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WO2024124933A1 - Elliptical bessel cutting head device - Google Patents

Elliptical bessel cutting head device Download PDF

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Publication number
WO2024124933A1
WO2024124933A1 PCT/CN2023/113336 CN2023113336W WO2024124933A1 WO 2024124933 A1 WO2024124933 A1 WO 2024124933A1 CN 2023113336 W CN2023113336 W CN 2023113336W WO 2024124933 A1 WO2024124933 A1 WO 2024124933A1
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WO
WIPO (PCT)
Prior art keywords
cutting head
elliptical
bessel
head device
diffractive
Prior art date
Application number
PCT/CN2023/113336
Other languages
French (fr)
Chinese (zh)
Inventor
赵裕兴
王承伟
Original Assignee
苏州德龙激光股份有限公司
江阴德力激光设备有限公司
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Publication date
Application filed by 苏州德龙激光股份有限公司, 江阴德力激光设备有限公司 filed Critical 苏州德龙激光股份有限公司
Publication of WO2024124933A1 publication Critical patent/WO2024124933A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the invention relates to an elliptical Bessel cutting head device, which is used for shaping ultrashort pulse laser from Gaussian distribution into elliptical Bessel distribution, and belongs to the field of laser processing.
  • Patent publication number CN212587848U discloses a laser device that uses a light-blocking bar and other modulation devices to obtain an elliptical cutting beam perpendicular to the modulation device, and controls the cutting direction by axially rotating the modulation device; however, the light-blocking bar blocks part of the beam, reducing the processing energy.
  • the present invention adopts an unobstructed, high-transmittance, elliptically distributed diffractive aconic lens, combined with a focusing lens to obtain an elliptical Bessel light beam, guides cracks along the major axis of the ellipse in sapphire and glass, and rotates the cutting head along the tangent angle of the pattern to achieve processing of any pattern.
  • the purpose of the present invention is to overcome the shortcomings of the prior art and provide an elliptical Bessel cutting head device.
  • the elliptical Bessel cutting head device is characterized in that: a direct drive motor is connected to a two-dimensional translation stage through an adapter, and the two-dimensional translation stage fixes the cutting head through an adapter block, which can drive the cutting head to rotate and move in two dimensions; the cutting head includes a diffraction conical lens and a focusing lens arranged along the optical path, which shapes a Gaussian distributed laser beam into an elliptical Bessel distributed beam.
  • the surface of the diffractive axicon element has a microstructure
  • the microstructure is an annular grating structure
  • ⁇ is the laser wavelength and n is the material refractive index
  • the cone angle ⁇ ranges from 0.5° to 20°, and the corresponding vertex angle ranges from 179° to 140°.
  • the microstructure is a G-order annular grating structure
  • G is an integer
  • the width of the G steps in each period is d/G
  • the relative phases of the G steps in each period constitute an arithmetic sequence with a first term of 0, a last term of 2(G-1) ⁇ /G and a tolerance of 2 ⁇ /G.
  • the microstructure is a G-order annular grating structure
  • G is an integer
  • the relative depths of the G steps in each period constitute an arithmetic progression with a first term of 0, a last term of (G-1) ⁇ /[G(n-1)] and a tolerance of ⁇ /[G(n-1)]
  • n is the refractive index of the material.
  • the material of the diffractive axicon is fused quartz glass, BK7 glass or S-LAH64 glass.
  • the refractive indices of fused quartz glass, BK7 glass and S-LAH64 glass at 1064 nm are 1.4496, 1.5066 and 1.7688 respectively.
  • the diffractive axicon is coated
  • Ellipse equation the major and minor radii are a and ell ⁇ a respectively, ell represents the roundness of the ellipse, 0% ⁇ ell ⁇ 100%;
  • the radius of the major axis at coordinate (x,y) is a.
  • R represents the radius of the diffractive aconic lens element, and the coordinates x and y are both composed of an arithmetic progression with -(M-1) ⁇ /2 as the first term, ⁇ as the tolerance, and (M-1) ⁇ /2 as the last term;
  • the phase is congruent to 2 ⁇ .
  • Each cycle width d is divided into G segments according to the order G.
  • the depth of the region in each cycle constitutes an arithmetic progression with the first term being 0, the last term being (G-1) ⁇ /[G(n-1)] and the tolerance being ⁇ /[G(n-1)].
  • the phase diagram is split into log 2 G sub-diagrams according to the order.
  • the 2nd, 4th, 8th and 16th orders are 1, 2, 3 and 4 times of coating, photolithography, etching and cleaning processes respectively.
  • the present invention has significant advantages and beneficial effects, which are specifically embodied in the following aspects:
  • the present invention adopts an elliptically distributed diffractive axicon lens in combination with a focusing lens to shape the Gaussian distributed ultrashort pulse laser into an elliptical Bessel beam, and guides cracks along the major axis of the ellipse in sapphire and glass; the cutting head is rotated along the tangent angle of the pattern to realize the processing of any pattern, avoiding the oblique cracks caused by ordinary Bessel beam processing;
  • Modulation devices such as collimating lenses and light-blocking strips are eliminated, which improves laser transmission efficiency and has a more compact structure;
  • the diffractive axon has high transmission efficiency and the quality is repeatable and controllable.
