[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Dang et al., 2005 - Google Patents

Wafer-level microfluidic cooling interconnects for GSI

Dang et al., 2005

Document ID
13443809273662103917
Author
Dang B
Joseph P
Bakir M
Spencer T
Kohl P
Meindl J
Publication year
Publication venue
Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.

External Links

Snippet

We present a novel CMOS compatible approach to fabricate on-chip microfluidic cooling channels using a spin-on sacrificial polymer material at wafer level. Deep trenches (> 100/spl mu/m) etched into the backside of an IC wafer were successfully filled up by a single …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto

Similar Documents

Publication Publication Date Title
Dang et al. Wafer-level microfluidic cooling interconnects for GSI
Dang et al. Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink
Dang et al. Integrated microfluidic cooling and interconnects for 2D and 3D chips
King et al. 3D stacking of chips with electrical and microfluidic I/O interconnects
Khan et al. 3-D packaging with through-silicon via (TSV) for electrical and fluidic interconnections
US7271034B2 (en) Semiconductor device with a high thermal dissipation efficiency
US20080115913A1 (en) Method of fabricating semiconductor-based porous structure
WO2022241848A1 (en) Silicon-based fan-out packaging structure and preparation method therefor
TW200425441A (en) Electro-osmotic pumps and micro-channels
EP2395549A1 (en) Device for cooling integrated circuits
US10784115B2 (en) Method of etching microelectronic mechanical system features in a silicon wafer
Cai et al. Thermal and electrical characterization of TSV interposer embedded with microchannel for 2.5 D integration of GaN RF devices
CN113488441A (en) Packaging structure based on manifold channel cover plate and preparation method thereof
JP2006518100A (en) 3D high performance heat sink
Yu et al. Fabrication of silicon carriers with TSV electrical interconnections and embedded thermal solutions for high power 3-D packages
US6992381B2 (en) Using external radiators with electroosmotic pumps for cooling integrated circuits
Yu et al. Fabrication of silicon carriers with TSV electrical interconnections and embedded thermal solutions for high power 3-D package
US10217648B1 (en) Fabrication of microfluidic channels in diamond
Joshi et al. Keynote Lecture: Micro and Meso Scale Compact Heat Exchangers in Electronics Thermal Management–Review
Han et al. Development of a jet-based Si micro-cooler with multiple drainage micro-trenches
US20230317548A1 (en) Structured Microchannel Cooling technology by utilizing a novel hard mask pattern transfer fabrication process
CN113023663B (en) All-silicon MEMS micro-channel radiator and processing method thereof
CN113035808B (en) On-chip micro-flow driving device applied to gallium nitride transistor and preparation method
CN112234037B (en) Embedded diamond silicon-based micro-fluid heat dissipation adapter plate and preparation method thereof
King Jr Thermal management of three-dimensional integrated circuits using inter-layer liquid cooling