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Khan et al., 2013 - Google Patents

3-D packaging with through-silicon via (TSV) for electrical and fluidic interconnections

Khan et al., 2013

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Document ID
12796580579537409587
Author
Khan N
Yu L
Pin T
Ho S
Kripesh V
Pinjala D
Lau J
Chuan T
Publication year
Publication venue
IEEE Transactions on Components, Packaging and Manufacturing Technology

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Snippet

In this paper, a liquid cooling solution has been reported for 3-D package in package-on- package format. A high heat dissipating chip is mounted on a silicon carrier, which has copper through-silicon via (TSV) for electrical interconnection and hollow TSV for fluidic …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

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