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WO2024204309A1 - Heat dissipation structure - Google Patents

Heat dissipation structure Download PDF

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Publication number
WO2024204309A1
WO2024204309A1 PCT/JP2024/012182 JP2024012182W WO2024204309A1 WO 2024204309 A1 WO2024204309 A1 WO 2024204309A1 JP 2024012182 W JP2024012182 W JP 2024012182W WO 2024204309 A1 WO2024204309 A1 WO 2024204309A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
dissipation structure
circuit board
flat plate
heat
Prior art date
Application number
PCT/JP2024/012182
Other languages
French (fr)
Japanese (ja)
Inventor
孟明 玉山
康二 澤井
芳幸 坂尾
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2024204309A1 publication Critical patent/WO2024204309A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat dissipation structure that dissipates heat from heat-generating elements such as ICs.
  • Patent document 1 describes a heat dissipation structure.
  • the heat dissipation structure in Patent document 1 includes a substrate, an integrated circuit, a thermal pad, a heat sink, and a base housing.
  • the board is placed in the base housing.
  • the integrated circuit which is a heat generating element, is placed on the board.
  • a thermal pad is placed on the surface of the integrated circuit (the surface opposite to the surface that is mounted on the board), and a heat sink is placed across this thermal pad.
  • the object of the present invention is therefore to realize a heat dissipation structure that is small in size, maintains electrical insulation, and improves heat dissipation.
  • the heat dissipation structure of the present invention comprises a circuit board having a first surface and a second surface, with an IC that is a heat source mounted on the first surface, a housing having a third surface that faces closely to the second surface, and a heat dissipation member that is mounted on the second surface and has high thermal conductivity.
  • the heat dissipation member comprises a flat plate having a predetermined area, and a plurality of rod-shaped foot pins connected to the flat plate and mounted on the second surface.
  • the circuit board comprises a ground electrode for connection to a reference potential.
  • the plurality of foot pins are connected to the ground electrode.
  • the IC comprises a first ground terminal that is connected to the ground electrode and that is located at the center of the circuit board in a plan view, and a second ground terminal that is located at the outer end. At least one of the plurality of foot pins is located between the first ground terminal and the second ground terminal in the direction from the center to the outer end of the IC.
  • the heat dissipation member conducts the heat of the IC through the circuit board to the side opposite the IC. This increases the amount of heat conducted from the IC to the outside.
  • the heat dissipation member is connected to the circuit board by rod-shaped foot pins, for example, even if mountable electronic components are mounted on the second surface of the circuit board, it can be connected to the circuit board while avoiding this mounting area. This allows the electrical insulation provided by using the heat dissipation member to be maintained.
  • the heat dissipation structure of this invention can prevent the device from becoming too large, maintain electrical insulation, and improve heat dissipation.
  • FIG. 1 is a side cross-sectional view showing a heat dissipation structure according to a first embodiment of the present invention.
  • FIG. 2 is an expanded view of FIG. 1 with additional examples of heat conduction paths.
  • 3A to 3C are a first plan view, a second plan view, a side view, and a cross-sectional side view of the heat dissipation member according to the first embodiment of the present invention.
  • FIG. 4 is a diagram showing the positional relationship between various terminals of the IC and the leg pins of the heat dissipation member.
  • FIG. 5 is an expanded view of FIG. 1 with the addition of examples of current conduction paths.
  • FIG. 6A is a schematic diagram showing the concept of canceling a magnetic field, and FIG.
  • FIG. 6B is a diagram showing an equivalent circuit diagram of a part of it and an image of a current.
  • FIG. 7 is a side cross-sectional view showing a heat dissipation structure according to a second embodiment of the present invention.
  • FIG. 8 is an expanded view of FIG. 6 with additional examples of heat conduction paths.
  • FIG. 9 is a side cross-sectional view showing a heat dissipation structure according to a third embodiment of the present invention.
  • FIG. 10 is a side cross-sectional view showing a heat dissipation structure according to a fourth embodiment of the present invention.
  • FIG. 11 is an enlarged side cross-sectional view showing a heat dissipation structure according to a fifth embodiment of the present invention, with an example of a heat conduction path added.
  • FIG. 1 is a side cross-sectional view showing a heat dissipation structure according to a first embodiment of the present invention. Note that FIG. 1 does not show a strict cross-section, but is a side cross-sectional view viewed to make the heat dissipation structure easier to understand. Also, in FIG. 1, reference numerals have been omitted as appropriate to make the drawing easier to read.
  • Figure 2 is an enlarged view of Figure 1, with examples of heat conduction paths added.
  • the dotted arrows indicate the heat conduction paths.
  • FIG. 3 shows a first plan view, a second plan view, a side view, and a cross-sectional side view of a heat dissipation member according to a first embodiment of the present invention.
  • FIG. 4 shows the positional relationship between various terminals of an IC and the foot pins of the heat dissipation member.
  • Figure 5 is an enlarged view of Figure 1, with examples of current conduction paths added.
  • the solid arrows indicate the current conduction paths.
  • the heat dissipation structure 10 includes an IC 21, a plurality of mounted electronic components 22, a circuit board 30, a heat dissipation member 40, a heat dissipation sheet 51, a heat dissipation sheet 52, a heat dissipation plate 60, a heat pipe 71, a fan 72, heat dissipation fins 73, and a housing 90.
  • the housing 90 includes a housing main plate 91 and a support 92.
  • the housing 90 is made of metal or the like and is conductive.
  • the housing 90 may be made of a material that is not conductive, but in that case, it is preferable that the housing 90 includes at least a conductor portion that provides a ground (reference potential, earth potential) for the housing.
  • the housing main board 91 has a main surface 911 and a main surface 912.
  • the main surface 911 corresponds to the third surface of the present invention.
  • the support 92 stands at a predetermined height from the main surface 911. It is preferable that the height of the support 92 is as low as possible within the range in which the multiple mounted electronic components 22, the heat dissipation member 40, and the heat dissipation sheet 51 are arranged as described below. This allows the structure that fixes the circuit board 30 to the housing 90 to be as low-profile as possible.
  • the circuit board 30 has a first surface 301 and a second surface 302.
  • a signal electrode 31 and a ground electrode 32G are formed inside the circuit board 30.
  • the signal electrode 31 and the ground electrode 32G are electrodes that extend in a direction parallel to the first surface 301 and the second surface 302, or are electrodes that are wired in a parallel direction.
  • a plurality of ground via electrodes 33VG and a plurality of ground via electrodes 34VG are formed inside the circuit board 30.
  • the plurality of ground via electrodes 33VG are electrodes extending in the thickness direction of the circuit board 30 (a direction perpendicular to the first surface 301 and the second surface 302).
  • the plurality of ground via electrodes 33VG are connected to the ground electrode 32G and are connected to an IC ground land electrode (not shown) formed on the first surface 301.
  • the plurality of ground via electrodes 34VG are connected to the ground electrode 32G and are exposed on the second surface 302 or are connected to an external ground electrode (not shown) formed on the second surface 302.
  • the circuit board 30 is fixed to the housing 90 with the second surface 302 facing the main surface 911 of the housing main board 91 and the tip of the support 92 in contact with the second surface 302.
  • the IC 21 is, for example, a CPU, a GPU, or a SoC, and is a heat-generating component that generates heat when driven.
  • the IC 21 includes an IC body 210, a wiring board 211, a number of signal terminals 213N, a number of first ground terminals 213Gi, and a number of second ground terminals 213Go.
  • the IC body 210 is mounted on one main surface of the wiring board 211.
  • the signal terminals 213N, the first ground terminals 213Gi, and the second ground terminals 213Go are, for example, solder bumps, and are formed in a two-dimensional arrangement on the other main surface of the wiring board 211.
  • the first ground terminals 213Gi are arranged in the center of the IC 21, and the second ground terminals 213Go are arranged near the outer end of the IC 21 (see FIG. 4).
  • the IC 21 is mounted on the first surface 301 of the circuit board 30.
  • the multiple signal terminals 213N, the multiple first ground terminals 213Gi, and the multiple second ground terminals 213Go are electrically and physically connected to the respective land electrodes of the circuit board 30.
  • the signal terminals 213N are connected to the signal electrodes 31 of the circuit board 30 through the signal land electrodes (not shown) and the signal via electrodes (not shown). Also, as shown in FIG. 2, the first ground terminals 213Gi and the second ground terminals 213Go are connected to the ground electrode 32G of the circuit board 30 through the IC ground land electrodes (not shown) and the ground via electrodes 33VG.
  • the multiple mounted electronic components 22 are, for example, decoupling capacitors for the IC 21. Note that the types of the multiple mounted electronic components 22 are not limited to this.
  • the multiple mounted electronic components 22 are mounted on the second surface 302 of the circuit board 30.
  • the multiple mounted electronic components 22 are connected to the IC 21 through the circuit board 30 in a predetermined pattern (not shown).
  • the multiple mounted electronic components 22 are mounted on the second surface 302 in a predetermined arrangement pattern (e.g., a two-dimensional array pattern). Between the multiple mounted electronic components 22, exposed portions of the multiple ground via electrodes 34VG or multiple ground external electrodes respectively connected to the multiple ground via electrodes 34VG are arranged. In a plan view of the second surface 302 of the circuit board 30, the exposed portions of the multiple ground via electrodes 34VG or the multiple ground external electrodes are arranged in positions that do not overlap the multiple mounted electronic components 22.
  • the heat dissipation member 40 is a material with high thermal conductivity, such as copper or a copper alloy. Note that the heat dissipation member 40 may be made of other materials as long as it has a higher thermal conductivity than the circuit board 30 or air. However, it is preferable that the heat dissipation member 40 is made of a material that is easy to join with solder or the like.
  • the heat dissipation member 40 includes a flat plate 41 having a predetermined area and a plurality of foot pins 42.
  • the flat plate 41 has a main surface 411 and a main surface 412.
  • the multiple foot pins 42 are rod-shaped and have a predetermined height.
  • the multiple foot pins 42 are spaced apart along the outer periphery of the flat plate 41.
  • the multiple foot pins 42 stand upright at a predetermined height from the main surface 412 of the flat plate 41.
  • the multiple foot pins 42 have the same height, which is higher than the height of the multiple mounted electronic components 22.
  • the heat dissipation member 40 is mounted on the second surface 302 of the circuit board 30. At this time, the heat dissipation member 40 is mounted in a position where the flat plate 41 is parallel to the second surface 302 and overlaps the IC 21 in a plan view.
  • the tips of the multiple foot pins 42 are mounted on the second surface 302 of the circuit board 30.
  • the multiple foot pins 42 are inserted between the multiple mount-type electronic components 22 and mounted on the second surface 302 so as not to come into contact with the multiple mount-type electronic components 22.
  • the foot pins 42 are higher than the mount-type electronic components 22. Therefore, even if the flat plate 41 is positioned so as to overlap the multiple mount-type electronic components 22 in a plan view, it does not come into electrical or physical contact with the multiple mount-type electronic components 22.
  • some of the multiple foot pins 42 are mounted on the exposed portions of the multiple ground via electrodes 34VG or on the multiple ground via electrodes 34VG, respectively, and are electrically and physically connected.
  • the multiple foot pins 42 are arranged outside the area surrounded by the ring (dashed line in FIG. 4) connecting the multiple first ground terminals 213Gi and inside the area surrounded by the ring (dashed line in FIG. 4) connecting the multiple second ground terminals 213Go.
  • at least one of the multiple foot pins 42 is arranged between the first ground terminal 213Gi and the second ground terminal 213Go in the direction from the center to the outer edge of the IC 21 (for example, the horizontal direction in FIG. 4).
  • FIG. 4 in a plan view, the multiple foot pins 42 are arranged outside the area surrounded by the ring (dashed line in FIG. 4) connecting the multiple first ground terminals 213Gi and inside the area surrounded by the ring (dashed line in FIG. 4) connecting the multiple second ground terminals 213Go.
  • the first ground terminal 213Gi1 and the second ground terminal 213Go1 are lined up in the direction from the center to the outer edge of the IC 21 (for example, the horizontal direction in FIG. 4), and the multiple foot pins 42 lined up in the vertical direction are arranged between them.
  • the heat dissipation sheet 51 is a so-called TIM (Thermal Interface Material), which has high thermal conductivity and is made of a material that can be deformed by pressure, etc.
  • TIM Thermal Interface Material
  • the heat dissipation sheet 51 is disposed between the flat plate 41 of the heat dissipation member 40 and the main surface 911 of the main housing board 91 of the housing 90.
  • the heat dissipation sheet 51 is disposed in a state in which it receives pressure from the flat plate 41 and the main housing board 91, and is in close contact with the flat plate 41 and the main surface 911 of the main housing board 91.
