ZA793786B - Electroless copper deposition process having faster plating rates - Google Patents
Electroless copper deposition process having faster plating ratesInfo
- Publication number
- ZA793786B ZA793786B ZA00793786A ZA793786A ZA793786B ZA 793786 B ZA793786 B ZA 793786B ZA 00793786 A ZA00793786 A ZA 00793786A ZA 793786 A ZA793786 A ZA 793786A ZA 793786 B ZA793786 B ZA 793786B
- Authority
- ZA
- South Africa
- Prior art keywords
- deposition process
- electroless copper
- copper deposition
- plating rates
- faster plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US94191278A | 1978-09-13 | 1978-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA793786B true ZA793786B (en) | 1980-07-30 |
Family
ID=25477278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA00793786A ZA793786B (en) | 1978-09-13 | 1979-07-24 | Electroless copper deposition process having faster plating rates |
Country Status (17)
| Country | Link |
|---|---|
| JP (2) | JPS5927379B2 (en) |
| AT (1) | AT366105B (en) |
| AU (1) | AU532144B2 (en) |
| BR (1) | BR7905066A (en) |
| CA (1) | CA1135903A (en) |
| CH (1) | CH646200A5 (en) |
| DE (1) | DE2937297C2 (en) |
| DK (1) | DK148920C (en) |
| ES (1) | ES484158A1 (en) |
| FR (1) | FR2436192A1 (en) |
| GB (1) | GB2032462B (en) |
| IL (1) | IL58202A (en) |
| IT (1) | IT1162420B (en) |
| MX (1) | MX152657A (en) |
| NL (1) | NL189523C (en) |
| SE (1) | SE7907531L (en) |
| ZA (1) | ZA793786B (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8005024A (en) * | 1980-09-05 | 1982-04-01 | Philips Nv | METHOD FOR MANUFACTURING COPPER ALLOY LAYERS AND PATTERNS ON SUBSTRATES AND PRODUCTS MADE THEREFORE |
| EP0179212B1 (en) * | 1984-09-27 | 1991-12-27 | Kabushiki Kaisha Toshiba | Chemical copper plating solution |
| ES2039403T3 (en) * | 1986-10-31 | 1993-10-01 | Amp-Akzo Corporation (A Delaware Corp.) | METHOD FOR DEPOSITING WITHOUT ELECTRICITY HIGH QUALITY COPPER. |
| JPH0723539B2 (en) * | 1986-11-06 | 1995-03-15 | 日本電装株式会社 | Chemical copper plating solution and method for forming copper plating film using the same |
| JP2615682B2 (en) * | 1986-11-14 | 1997-06-04 | 株式会社デンソー | Chemical copper plating solution |
| US4814009A (en) * | 1986-11-14 | 1989-03-21 | Nippondenso Co., Ltd. | Electroless copper plating solution |
| AU3304389A (en) * | 1988-04-29 | 1989-11-02 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
| JP2595319B2 (en) * | 1988-07-20 | 1997-04-02 | 日本電装株式会社 | Chemical copper plating solution and method for forming copper plating film using the same |
| JPH036383A (en) * | 1989-06-02 | 1991-01-11 | Nippondenso Co Ltd | Chemical copper plating solution |
| JPH0448100A (en) * | 1990-06-15 | 1992-02-18 | Nkk Corp | Washing equipment |
| US7905994B2 (en) | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
| US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
| JP5255015B2 (en) * | 2010-04-28 | 2013-08-07 | 名古屋メッキ工業株式会社 | Electroless copper plating method for polymer fiber |
| JP5780920B2 (en) * | 2011-10-31 | 2015-09-16 | 新光電気工業株式会社 | Electroless copper plating bath |
| US20190382901A1 (en) * | 2018-06-15 | 2019-12-19 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions and methods for electroless plating copper on substrates |
| US10590541B2 (en) * | 2018-06-15 | 2020-03-17 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions and methods for electroless plating copper on substrates |
| CN113881984B (en) * | 2021-10-21 | 2022-09-16 | 深圳市励高表面处理材料有限公司 | Pulse electroplating leveling agent, preparation method and electroplating solution applying leveling solution |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3222195A (en) * | 1962-02-23 | 1965-12-07 | Pearlstein Fred | Stabilized electroless copper solution |