  • Figure 1 A schematic diagram of the structure of the device of the present invention
  • FIG. 1 Schematic diagram of the cutting head
  • Figure 3 Phase diagram of an elliptical diffractive axicon with 100% circularity
  • Figure 4 Phase diagram of an elliptical diffractive axicon with a circularity of 90%.
  • the elliptical Bessel cutting head device the direct drive motor (DiDi DD motor) 5 is connected to the two-dimensional translation stage 3 through the adapter 4, and the two-dimensional translation stage 3 fixes the cutting head 1 through the adapter block 2 and screws and top screws, which can drive the cutting head 1 to rotate and two-dimensionally translate;
  • the cutting head 1 includes a diffraction conical lens 12 and a focusing mirror 13 arranged along the optical path, which shapes the Gaussian distributed laser beam 11 into an elliptical Bessel distributed beam 14.
  • the wavelength ⁇ applicable to the diffraction axicon 12 is 1064nm, 1030nm, 532nm, and 515nm.
  • the light beam is a short pulse laser with a pulse width ranging from 0.1 to 100ps.
  • the elliptical Bessel beam guides cracks along the long axis of the ellipse in sapphire and glass.
  • the cutting head is rotated along the tangent angle of the pattern to achieve processing of any pattern.
  • the diffractive axicon 12 is made of fused quartz glass, BK7 glass or S-LAH64 glass.
  • the microstructure is processed on the surface of the diffractive axicon 12 element by using a phase modulator interference lithography device and an inductively coupled plasma etching device.
  • ⁇ is the laser wavelength and n is the refractive index of the material.
  • the refractive index is related to factors such as the material and wavelength.
  • the cone angle ⁇ ranges from 0.5° to 20°, and the corresponding vertex angle ranges from 179° to 140°.
  • the refractive indices of fused silica glass, BK7 glass and S-LAH64 glass at 1064nm are 1.4496, 1.5066 and 1.7688, respectively.
  • the annular grating structure of the diffractive axicon element is different at different orders.
  • the microstructure is G order
  • the annular grating structure, G is an integer
  • the width of the G steps in each period is d/G
  • the relative phases of the G steps in each period form an arithmetic progression with the first term 0, the last term 2(G-1) ⁇ /G, and a tolerance of 2 ⁇ /G.
  • the relative depths of the G steps in each period form an arithmetic progression with the first term 0, the last term (G-1) ⁇ /[G(n-1)], and a tolerance of ⁇ /[G(n-1)], n is the refractive index of the material; G ⁇ 2;
  • the diffractive axicon 12 is coated
  • Ellipse equation the major and minor radii are a and ell ⁇ a respectively, ell represents the roundness of the ellipse, 0% ⁇ ell ⁇ 100%;
  • the radius of the major axis at coordinate (x,y) is a.
  • R represents the radius of the diffractive aconic lens element
  • the coordinates x and y are both composed of an arithmetic progression with -(M-1) ⁇ /2 as the first term, ⁇ as the tolerance, and (M-1) ⁇ /2 as the last term;
  • the phase is congruent to 2 ⁇ .
  • Each cycle width d is divided into G segments according to the order G.
  • the depth of the region in each cycle consists of a first term of 0, a last term of (G-1) ⁇ /[G(n-1)] and a tolerance of
  • the phase diagram is split into log 2 G sub-diagrams according to the order.
  • the 2nd, 4th, 8th and 16th orders represent 1st, 2nd, 3rd and 4th coating, photolithography, etching and cleaning processes respectively.
  • a 10 ps laser beam 11 with Gaussian distribution passes through a diffractive axicon 12 and a focusing lens 13 and is shaped into an elliptical Bessel beam 14 .
  • the cone angle of 1°, ⁇ 1064nm wavelength, corresponds to a grating period of 135.6 ⁇ m.
  • a 4-order grating level is used, each pixel width is 33.9 ⁇ m, and the DOE pixels of 25.4mm and 1.27mm diameters are 749 ⁇ 749 and 37 ⁇ 37 respectively.
  • the DOE of 1.27mm diameter is used to describe it.
  • the calculation of the DOE of 25.4mm diameter is the same, and the calculation of the DOE of other cone angles is also the same.
  • the phase diagrams of the elliptical diffraction cone lens with roundness of 100% and 90% are shown in Figures 3 and 4. When the roundness is 100%, the phase diagram is centrosymmetric, with 4 periods in the x and y directions.
  • phase diagram is non-centrosymmetric, with 4 and 5 periods in the horizontal and vertical directions respectively. Points with the same phase form an ellipse, with 4 grayscales in each period, and the phases are 0, 2 ⁇ /4, 2 ⁇ /4, and 3 ⁇ /4, respectively.
  • Fused quartz is used as the material, and the corresponding step depths are 0, 592nm, 1183nm, and 1775nm, respectively.
  • phase image is etched and irradiated multiple times. Before each etching, the lens is cleaned with isopropyl alcohol and dried with N2. Then a chromium layer is deposited to prevent charge deposition from causing ion beam deviation, followed by deposition of positive photoresist.
