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This workshop aims to explore the intersection of Generative AI with the rich tapestry of financial data types, seeking to uncover new methodologies and techniques that can enhance predictive analytics, fraud detection, and customer insights across the ...

AI has found a wide range of application areas in the financial services industry. As the number and the criticality of the applications continue to increase, fair and ethical AI has emerged as an industry-wide objective. In recent years, numerous ...

AI systems have found a wide range of application areas in financial services. Their involvement in broader and increasingly critical decisions has escalated the need for compliance and effective model governance. Current governance practices have ...

Machine learning models have widely been used in fraud detection systems. Most of the research and development efforts have been concentrated on improving the performance of the fraud scoring models. Yet, the downstream fraud alert systems still have ...

Thermal characteristics have been considered as one of the most challenging problems in 3-D integrated circuits (3-D ICs). Due to the thermal expansion coefficient mismatch between through-silicon vias (TSVs) and the silicon substrate, and the presence of ...

Existing works on Three-dimensional (3D) hardware security focus on leveraging the unique 3D characteristics to address the supply chain attacks that exist in 2D design. However, 3D ICs introduce specific and unexplored challenges as well as new ...

As I start my second two-year term (2017–2018) as the Editor-in-Chief (EIC) of the IEEE Transactions on Very Large Scale Integration Systems (TVLSI), I wish the TVLSI readership a very happy new year and continued professional success. It gives me great ...

3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks, hardware trojans,...

Improving the vulnerability to soft errors is one of the important design goals for future architecture design of Chip-MultiProcessors (CMPs). In this study, we explore the soft error characteristics of CMPs with 3D stacked NonVolatile Memory (NVM), in ...

3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal conductivity in the ...

The thermomechanical stress has been considered as one of the most challenging problems in three-dimensional integration circuits (3D ICs), due to the thermal expansion coefficient mismatch between the through-silicon vias (TSVs) and silicon substrate, ...

Three-dimensional integration provides a new way of performance growth for microprocessor architectures. While a recent studies report promising performance improvement numbers, majority of the processor stacking options are thermally-limited. Elevated ...

Accurate and efficient thermal analysis for a VLSI chip is crucial, both for sign-off reliability verification and for design-time circuit optimization. To determine an accurate temperature profile, it is important to simulate a die together with its ...

Full-chip thermal monitoring is an important and challenging issue in today's microprocessor design. In this paper, we propose a new information-theoretic framework to quantitatively model the uncertainty of on-chip temperature variation by differential ...

Spin-transfer Torque Random Access Memory (STT-RAM) emerges for on-chip memory in microprocessor architectures. Thanks to the magnetic field based storage STT-RAM cells have immunity to radiation induced soft errors that affect electrical charge based ...

The three-dimensional integrated circuits (3D ICs) offer performance advantages thanks to the increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal ...

Technology scaling has provided the semiconductor industry a recipe to successfully meet the application demands for performance for over three decades. This computational capacity was further fueled by the success of circuit and architecture-level ...

Proposals have focused on reducing energy requirements for large-scale computing facilities (LSCFs), but little research has addressed the need for energy-usage-based accounting. Energy-aware accounting and billing benefits LSCF owners and users. This ...

Inherent temperature variation among cores in a multicore architecture can be caused by a number of factors including process variation, cooling and packaging imperfections, and even placement of the chip in the module. Current dynamic thermal management ...

Controlling power consumption and temperature is of major concern for modern computing systems. In this work we characterize thermal behavior and power consumption of an IBM POWER6-based system. We perform the characterization at several levels: ...