| US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
| US3377174A (en) * | 1963-10-24 | 1968-04-09 | Torigai Eiichi | Method and bath for chemically plating copper |
| CH491206A (en) * | 1966-02-01 | 1970-05-31 | Photocircuits Corp | Bath solution for electroless deposition of metal layers |
| US3720525A (en) * | 1971-08-16 | 1973-03-13 | Rca Corp | Electroless copper plating solutions with accelerated plating rates |
| US3708329A (en) * | 1971-09-10 | 1973-01-02 | Bell Telephone Labor Inc | Electroless copper plating |
| US3915718A (en) * | 1972-10-04 | 1975-10-28 | Schering Ag | Chemical silver bath |
| US3793038A (en) * | 1973-01-02 | 1974-02-19 | Crown City Plating Co | Process for electroless plating |
| JPS5173933A (en) * | 1974-12-25 | 1976-06-26 | Mitsubishi Rayon Co | MUDENKAIDOMETSUKYOKU |
| JPS5746448B2 (en) * | 1975-03-14 | 1982-10-04 | ||
| JPS5217335A (en) * | 1975-08-01 | 1977-02-09 | Hitachi Ltd | Chemical copper plating solution |
| JPS5288227A (en) * | 1976-01-19 | 1977-07-23 | Hitachi Ltd | Chemical copper plating solution |
| IT1059950B (en) * | 1976-04-30 | 1982-06-21 | Alfachimici Spa | COMPOSITION FOR AUTOCATALYTIC ANELECTRIC COPPERING |
| JPS56156749A (en) * | 1980-05-08 | 1981-12-03 | Toshiba Corp | Chemical copper plating solution |
-
1979
- 1979-07-12 CA CA000331706A patent/CA1135903A/en not_active Expired
- 1979-07-24 ZA ZA00793786A patent/ZA793786B/en unknown
- 1979-08-01 MX MX178747A patent/MX152657A/en unknown
- 1979-08-03 AU AU49567/79A patent/AU532144B2/en not_active Ceased
- 1979-08-07 BR BR7905066A patent/BR7905066A/en not_active IP Right Cessation
- 1979-09-05 GB GB7930740A patent/GB2032462B/en not_active Expired
- 1979-09-07 IL IL58202A patent/IL58202A/en unknown
- 1979-09-11 SE SE7907531A patent/SE7907531L/en unknown
- 1979-09-11 IT IT50227/79A patent/IT1162420B/en active
- 1979-09-12 AT AT0600879A patent/AT366105B/en not_active IP Right Cessation
- 1979-09-12 CH CH826779A patent/CH646200A5/en not_active IP Right Cessation
- 1979-09-12 DK DK381979A patent/DK148920C/en not_active IP Right Cessation
- 1979-09-12 DE DE2937297A patent/DE2937297C2/en not_active Expired
- 1979-09-13 FR FR7922867A patent/FR2436192A1/en active Granted
- 1979-09-13 NL NLAANVRAGE7906856,A patent/NL189523C/en not_active IP Right Cessation
- 1979-09-13 JP JP54118651A patent/JPS5927379B2/en not_active Expired
- 1979-09-13 ES ES484158A patent/ES484158A1/en not_active Expired
-
1983
- 1983-06-21 JP JP58112590A patent/JPS5915981B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2436192B1 (en) | 1983-08-26 |
| IT1162420B (en) | 1987-04-01 |
| NL7906856A (en) | 1980-03-17 |
| JPS5565355A (en) | 1980-05-16 |
| IL58202A (en) | 1982-08-31 |
| JPS5927379B2 (en) | 1984-07-05 |
| IL58202A0 (en) | 1979-12-30 |
| MX152657A (en) | 1985-10-07 |
| ATA600879A (en) | 1981-07-15 |
| AT366105B (en) | 1982-03-10 |
| CA1135903A (en) | 1982-11-23 |
| BR7905066A (en) | 1980-04-29 |
| SE7907531L (en) | 1980-03-14 |
| GB2032462A (en) | 1980-05-08 |
| FR2436192A1 (en) | 1980-04-11 |
| JPS5925965A (en) | 1984-02-10 |
| IT7950227A0 (en) | 1979-09-11 |
| GB2032462B (en) | 1983-05-18 |
| ES484158A1 (en) | 1980-09-01 |
| DE2937297C2 (en) | 1982-04-08 |
| DK148920C (en) | 1986-05-05 |
| DK381979A (en) | 1980-03-14 |
| DE2937297A1 (en) | 1980-03-20 |
| DK148920B (en) | 1985-11-18 |
| CH646200A5 (en) | 1984-11-15 |
| AU532144B2 (en) | 1983-09-22 |
| AU4956779A (en) | 1980-03-20 |
| JPS5915981B2 (en) | 1984-04-12 |
| NL189523C (en) | 1993-05-03 |
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