  • Phase modulator interference lithography equipment for photoresist NanoCrystal irradiation, line width range 100nm to 10um, processing format 300mm ⁇ 300mm, speed 50-300mm/s, can quickly process mask on photoresist, pixel width 33.9 ⁇ m through multi-line irradiation processing.
  • ICP inductively coupled plasma
  • the etching gas is a mixture of trifluoromethane CHF3, argon Ar and oxygen O2, with flow rates of 200, 20 and 5sccm (standard milliliters per minute) respectively; after etching the glass, the chromium layer is removed with a solution.
  • the present invention adopts an elliptically distributed diffractive conical lens in combination with a focusing mirror to shape the Gaussian distributed ultrashort pulse laser into an elliptical Bessel beam, and guides cracks along the major axis of the ellipse in sapphire and glass; the cutting head is rotated along the tangent angle of the pattern to realize the processing of any pattern, avoiding the oblique cracks caused by ordinary Bessel beam processing.
  • Modulation devices such as collimating lenses and light-blocking strips are eliminated, which improves laser transmission efficiency and makes the structure more compact; the diffraction conical lens has high transmission efficiency and repeatable and controllable quality.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)

Abstract

An elliptical Bessel cutting head device. A direct drive motor (5) is connected to a two-dimensional translation stage (3) by means of an adapter (4), and a cutting head (1) is fixed to the two-dimensional translation stage by means of an adapter block, so that the cutting head is driven to rotate and perform a two-dimensional translational motion. The cutting head comprises a diffractive conical lens (12) and a focusing lens (13) which are arranged along an optical path, wherein a Gaussian distributed laser beam (11) is shaped into an elliptical Bessel distributed beam (14), a microstructure is provided on a surface of a diffractive conical lens element, and the microstructure is of an annular grating structure. In the device, the elliptically-distributed diffractive conical lens is combined with the focusing lens, thus shaping a Gaussian distributed ultra-short pulse laser into an elliptical Bessel beam, and inducing cracking in sapphire and in glass along the long-axis direction of an ellipse; any pattern can be machined by rotating the cutting head along the tangential angle of the pattern, and oblique cracks generated by common Bessel beam machining are avoided. The laser transmission efficiency is improved, and the structure is compact.

Description

椭圆贝塞尔切割头装置Elliptical Bessel cutting head device 技术领域Technical Field
本发明涉及一种椭圆贝塞尔切割头装置，用于将超短脉冲激光从高斯分布整形成椭圆贝塞尔分布，属于激光加工领域。The invention relates to an elliptical Bessel cutting head device, which is used for shaping ultrashort pulse laser from Gaussian distribution into elliptical Bessel distribution, and belongs to the field of laser processing.
背景技术Background technique
普通贝塞尔光束加工各向异性的蓝宝石，易产生斜裂纹。专利公开号CN212587848U公开了一种激光装置，采用挡光条等调制器件，获得与调制器件相垂直的椭圆形切割光束，通过轴向旋转调制器件，控制切割方向；但挡光条阻挡了部分光束，降低了加工能量。Ordinary Bessel beams are prone to produce oblique cracks when processing anisotropic sapphire. Patent publication number CN212587848U discloses a laser device that uses a light-blocking bar and other modulation devices to obtain an elliptical cutting beam perpendicular to the modulation device, and controls the cutting direction by axially rotating the modulation device; however, the light-blocking bar blocks part of the beam, reducing the processing energy.
本发明采用无阻挡、高透过率的椭圆分布的衍射式锥透镜，结合聚焦镜获得椭圆贝塞尔光束，在蓝宝石和玻璃中引导出沿椭圆长轴方向的裂纹，沿图案切线角度旋转切割头，实现任意图案的加工。The present invention adopts an unobstructed, high-transmittance, elliptically distributed diffractive aconic lens, combined with a focusing lens to obtain an elliptical Bessel light beam, guides cracks along the major axis of the ellipse in sapphire and glass, and rotates the cutting head along the tangent angle of the pattern to achieve processing of any pattern.
发明内容Summary of the invention
本发明的目的是克服现有技术存在的不足，提供一种椭圆贝塞尔切割头装置。The purpose of the present invention is to overcome the shortcomings of the prior art and provide an elliptical Bessel cutting head device.
本发明的目的通过以下技术方案来实现：The purpose of the present invention is achieved through the following technical solutions:
椭圆贝塞尔切割头装置，特点是：直接驱动电机通过转接件连接二维平移台，二维平移台通过转接块固定切割头，可驱动切割头旋转和二维平移运动；所述切割头包含沿光路设置的衍射式锥透镜和聚焦镜，将高斯分布的激光束整形为椭圆贝塞尔分布光束。 The elliptical Bessel cutting head device is characterized in that: a direct drive motor is connected to a two-dimensional translation stage through an adapter, and the two-dimensional translation stage fixes the cutting head through an adapter block, which can drive the cutting head to rotate and move in two dimensions; the cutting head includes a diffraction conical lens and a focusing lens arranged along the optical path, which shapes a Gaussian distributed laser beam into an elliptical Bessel distributed beam.
