DK381979A - METHOD OF AUTOCATALYTIC DEPOSITION OF COPPER AT HIGHER SPEED AND SOLUTION THEREOF - Google Patents

METHOD OF AUTOCATALYTIC DEPOSITION OF COPPER AT HIGHER SPEED AND SOLUTION THEREOF

Info

Publication number: DK381979A
Authority: DK; Denmark
Prior art keywords: copper; solution; higher speed; autocatalytic deposition; autocatalytic
Prior art date: 1978-09-13

Application number

DK381979A

Other languages

Danish (da)

Other versions

DK148920B (en

DK148920C (en

Inventor

J F Mccormack

F J Nuzzi

Original Assignee

Kollmorgen Tech Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-09-13

Filing date

1979-09-12

Publication date

1980-03-14

1979-09-12 Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp

1980-03-14 Publication of DK381979A publication Critical patent/DK381979A/en

1985-11-18 Publication of DK148920B publication Critical patent/DK148920B/en

1986-05-05 Application granted granted Critical

1986-05-05 Publication of DK148920C publication Critical patent/DK148920C/en

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)
Electroplating And Plating Baths Therefor (AREA)

DK381979A 1978-09-13 1979-09-12 PROCEDURE FOR PROMOTING COPPER DISPOSAL FROM A CURRENTLY WORKING COPPER DISPOSAL SOLUTION DK148920C (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US94191278A	1978-09-13	1978-09-13
US94191278		1978-09-13

Publications (3)

Publication Number	Publication Date
DK381979A true DK381979A (en)	1980-03-14
DK148920B DK148920B (en)	1985-11-18
DK148920C DK148920C (en)	1986-05-05

Family

ID=25477278

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DK381979A DK148920C (en)	1978-09-13	1979-09-12	PROCEDURE FOR PROMOTING COPPER DISPOSAL FROM A CURRENTLY WORKING COPPER DISPOSAL SOLUTION

Country Status (17)

Country	Link
JP (2)	JPS5927379B2 (en)
AT (1)	AT366105B (en)
AU (1)	AU532144B2 (en)
BR (1)	BR7905066A (en)
CA (1)	CA1135903A (en)
CH (1)	CH646200A5 (en)
DE (1)	DE2937297C2 (en)
DK (1)	DK148920C (en)
ES (1)	ES484158A1 (en)
FR (1)	FR2436192A1 (en)
GB (1)	GB2032462B (en)
IL (1)	IL58202A (en)
IT (1)	IT1162420B (en)
MX (1)	MX152657A (en)
NL (1)	NL189523C (en)
SE (1)	SE7907531L (en)
ZA (1)	ZA793786B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NL8005024A (en) *	1980-09-05	1982-04-01	Philips Nv	METHOD FOR MANUFACTURING COPPER ALLOY LAYERS AND PATTERNS ON SUBSTRATES AND PRODUCTS MADE THEREFORE
DE3585017D1 (en) *	1984-09-27	1992-02-06	Toshiba Kawasaki Kk	CURRENT COPPER PLATING SOLUTION.
ES2039403T3 (en) *	1986-10-31	1993-10-01	Amp-Akzo Corporation (A Delaware Corp.)	METHOD FOR DEPOSITING WITHOUT ELECTRICITY HIGH QUALITY COPPER.
JPH0723539B2 (en) *	1986-11-06	1995-03-15	日本電装株式会社	Chemical copper plating solution and method for forming copper plating film using the same
JP2615682B2 (en) *	1986-11-14	1997-06-04	株式会社デンソー	Chemical copper plating solution
US4814009A (en) *	1986-11-14	1989-03-21	Nippondenso Co., Ltd.	Electroless copper plating solution
AU3304389A (en) *	1988-04-29	1989-11-02	Kollmorgen Corporation	Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2595319B2 (en) *	1988-07-20	1997-04-02	日本電装株式会社	Chemical copper plating solution and method for forming copper plating film using the same
JPH036383A (en) *	1989-06-02	1991-01-11	Nippondenso Co Ltd	Chemical copper plating solution
JPH0448100A (en) *	1990-06-15	1992-02-18	Nkk Corp	Washing equipment
US7905994B2 (en)	2007-10-03	2011-03-15	Moses Lake Industries, Inc.	Substrate holder and electroplating system
US8262894B2 (en)	2009-04-30	2012-09-11	Moses Lake Industries, Inc.	High speed copper plating bath
JP5255015B2 (en) *	2010-04-28	2013-08-07	名古屋メッキ工業株式会社	Electroless copper plating method for polymer fiber
JP5780920B2 (en) *	2011-10-31	2015-09-16	新光電気工業株式会社	Electroless copper plating bath
US20190382901A1 (en) *	2018-06-15	2019-12-19	Rohm And Haas Electronic Materials Llc	Electroless copper plating compositions and methods for electroless plating copper on substrates
US10590541B2 (en) *	2018-06-15	2020-03-17	Rohm And Haas Electronic Materials Llc	Electroless copper plating compositions and methods for electroless plating copper on substrates
CN113881984B (en) *	2021-10-21	2022-09-16	深圳市励高表面处理材料有限公司	Pulse electroplating leveling agent, preparation method and electroplating solution applying leveling solution