  • the heat dissipation member 40 is indirectly in contact with the main surface 911 of the housing main board 91 via the heat dissipation sheet 51.
  • the heat dissipation sheet 52 is a TIM like the heat dissipation sheet 51, and is in close contact with the top surface of the IC body 210 of the IC 21 (the surface opposite to the surface that is mounted on the wiring board 211).
  • the heat dissipation plate 60 has high thermal conductivity.
  • the heat dissipation plate 60 covers the IC 21 and the heat dissipation sheet 51 from the top side.
  • the heat dissipation plate 60 is fixed to the circuit board 30 and is in close contact with the heat dissipation sheet 51.
  • the heat pipe 71 has a shape that expands in a direction parallel to the first surface 301 of the circuit board 30.
  • the heat pipe 71 is fixed to the heat dissipation plate 60 and is thermally connected to it.
  • a fan 72 and heat dissipation fins 73 are installed on the heat pipe 71.
  • the fan 72 is positioned so as to generate an airflow toward the heat dissipation fins 73.
  • Heat dissipation on the top side of IC21 Heat on the top surface side is conducted from IC 21 through heat dissipation sheet 51 and heat dissipation plate 60 to heat pipe 71.
  • the heat conducted to heat pipe 71 is conducted through heat pipe 71 and then to heat dissipation fin 73.
  • Heat dissipation fin 73 dissipates the heat by airflow from fan 72. In this way, the heat conducted to the top surface side of IC 21 is effectively dissipated.
  • heat pipe 71 it is possible to realize a low-profile heat dissipation structure 10 while suppressing a decrease in the heat dissipation effect.
  • the first ground terminals 213Gi and the second ground terminals 213Go of the IC 21 are connected to the foot pins 42 of the heat dissipation member 40 through the ground via electrodes 33VG, the ground electrode 32G, and the ground via electrodes 34VG.
  • the first ground terminals 213Gi and the second ground terminals 213Go, the ground via electrodes 33VG, the ground electrode 32G, the ground via electrodes 34VG, and the heat dissipation member 40 are made of metal and have high thermal conductivity. Therefore, the heat of the IC 21 is conducted to the foot pins 42 of the heat dissipation member 40 through these paths.
  • the heat conducted to the multiple leg pins 42 of the heat dissipation member 40 is diffused in a planar manner by the flat plate 41 and conducted to the heat dissipation sheet 51 over a specified area.
  • the heat conducted to the heat dissipation sheet 51 is conducted to the main housing plate 91 of the housing 90 and dissipated to the outside.
  • the heat of the IC 21 can be dissipated from the housing 90 side as well.
  • the heat dissipation member 40 is disposed in the narrow space between the circuit board 30 and the main housing board 91, so the size of the heat dissipation structure can be suppressed.
  • the heat dissipation structure 10 can improve heat dissipation performance without increasing the size of the heat dissipation structure on the top side of the IC 21 as in the conventional case.
  • the heat dissipation member 40 is connected to the circuit board 30 by a plurality of foot pins 42, each of which is rod-shaped. This allows connection to the circuit board 30 through the second surface 302 side (main housing board 91 side) of the circuit board 30, even if multiple mount-type electronic components 22 are densely mounted on the second surface 302 side (main housing board 91 side) of the circuit board 30. Therefore, the heat dissipation structure 10 can achieve heat dissipation without changing the mounting pattern of the multiple mount-type electronic components 22. Furthermore, by adopting the heat dissipation structure 10, it is possible to prevent the multiple foot pins 42 from connecting to the multiple mount-type electronic components 22, and to prevent physical and electrical interference with the multiple mount-type electronic components 22. As a result, the heat dissipation structure 10 can achieve heat dissipation while maintaining electrical insulation.
  • the heat dissipation structure 10 can improve heat dissipation while preventing the size from increasing and maintaining electrical insulation.
  • the heat dissipation structure 10 it is possible to suppress the increase in cost and size that would be caused by multiple heat pipes 71 on the top side of the IC 21. Furthermore, by adopting the heat dissipation structure 10, it is possible to simplify the heat dissipation design on the top side of the IC 21, and it is possible to suppress the increase in cost and size.
  • a certain ground via electrode 34VG and a plurality of foot pins 42 are disposed between the first ground terminal 213Gi and the second ground terminal 213Go in a direction from the center toward the outer end of the IC 21 (for example, the horizontal direction in FIG. 4), as described above.
  • a current flowing from the first ground terminal 213Gi toward the ground via electrode 34VG and the plurality of foot pins 42 (for example, the current igi in FIG. 4) and a current flowing from the second ground terminal 213Go toward the ground via electrode 34VG and the plurality of foot pins 42 (for example, the current iGo in FIG. 4) flow in opposite directions.
  • the heat dissipation member 40 is also electrically connected to the ground electrode 32G of the circuit board 30 at multiple points by multiple foot pins 42. This configuration reduces fluctuations in the ground potential.
  • Figure 6(A) is a schematic diagram showing the concept of magnetic field cancellation
  • Figure 6(B) shows a partial equivalent circuit diagram and an image of the current.
  • the IC 21 has a switching element Qi that connects to the inner ground via electrode 33VGi and a switching element Qo that connects to the outer ground via electrode 33VGo for the multiple foot pins 42 and the multiple ground via electrodes 34VG connected to them.
  • a high-frequency current igo corresponding to the switching frequency flows through the ground via electrode 33VGo and the ground electrode 32G to the ground via electrode 34VG.
  • the current igo flows from the ground electrode 32G to the foot pin 42 (heat dissipation member 40) for the ground via electrode 34VG.
  • the ground via electrode 34VG (and the foot pin 42) is a conductor and appears as an inductor Lv to the high-frequency current igo. Therefore, a magnetic field is generated by the current igo flowing through the ground via electrode 34VG. When such a magnetic field is generated, a current igoL flows through the ground via electrode 34VG so as to cancel out this magnetic field. As shown by the thick dashed arrow in FIG. 6B, the current igoL flows from the foot pin 42 (heat dissipation member 40) toward the ground electrode 32G, and flows in the direction of the inner ground via electrode 33VGi to which the switching element Qi in the ground electrode 32G is connected.
  • the current igoL is a current in the opposite direction to the current igi that flows from the switching element Qi to the heat dissipation member 40 through the ground via electrode 34VG.
  • the magnetic field generated by the current igoL and the magnetic field generated by the current igi cancel each other out and weaken each other.
  • Fig. 7 is a side cross-sectional view showing the heat dissipation structure according to the second embodiment of the present invention. Note that Fig. 7 is not a strict cross-sectional view, as in Fig. 1, but is a side cross-sectional view seen to make the heat dissipation structure easy to understand. Also, in Fig. 7, as in Fig. 1, reference numerals are omitted as appropriate to make the drawing easier to understand.
  • Figure 8 is an enlarged view of Figure 7, with examples of heat conduction paths added.
  • the dotted arrows indicate the heat conduction paths.
  • the heat dissipation structure 10A according to the second embodiment differs from the heat dissipation structure 10 according to the first embodiment in that it includes a vapor chamber 80.
  • the other configuration of the heat dissipation structure 10A is the same as that of the heat dissipation structure 10, and a description of similar parts will be omitted.
  • the heat dissipation structure 10A includes a vapor chamber 80.
  • the vapor chamber 80 is flat.
  • the planar area of the vapor chamber 80 is larger than the planar area of the flat plate 41 of the heat dissipation member 40.
  • the vapor chamber 80 is disposed between the heat dissipation sheet 51 and the main surface 911 of the main housing board 91.
  • the vapor chamber 80 is in close contact with the heat dissipation sheet 51 and is in surface contact with the main surface 911 of the main housing board 91.
  • the heat conducted to the heat dissipation member 40 is conducted to the vapor chamber 80 through the heat dissipation sheet 51.
  • the vapor chamber 80 diffuses heat in a planar manner.
  • the heat diffused in a planar manner is dissipated to the outside through the main housing plate 91.
  • the heat dissipation structure 10A can increase the heat dissipation area on the side of the main housing board 91, improving heat dissipation efficiency.
  • the vapor chamber 80 can be made thinner than fins, etc. This improves heat dissipation while preventing the gap between the circuit board 30 and the main housing board 91 from becoming significantly wider. Therefore, the heat dissipation structure 10A can achieve even higher heat dissipation performance while preventing it from becoming larger.
  • FIG. 9 is a side cross-sectional view showing the heat dissipation structure according to the third embodiment of the present invention.
  • Fig. 9 is a side cross-sectional view seen to make the heat dissipation structure easier to understand, not a strict cross-section, as in Fig. 1.
  • reference numerals are omitted as appropriate to make the drawing easier to understand, as in Fig. 1.
  • the heat dissipation structure 10B according to the third embodiment differs from the heat dissipation structure 10 according to the first embodiment in that it includes a heat dissipation sheet 51B.
  • the other configuration of the heat dissipation structure 10B is the same as that of the heat dissipation structure 10, and a description of similar parts will be omitted.
  • the heat dissipation structure 10B includes a heat dissipation sheet 51B.
  • the heat dissipation sheet 51B is conductive.
  • the heat dissipation member 40 can be connected to the ground potential of the housing 90 through the heat dissipation sheet 51B. This makes the ground potential of the IC 21 even more stable.
  • FIG. 10 is a side cross-sectional view showing the heat dissipation structure according to the fourth embodiment of the present invention.
  • Fig. 10 is a side cross-sectional view seen to make the heat dissipation structure easier to understand, rather than showing a strict cross section, as in Fig. 1.
  • reference numerals are omitted as appropriate to make the drawing easier to understand, as in Fig. 1.
  • the heat dissipation structure 10C according to the fourth embodiment differs from the heat dissipation structure 10 according to the first embodiment in that it includes a heat dissipation sheet 51C and a vapor chamber 80.
  • the other configuration of the heat dissipation structure 10C is similar to that of the heat dissipation structure 10, and a description of similar parts will be omitted.
  • the heat dissipation structure 10C has a configuration that combines the heat dissipation structures 10A and 10B.
  • the heat dissipation structure 10C includes a heat dissipation sheet 51C and a vapor chamber 80.
  • the heat dissipation sheet 51C is electrically conductive.
  • the vapor chamber 80 is disposed between the heat dissipation sheet 51C and the main surface 911 of the main housing board 91.
  • the vapor chamber 80 is in close contact with the heat dissipation sheet 51C and is in surface contact with the main surface 911 of the main housing board 91.
  • the heat dissipation member 40 can be connected to the ground potential of the housing 90 through the heat dissipation sheet 51C and the vapor chamber 80. This further stabilizes the ground potential of the IC 21. Also, the inclusion of the vapor chamber 80 improves heat dissipation.
  • FIG. 11 is an enlarged side cross-sectional view showing the heat dissipation structure according to the fifth embodiment of the present invention, with an example of a heat conduction path added.
  • dotted arrows indicate the heat conduction path.
  • Fig. 11 does not show a strict cross-section, but is a side cross-sectional view seen to make the heat dissipation structure easy to understand.
  • reference numerals are omitted as appropriate to make the drawing easier to see.
  • the heat dissipation structure 10D according to the fifth embodiment differs from the heat dissipation structure 10 according to the first embodiment in that it includes a heat dissipation member 40D and an insulating member 59.
  • the other configuration of the heat dissipation structure 10D is the same as that of the heat dissipation structure 10, and a description of similar parts will be omitted.
  • the heat dissipation structure 10D includes a heat dissipation member 40D and an insulating member 59.
  • the heat dissipation member 40D differs from the heat dissipation member 40 according to the first embodiment in that it has a through hole 419 formed in the flat plate 41.
  • the rest of the configuration of the heat dissipation member 40D is the same as that of the heat dissipation member 40, and a description of similar parts will be omitted.
  • the through hole 419 penetrates the flat plate 41 in the thickness direction.
  • When there is one through hole 419 it is formed at a position different from the center when the flat plate 41 is viewed in a plan view.
  • When there are multiple through holes 419 they are formed at asymmetric positions when the flat plate 41 is viewed in a plan view.
  • the through hole 419 indicates the directionality and shape of the flat plate 41, in other words, the directionality and shape of the heat dissipation member 40D.
  • the heat dissipation member 40D can be easily mounted on the circuit board 30 at a highly accurate position using surface mounting technology.
  • the insulating member 59 is filled between the second surface 302 of the circuit board 30 and the flat plate 41.
  • the insulating member 59 is flexible when filled, and is solidified by heating or the like.
  • the insulating member 59 is made of a material with higher thermal conductivity than air, for example, insulating resin.