进一步地，上述的椭圆贝塞尔切割头装置，其中，衍射式锥透镜元件表面具有微结构，微结构呈环形光栅结构，光栅周期d与锥角γ的关系式为：
d＝λ/sin[γ(n-1)]Furthermore, in the above-mentioned elliptical Bessel cutting head device, the surface of the diffractive axicon element has a microstructure, the microstructure is an annular grating structure, and the relationship between the grating period d and the cone angle γ is:
d = λ/sin[γ(n-1)]
式中，λ为激光波长，n为材料折射率；Where λ is the laser wavelength and n is the material refractive index;
锥角γ范围是0.5°～20°，对应的顶角范围是179°～140°。The cone angle γ ranges from 0.5° to 20°, and the corresponding vertex angle ranges from 179° to 140°.
进一步地，上述的椭圆贝塞尔切割头装置，其中，微结构为G阶的环形光栅结构，G为整数，每个周期内G个台阶的宽度均为d/G，每个周期内G个台阶相对相位依次构成首项0、末项2(G-1)π/G和公差为2π/G的等差数列。Furthermore, in the above-mentioned elliptical Bessel cutting head device, the microstructure is a G-order annular grating structure, G is an integer, the width of the G steps in each period is d/G, and the relative phases of the G steps in each period constitute an arithmetic sequence with a first term of 0, a last term of 2(G-1)π/G and a tolerance of 2π/G.
进一步地，上述的椭圆贝塞尔切割头装置，其中，微结构为G阶的环形光栅结构，G为整数，每个周期内G个台阶相对深度构成首项为0、末项为(G-1)λ/[G(n-1)]和公差为λ/[G(n-1)]的等差数列，n为材料折射率。Furthermore, in the above-mentioned elliptical Bessel cutting head device, the microstructure is a G-order annular grating structure, G is an integer, and the relative depths of the G steps in each period constitute an arithmetic progression with a first term of 0, a last term of (G-1)λ/[G(n-1)] and a tolerance of λ/[G(n-1)], and n is the refractive index of the material.
进一步地，上述的椭圆贝塞尔切割头装置，其中，衍射式锥透镜的材质为熔融石英玻璃、BK7玻璃或S-LAH64玻璃，室温下，熔融石英玻璃、BK7玻璃和S-LAH64玻璃在1064nm处的折射率分别为1.4496、1.5066、1.7688。Furthermore, in the above-mentioned elliptical Bessel cutting head device, the material of the diffractive axicon is fused quartz glass, BK7 glass or S-LAH64 glass. At room temperature, the refractive indices of fused quartz glass, BK7 glass and S-LAH64 glass at 1064 nm are 1.4496, 1.5066 and 1.7688 respectively.
进一步地，上述的椭圆贝塞尔切割头装置，其中，G≥2。Furthermore, in the above-mentioned elliptical Bessel cutting head device, G≥2.
进一步地，上述的椭圆贝塞尔切割头装置，其中，衍射式锥透镜上镀膜；Further, in the above-mentioned elliptical Bessel cutting head device, the diffractive axicon is coated;
椭圆方程，长轴和短轴半径分别为a和ell×a，ell表示椭圆的圆度，0％<ell≤100％；
Ellipse equation, the major and minor radii are a and ell×a respectively, ell represents the roundness of the ellipse, 0%<ell≤100%;
坐标(x,y)处的长轴半径a，
The radius of the major axis at coordinate (x,y) is a.
坐标x和y的步长Δ＝d/G，G表示阶数，矩阵长度M为：
The step size of the coordinates x and y is Δ = d/G, G represents the order, and the matrix length M is:
R表示衍射式锥透镜元件半径，坐标x和y均由-(M-1)Δ/2为首项、Δ为公差、(M-1)Δ/2为末项的等差数列构成；R represents the radius of the diffractive aconic lens element, and the coordinates x and y are both composed of an arithmetic progression with -(M-1)Δ/2 as the first term, Δ as the tolerance, and (M-1)Δ/2 as the last term;
椭圆贝塞尔相位Φ，

a∈[0,R]；Elliptical Bessel phase Φ,

a∈[0,R];
转换为直角坐标系，
Convert to rectangular coordinate system,
相位对2π同余，每个周期宽度d内，根据阶数G分为G段区域，每个周期内区域深度构成首项为0、末项为(G-1)λ/[G(n-1)]和公差为λ/[G(n-1)]的等差数列；相位图按阶数拆分为log2G副图，2、4、8、16阶分别1次、2次、3次和4次镀膜、光刻、刻蚀和清洗制程。The phase is congruent to 2π. Each cycle width d is divided into G segments according to the order G. The depth of the region in each cycle constitutes an arithmetic progression with the first term being 0, the last term being (G-1)λ/[G(n-1)] and the tolerance being λ/[G(n-1)]. The phase diagram is split into log 2 G sub-diagrams according to the order. The 2nd, 4th, 8th and 16th orders are 1, 2, 3 and 4 times of coating, photolithography, etching and cleaning processes respectively.