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3222195A (en) *	1962-02-23	1965-12-07	Pearlstein Fred	Stabilized electroless copper solution
US3361580A (en) *	1963-06-18	1968-01-02	Day Company	Electroless copper plating
US3377174A (en) *	1963-10-24	1968-04-09	Torigai Eiichi	Method and bath for chemically plating copper
CH491206A (en) *	1966-02-01	1970-05-31	Photocircuits Corp	Bath solution for electroless deposition of metal layers
US3720525A (en) *	1971-08-16	1973-03-13	Rca Corp	Electroless copper plating solutions with accelerated plating rates
US3708329A (en) *	1971-09-10	1973-01-02	Bell Telephone Labor Inc	Electroless copper plating
US3915718A (en) *	1972-10-04	1975-10-28	Schering Ag	Chemical silver bath
US3793038A (en) *	1973-01-02	1974-02-19	Crown City Plating Co	Process for electroless plating
JPS5173933A (en) *	1974-12-25	1976-06-26	Mitsubishi Rayon Co	MUDENKAIDOMETSUKYOKU
JPS5746448B2 (en) *	1975-03-14	1982-10-04
JPS5217335A (en) *	1975-08-01	1977-02-09	Hitachi Ltd	Chemical copper plating solution
JPS5288227A (en) *	1976-01-19	1977-07-23	Hitachi Ltd	Chemical copper plating solution
IT1059950B (en) *	1976-04-30	1982-06-21	Alfachimici Spa	COMPOSITION FOR AUTOCATALYTIC ANELECTRIC COPPERING
JPS56156749A (en) *	1980-05-08	1981-12-03	Toshiba Corp	Chemical copper plating solution

1979
- 1979-07-12 CA CA000331706A patent/CA1135903A/en not_active Expired
- 1979-07-24 ZA ZA00793786A patent/ZA793786B/en unknown
- 1979-08-01 MX MX178747A patent/MX152657A/en unknown
- 1979-08-03 AU AU49567/79A patent/AU532144B2/en not_active Ceased
- 1979-08-07 BR BR7905066A patent/BR7905066A/en not_active IP Right Cessation
- 1979-09-05 GB GB7930740A patent/GB2032462B/en not_active Expired
- 1979-09-07 IL IL58202A patent/IL58202A/en unknown
- 1979-09-11 SE SE7907531A patent/SE7907531L/en unknown
- 1979-09-11 IT IT50227/79A patent/IT1162420B/en active
- 1979-09-12 DK DK381979A patent/DK148920C/en not_active IP Right Cessation
- 1979-09-12 AT AT0600879A patent/AT366105B/en not_active IP Right Cessation
- 1979-09-12 DE DE2937297A patent/DE2937297C2/en not_active Expired
- 1979-09-12 CH CH826779A patent/CH646200A5/en not_active IP Right Cessation
- 1979-09-13 ES ES484158A patent/ES484158A1/en not_active Expired
- 1979-09-13 JP JP54118651A patent/JPS5927379B2/en not_active Expired
- 1979-09-13 FR FR7922867A patent/FR2436192A1/en active Granted
- 1979-09-13 NL NLAANVRAGE7906856,A patent/NL189523C/en not_active IP Right Cessation
1983
- 1983-06-21 JP JP58112590A patent/JPS5915981B2/en not_active Expired