  • the insulating member 59 can also be made of insulating resin mixed with multiple small metal balls, each of which is insulated and shielded. By providing multiple small metal balls, each of which is insulated and shielded, the thermal conductivity of the insulating member 59 can be improved.
  • the heat of the circuit board 30 is conducted to the flat plate 41 of the heat dissipation member 40D not only through the multiple foot pins 42 but also through the insulating member 59. This allows the heat dissipation structure 10D to achieve even higher heat dissipation performance.
  • the flat plate 41 has a through hole 419, the insulating material 59, which has fluidity when filled, can be easily supplied between the flat plate 41 and the circuit board 30 through the through hole 419.
  • the heat dissipation structure includes the heat pipe 71, the fan 72, and the heat dissipation fins 73, but it is also possible to omit the fan 72, omit the fan 72 and the heat dissipation fins 73, or omit the heat pipe 71, the fan 72, and the heat dissipation fins 73.
  • the fan 72 omits the fan 72 and the heat dissipation fins 73
  • high heat dissipation can be realized, so it is preferable to provide these.
  • ⁇ 3> A heat dissipation structure as described in ⁇ 1> or ⁇ 2>, in which the flat plate of the heat dissipation member is in direct or indirect surface contact with the third surface of the housing.
  • a heat dissipation sheet that can be deformed by pressure is provided, The heat dissipation structure described in ⁇ 3>, wherein the flat plate contacts the third surface via the heat dissipation sheet.
  • a flat vapor chamber is provided, The planar area of the vapor chamber is larger than the planar area of the flat plate, The heat dissipation structure described in ⁇ 3>, wherein the vapor chamber is disposed between the flat plate and the third surface.
  • ⁇ 6> A heat dissipation structure according to any one of ⁇ 1> to ⁇ 5>, in which the heat dissipation member is made of copper or a copper alloy.
  • a heat dissipation structure according to any one of ⁇ 1> to ⁇ 7>, in which the area of the flat plate is equal to or smaller than the planar area of the IC.
  • the heat pipe is the IC is in direct or indirect contact with a surface of the IC opposite to the circuit board; A shape extending in a direction parallel to the first surface.
  • the heat dissipation structure according to any one of ⁇ 1> to ⁇ 8>.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation structure (10) is provided with: a circuit board (30) having a first surface (301) and a second surface (302), with an IC (21) that is a heat-generating source mounted on the first surface (301); a housing (90) having a main surface (911) proximate to and opposing the second surface (302); and a heat dissipation member (40) that is mounted on the second surface (302) and has high thermal conductivity. The heat dissipation member (40) is provided with a flat plate (41) having a predetermined area, and a plurality of rod-shaped leg pins (42) connected to the flat plate (41) and mounted on the second surface. The circuit board (30) is provided with a ground electrode (32G) for connecting to a reference potential. The plurality of leg pins (42) are connected to the ground electrode (32G). The IC (21) is provided with a first ground terminal (213Gi) and a second ground terminal (213Go) each connected to the ground electrode (32G), the first ground terminal (213Gi) being disposed in the center and the second ground terminal (213Go) on the outer end side in a plan view of the circuit board (30). At least one of the plurality of leg pins (42) is disposed between the first ground terminal (213Gi) and the second ground terminal (213Go) in a direction from the center of the IC (21) toward the outer end.

Description

放熱構造Heat dissipation structure
　本発明は、ＩＣ等の発熱素子を放熱する放熱構造に関する。 The present invention relates to a heat dissipation structure that dissipates heat from heat-generating elements such as ICs.
　特許文献１には、放熱構造体が記載されている。特許文献１の放熱構造体は、基板、集積回路、サーマルパッド、ヒートシンク、および、ベース筐体を備える。 Patent document 1 describes a heat dissipation structure. The heat dissipation structure in Patent document 1 includes a substrate, an integrated circuit, a thermal pad, a heat sink, and a base housing.
　基板は、ベース筐体に設置される。集積回路は、発熱体であり、基板に配置される。サーマルパッドは、集積回路の表面（基板への実装面と反対側の面）に配置され、このサーマルパッドを介してヒートシンクが配置される。 The board is placed in the base housing. The integrated circuit, which is a heat generating element, is placed on the board. A thermal pad is placed on the surface of the integrated circuit (the surface opposite to the surface that is mounted on the board), and a heat sink is placed across this thermal pad.
特許第６５１２６４４号公報Patent No. 6512644
　現在のＣＰＵ、ＧＰＵ等の集積回路の発熱量は大きい。したがって、特許文献１に示すようなヒートシンクによって放熱量を増加させようとすると、ヒートシンクをさらに大きくしなければならない。このため、集積回路が実装される電子機器の大型化を招いてしまう。 Current integrated circuits such as CPUs and GPUs generate a large amount of heat. Therefore, if an attempt is made to increase the amount of heat dissipation using a heat sink as shown in Patent Document 1, the heat sink must be made even larger. This leads to an increase in the size of the electronic device in which the integrated circuit is mounted.
　また、ヒートパイプやファンを取り付けることも考えられる。しかしながら、この構成においても、放熱量をさらに増加させるには、ヒートパイプの個数を増加させること、ファンの回転数を上げる、或いはより大径のファンを採用すること等が必要になる。この場合も、集積回路が実装される電子機器の大型化を招いてしまう。また、回転数を上げると静粛性が損なわれてしまう。 It is also possible to install heat pipes and fans. However, even with this configuration, in order to further increase the amount of heat dissipation, it would be necessary to increase the number of heat pipes, increase the fan rotation speed, or adopt a fan with a larger diameter. This would also result in an increase in the size of the electronic device in which the integrated circuit is mounted. Furthermore, increasing the rotation speed would impair quietness.
　また、集積回路の熱は基板に伝わるので、基板を通じてベース筐体に放熱することも考えられる。しかしながら、現在のＣＰＵ、ＧＰＵ等の場合、基板におけるＣＰＵ、ＧＰＵの実装面の裏側（反対側）の面、すなわち、ベース筐体に近接する面には、多くのデカップリングコンデンサ等の電子部品が高密度で実装されている。このため、電気的な絶縁性等を保持しながら、基板からベース筐体への効率的な放熱を行うことは難しかった。 In addition, since heat from integrated circuits is transferred to the board, it is possible to dissipate the heat to the base housing through the board. However, in the case of current CPUs, GPUs, etc., the back (opposite) surface of the board to the surface on which the CPU or GPU is mounted, i.e., the surface closest to the base housing, has many electronic components such as decoupling capacitors densely mounted on it. For this reason, it has been difficult to efficiently dissipate heat from the board to the base housing while maintaining electrical insulation, etc.
　したがって、本発明の目的は、大型化を抑制し、電気的な絶縁性を保持して、放熱性を向上した放熱構造を実現することにある。 The object of the present invention is therefore to realize a heat dissipation structure that is small in size, maintains electrical insulation, and improves heat dissipation.
　この発明の放熱構造は、第１面と第２面とを有し、発熱源のＩＣが第１面に実装された回路基板と、第２面に近接して対向する第３面を有する筐体と、第２面に実装され、高い熱伝導性を有する放熱部材と、を備える。 The heat dissipation structure of the present invention comprises a circuit board having a first surface and a second surface, with an IC that is a heat source mounted on the first surface, a housing having a third surface that faces closely to the second surface, and a heat dissipation member that is mounted on the second surface and has high thermal conductivity.
　放熱部材は、所定面積を有する平板と、平板に接続する棒状からなり、第２面に実装される複数の足ピンと、を備える。回路基板は、基準電位に接続するためのグランド電極を備える。複数の足ピンは、グランド電極に接続される。ＩＣは、それぞれがグランド電極に接続され、回路基板の平面視において中央側に配置される第１グランド端子と外端側に配置される第２グランド端子とを備える。複数の足ピンの少なくとも1つは、ＩＣの中央から外端に向かう方向において、第１グランド端子と第２グランド端子との間に配置される。 The heat dissipation member comprises a flat plate having a predetermined area, and a plurality of rod-shaped foot pins connected to the flat plate and mounted on the second surface. The circuit board comprises a ground electrode for connection to a reference potential. The plurality of foot pins are connected to the ground electrode. The IC comprises a first ground terminal that is connected to the ground electrode and that is located at the center of the circuit board in a plan view, and a second ground terminal that is located at the outer end. At least one of the plurality of foot pins is located between the first ground terminal and the second ground terminal in the direction from the center to the outer end of the IC.
　この構成では、放熱部材によって、ＩＣの熱は、回路基板を通じてＩＣ側とは反対側に伝導される。これにより、ＩＣからの熱の外部への伝導量を大きくできる。また、放熱部材は、棒状の足ピンによって回路基板に接続するため、例えば、回路基板の第２面に実装型電子部品が実装されていても、この実装部分を避けて、回路基板に接続できる。これにより、放熱部材を用いることによる電気的な絶縁性を保持できる。 In this configuration, the heat dissipation member conducts the heat of the IC through the circuit board to the side opposite the IC. This increases the amount of heat conducted from the IC to the outside. In addition, because the heat dissipation member is connected to the circuit board by rod-shaped foot pins, for example, even if mountable electronic components are mounted on the second surface of the circuit board, it can be connected to the circuit board while avoiding this mounting area. This allows the electrical insulation provided by using the heat dissipation member to be maintained.
　また、足ピンの両側にグランド端子が配置されることで、それぞれのグランド端子から足ピンに流れる電流の向きは逆になる。これにより、それぞれのグランド端子から流れる電流によって発生する磁界が打ち消しあって低減され、グランドインピーダンスが低下し、グランド電位の揺れが低減する。したがって、ＩＣの動作は安定する。 In addition, by placing ground terminals on both sides of the foot pin, the currents flowing from each ground terminal to the foot pin in the opposite directions. This causes the magnetic fields generated by the currents flowing from each ground terminal to cancel each other out, lowering the ground impedance and reducing fluctuations in the ground potential. This stabilizes the operation of the IC.
　この発明の放熱構造によれば、大型化を抑制し、電気的な絶縁性を保持して、放熱性を向上できる。 The heat dissipation structure of this invention can prevent the device from becoming too large, maintain electrical insulation, and improve heat dissipation.
図１は、本発明の第１の実施形態に係る放熱構造を示す側面断面図である。FIG. 1 is a side cross-sectional view showing a heat dissipation structure according to a first embodiment of the present invention. 図２は、図１の拡大図であり、熱の伝導経路の例を追加した図である。FIG. 2 is an expanded view of FIG. 1 with additional examples of heat conduction paths. 図３は、本発明の第１の実施形態に係る放熱部材の第１平面図、第２平面図、側面図、および、側面断面図である。3A to 3C are a first plan view, a second plan view, a side view, and a cross-sectional side view of the heat dissipation member according to the first embodiment of the present invention. 図４は、ＩＣの各種端子と放熱部材の足ピンとの位置関係を示す図である。FIG. 4 is a diagram showing the positional relationship between various terminals of the IC and the leg pins of the heat dissipation member. 図５は、図１の拡大図であり、電流の伝導経路の例を追加した図である。FIG. 5 is an expanded view of FIG. 1 with the addition of examples of current conduction paths. 図６（Ａ）は、磁界のキャンセルの概念を示すための模式図であり、図６（Ｂ）は、その一部の等価回路図と電流のイメージを示す図である。FIG. 6A is a schematic diagram showing the concept of canceling a magnetic field, and FIG. 6B is a diagram showing an equivalent circuit diagram of a part of it and an image of a current. 図７は、本発明の第２の実施形態に係る放熱構造を示す側面断面図である。FIG. 7 is a side cross-sectional view showing a heat dissipation structure according to a second embodiment of the present invention. 図８は、図６の拡大図であり、熱の伝導経路の例を追加した図である。FIG. 8 is an expanded view of FIG. 6 with additional examples of heat conduction paths. 図９は、本発明の第３の実施形態に係る放熱構造を示す側面断面図である。FIG. 9 is a side cross-sectional view showing a heat dissipation structure according to a third embodiment of the present invention. 図１０は、本発明の第４の実施形態に係る放熱構造を示す側面断面図である。FIG. 10 is a side cross-sectional view showing a heat dissipation structure according to a fourth embodiment of the present invention. 図１１は、本発明の第５の実施形態に係る放熱構造を示す側面断面の拡大図であり、熱の伝導経路の例を追加した図である。FIG. 11 is an enlarged side cross-sectional view showing a heat dissipation structure according to a fifth embodiment of the present invention, with an example of a heat conduction path added.
　［第１の実施形態］
　本発明の第１の実施形態に係る放熱構造について、図を参照して説明する。 [First embodiment]
A heat dissipation structure according to a first embodiment of the present invention will be described with reference to the drawings.