本发明与现有技术相比具有显著的优点和有益效果，具体体现在以下方面：Compared with the prior art, the present invention has significant advantages and beneficial effects, which are specifically embodied in the following aspects:
①本发明采用椭圆分布的衍射式锥透镜，结合聚焦镜，将高斯分布的超短脉冲激光整形为椭圆贝塞尔光束，在蓝宝石和玻璃引导出沿椭圆长轴方向的裂纹；沿图案切线角度旋转切割头，实现任意图案的加工，避免普通贝塞尔光束加工产生的斜裂纹； ① The present invention adopts an elliptically distributed diffractive axicon lens in combination with a focusing lens to shape the Gaussian distributed ultrashort pulse laser into an elliptical Bessel beam, and guides cracks along the major axis of the ellipse in sapphire and glass; the cutting head is rotated along the tangent angle of the pattern to realize the processing of any pattern, avoiding the oblique cracks caused by ordinary Bessel beam processing;
②省去了准直透镜和挡光条等调制器件，提高了激光传输效率、结构较为紧凑；② Modulation devices such as collimating lenses and light-blocking strips are eliminated, which improves laser transmission efficiency and has a more compact structure;
③衍射式锥透镜传输效率高，质量重复可控。③The diffractive axon has high transmission efficiency and the quality is repeatable and controllable.
本发明的其他特征和优点将在随后的说明书阐述，并且，部分地从说明书中变得显而易见，或者通过实施本发明具体实施方式了解。本发明的目的和其他优点可通过在所写的说明书以及附图中所特别指出的结构来实现和获得。Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or be understood by practicing the specific embodiments of the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the drawings.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了更清楚地说明本发明实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，应当理解，以下附图仅示出了本发明的某些实施例，因此不应被看作是对范围的限定，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他相关的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.
图1：本发明装置的结构示意图；Figure 1: A schematic diagram of the structure of the device of the present invention;
图2：切割头的原理示意图；Figure 2: Schematic diagram of the cutting head;
图3：圆度100％的椭圆衍射锥透镜的相位图；Figure 3: Phase diagram of an elliptical diffractive axicon with 100% circularity;
图4：圆度90％的椭圆衍射锥透镜的相位图。Figure 4: Phase diagram of an elliptical diffractive axicon with a circularity of 90%.
具体实施方式Detailed ways
下面将结合本发明实施例中附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。通常在此处附图中描述和示出的本发明实施例的组件可以以各种不同的配置来布置和设计。因此，以下对在附图中提供的本发明的实施例的详细描述并非旨在限制要求保护的本发明的范围，而是仅仅表示本发明的选定实施例。基于本发明的实施例，本领域技术人员在没 有做出创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, those skilled in the art will be able to understand the present invention in detail without any prior art knowledge. All other embodiments obtained on the premise of creative work shall fall within the scope of protection of the present invention.
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。同时，在本发明的描述中，方位术语和次序术语等仅用于区分描述，而不能理解为指示或暗示相对重要性。It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. At the same time, in the description of the present invention, directional terms and order terms are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
如图1所示，椭圆贝塞尔切割头装置，直接驱动电机(滴滴DD马达)5通过转接件4连接二维平移台3，二维平移台3通过转接块2以及螺钉和顶丝固定切割头1，可驱动切割头1旋转和二维平移运动；切割头1包含沿光路设置的衍射式锥透镜12和聚焦镜13，将高斯分布的激光束11整形为椭圆贝塞尔分布光束14。As shown in Figure 1, the elliptical Bessel cutting head device, the direct drive motor (DiDi DD motor) 5 is connected to the two-dimensional translation stage 3 through the adapter 4, and the two-dimensional translation stage 3 fixes the cutting head 1 through the adapter block 2 and screws and top screws, which can drive the cutting head 1 to rotate and two-dimensionally translate; the cutting head 1 includes a diffraction conical lens 12 and a focusing mirror 13 arranged along the optical path, which shapes the Gaussian distributed laser beam 11 into an elliptical Bessel distributed beam 14.
衍射式锥透镜12适用于的波长λ是1064nm、1030nm、532nm、515nm。光束为短脉冲激光，脉宽范围0.1～100ps。The wavelength λ applicable to the diffraction axicon 12 is 1064nm, 1030nm, 532nm, and 515nm. The light beam is a short pulse laser with a pulse width ranging from 0.1 to 100ps.
椭圆贝塞尔光束，在蓝宝石和玻璃引导出沿椭圆长轴方向的裂纹。沿图案切线角度旋转切割头，实现任意图案的加工。The elliptical Bessel beam guides cracks along the long axis of the ellipse in sapphire and glass. The cutting head is rotated along the tangent angle of the pattern to achieve processing of any pattern.
衍射式锥透镜12的材质为熔融石英玻璃、BK7玻璃或S-LAH64玻璃。The diffractive axicon 12 is made of fused quartz glass, BK7 glass or S-LAH64 glass.
采用相位调制器干涉光刻设备和感应耦合等离子体刻蚀设备，在衍射式锥透镜12元件表面上加工微结构。The microstructure is processed on the surface of the diffractive axicon 12 element by using a phase modulator interference lithography device and an inductively coupled plasma etching device.
