/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
  • Paints Or Removers (AREA)

Abstract

Un proceso para preparar una composición de dispersión acuosa fabricada usando un proceso continuo a base de extrusora que incluye las etapas de: (A) proporcionar una extrusora; (B) alimentar una mezcla de: (i) al menos un copolímero de acetato de vinilo; (ii) al menos un compatibilizador; y un agente dispersante en la extrusora; (C) alimentar una primera adición de agua a la mezcla de la etapa (B) en la extrusora para proporcionar una dispersión continua de polímero; (D) alimentar al menos una base a la mezcla de la etapa (C) en la extrusora para neutralizar cualquier ácido disponible presente en la mezcla de la etapa (C); y (E) alimentar una segunda adición de agua a la mezcla de la etapa (D) en la extrusora para proporcionar una inversión de fase que forma una dispersión continua de agua.
MX2021012763A 2019-04-17 2020-03-02 Composición de dispersión acuosa. MX2021012763A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962834993P 2019-04-17 2019-04-17
PCT/US2020/020636 WO2020214257A1 (en) 2019-04-17 2020-03-02 Waterborne dispersion composition

Publications (1)

Publication Number Publication Date
MX2021012763A true MX2021012763A (es) 2022-01-19

Family

ID=70058482

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021012763A MX2021012763A (es) 2019-04-17 2020-03-02 Composición de dispersión acuosa.

Country Status (8)

Country Link
US (1) US20220351980A1 (es)
EP (1) EP3956384A1 (es)
JP (1) JP2022529693A (es)
CN (1) CN113853400B (es)
AR (1) AR118567A1 (es)
BR (1) BR112021020892A2 (es)
MX (1) MX2021012763A (es)
WO (1) WO2020214257A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240162043A1 (en) * 2022-11-16 2024-05-16 Tokyo Electron Limited Sidewall Inorganic Passivation for Dielectric Etching Via Surface Modification
US20240332029A1 (en) * 2023-03-28 2024-10-03 Tokyo Electron Limited High aspect ratio contact etching with additive gas

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562149A (en) * 1979-06-19 1981-01-10 Mitsubishi Petrochem Co Ltd Continuous manufacture of aqueous dispersion of olefin resin
JP2004528440A (ja) * 2001-03-01 2004-09-16 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド 酸マクロモノマーの組成物及びその調製方法
BRPI0817407B1 (pt) * 2007-11-15 2018-10-23 Dow Global Technologies Inc composição de revestimento, produto revestido e método para formar um produto revestido
BRPI0915236B1 (pt) * 2008-11-12 2019-09-24 Akzo Nobel Coatings International B.V. Processo de fabricação de uma dispersão de polímero, dispersão de partículas de polímero, e composição de revestimento
CN102639610B (zh) * 2009-11-12 2015-09-02 阿克佐诺贝尔国际涂料股份有限公司 含水聚合物分散体
CA2838291A1 (en) * 2011-06-10 2012-12-13 Dow Global Technologies Llc Aqueous pour point depressant dispersion composition
US20150369822A1 (en) * 2011-06-10 2015-12-24 Dow Global Technologies Llc Method t0 make an aqueous pour point depressant dispersion composition
SG10201508406WA (en) * 2014-12-23 2016-07-28 Dow Global Technologies Llc Polyolefin dispersion compositions for making high vapor transport hydrophobic coatings
EP3359614B8 (en) * 2015-10-07 2019-11-27 Dow Global Technologies LLC Process for preparing waterborne heat seal coating compositions
MX2020003982A (es) * 2017-10-31 2020-08-13 Dow Global Technologies Llc Metodos para preparar composiciones de recubrimiento termosellado a base de agua.
CN108102472B (zh) 2017-12-21 2020-08-04 海南必凯水性新材料有限公司 一种薄膜用低温热封涂料及其制备方法
CN108148215A (zh) 2017-12-21 2018-06-12 海南必凯水性新材料有限公司 一种低温热封eea乳液及其制备方法
CN108084370A (zh) 2017-12-21 2018-05-29 海南必凯水性新材料有限公司 一种低温热封eva乳液及其制备方法和用途

Also Published As

Publication number Publication date
AR118567A1 (es) 2021-10-20
TW202039645A (zh) 2020-11-01
JP2022529693A (ja) 2022-06-23
WO2020214257A1 (en) 2020-10-22
CN113853400B (zh) 2024-10-15
US20220351980A1 (en) 2022-11-03
BR112021020892A2 (pt) 2021-12-21
EP3956384A1 (en) 2022-02-23
CN113853400A (zh) 2021-12-28

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