　図１は、本発明の第１の実施形態に係る放熱構造を示す側面断面図である。なお、図１は、厳密な断面を示すものではなく、放熱構造を理解し易いように見た側面断面図である。また、図１では、図を見易くするために符号を適宜省略している。 FIG. 1 is a side cross-sectional view showing a heat dissipation structure according to a first embodiment of the present invention. Note that FIG. 1 does not show a strict cross-section, but is a side cross-sectional view viewed to make the heat dissipation structure easier to understand. Also, in FIG. 1, reference numerals have been omitted as appropriate to make the drawing easier to read.
　図２は、図１の拡大図であり、熱の伝導経路の例を追加した図である。図２において、点線の矢印が熱の伝導経路を示す。 Figure 2 is an enlarged view of Figure 1, with examples of heat conduction paths added. In Figure 2, the dotted arrows indicate the heat conduction paths.
　図３は、本発明の第１の実施形態に係る放熱部材の第１平面図、第２平面図、側面図、および、側面断面図である。図４は、ＩＣの各種端子と放熱部材の足ピンとの位置関係を示す図である。 FIG. 3 shows a first plan view, a second plan view, a side view, and a cross-sectional side view of a heat dissipation member according to a first embodiment of the present invention. FIG. 4 shows the positional relationship between various terminals of an IC and the foot pins of the heat dissipation member.
　図５は、図１の拡大図であり、電流の伝導経路の例を追加した図である。図５において、実線の矢印が電流の伝導経路を示す。 Figure 5 is an enlarged view of Figure 1, with examples of current conduction paths added. In Figure 5, the solid arrows indicate the current conduction paths.
　図１、図２に示すように、放熱構造１０は、ＩＣ２１、複数の実装型電子部品２２、回路基板３０、放熱部材４０、放熱シート５１、放熱シート５２、放熱プレート６０、ヒートパイプ７１、ファン７２、放熱フィン７３、および、筐体９０を備える。 As shown in Figures 1 and 2, the heat dissipation structure 10 includes an IC 21, a plurality of mounted electronic components 22, a circuit board 30, a heat dissipation member 40, a heat dissipation sheet 51, a heat dissipation sheet 52, a heat dissipation plate 60, a heat pipe 71, a fan 72, heat dissipation fins 73, and a housing 90.
　筐体９０は、筐体主板９１と支持体９２とを備える。筐体９０は、金属等からなり、導電性を有する。なお、筐体９０は、導電性を有さない材料から構成されていてもよいが、その場合、筐体用のグランド（基準電位、接地電位）を実現する導体部を少なくとも備えていることが好ましい。 The housing 90 includes a housing main plate 91 and a support 92. The housing 90 is made of metal or the like and is conductive. The housing 90 may be made of a material that is not conductive, but in that case, it is preferable that the housing 90 includes at least a conductor portion that provides a ground (reference potential, earth potential) for the housing.
　筐体主板９１は、主面９１１と主面９１２とを有する。主面９１１が本発明の第３面に対応する。支持体９２は、主面９１１から所定高さで立設している。支持体９２の高さは、複数の実装型電子部品２２、放熱部材４０、放熱シート５１を後述のように配置する範囲においてできるだけ低いことが好ましい。これにより、回路基板３０を筐体９０に固定する構造を可能な限り低背化できる。 The housing main board 91 has a main surface 911 and a main surface 912. The main surface 911 corresponds to the third surface of the present invention. The support 92 stands at a predetermined height from the main surface 911. It is preferable that the height of the support 92 is as low as possible within the range in which the multiple mounted electronic components 22, the heat dissipation member 40, and the heat dissipation sheet 51 are arranged as described below. This allows the structure that fixes the circuit board 30 to the housing 90 to be as low-profile as possible.
　回路基板３０は、第１面３０１と第２面３０２とを有する。回路基板３０の内部には、信号用電極３１、および、グランド電極３２Ｇが形成されている。信号用電極３１およびグランド電極３２Ｇは、第１面３０１および第２面３０２に平行な方向に広がる、または平行な方向に配線される電極である。 The circuit board 30 has a first surface 301 and a second surface 302. A signal electrode 31 and a ground electrode 32G are formed inside the circuit board 30. The signal electrode 31 and the ground electrode 32G are electrodes that extend in a direction parallel to the first surface 301 and the second surface 302, or are electrodes that are wired in a parallel direction.
　また、回路基板３０の内部は、複数のグランド用ビア電極３３ＶＧおよび複数のグランド用ビア電極３４ＶＧが形成されている。複数のグランド用ビア電極３３ＶＧは、回路基板３０の厚み方向（第１面３０１および第２面３０２に直交する方向）に延びる電極である。複数のグランド用ビア電極３３ＶＧは、グランド電極３２Ｇに接続するとともに、第１面３０１に形成されたＩＣグランド用ランド電極（図示を省略）に接続する。複数のグランド用ビア電極３４ＶＧは、グランド電極３２Ｇに接続するとともに、第２面３０２に露出するか、第２面３０２に形成されたグランド用外部電極（図示を省略）に接続する。 In addition, a plurality of ground via electrodes 33VG and a plurality of ground via electrodes 34VG are formed inside the circuit board 30. The plurality of ground via electrodes 33VG are electrodes extending in the thickness direction of the circuit board 30 (a direction perpendicular to the first surface 301 and the second surface 302). The plurality of ground via electrodes 33VG are connected to the ground electrode 32G and are connected to an IC ground land electrode (not shown) formed on the first surface 301. The plurality of ground via electrodes 34VG are connected to the ground electrode 32G and are exposed on the second surface 302 or are connected to an external ground electrode (not shown) formed on the second surface 302.
　回路基板３０は、第２面３０２が筐体主板９１の主面９１１に対向し、支持体９２の先端が第２面３０２に接する状態で、筐体９０に固定される。 The circuit board 30 is fixed to the housing 90 with the second surface 302 facing the main surface 911 of the housing main board 91 and the tip of the support 92 in contact with the second surface 302.
　ＩＣ２１は、例えば、ＣＰＵ、ＧＰＵ、ＳｏＣ等であり、駆動によって熱を発生する発熱部材である。ＩＣ２１は、ＩＣ本体２１０、配線基板２１１、複数の信号用端子２１３Ｎ、複数の第１グランド端子２１３Ｇｉ、および、複数の第２グランド端子２１３Ｇｏを備える。 The IC 21 is, for example, a CPU, a GPU, or a SoC, and is a heat-generating component that generates heat when driven. The IC 21 includes an IC body 210, a wiring board 211, a number of signal terminals 213N, a number of first ground terminals 213Gi, and a number of second ground terminals 213Go.
　ＩＣ本体２１０は、配線基板２１１の一方主面に実装される。 The IC body 210 is mounted on one main surface of the wiring board 211.
　複数の信号用端子２１３Ｎ、複数の第１グランド端子２１３Ｇｉ、および、複数の第２グランド端子２１３Ｇｏは、例えば、はんだバンプであり、配線基板２１１の他方主面に二次元配置された状態で形成される。この際、ＩＣ２１を平面視して、複数の第１グランド端子２１３Ｇｉは、ＩＣ２１の中央部分に配置され、複数の第２グランド端子２１３Ｇｏは、ＩＣ２１の外端付近に配置される（図４を参照）。 The signal terminals 213N, the first ground terminals 213Gi, and the second ground terminals 213Go are, for example, solder bumps, and are formed in a two-dimensional arrangement on the other main surface of the wiring board 211. In this case, when the IC 21 is viewed in a plan view, the first ground terminals 213Gi are arranged in the center of the IC 21, and the second ground terminals 213Go are arranged near the outer end of the IC 21 (see FIG. 4).
　ＩＣ２１は、回路基板３０の第１面３０１に実装される。この際、複数の信号用端子２１３Ｎ、複数の第１グランド端子２１３Ｇｉ、および、複数の第２グランド端子２１３Ｇｏは、回路基板３０の各ランド電極に、電気的、物理的に接続する。 The IC 21 is mounted on the first surface 301 of the circuit board 30. At this time, the multiple signal terminals 213N, the multiple first ground terminals 213Gi, and the multiple second ground terminals 213Go are electrically and physically connected to the respective land electrodes of the circuit board 30.
　これにより、図２に示すように、複数の信号用端子２１３Ｎは、複数の信号用ランド電極（図示を省略）、複数の信号用ビア電極（図示を省略）をそれぞれに通じて、回路基板３０の信号用電極３１に接続する。また、図２に示すように、複数の第１グランド端子２１３Ｇｉ、および、複数の第２グランド端子２１３Ｇｏは、複数のＩＣグランド用ランド電極（図示を省略）、複数のグランド用ビア電極３３ＶＧをそれぞれに通じて、回路基板３０のグランド電極３２Ｇに接続する。 2, the signal terminals 213N are connected to the signal electrodes 31 of the circuit board 30 through the signal land electrodes (not shown) and the signal via electrodes (not shown). Also, as shown in FIG. 2, the first ground terminals 213Gi and the second ground terminals 213Go are connected to the ground electrode 32G of the circuit board 30 through the IC ground land electrodes (not shown) and the ground via electrodes 33VG.
　複数の実装型電子部品２２は、例えば、ＩＣ２１に対するデカップリングコンデンサである。なお、複数の実装型電子部品２２の種類は、これに限るものではない。 The multiple mounted electronic components 22 are, for example, decoupling capacitors for the IC 21. Note that the types of the multiple mounted electronic components 22 are not limited to this.
　複数の実装型電子部品２２は、回路基板３０の第２面３０２に実装される。なお、複数の実装型電子部品２２は、回路基板３０を通じてＩＣ２１に対して所定パターンで接続されている（図示省略）。 The multiple mounted electronic components 22 are mounted on the second surface 302 of the circuit board 30. The multiple mounted electronic components 22 are connected to the IC 21 through the circuit board 30 in a predetermined pattern (not shown).
　複数の実装型電子部品２２は、所定の配置パターン（例えば、二次元配列パターン）で第２面３０２に実装される。複数の実装型電子部品２２の間には、複数のグランド用ビア電極３４ＶＧの露出部、または、複数のグランド用ビア電極３４ＶＧにそれぞれ接続する複数のグランド用外部電極が配置される。回路基板３０の第２面３０２の平面視において、複数のグランド用ビア電極３４ＶＧの露出部または複数のグランド用外部電極は、複数の実装型電子部品２２に重ならない位置に配置される。 The multiple mounted electronic components 22 are mounted on the second surface 302 in a predetermined arrangement pattern (e.g., a two-dimensional array pattern). Between the multiple mounted electronic components 22, exposed portions of the multiple ground via electrodes 34VG or multiple ground external electrodes respectively connected to the multiple ground via electrodes 34VG are arranged. In a plan view of the second surface 302 of the circuit board 30, the exposed portions of the multiple ground via electrodes 34VG or the multiple ground external electrodes are arranged in positions that do not overlap the multiple mounted electronic components 22.
　放熱部材４０は、銅または銅合金等の高い熱伝導性を有する材料である。なお、放熱部材４０は、回路基板３０や空気よりも高い熱伝導性を有していればよく、他の材料であってもよい。ただし、放熱部材４０は、はんだ等での接合が容易な材料であるとよりよい。 The heat dissipation member 40 is a material with high thermal conductivity, such as copper or a copper alloy. Note that the heat dissipation member 40 may be made of other materials as long as it has a higher thermal conductivity than the circuit board 30 or air. However, it is preferable that the heat dissipation member 40 is made of a material that is easy to join with solder or the like.
　図３に示すように、放熱部材４０は、所定面積を有する平板４１、および、複数の足ピン４２を備える。平板４１は、主面４１１と主面４１２とを有する。 As shown in FIG. 3, the heat dissipation member 40 includes a flat plate 41 having a predetermined area and a plurality of foot pins 42. The flat plate 41 has a main surface 411 and a main surface 412.
　複数の足ピン４２は、所定高さ棒状である。複数の足ピン４２は、平板４１の外周に沿って間隔で配置されている。複数の足ピン４２は、平板４１の主面４１２から所定高さで立設する。複数の足ピン４２の高さは同じであり、複数の実装型電子部品２２の高さよりも高い。 The multiple foot pins 42 are rod-shaped and have a predetermined height. The multiple foot pins 42 are spaced apart along the outer periphery of the flat plate 41. The multiple foot pins 42 stand upright at a predetermined height from the main surface 412 of the flat plate 41. The multiple foot pins 42 have the same height, which is higher than the height of the multiple mounted electronic components 22.
　図１、図２に示すように、放熱部材４０は、回路基板３０の第２面３０２に実装される。この際、放熱部材４０は、平板４１が第２面３０２に平行になり、平面視において、ＩＣ２１に重なる位置に実装される。 As shown in Figures 1 and 2, the heat dissipation member 40 is mounted on the second surface 302 of the circuit board 30. At this time, the heat dissipation member 40 is mounted in a position where the flat plate 41 is parallel to the second surface 302 and overlaps the IC 21 in a plan view.