微结构呈环形光栅结构，光栅周期d与锥角γ的关系式为：
d＝λ/sin[γ(n-1)]The microstructure is a ring grating structure, and the relationship between the grating period d and the cone angle γ is:
d = λ/sin[γ(n-1)]
式中，λ为激光波长，n为材料折射率；折射率与材料和波长等因素有关。Where λ is the laser wavelength and n is the refractive index of the material. The refractive index is related to factors such as the material and wavelength.
锥角γ范围是0.5°～20°，对应的顶角范围是179°～140°。The cone angle γ ranges from 0.5° to 20°, and the corresponding vertex angle ranges from 179° to 140°.
室温下，熔融石英玻璃、BK7玻璃和S-LAH64玻璃在1064nm处的折射率分别为1.4496、1.5066、1.7688。At room temperature, the refractive indices of fused silica glass, BK7 glass and S-LAH64 glass at 1064nm are 1.4496, 1.5066 and 1.7688, respectively.
不同阶数下，衍射式锥透镜元件的环形光栅结构不同。微结构为G阶 的环形光栅结构，G为整数，每个周期内G个台阶的宽度均为d/G，每个周期内G个台阶相对相位依次构成首项0、末项2(G-1)π/G和公差为2π/G的等差数列。每个周期内G个台阶相对深度构成首项为0、末项为(G-1)λ/[G(n-1)]和公差为λ/[G(n-1)]的等差数列，n为材料折射率；G≥2；The annular grating structure of the diffractive axicon element is different at different orders. The microstructure is G order The annular grating structure, G is an integer, the width of the G steps in each period is d/G, and the relative phases of the G steps in each period form an arithmetic progression with the first term 0, the last term 2(G-1)π/G, and a tolerance of 2π/G. The relative depths of the G steps in each period form an arithmetic progression with the first term 0, the last term (G-1)λ/[G(n-1)], and a tolerance of λ/[G(n-1)], n is the refractive index of the material; G≥2;
衍射式锥透镜12上镀膜；The diffractive axicon 12 is coated;
椭圆方程，长轴和短轴半径分别为a和ell×a，ell表示椭圆的圆度，0％<ell≤100％；
Ellipse equation, the major and minor radii are a and ell×a respectively, ell represents the roundness of the ellipse, 0%<ell≤100%;
坐标(x,y)处的长轴半径a，
The radius of the major axis at coordinate (x,y) is a.
坐标x和y的步长Δ＝d/G，G表示阶数，矩阵长度M为：
The step size of the coordinates x and y is Δ = d/G, G represents the order, and the matrix length M is:
式中R表示衍射式锥透镜元件半径，坐标x和y均由-(M-1)Δ/2为首项、Δ为公差、(M-1)Δ/2为末项的等差数列构成；Where R represents the radius of the diffractive aconic lens element, and the coordinates x and y are both composed of an arithmetic progression with -(M-1)Δ/2 as the first term, Δ as the tolerance, and (M-1)Δ/2 as the last term;
椭圆贝塞尔相位Φ，
Elliptical Bessel phase Φ,
a∈[0,R]；转换为直角坐标系，
a∈[0,R]; converted to rectangular coordinate system,
相位对2π同余，每个周期宽度d内，根据阶数G分为G段区域，每个周期内区域深度构成首项为0、末项为(G-1)λ/[G(n-1)]和公差为 λ/[G(n-1)]的等差数列；相位图按阶数拆分为log2G副图，2、4、8、16阶分别1次、2次、3次和4次镀膜、光刻、刻蚀和清洗制程。The phase is congruent to 2π. Each cycle width d is divided into G segments according to the order G. The depth of the region in each cycle consists of a first term of 0, a last term of (G-1)λ/[G(n-1)] and a tolerance of The phase diagram is split into log 2 G sub-diagrams according to the order. The 2nd, 4th, 8th and 16th orders represent 1st, 2nd, 3rd and 4th coating, photolithography, etching and cleaning processes respectively.
如图2所示，高斯分布的10ps激光束11经过衍射式锥透镜12和聚焦镜13，整形为椭圆贝塞尔光束14。As shown in FIG. 2 , a 10 ps laser beam 11 with Gaussian distribution passes through a diffractive axicon 12 and a focusing lens 13 and is shaped into an elliptical Bessel beam 14 .