Also Published As

Publication number	Publication date
ZA793786B (en)	1980-07-30
BR7905066A (en)	1980-04-29
JPS5565355A (en)	1980-05-16
CA1135903A (en)	1982-11-23
ATA600879A (en)	1981-07-15
DK148920B (en)	1985-11-18
DK148920C (en)	1986-05-05
GB2032462B (en)	1983-05-18
FR2436192B1 (en)	1983-08-26
GB2032462A (en)	1980-05-08
DE2937297C2 (en)	1982-04-08
NL189523C (en)	1993-05-03
AU532144B2 (en)	1983-09-22
IT1162420B (en)	1987-04-01
AU4956779A (en)	1980-03-20
NL7906856A (en)	1980-03-17
MX152657A (en)	1985-10-07
JPS5925965A (en)	1984-02-10
CH646200A5 (en)	1984-11-15
IT7950227A0 (en)	1979-09-11
AT366105B (en)	1982-03-10
FR2436192A1 (en)	1980-04-11
SE7907531L (en)	1980-03-14
IL58202A (en)	1982-08-31
IL58202A0 (en)	1979-12-30
ES484158A1 (en)	1980-09-01
JPS5915981B2 (en)	1984-04-12
JPS5927379B2 (en)	1984-07-05
DE2937297A1 (en)	1980-03-20

Publication	Publication Date	Title
DK381979A (en)	1980-03-14	METHOD OF AUTOCATALYTIC DEPOSITION OF COPPER AT HIGHER SPEED AND SOLUTION THEREOF
DK170680A (en)	1980-10-24	METHOD OF PREPARING AMYLES OF ACYL CARNITINES
DK350083A (en)	1984-02-11	METHOD OF PREPARING PHENYLETHANOLAMINES
KR880007791A (en)	1988-08-29	Selective deposition method of metal thin film
DK88081A (en)	1981-08-30	METHOD OF PREPARING TETRAZLE DERIVATIVES
DK343682A (en)	1983-02-04	METHOD OF PREPARING THIAZOLIDINYLALKYLEN-PIPERAZINE DERIVATIVES
DK366778A (en)	1980-02-19	METHOD OF COUNTING BACTERIES
DK156253C (en)	1989-12-11	METHOD OF PYRUVATOXIDASE PREPARATION
DK366379A (en)	1980-03-02	METHOD OF PREPARING ALKYL OR ARYLTHIOMETHYLPHENOLS
DK247080A (en)	1980-12-08	METHOD OF TREATMENT OF METAL SURFACES
DK479981A (en)	1982-05-01	METHOD OF PREPARING 3-ARYL-3-HYDROXYPHTHALIMIDINES
DK343782A (en)	1983-02-04	METHOD OF PREPARING SPIROTHIAZOLIDINYL-PIPERAZINE DERIVATIVES
DK317279A (en)	1980-01-29	METHOD FOR STRING OF METAL
DK510979A (en)	1980-06-02	PROCEDURE FOR ENVIRONMENT OF ROTATION SYMMETRIC METALLIC FORMS WITH FORMS
DK424083D0 (en)	1983-09-16	METHOD OF PREPARING ANTHRACYCLING LYCOSIDES
DK40883A (en)	1983-08-04	METHOD OF PREPARING BENZOTHIENYLALLYLAMINES
DK206581A (en)	1981-11-21	BATTERY BATTERY AND METHOD OF PREPARING THIS
DK501582A (en)	1983-05-12	METHOD OF PREPARING ACYLCYANIDES
DK431083D0 (en)	1983-09-21	METHOD OF PREPARING HYDROXYLAMINE DERIVATIVES
DK457983A (en)	1984-04-07	METHOD OF PREPARING BETA-LACTAM
DK548081A (en)	1982-06-12	METHOD OF BUSPIRON PREPARATION
DK141382A (en)	1982-09-28	METHOD OF PRODUCING ISOXAZOLES AND ACYLOXADIAZOL INTERMEDIATES
DK149472C (en)	1986-12-08	METHOD OF PREPARING PHOSPHORCHLORIDE THIOLATES
DK219483D0 (en)	1983-05-17	METHOD OF PREPARING ANTHRACYCLING LYCOSIDES
DK143107C (en)	1981-11-09	METHOD OF PREPARING 2-ISOPROPYLAMINOPYRIMIDINE

Legal Events

Date	Code	Title	Description
1994-05-24	PBP	Patent lapsed