　より具体的に、複数の足ピン４２の先端は、回路基板３０の第２面３０２に実装される。複数の足ピン４２は、複数の実装型電子部品２２に接触しないように、複数の実装型電子部品２２の間に挿入されて、第２面３０２に実装される。足ピン４２が実装型電子部品２２よりも高い。したがって、平板４１は、平面視において複数の実装型電子部品２２と重なる位置に配置されても、複数の実装型電子部品２２と電気的、物理的に接触しない。 More specifically, the tips of the multiple foot pins 42 are mounted on the second surface 302 of the circuit board 30. The multiple foot pins 42 are inserted between the multiple mount-type electronic components 22 and mounted on the second surface 302 so as not to come into contact with the multiple mount-type electronic components 22. The foot pins 42 are higher than the mount-type electronic components 22. Therefore, even if the flat plate 41 is positioned so as to overlap the multiple mount-type electronic components 22 in a plan view, it does not come into electrical or physical contact with the multiple mount-type electronic components 22.
　さらに、複数の足ピン４２のうちの一部の足ピン４２は、複数のグランド用ビア電極３４ＶＧの露出部、または、複数のグランド用ビア電極３４ＶＧにそれぞれ実装され、電気的、物理的に接続される。 Furthermore, some of the multiple foot pins 42 are mounted on the exposed portions of the multiple ground via electrodes 34VG or on the multiple ground via electrodes 34VG, respectively, and are electrically and physically connected.
　さらに、図４に示すように、平面視において、複数の足ピン４２は、複数の第１グランド端子２１３Ｇｉを結ぶ環（図４の一点鎖線）で囲まれる領域よりも外側で、複数の第２グランド端子２１３Ｇｏを結ぶ環（図４の二点鎖線）で囲まれる領域よりも内側の範囲に配置される。これにより、複数の足ピン４２の少なくとも１つは、ＩＣ２１の中央から外端に向かう方向（例えば、図４の横方向）において、第１グランド端子２１３Ｇｉと第２グランド端子２１３Ｇｏとの間に配置される。具体的に、図４に示す場合、ＩＣ２１の中央から外端に向かう方向（例えば、図４の横方向）において、第１グランド端子２１３Ｇｉ１と第２グランド端子２１３Ｇｏ１とは並んでいるが、これらの間の位置に、縦方向に並ぶ複数の足ピン４２が配置される。 Furthermore, as shown in FIG. 4, in a plan view, the multiple foot pins 42 are arranged outside the area surrounded by the ring (dashed line in FIG. 4) connecting the multiple first ground terminals 213Gi and inside the area surrounded by the ring (dashed line in FIG. 4) connecting the multiple second ground terminals 213Go. As a result, at least one of the multiple foot pins 42 is arranged between the first ground terminal 213Gi and the second ground terminal 213Go in the direction from the center to the outer edge of the IC 21 (for example, the horizontal direction in FIG. 4). Specifically, in the case shown in FIG. 4, the first ground terminal 213Gi1 and the second ground terminal 213Go1 are lined up in the direction from the center to the outer edge of the IC 21 (for example, the horizontal direction in FIG. 4), and the multiple foot pins 42 lined up in the vertical direction are arranged between them.
　放熱シート５１は、所謂ＴＩＭ（Ｔｈｅｒｍａｌ　Ｉｎｔｅｒｆａｃｅ　Ｍａｔｅｒｉａｌ）であり、高い熱伝導性を有し、押圧等によって変形可能な材料からなる。 The heat dissipation sheet 51 is a so-called TIM (Thermal Interface Material), which has high thermal conductivity and is made of a material that can be deformed by pressure, etc.
　放熱シート５１は、放熱部材４０の平板４１と筐体９０における筐体主板９１の主面９１１との間に配置される。放熱シート５１は、平板４１と筐体主板９１とから圧力を受ける状態で配置されており、平板４１と筐体主板９１の主面９１１とに面で密着する。 The heat dissipation sheet 51 is disposed between the flat plate 41 of the heat dissipation member 40 and the main surface 911 of the main housing board 91 of the housing 90. The heat dissipation sheet 51 is disposed in a state in which it receives pressure from the flat plate 41 and the main housing board 91, and is in close contact with the flat plate 41 and the main surface 911 of the main housing board 91.
　これにより、放熱部材４０は、放熱シート５１を介して、筐体主板９１の主面９１１に間接的に接する。 As a result, the heat dissipation member 40 is indirectly in contact with the main surface 911 of the housing main board 91 via the heat dissipation sheet 51.
　放熱シート５２は、放熱シート５１と同様にＴＩＭであり、ＩＣ２１のＩＣ本体２１０の天面（配線基板２１１に実装される面と反対側の面）に密着する。 The heat dissipation sheet 52 is a TIM like the heat dissipation sheet 51, and is in close contact with the top surface of the IC body 210 of the IC 21 (the surface opposite to the surface that is mounted on the wiring board 211).
　放熱プレート６０は、高い熱伝導性を有する。放熱プレート６０は、ＩＣ２１および放熱シート５１を天面側から覆っている。放熱プレート６０は、回路基板３０に固定されており、放熱シート５１に密着する。 The heat dissipation plate 60 has high thermal conductivity. The heat dissipation plate 60 covers the IC 21 and the heat dissipation sheet 51 from the top side. The heat dissipation plate 60 is fixed to the circuit board 30 and is in close contact with the heat dissipation sheet 51.
　ヒートパイプ７１は、回路基板３０の第１面３０１に平行な方向に広がる形状である。ヒートパイプ７１は、放熱プレート６０に固定されており、熱的に接続される。ヒートパイプ７１には、ファン７２および放熱フィン７３が設置される。ファン７２は、放熱フィン７３に向けて気流を発生するように配置される。 The heat pipe 71 has a shape that expands in a direction parallel to the first surface 301 of the circuit board 30. The heat pipe 71 is fixed to the heat dissipation plate 60 and is thermally connected to it. A fan 72 and heat dissipation fins 73 are installed on the heat pipe 71. The fan 72 is positioned so as to generate an airflow toward the heat dissipation fins 73.
　（放熱）
　このような構成において、ＩＣ２１が駆動して発熱すると、熱は、ＩＣ２１の天面側と回路基板３０側に伝導する。 (Heat dissipation)
In such a configuration, when the IC 21 is driven and generates heat, the heat is conducted to the top surface side of the IC 21 and to the circuit board 30 side.
　（ＩＣ２１の天面側の放熱）
　天面側の熱は、ＩＣ２１から、放熱シート５１、放熱プレート６０を通じて、ヒートパイプ７１に伝導する。ヒートパイプ７１に伝導した熱は、ヒートパイプ７１を伝導し、放熱フィン７３に伝導する。放熱フィン７３は、ファン７２からの気流によって、放熱する。これにより、ＩＣ２１の天面側に伝導した熱は、効果的に放熱される。この際、ヒートパイプ７１を用いることによって、放熱効果の低下を抑制しながら、放熱構造１０の低背化を実現できる。 (Heat dissipation on the top side of IC21)
Heat on the top surface side is conducted from IC 21 through heat dissipation sheet 51 and heat dissipation plate 60 to heat pipe 71. The heat conducted to heat pipe 71 is conducted through heat pipe 71 and then to heat dissipation fin 73. Heat dissipation fin 73 dissipates the heat by airflow from fan 72. In this way, the heat conducted to the top surface side of IC 21 is effectively dissipated. In this case, by using heat pipe 71, it is possible to realize a low-profile heat dissipation structure 10 while suppressing a decrease in the heat dissipation effect.
　（回路基板３０側の放熱）
　ＩＣ２１の熱は、回路基板３０に伝導される。この際、図２に示すように、ＩＣ２１の複数の第１グランド端子２１３Ｇｉおよび複数の第２グランド端子２１３Ｇｏは、複数のグランド用ビア電極３３ＶＧ、グランド電極３２Ｇ、および、複数のグランド用ビア電極３４ＶＧを通じて、放熱部材４０の複数の足ピン４２に接続される。複数の第１グランド端子２１３Ｇｉおよび複数の第２グランド端子２１３Ｇｏは、複数のグランド用ビア電極３３ＶＧ、グランド電極３２Ｇ、複数のグランド用ビア電極３４ＶＧ、および、放熱部材４０は、金属であり、高い熱伝導性を有する。したがって、ＩＣ２１の熱は、これらの経路を通じて放熱部材４０の足ピン４２に伝導する。 (Heat dissipation on the circuit board 30 side)
2, the first ground terminals 213Gi and the second ground terminals 213Go of the IC 21 are connected to the foot pins 42 of the heat dissipation member 40 through the ground via electrodes 33VG, the ground electrode 32G, and the ground via electrodes 34VG. The first ground terminals 213Gi and the second ground terminals 213Go, the ground via electrodes 33VG, the ground electrode 32G, the ground via electrodes 34VG, and the heat dissipation member 40 are made of metal and have high thermal conductivity. Therefore, the heat of the IC 21 is conducted to the foot pins 42 of the heat dissipation member 40 through these paths.
　放熱部材４０の複数の足ピン４２に伝導した熱は、平板４１で平面状に拡散し、放熱シート５１に所定面積で伝導する。放熱シート５１に伝導した熱は、筐体９０の筐体主板９１に伝導し、外部に放熱される。 The heat conducted to the multiple leg pins 42 of the heat dissipation member 40 is diffused in a planar manner by the flat plate 41 and conducted to the heat dissipation sheet 51 over a specified area. The heat conducted to the heat dissipation sheet 51 is conducted to the main housing plate 91 of the housing 90 and dissipated to the outside.
　このように、放熱構造１０を備えることで、ＩＣ２１の熱は、筐体９０側からも放熱できる。これにより、放熱構造１０は、放熱性をさらに向上できる。この際、放熱部材４０は、回路基板３０と筐体主板９１との間の狭空間に配置されるので、放熱構造の大型化を抑制できる。すなわち、放熱構造１０は、従来のようなＩＣ２１の天面側の放熱構造を大型化することなく、放熱性を向上できる。 In this way, by providing the heat dissipation structure 10, the heat of the IC 21 can be dissipated from the housing 90 side as well. This allows the heat dissipation structure 10 to further improve its heat dissipation performance. In this case, the heat dissipation member 40 is disposed in the narrow space between the circuit board 30 and the main housing board 91, so the size of the heat dissipation structure can be suppressed. In other words, the heat dissipation structure 10 can improve heat dissipation performance without increasing the size of the heat dissipation structure on the top side of the IC 21 as in the conventional case.
　また、放熱部材４０は、それぞれが棒状からなる複数の足ピン４２によって、回路基板３０に接続する。これにより、回路基板３０の第２面３０２側（筐体主板９１側）に複数の実装型電子部品２２が高密度で実装されていても、その間を通して、回路基板３０に接続できる。したがって、放熱構造１０は、複数の実装型電子部品２２の実装パターンを変更することなく、放熱を実現できる。また、放熱構造１０を採用することで複数の足ピン４２が複数の実装型電子部品２２に接続することを抑制でき、複数の実装型電子部品２２に対する物理的電気的な干渉を抑制できる。この結果、放熱構造１０は、電気的な絶縁性を保持しながら、放熱を実現できる。 The heat dissipation member 40 is connected to the circuit board 30 by a plurality of foot pins 42, each of which is rod-shaped. This allows connection to the circuit board 30 through the second surface 302 side (main housing board 91 side) of the circuit board 30, even if multiple mount-type electronic components 22 are densely mounted on the second surface 302 side (main housing board 91 side) of the circuit board 30. Therefore, the heat dissipation structure 10 can achieve heat dissipation without changing the mounting pattern of the multiple mount-type electronic components 22. Furthermore, by adopting the heat dissipation structure 10, it is possible to prevent the multiple foot pins 42 from connecting to the multiple mount-type electronic components 22, and to prevent physical and electrical interference with the multiple mount-type electronic components 22. As a result, the heat dissipation structure 10 can achieve heat dissipation while maintaining electrical insulation.
　以上のように、放熱構造１０は、大型化を抑制し、電気的な絶縁性を保持しながら、放熱性を向上できる。 As described above, the heat dissipation structure 10 can improve heat dissipation while preventing the size from increasing and maintaining electrical insulation.