1°的锥角，λ＝1064nm波长，对应的光栅周期为135.6μm。为显示方便，采用4阶的光栅水平，每个像素宽度33.9μm，直径25.4mm、1.27mm的DOE像素分别为749×749、37×37。为显示方便，采用直径1.27mm的DOE来描述，直径25.4mm的DOE计算相同，其他锥角的DOE计算也相同。圆度为100％和90％的椭圆衍射锥透镜的相位图如图3、图4，圆度为100％时相位图中心对称，x和y方向均为4个周期；圆度90％时相位图非中心对称，图中水平和竖直方向分别有4个和5个周期，相位相同的点构成椭圆，每个周期4个灰度，相位分别为0、2π/4、2π/4、3π/4，采用熔融石英作为材料，相应的台阶深度分别为0、592nm、1183nm、1775nm。The cone angle of 1°, λ = 1064nm wavelength, corresponds to a grating period of 135.6μm. For the convenience of display, a 4-order grating level is used, each pixel width is 33.9μm, and the DOE pixels of 25.4mm and 1.27mm diameters are 749×749 and 37×37 respectively. For the convenience of display, the DOE of 1.27mm diameter is used to describe it. The calculation of the DOE of 25.4mm diameter is the same, and the calculation of the DOE of other cone angles is also the same. The phase diagrams of the elliptical diffraction cone lens with roundness of 100% and 90% are shown in Figures 3 and 4. When the roundness is 100%, the phase diagram is centrosymmetric, with 4 periods in the x and y directions. When the roundness is 90%, the phase diagram is non-centrosymmetric, with 4 and 5 periods in the horizontal and vertical directions respectively. Points with the same phase form an ellipse, with 4 grayscales in each period, and the phases are 0, 2π/4, 2π/4, and 3π/4, respectively. Fused quartz is used as the material, and the corresponding step depths are 0, 592nm, 1183nm, and 1775nm, respectively.
相位图多次刻蚀辐照，每次刻蚀前镜片用异丙醇清洗并用N2干燥，然后沉积铬层以防电荷沉积导致离子束偏移，接着沉积正光刻胶。The phase image is etched and irradiated multiple times. Before each etching, the lens is cleaned with isopropyl alcohol and dried with N2. Then a chromium layer is deposited to prevent charge deposition from causing ion beam deviation, followed by deposition of positive photoresist.
光刻胶用相位调制器干涉光刻设备：NanoCrystal辐照，线宽范围100nm到10um、加工幅面300mm×300mm，速度50-300mm/s，可在光刻胶上快速加工掩膜版，像素宽度33.9μm通过多线辐照加工。采用ICP(inductively coupled plasma，感应耦合等离子体)装置进行离子束刻蚀，刻蚀气体采用三氟甲烷CHF3、氩气Ar和氧气O2的混合物，流量分别用200、20和5sccm(标况毫升每分)；刻蚀玻璃后用溶液去除铬层。Phase modulator interference lithography equipment for photoresist: NanoCrystal irradiation, line width range 100nm to 10um, processing format 300mm×300mm, speed 50-300mm/s, can quickly process mask on photoresist, pixel width 33.9μm through multi-line irradiation processing. ICP (inductively coupled plasma) device is used for ion beam etching, and the etching gas is a mixture of trifluoromethane CHF3, argon Ar and oxygen O2, with flow rates of 200, 20 and 5sccm (standard milliliters per minute) respectively; after etching the glass, the chromium layer is removed with a solution.
综上所述，本发明采用椭圆分布的衍射式锥透镜，结合聚焦镜，将高斯分布的超短脉冲激光整形为椭圆贝塞尔光束，在蓝宝石和玻璃引导出沿椭圆长轴方向的裂纹；沿图案切线角度旋转切割头，实现任意图案的加工，避免普通贝塞尔光束加工产生的斜裂纹。 In summary, the present invention adopts an elliptically distributed diffractive conical lens in combination with a focusing mirror to shape the Gaussian distributed ultrashort pulse laser into an elliptical Bessel beam, and guides cracks along the major axis of the ellipse in sapphire and glass; the cutting head is rotated along the tangent angle of the pattern to realize the processing of any pattern, avoiding the oblique cracks caused by ordinary Bessel beam processing.
省去了准直透镜和挡光条等调制器件，提高了激光传输效率、结构较为紧凑；衍射式锥透镜传输效率高，质量重复可控。Modulation devices such as collimating lenses and light-blocking strips are eliminated, which improves laser transmission efficiency and makes the structure more compact; the diffraction conical lens has high transmission efficiency and repeatable and controllable quality.
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention. It should be noted that similar numbers and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.
上述仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。 It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

Claims (7)

  1. 椭圆贝塞尔切割头装置，其特征在于：直接驱动电机(5)通过转接件(4)连接二维平移台(3)，二维平移台(3)通过转接块(2)固定切割头(1)，可驱动切割头(1)旋转和二维平移运动；所述切割头(1)包含沿光路设置的衍射式锥透镜(12)和聚焦镜(13)，将高斯分布的激光束(11)整形为椭圆贝塞尔分布光束(14)。An elliptical Bessel cutting head device is characterized in that: a direct drive motor (5) is connected to a two-dimensional translation stage (3) through an adapter (4); the two-dimensional translation stage (3) fixes a cutting head (1) through an adapter block (2), and can drive the cutting head (1) to rotate and perform two-dimensional translation movement; the cutting head (1) comprises a diffraction cone lens (12) and a focusing lens (13) arranged along an optical path, and shapes a Gaussian distributed laser beam (11) into an elliptical Bessel distributed light beam (14).