　また、放熱構造１０を採用することで、ＩＣ２１の天面側のヒートパイプ７１の複数化によるコストアップや大型化を抑制できる。さらに、放熱構造１０を採用することで、ＩＣ２１の天面側の放熱設計を簡素化でき、コストアップや大型化を抑制できる。 In addition, by adopting the heat dissipation structure 10, it is possible to suppress the increase in cost and size that would be caused by multiple heat pipes 71 on the top side of the IC 21. Furthermore, by adopting the heat dissipation structure 10, it is possible to simplify the heat dissipation design on the top side of the IC 21, and it is possible to suppress the increase in cost and size.
　（グランド電位の揺れの低減）
　図４、図５に示すように、放熱構造１０では、所定のグランド用ビア電極３４ＶＧ、複数の足ピン４２は、上述のように、ＩＣ２１の中央から外端に向かう方向（例えば、図４の横方向）において、第１グランド端子２１３Ｇｉと第２グランド端子２１３Ｇｏとの間に配置される。これにより、第１グランド端子２１３Ｇｉからグランド用ビア電極３４ＶＧおよび複数の足ピン４２に向かう電流（例えば、図４の電流ｉｇｉ）と、第２グランド端子２１３Ｇｏからグランド用ビア電極３４ＶＧおよび複数の足ピン４２に向かう電流（例えば、図４の電流ｉＧｏ）とは、逆向きの流れである。 (Reduction of ground potential fluctuation)
4 and 5, in the heat dissipation structure 10, a certain ground via electrode 34VG and a plurality of foot pins 42 are disposed between the first ground terminal 213Gi and the second ground terminal 213Go in a direction from the center toward the outer end of the IC 21 (for example, the horizontal direction in FIG. 4), as described above. As a result, a current flowing from the first ground terminal 213Gi toward the ground via electrode 34VG and the plurality of foot pins 42 (for example, the current igi in FIG. 4) and a current flowing from the second ground terminal 213Go toward the ground via electrode 34VG and the plurality of foot pins 42 (for example, the current iGo in FIG. 4) flow in opposite directions.
　また、放熱部材４０は、複数の足ピン４２によって、回路基板３０のグランド電極３２Ｇに対して複数個所で電気的に接続されている。このような構成によって、グランド電位の揺れを低減できる。 The heat dissipation member 40 is also electrically connected to the ground electrode 32G of the circuit board 30 at multiple points by multiple foot pins 42. This configuration reduces fluctuations in the ground potential.
　図６（Ａ）は、磁界のキャンセルの概念を示すための模式図であり、図６（Ｂ）は、その一部の等価回路図と電流のイメージを示す図である。 Figure 6(A) is a schematic diagram showing the concept of magnetic field cancellation, and Figure 6(B) shows a partial equivalent circuit diagram and an image of the current.
　図６（Ａ）示すように、ＩＣ２１は、複数の足ピン４２およびこれらに接続する複数のグランド用ビア電極３４ＶＧに対して、内側のグランド用ビア電極３３ＶＧｉに接続するスイッチング素子Ｑｉと、外側のグランド用ビア電極３３ＶＧｏに接続するスイッチング素子Ｑｏとを備える。 As shown in FIG. 6(A), the IC 21 has a switching element Qi that connects to the inner ground via electrode 33VGi and a switching element Qo that connects to the outer ground via electrode 33VGo for the multiple foot pins 42 and the multiple ground via electrodes 34VG connected to them.
　この構成において、例えば、スイッチング素子Ｑｏがオン制御されると、グランド用ビア電極３３ＶＧｏ、グランド電極３２Ｇを通じて、グランド用ビア電極３４ＶＧに、スイッチング周波数に応じた高周波の電流ｉｇｏが流れる。図６（Ｂ）の太線矢印に示すように、電流ｉｇｏは、グランド用ビア電極３４ＶＧに対して、グランド電極３２Ｇから足ピン４２（放熱部材４０）に向かって流れる電流である。 In this configuration, for example, when the switching element Qo is controlled to be turned on, a high-frequency current igo corresponding to the switching frequency flows through the ground via electrode 33VGo and the ground electrode 32G to the ground via electrode 34VG. As shown by the bold arrow in FIG. 6(B), the current igo flows from the ground electrode 32G to the foot pin 42 (heat dissipation member 40) for the ground via electrode 34VG.
　グランド用ビア電極３４ＶＧ（および足ピン４２）は、導体であり、高周波の電流ｉｇｏに対してはインダクタＬｖとしてみえる。このため、グランド用ビア電極３４ＶＧに流れる電流ｉｇｏによって磁界が発生する。このような磁界が発生すると、グランド用ビア電極３４ＶＧには、この磁界を打ち消すように、電流ｉｇｏＬが流れる。図６（Ｂ）の太破線矢印に示すように、電流ｉｇｏＬは、足ピン４２（放熱部材４０）からグランド電極３２Ｇに向かって流れる電流であり、グランド電極３２Ｇにおけるスイッチング素子Ｑｉが接続する内側のグランド用ビア電極３３ＶＧｉの方向に流れる。したがって、電流ｉｇｏＬは、スイッチング素子Ｑｉからグランド用ビア電極３４ＶＧを通じて放熱部材４０に流れる電流ｉｇｉと逆向きの電流になる。この結果、電流ｉｇｏＬによって発生する磁界と、電流ｉｇｉによって発生する磁界とは相殺されて弱めあう。 The ground via electrode 34VG (and the foot pin 42) is a conductor and appears as an inductor Lv to the high-frequency current igo. Therefore, a magnetic field is generated by the current igo flowing through the ground via electrode 34VG. When such a magnetic field is generated, a current igoL flows through the ground via electrode 34VG so as to cancel out this magnetic field. As shown by the thick dashed arrow in FIG. 6B, the current igoL flows from the foot pin 42 (heat dissipation member 40) toward the ground electrode 32G, and flows in the direction of the inner ground via electrode 33VGi to which the switching element Qi in the ground electrode 32G is connected. Therefore, the current igoL is a current in the opposite direction to the current igi that flows from the switching element Qi to the heat dissipation member 40 through the ground via electrode 34VG. As a result, the magnetic field generated by the current igoL and the magnetic field generated by the current igi cancel each other out and weaken each other.
　内側のスイッチング素子Ｑｉがオンの場合も同様のことが生じる。そして、複数のグランド用ビア電極３４ＶＧおよび複数の足ピン４２のそれぞれにおいて、上述の作用、効果が生じる。 The same thing happens when the inner switching element Qi is on. The above-mentioned actions and effects occur in each of the multiple ground via electrodes 34VG and the multiple foot pins 42.
　このように、放熱構造１０を備えることによって、スイッチング素子がオンのときにグランド電極３２Ｇに流れる電流を抑制できる。これにより、ＩＣ２１がスリープ状態のときと、ＩＣ２１が起動、駆動しているときとの間でのグランド（グランド電位）の揺れを低減できる。したがって、ＩＣ２１を高負荷で駆動しても、誤作動が抑制され、安定した動作を実現できる。 In this way, by providing the heat dissipation structure 10, it is possible to suppress the current flowing through the ground electrode 32G when the switching element is on. This reduces the fluctuation of the ground (ground potential) between when the IC 21 is in a sleep state and when the IC 21 is activated and operating. Therefore, even if the IC 21 is operated under a high load, malfunctions are suppressed and stable operation can be achieved.
　一方、本実施形態のような放熱部材４０を備えていない構成では、スイッチング素子がオンのときにだけ回路基板内のグランド電極に高周波電流が流れる。このため、グランド電位の揺れが生じてしまう。 On the other hand, in a configuration that does not include a heat dissipation member 40 as in this embodiment, high-frequency current flows through the ground electrode in the circuit board only when the switching element is on. This causes fluctuations in the ground potential.
　また、放熱構造１０では、ＩＣ２１にグランドの揺れを低下させる制御を行わなくてもよいので、ＩＣ２１のスイッチング周波数を高めたり、ＩＣ２１を構成する複数のスイッチング素子の同時スイッチング数を高めたりでき、ＩＣ２１の性能を向上できる。 In addition, with the heat dissipation structure 10, it is not necessary to perform control on the IC 21 to reduce ground fluctuations, so it is possible to increase the switching frequency of the IC 21 or increase the number of simultaneous switching operations of the multiple switching elements that make up the IC 21, thereby improving the performance of the IC 21.
　［第２の実施形態］
　本発明の第２の実施形態に係る放熱構造について、図を参照して説明する。図７は、本発明の第２の実施形態に係る放熱構造を示す側面断面図である。なお、図７は、図１と同様に、厳密な断面を示すものではなく、放熱構造を理解し易いように見た側面断面図である。また、図７では、図１と同様に、図を見易くするために符号を適宜省略している。 Second Embodiment
A heat dissipation structure according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 7 is a side cross-sectional view showing the heat dissipation structure according to the second embodiment of the present invention. Note that Fig. 7 is not a strict cross-sectional view, as in Fig. 1, but is a side cross-sectional view seen to make the heat dissipation structure easy to understand. Also, in Fig. 7, as in Fig. 1, reference numerals are omitted as appropriate to make the drawing easier to understand.
　図８は、図７の拡大図であり、熱の伝導経路の例を追加した図である。図８において、点線の矢印が熱の伝導経路を示す。 Figure 8 is an enlarged view of Figure 7, with examples of heat conduction paths added. In Figure 8, the dotted arrows indicate the heat conduction paths.
　図７、図８に示すように、第２の実施形態に係る放熱構造１０Ａは、第１の実施形態に係る放熱構造１０に対して、ベーパチャンバ８０を備える点で異なる。放熱構造１０Ａの他の構成は、放熱構造１０と同様であり、同様の箇所の説明は省略する。 As shown in Figures 7 and 8, the heat dissipation structure 10A according to the second embodiment differs from the heat dissipation structure 10 according to the first embodiment in that it includes a vapor chamber 80. The other configuration of the heat dissipation structure 10A is the same as that of the heat dissipation structure 10, and a description of similar parts will be omitted.
　放熱構造１０Ａは、ベーパチャンバ８０を備える。ベーパチャンバ８０は、平板状である。ベーパチャンバ８０の平面面積は、放熱部材４０の平板４１の平面面積よりも大きい。 The heat dissipation structure 10A includes a vapor chamber 80. The vapor chamber 80 is flat. The planar area of the vapor chamber 80 is larger than the planar area of the flat plate 41 of the heat dissipation member 40.
　ベーパチャンバ８０は、放熱シート５１と筐体主板９１の主面９１１との間に配置される。ベーパチャンバ８０は、放熱シート５１に密着するとともに、筐体主板９１の主面９１１に面で接する。 The vapor chamber 80 is disposed between the heat dissipation sheet 51 and the main surface 911 of the main housing board 91. The vapor chamber 80 is in close contact with the heat dissipation sheet 51 and is in surface contact with the main surface 911 of the main housing board 91.
　このような構成によって、図７に示すように、放熱構造１０Ａでは、放熱部材４０に伝導した熱は、放熱シート５１を通じてベーパチャンバ８０に伝導する。 With this configuration, as shown in FIG. 7, in the heat dissipation structure 10A, the heat conducted to the heat dissipation member 40 is conducted to the vapor chamber 80 through the heat dissipation sheet 51.
　ベーパチャンバ８０は、熱を面状に拡散させる。面状に拡散した熱は、筐体主板９１を通じて外部に放熱される。 The vapor chamber 80 diffuses heat in a planar manner. The heat diffused in a planar manner is dissipated to the outside through the main housing plate 91.
　このような構成によって、放熱構造１０Ａは、筐体主板９１側の放熱面積を広くでき、放熱効率を向上できる。この際、ベーパチャンバ８０は、フィン等と比較して薄型にできる。これにより、回路基板３０と筐体主板９１との間隔が大幅に広くなることを抑制しながら、放熱性を向上できる。したがって、放熱構造１０Ａは、大型化を抑制しながら、さらに高い放熱性を実現できる。 With this configuration, the heat dissipation structure 10A can increase the heat dissipation area on the side of the main housing board 91, improving heat dissipation efficiency. In this case, the vapor chamber 80 can be made thinner than fins, etc. This improves heat dissipation while preventing the gap between the circuit board 30 and the main housing board 91 from becoming significantly wider. Therefore, the heat dissipation structure 10A can achieve even higher heat dissipation performance while preventing it from becoming larger.
　［第３の実施形態］
　本発明の第３の実施形態に係る放熱構造について、図を参照して説明する。図９は、本発明の第３の実施形態に係る放熱構造を示す側面断面図である。なお、図９は、図１と同様に、厳密な断面を示すものではなく、放熱構造を理解し易いように見た側面断面図である。また、図９では、図１と同様に、図を見易くするために符号を適宜省略している。 [Third embodiment]
A heat dissipation structure according to a third embodiment of the present invention will be described with reference to the drawings. Fig. 9 is a side cross-sectional view showing the heat dissipation structure according to the third embodiment of the present invention. Note that Fig. 9 is a side cross-sectional view seen to make the heat dissipation structure easier to understand, not a strict cross-section, as in Fig. 1. Also, in Fig. 9, reference numerals are omitted as appropriate to make the drawing easier to understand, as in Fig. 1.
　図９に示すように、第３の実施形態に係る放熱構造１０Ｂは、第１の実施形態に係る放熱構造１０に対して、放熱シート５１Ｂを備える点で異なる。放熱構造１０Ｂの他の構成は、放熱構造１０と同様であり、同様の箇所の説明は省略する。 As shown in FIG. 9, the heat dissipation structure 10B according to the third embodiment differs from the heat dissipation structure 10 according to the first embodiment in that it includes a heat dissipation sheet 51B. The other configuration of the heat dissipation structure 10B is the same as that of the heat dissipation structure 10, and a description of similar parts will be omitted.
　放熱構造１０Ｂは、放熱シート５１Ｂを備える。放熱シート５１Ｂは、導電性を有する。 The heat dissipation structure 10B includes a heat dissipation sheet 51B. The heat dissipation sheet 51B is conductive.
　この構成によって、筐体主板９１が導電性を有し、筐体９０としてのグランド電位を形成するとき、放熱部材４０は、放熱シート５１Ｂを通じて、筐体９０のグランド電位に接続できる。これにより、ＩＣ２１のグランド電位はさらに安定する。 With this configuration, when the housing main board 91 is conductive and forms a ground potential for the housing 90, the heat dissipation member 40 can be connected to the ground potential of the housing 90 through the heat dissipation sheet 51B. This makes the ground potential of the IC 21 even more stable.
　［第４の実施形態］
　本発明の第４の実施形態に係る放熱構造について、図を参照して説明する。図１０は、本発明の第４の実施形態に係る放熱構造を示す側面断面図である。なお、図１０は、図１と同様に、厳密な断面を示すものではなく、放熱構造を理解し易いように見た側面断面図である。また、図１０では、図１と同様に、図を見易くするために符号を適宜省略している。 [Fourth embodiment]
A heat dissipation structure according to a fourth embodiment of the present invention will be described with reference to the drawings. Fig. 10 is a side cross-sectional view showing the heat dissipation structure according to the fourth embodiment of the present invention. Note that Fig. 10 is a side cross-sectional view seen to make the heat dissipation structure easier to understand, rather than showing a strict cross section, as in Fig. 1. Also, in Fig. 10, reference numerals are omitted as appropriate to make the drawing easier to understand, as in Fig. 1.
　図１０に示すように、第４の実施形態に係る放熱構造１０Ｃは、第１の実施形態に係る放熱構造１０に対して、放熱シート５１Ｃ、および、ベーパチャンバ８０を備える点で異なる。放熱構造１０Ｃの他の構成は、放熱構造１０と同様であり、同様の箇所の説明は省略する。概略的に言えば、放熱構造１０Ｃは、放熱構造１０Ａと放熱構造１０Ｂとを組み合わせた構成を備える。 As shown in FIG. 10, the heat dissipation structure 10C according to the fourth embodiment differs from the heat dissipation structure 10 according to the first embodiment in that it includes a heat dissipation sheet 51C and a vapor chamber 80. The other configuration of the heat dissipation structure 10C is similar to that of the heat dissipation structure 10, and a description of similar parts will be omitted. In general terms, the heat dissipation structure 10C has a configuration that combines the heat dissipation structures 10A and 10B.
　放熱構造１０Ｃは、放熱シート５１Ｃおよびベーパチャンバ８０を備える。放熱シート５１Ｃは、導電性を有する。 The heat dissipation structure 10C includes a heat dissipation sheet 51C and a vapor chamber 80. The heat dissipation sheet 51C is electrically conductive.
　ベーパチャンバ８０は、放熱シート５１Ｃと筐体主板９１の主面９１１との間に配置される。ベーパチャンバ８０は、放熱シート５１Ｃに密着するとともに、筐体主板９１の主面９１１に面で接する。 The vapor chamber 80 is disposed between the heat dissipation sheet 51C and the main surface 911 of the main housing board 91. The vapor chamber 80 is in close contact with the heat dissipation sheet 51C and is in surface contact with the main surface 911 of the main housing board 91.
　この構成によって、筐体主板９１が導電性を有し、筐体９０としてのグランド電位を形成するとき、放熱部材４０は、放熱シート５１Ｃおよびベーパチャンバ８０を通じて、筐体９０のグランド電位に接続できる。これにより、ＩＣ２１のグランド電位はさらに安定する。また、ベーパチャンバ８０を備えることで、放熱性は向上する。 With this configuration, when the housing main plate 91 is conductive and forms a ground potential for the housing 90, the heat dissipation member 40 can be connected to the ground potential of the housing 90 through the heat dissipation sheet 51C and the vapor chamber 80. This further stabilizes the ground potential of the IC 21. Also, the inclusion of the vapor chamber 80 improves heat dissipation.
　［第５の実施形態］
　本発明の第５の実施形態に係る放熱構造について、図を参照して説明する。図１１は、本発明の第５の実施形態に係る放熱構造を示す側面断面の拡大図であり、熱の伝導経路の例を追加した図である。図１１において、点線の矢印が熱の伝導経路を示す。なお、図１１は、厳密な断面を示すものではなく、放熱構造を理解し易いように見た側面断面図である。また、図１１では、図を見易くするために符号を適宜省略している。 [Fifth embodiment]
A heat dissipation structure according to a fifth embodiment of the present invention will be described with reference to the drawings. Fig. 11 is an enlarged side cross-sectional view showing the heat dissipation structure according to the fifth embodiment of the present invention, with an example of a heat conduction path added. In Fig. 11, dotted arrows indicate the heat conduction path. Note that Fig. 11 does not show a strict cross-section, but is a side cross-sectional view seen to make the heat dissipation structure easy to understand. Also, in Fig. 11, reference numerals are omitted as appropriate to make the drawing easier to see.
　図１１に示すように、第５の実施形態に係る放熱構造１０Ｄは、第１の実施形態に係る放熱構造１０に対して、放熱部材４０Ｄおよび絶縁性部材５９を備える点で異なる。放熱構造１０Ｄの他の構成は、放熱構造１０と同様であり、同様の箇所の説明は省略する。 As shown in FIG. 11, the heat dissipation structure 10D according to the fifth embodiment differs from the heat dissipation structure 10 according to the first embodiment in that it includes a heat dissipation member 40D and an insulating member 59. The other configuration of the heat dissipation structure 10D is the same as that of the heat dissipation structure 10, and a description of similar parts will be omitted.
　放熱構造１０Ｄは、放熱部材４０Ｄおよび絶縁性部材５９を備える。放熱部材４０Ｄは、第１の実施形態に係る放熱部材４０に対して、平板４１に形成された貫通孔４１９を有する点で異なる。放熱部材４０Ｄの他の構成は、放熱部材４０と同様であり、同様の箇所の説明は省略する。 The heat dissipation structure 10D includes a heat dissipation member 40D and an insulating member 59. The heat dissipation member 40D differs from the heat dissipation member 40 according to the first embodiment in that it has a through hole 419 formed in the flat plate 41. The rest of the configuration of the heat dissipation member 40D is the same as that of the heat dissipation member 40, and a description of similar parts will be omitted.
　貫通孔４１９は、平板４１を厚み方向に貫通する。貫通孔４１９は、平板４１に対して１つ形成される場合と、平板４１に対して複数形成される場合とがある。貫通孔４１９が１つの場合、平板４１を平面視して、中心と異なる位置に形成される。貫通孔４１９が複数の場合、平板４１を平面視して、非対称な位置に形成される。これらにより、貫通孔４１９は、平板４１の方向性や形状、言い換えれば、放熱部材４０Ｄの方向性や形状を示すものとなる。これにより、放熱部材４０Ｄは、表面実装技術によって、回路基板３０に容易に且つ高精度な位置で実装される。 The through hole 419 penetrates the flat plate 41 in the thickness direction. There may be one through hole 419 formed in the flat plate 41, or multiple through holes 419 may be formed in the flat plate 41. When there is one through hole 419, it is formed at a position different from the center when the flat plate 41 is viewed in a plan view. When there are multiple through holes 419, they are formed at asymmetric positions when the flat plate 41 is viewed in a plan view. As a result, the through hole 419 indicates the directionality and shape of the flat plate 41, in other words, the directionality and shape of the heat dissipation member 40D. As a result, the heat dissipation member 40D can be easily mounted on the circuit board 30 at a highly accurate position using surface mounting technology.
　絶縁性部材５９は、回路基板３０の第２面３０２と平板４１との間に充填される。絶縁性部材５９は、充填時には可撓性を有し、加熱等によって固化する。絶縁性部材５９は、空気よりも熱伝導性が高い材料からなり、例えば、絶縁性樹脂からなる。ただし、絶縁性部材５９は、それぞれが絶縁シールドされた複数の金属小球を混ぜ込んだ絶縁性樹脂で構成することも可能である。それぞれが絶縁シールドされた複数の金属小球を備えることで、絶縁性部材５９の熱伝導性を向上できる。 The insulating member 59 is filled between the second surface 302 of the circuit board 30 and the flat plate 41. The insulating member 59 is flexible when filled, and is solidified by heating or the like. The insulating member 59 is made of a material with higher thermal conductivity than air, for example, insulating resin. However, the insulating member 59 can also be made of insulating resin mixed with multiple small metal balls, each of which is insulated and shielded. By providing multiple small metal balls, each of which is insulated and shielded, the thermal conductivity of the insulating member 59 can be improved.
　絶縁性部材５９を備えることで、回路基板３０の熱は、複数の足ピン４２のみでなく、絶縁性部材５９を通じて、放熱部材４０Ｄの平板４１に伝導する。これにより、放熱構造１０Ｄは、さらに高い放熱性を実現できる。 By providing the insulating member 59, the heat of the circuit board 30 is conducted to the flat plate 41 of the heat dissipation member 40D not only through the multiple foot pins 42 but also through the insulating member 59. This allows the heat dissipation structure 10D to achieve even higher heat dissipation performance.
　また、平板４１が貫通孔４１９を有するので、充填時に流動性を有する絶縁性部材５９を、貫通孔４１９から平板４１と回路基板３０との間に、容易に供給できる。 In addition, since the flat plate 41 has a through hole 419, the insulating material 59, which has fluidity when filled, can be easily supplied between the flat plate 41 and the circuit board 30 through the through hole 419.
　なお、上述の実施形態では、放熱構造は、ヒートパイプ７１、ファン７２、および、放熱フィン７３を備えているが、ファン７２を省略する態様、ファン７２と放熱フィン７３とを省略する態様、ヒートパイプ７１、ファン７２、および、放熱フィン７３を省略する態様も可能である。ただし、これらを備えることで、高い放熱性を実電できるので、これらは備えた方が好ましい。 In the above embodiment, the heat dissipation structure includes the heat pipe 71, the fan 72, and the heat dissipation fins 73, but it is also possible to omit the fan 72, omit the fan 72 and the heat dissipation fins 73, or omit the heat pipe 71, the fan 72, and the heat dissipation fins 73. However, by providing these, high heat dissipation can be realized, so it is preferable to provide these.
　＜１＞　第１面と第２面とを有し、発熱源のＩＣが前記第１面に実装された回路基板と、
　前記第２面に近接して対向する第３面を有する筐体と、
　前記第２面に実装され、高い熱伝導性を有する放熱部材と、
　を備え、
　前記放熱部材は、
　　所定面積を有する平板と、
　　前記平板に接続する棒状からなり、前記第２面に実装される複数の足ピンと、
　を備え、
　前記回路基板は、基準電位に接続するためのグランド電極を備え、
　前記複数の足ピンは、前記グランド電極に接続され、
　前記ＩＣは、それぞれが前記グランド電極に接続され、前記回路基板の平面視において中央側に配置される第１グランド端子と外端側に配置される第２グランド端子とを備え、
　前記複数の足ピンの少なくとも１つは、前記ＩＣの中央から外端に向かう方向において、前記第１グランド端子と前記第２グランド端子との間に配置される、放熱構造。 <1> A circuit board having a first surface and a second surface, and an IC that is a heat source is mounted on the first surface;
a housing having a third surface adjacent to and facing the second surface;
a heat dissipation member mounted on the second surface and having high thermal conductivity;
Equipped with
The heat dissipation member is
A flat plate having a predetermined area;
a plurality of foot pins each having a rod shape connected to the flat plate and mounted on the second surface;
Equipped with
the circuit board includes a ground electrode for connection to a reference potential;
the plurality of foot pins are connected to the ground electrode;
the IC is connected to the ground electrode and includes a first ground terminal disposed on a central side in a plan view of the circuit board and a second ground terminal disposed on an outer end side;
A heat dissipation structure, wherein at least one of the plurality of foot pins is disposed between the first ground terminal and the second ground terminal in a direction from a center toward an outer end of the IC.