  2. 根据权利要求1所述的椭圆贝塞尔切割头装置，其特征在于：衍射式锥透镜(12)元件表面具有微结构，微结构呈环形光栅结构，光栅周期d与锥角γ的关系式为：
    d＝λ/sin[γ(n-1)]    The elliptical Bessel cutting head device according to claim 1 is characterized in that: the surface of the diffractive axicon (12) element has a microstructure, the microstructure is an annular grating structure, and the relationship between the grating period d and the cone angle γ is:
    d = λ/sin[γ(n-1)]
    式中，λ为激光波长，n为材料折射率；Where λ is the laser wavelength and n is the material refractive index;
    锥角γ范围是0.5°～20°，对应的顶角范围是179°～140°。The cone angle γ ranges from 0.5° to 20°, and the corresponding vertex angle ranges from 179° to 140°.
  3. 根据权利要求2所述的椭圆贝塞尔切割头装置，其特征在于：微结构为G阶的环形光栅结构，G为整数，每个周期内G个台阶的宽度均为d/G，每个周期内G个台阶相对相位依次构成首项0、末项2(G-1)π/G和公差为2π/G的等差数列。The elliptical Bessel cutting head device according to claim 2 is characterized in that the microstructure is a G-order annular grating structure, G is an integer, the width of the G steps in each period is d/G, and the relative phases of the G steps in each period sequentially constitute an arithmetic progression with a first term of 0, a last term of 2(G-1)π/G and a tolerance of 2π/G.
  4. 根据权利要求2所述的椭圆贝塞尔切割头装置，其特征在于：微结构为G阶的环形光栅结构，G为整数，每个周期内G个台阶相对深度构成首项为0、末项为(G-1)λ/[G(n-1)]和公差为λ/[G(n-1)]的等差数列，n为材料折射率。The elliptical Bessel cutting head device according to claim 2 is characterized in that the microstructure is a G-order annular grating structure, G is an integer, the relative depths of the G steps in each period constitute an arithmetic progression with a first term of 0, a last term of (G-1)λ/[G(n-1)] and a tolerance of λ/[G(n-1)], and n is the refractive index of the material.
  5. 根据权利要求1或2所述的椭圆贝塞尔切割头装置，其特征在于：衍射式锥透镜(12)的材质为熔融石英玻璃、BK7玻璃或S-LAH64玻璃，室温下，熔融石英玻璃、BK7玻璃和S-LAH64玻璃在1064nm处的折射率分别为1.4496、1.5066、1.7688。 The elliptical Bessel cutting head device according to claim 1 or 2 is characterized in that the diffractive axicon (12) is made of fused quartz glass, BK7 glass or S-LAH64 glass, and at room temperature, the refractive indices of fused quartz glass, BK7 glass and S-LAH64 glass at 1064 nm are 1.4496, 1.5066 and 1.7688 respectively.
  6. 根据权利要求3或4所述的椭圆贝塞尔切割头装置，其特征在于：G≥2。The elliptical Bessel cutting head device according to claim 3 or 4, characterized in that: G≥2.
  7. 根据权利要求1所述的椭圆贝塞尔切割头装置，其特征在于：衍射式锥透镜(12)上镀膜；The elliptical Bessel cutting head device according to claim 1, characterized in that: the diffractive axicon (12) is coated;
    椭圆方程，长轴和短轴半径分别为a和ell×a，ell表示椭圆的圆度，0％<ell≤100％；
    Ellipse equation, the major and minor radii are a and ell×a respectively, ell represents the roundness of the ellipse, 0%<ell≤100%;
    坐标(x,y)处的长轴半径a，
    The radius of the major axis at coordinate (x,y) is a.
    坐标x和y的步长Δ＝d/G，G表示阶数，矩阵长度M为：
    The step size of the coordinates x and y is Δ = d/G, G represents the order, and the matrix length M is:
    R表示衍射式锥透镜元件半径，坐标x和y均由-(M-1)Δ/2为首项、Δ为公差、(M-1)Δ/2为末项的等差数列构成；R represents the radius of the diffractive aconic lens element, and the coordinates x and y are both composed of an arithmetic progression with -(M-1)Δ/2 as the first term, Δ as the tolerance, and (M-1)Δ/2 as the last term;
    椭圆贝塞尔相位Φ，
    Elliptical Bessel phase Φ,
    a∈[0,R]；a∈[0,R];
    转换为直角坐标系，
    Convert to rectangular coordinate system,
    相位对2π同余，每个周期宽度d内，根据阶数G分为G段区域，每个周期内区域深度构成首项为0、末项为(G-1)λ/[G(n-1)]和公差为λ /[G(n-1)]的等差数列；相位图按阶数拆分为log2G副图，2、4、8、16阶分别1次、2次、3次和4次镀膜、光刻、刻蚀和清洗制程。 The phase is congruent to 2π. Each cycle width d is divided into G segments according to the order G. The depth of the region in each cycle consists of a first term of 0, a last term of (G-1)λ/[G(n-1)] and a tolerance of λ /[G(n-1)] arithmetic progression; the phase diagram is split into log 2 G sub-diagrams according to the order, and the 2nd, 4th, 8th, and 16th orders are 1st, 2nd, 3rd, and 4th coating, lithography, etching, and cleaning processes respectively.
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