　＜２＞　前記ＩＣに電気的に接続される複数の実装型電子部品を備え、
　前記複数の実装型電子部品は、前記平面視において、前記回路基板の前記第２面における前記ＩＣに重なる位置に実装されており、
　前記複数の足ピンは、前記複数の実装型電子部品の間に、前記複数の実装型電子部品から離して配置され、
　前記平板は、前記第２面に対して前記複数の実装型電子部品よりも離れた位置に配置される、＜１＞に記載の放熱構造。 <2> A plurality of mounted electronic components electrically connected to the IC,
the plurality of mount-type electronic components are mounted on the second surface of the circuit board at positions overlapping the IC in the plan view,
the plurality of foot pins are disposed between the plurality of mount-type electronic components and spaced apart from the plurality of mount-type electronic components;
The heat dissipation structure according to <1>, wherein the flat plate is disposed at a position farther away from the second surface than the plurality of mounted electronic components.
　＜３＞　前記放熱部材の前記平板は、前記筐体の前記第３面に対して直接的または間接的に面で接している、＜１＞または＜２＞に記載の放熱構造。 <3> A heat dissipation structure as described in <1> or <2>, in which the flat plate of the heat dissipation member is in direct or indirect surface contact with the third surface of the housing.
　＜４＞　押圧によって変形可能な放熱シートを備え、
　前記平板は、前記放熱シートを介して前記第３面に接する、＜３＞に記載の放熱構造。 <4> A heat dissipation sheet that can be deformed by pressure is provided,
The heat dissipation structure described in <3>, wherein the flat plate contacts the third surface via the heat dissipation sheet.
　＜５＞　平板状のベーパチャンバを備え、
　前記ベーパチャンバの平面面積は、前記平板の平面面積よりも大きく、
　前記ベーパチャンバは、前記平板と前記第３面との間に配置される、＜３＞に記載の放熱構造。 <5> A flat vapor chamber is provided,
The planar area of the vapor chamber is larger than the planar area of the flat plate,
The heat dissipation structure described in <3>, wherein the vapor chamber is disposed between the flat plate and the third surface.
　＜６＞　前記放熱部材は、銅または銅合金からなる、＜１＞乃至＜５＞のいずれかに記載の放熱構造。 <6> A heat dissipation structure according to any one of <1> to <5>, in which the heat dissipation member is made of copper or a copper alloy.
　＜７＞　前記複数の足ピンは、前記実装型電子部品よりも高い、＜２＞に記載の放熱構造。 <7> The heat dissipation structure described in <2>, in which the multiple foot pins are higher than the mounted electronic component.
　＜８＞　前記平板の面積は、前記ＩＣの平面面積以下である、＜１＞乃至＜７＞のいずれかに記載の放熱構造。 <8> A heat dissipation structure according to any one of <1> to <7>, in which the area of the flat plate is equal to or smaller than the planar area of the IC.
　＜９＞　ヒートパイプを備え、
　前記ヒートパイプは、
　　前記ＩＣにおける前記回路基板と反対側の面に直接的または間接的に接しており、
　　前記第１面に平行な方向に広がる形状である、
　＜１＞乃至＜８＞のいずれかに記載の放熱構造。 <9> Equipped with a heat pipe,
The heat pipe is
the IC is in direct or indirect contact with a surface of the IC opposite to the circuit board;
A shape extending in a direction parallel to the first surface.
<9> The heat dissipation structure according to any one of <1> to <8>.
１０、１０Ａ、１０Ｂ、１０Ｃ、１０Ｄ：放熱構造
２１：ＩＣ
２２：実装型電子部品
３０：回路基板
３１：信号用電極
３２Ｇ：グランド電極
３３ＶＧ、３４ＶＧ：グランド用ビア電極
４０、４０Ｄ：放熱部材
４１：平板
４２：足ピン
５１、５１Ｂ、５１Ｃ：放熱シート
５２：放熱シート
５９：絶縁性部材
６０：放熱プレート
７１：ヒートパイプ
７２：ファン
７３：放熱フィン
８０：ベーパチャンバ
９０：筐体
９１：筐体主板
９２：支持体
２１０：ＩＣ本体
２１１：配線基板
２１３Ｇｉ、２１３Ｇｉ１：第１グランド端子
２１３Ｇｏ、２１３Ｇｏ１：第２グランド端子
２１３Ｎ：信号用端子
３０１：第１面
３０２：第２面
４１１、４１２：主面
４１９：貫通孔
９１１、９１２：主面 10, 10A, 10B, 10C, 10D: Heat dissipation structure 21: IC
22: Mounted electronic component 30: Circuit board 31: Signal electrode 32G: Ground electrodes 33VG, 34VG: Ground via electrodes 40, 40D: Heat dissipation member 41: Flat plate 42: Foot pins 51, 51B, 51C: Heat dissipation sheet 52: Heat dissipation sheet 59: insulating member 60: heat dissipation plate 71: heat pipe 72: fan 73: heat dissipation fin 80: vapor chamber 90: housing 91: housing main board 92: support 210: IC body 211: wiring boards 213Gi, 213Gi1 : First ground terminal 213Go, 213Go1: Second ground terminal 213N: Signal terminal 301: First surface 302: Second surface 411, 412: Main surface 419: Through holes 911, 912: Main surface

Claims (9)

  1. 　第１面と第２面とを有し、発熱源のＩＣが前記第１面に実装された回路基板と、
    　前記第２面に近接して対向する第３面を有する筐体と、
    　前記第２面に実装され、高い熱伝導性を有する放熱部材と、
    　を備え、
    　前記放熱部材は、
    　　所定面積を有する平板と、
    　　前記平板に接続する棒状からなり、前記第２面に実装される複数の足ピンと、
    　を備え、
    　前記回路基板は、基準電位に接続するためのグランド電極を備え、
    　前記複数の足ピンは、前記グランド電極に接続され、
    　前記ＩＣは、それぞれが前記グランド電極に接続され、前記回路基板の平面視において中央側に配置される第１グランド端子と外端側に配置される第２グランド端子とを備え、
    　前記複数の足ピンの少なくとも１つは、前記ＩＣの中央から外端に向かう方向において、前記第１グランド端子と前記第２グランド端子との間に配置される、
    　放熱構造。     a circuit board having a first surface and a second surface, the circuit board having an IC as a heat source mounted on the first surface;
    a housing having a third surface adjacent to and facing the second surface;
    a heat dissipation member mounted on the second surface and having high thermal conductivity;
    Equipped with
    The heat dissipation member is
    A flat plate having a predetermined area;
    a plurality of foot pins each having a rod shape connected to the flat plate and mounted on the second surface;
    Equipped with
    the circuit board includes a ground electrode for connection to a reference potential;
    the plurality of foot pins are connected to the ground electrode;
    the IC is connected to the ground electrode and includes a first ground terminal disposed on a central side in a plan view of the circuit board and a second ground terminal disposed on an outer end side;
    At least one of the plurality of foot pins is disposed between the first ground terminal and the second ground terminal in a direction from a center of the IC toward an outer end thereof.
    Heat dissipation structure.
  2. 　前記ＩＣに電気的に接続される複数の実装型電子部品を備え、
    　前記複数の実装型電子部品は、前記平面視において、前記回路基板の前記第２面における前記ＩＣに重なる位置に実装されており、
    　前記複数の足ピンは、前記複数の実装型電子部品の間に、前記複数の実装型電子部品から離して配置され、
    　前記平板は、前記第２面に対して前記複数の実装型電子部品よりも離れた位置に配置される、
    　請求項１に記載の放熱構造。     a plurality of mounted electronic components electrically connected to the IC;
    the plurality of mount-type electronic components are mounted on the second surface of the circuit board at positions overlapping the IC in the plan view,
    the plurality of foot pins are disposed between the plurality of mount-type electronic components and spaced apart from the plurality of mount-type electronic components;
    the flat plate is disposed at a position farther away from the second surface than the plurality of mount-type electronic components.
    The heat dissipation structure according to claim 1 .
  3. 　前記放熱部材の前記平板は、前記筐体の前記第３面に対して直接的または間接的に面で接している、
    　請求項１または請求項２に記載の放熱構造。     The flat plate of the heat dissipation member is in direct or indirect surface contact with the third surface of the housing.
    The heat dissipation structure according to claim 1 or 2.
  4. 　押圧によって変形可能な放熱シートを備え、
    　前記平板は、前記放熱シートを介して前記第３面に接する、
    　請求項３に記載の放熱構造。     A heat dissipation sheet that can be deformed by pressure is provided,
    The flat plate contacts the third surface via the heat dissipation sheet.
    The heat dissipation structure according to claim 3 .
  5. 　平板状のベーパチャンバを備え、
    　前記ベーパチャンバの平面面積は、前記平板の平面面積よりも大きく、
    　前記ベーパチャンバは、前記平板と前記第３面との間に配置される、
    　請求項３に記載の放熱構造。     A flat vapor chamber is provided.
    The planar area of the vapor chamber is larger than the planar area of the flat plate,
    the vapor chamber is disposed between the flat plate and the third surface;
    The heat dissipation structure according to claim 3 .
  6. 　前記放熱部材は、銅または銅合金からなる、
    　請求項１乃至請求項５のいずれかに記載の放熱構造。     The heat dissipation member is made of copper or a copper alloy.
    The heat dissipation structure according to any one of claims 1 to 5.
  7. 　前記複数の足ピンは、前記実装型電子部品よりも高い、
    　請求項２に記載の放熱構造。     The plurality of foot pins are higher than the mount-type electronic component.
    The heat dissipation structure according to claim 2 .
  8. 　前記平板の面積は、前記ＩＣの平面面積以下である、
    　請求項１乃至請求項７のいずれかに記載の放熱構造。     The area of the flat plate is equal to or smaller than the planar area of the IC.
    The heat dissipation structure according to any one of claims 1 to 7.
  9. 　ヒートパイプを備え、
    　前記ヒートパイプは、
    　　前記ＩＣにおける前記回路基板と反対側の面に直接的または間接的に接しており、
    　　前記第１面に平行な方向に広がる形状である、
    　請求項１乃至請求項８のいずれかに記載の放熱構造。     Equipped with heat pipes,
    The heat pipe is
    the IC is in direct or indirect contact with a surface of the IC opposite to the circuit board;
    A shape extending in a direction parallel to the first surface.
    The heat dissipation structure according to any one of claims 1 to 8.
PCT/JP2024/012182 2023-03-31 2024-03-27 Heat dissipation structure WO2024204309A1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237353A (en) * 2000-02-21 2001-08-31 Fujitsu Denso Ltd Heat radiating structure of electronic part and method of manufacturing electronic part
JP2004349345A (en) * 2003-05-20 2004-12-09 Denso Corp Electronic control device
US20070081311A1 (en) * 2005-09-29 2007-04-12 Edward Iwamiya EMI shielding techniques using multiple EMI shields which share the same circuit board holes
US20080218971A1 (en) * 2007-03-05 2008-09-11 International Business Machines Corporation Method and structure to improve thermal dissipation from semiconductor devices
JP2012033549A (en) * 2010-07-28 2012-02-16 Fdk Twicell Co Ltd Circuit board device
CN103025125A (en) * 2011-09-27 2013-04-03 升业科技股份有限公司 Heat radiation structure and back board used by heat radiation structure
WO2021010173A1 (en) * 2019-07-12 2021-01-21 ソニーセミコンダクタソリューションズ株式会社 Wiring module and imaging device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237353A (en) * 2000-02-21 2001-08-31 Fujitsu Denso Ltd Heat radiating structure of electronic part and method of manufacturing electronic part
JP2004349345A (en) * 2003-05-20 2004-12-09 Denso Corp Electronic control device
US20070081311A1 (en) * 2005-09-29 2007-04-12 Edward Iwamiya EMI shielding techniques using multiple EMI shields which share the same circuit board holes
US20080218971A1 (en) * 2007-03-05 2008-09-11 International Business Machines Corporation Method and structure to improve thermal dissipation from semiconductor devices
JP2012033549A (en) * 2010-07-28 2012-02-16 Fdk Twicell Co Ltd Circuit board device
CN103025125A (en) * 2011-09-27 2013-04-03 升业科技股份有限公司 Heat radiation structure and back board used by heat radiation structure
WO2021010173A1 (en) * 2019-07-12 2021-01-21 ソニーセミコンダクタソリューションズ株式会社 Wiring module and imaging device

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