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CN204975690U - Produce device of bezier laser beam - Google Patents

Produce device of bezier laser beam Download PDF

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Publication number
CN204975690U
CN204975690U CN201520512683.9U CN201520512683U CN204975690U CN 204975690 U CN204975690 U CN 204975690U CN 201520512683 U CN201520512683 U CN 201520512683U CN 204975690 U CN204975690 U CN 204975690U
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Prior art keywords
laser
bezier
laser beam
cone prism
gaussian
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CN201520512683.9U
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王建刚
王雪辉
冯峰
程伟
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Wuhan Huagong Laser Engineering Co Ltd
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Wuhan Huagong Laser Engineering Co Ltd
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Abstract

The utility model relates to a laser cutting field especially relates to a produce device of bezier laser beam. The device includes toper prism, first focusing mirror and second focusing mirror, and wherein, first focusing mirror and second focusing mirror constitute the 4f system, and be specific: the toper prism for be the bezier light beam with the gaussian laser beam plastic, the bezier light beam forms annular laser behind first focusing mirror, annular laser forms the used bezier laser of processing material behind the second focusing mirror, bezier laser has appointed focusing spot and focal depth. The embodiment of the utility model provides a produce the gaussian laser beam of two bundles of specific contained angles when utilizing gaussian laser beam that the laser instrument produced through the toper prism, the gaussian laser beam mutual interference produces the bezier light beam, and after a 4f system was crossed in the break -over of bezier light beam, the bezier light beam is enlargied or reduces formed required spot size and the focal depth of materials processing.

Description

A kind of device producing Bezier laser beam
Technical field
The utility model relates to field, particularly relates to a kind of device producing Bezier laser beam.
Background technology
Along with the increase of material thickness cut in laser cutting, the impact that laser inner-cutting technology is subject to normal Gaussian laser depth of focus etc. cannot complete disposable cutting, and its working (machining) efficiency decreases, and cannot meet the requirement of existing market to this technology working (machining) efficiency.Therefore, need the larger laser beam of a kind of depth of focus to improve the efficiency of the thicker material of processing
Therefore be necessary to design a kind of device producing Bezier laser beam, to overcome the problems referred to above.
Utility model content
The purpose of this utility model is the defect overcoming prior art, provides a kind of device producing Bezier laser beam.
The utility model is achieved in that
The utility model provides a kind of device producing Bezier laser beam, comprises cone prism, the first focus lamp and the second focus lamp, and wherein, the first focus lamp and the second focus lamp form 4f system, concrete:
Cone prism, for being shaped as bessel beam by Gaussian laser beam; Described bessel beam, after the first focus lamp, forms loop laser; Described loop laser is after the second focus lamp, and form the Bezier laser that rapidoprint is used, described Bezier laser has the focal beam spot and depth of focus of specifying.
Preferably, the laser pulse width of described Gaussian laser beam is less than 100ns.
Preferably, the two bundle Gaussian laser beams through cone prism can interfere generation bessel beam mutually.
Preferably, the Bezier laser beam that cone prism produces, its laser energy density I passes through formula:
I ( r , z ) = 2 k π ( tan 2 β ) ( n a - 1 ) 2 zI 0 e - 2 ( n - 1 ) z t a n α / ω 0
Try to achieve, wherein, k is wave vector, and β is the angle of wedge of cone prism, n afor the refractive index of cone prism, z be bessel beam along direction of propagation coordinate, I 0for gauss laser beam energy density, ω 0for the size with a tight waist of Gaussian laser beam.
Preferably, the Bezier laser beam that cone prism produces, its depth of focus passes through formula: try to achieve, wherein, D is incident beam diameter, and n is cone prism refractive index, and α is that cone prism carves angle.
Preferably, the laser beam that laser instrument sends first produces the Gaussian laser beam of two bundle certain degree by cone prism, described angle passes through formula: θ ba-arccos (n acos θ a) try to achieve, wherein, n aand θ abe respectively refractive index and the semiapex angle of axicon.
Preferably, the first focus lamp and the second focus lamp composition 4f system, zoom in or out accordingly to bessel beam, forms focal beam spot and the depth of focus of material cutting needs.
Preferably, described laser instrument is for cutting the transparent material with light transmission.
Preferably, the Bezier wave-length coverage of generation is between 1000nm to 2000nm.
Preferably, when cut transparent material and laser produce relative motion, transparent material inside can produce implosion band along cut direction; After having cut, prolong cutting path at material surface and apply pressure, material splits by set cut direction.
The utility model has following beneficial effect: the Gaussian laser beam that the utility model embodiment utilizes laser instrument to produce is by producing the Gaussian laser beam of two bundle certain degree during cone prism, Gaussian laser beam interferes generation bessel beam mutually, after a 4f system is crossed in bessel beam break-through, bessel beam is exaggerated or reduces and forms spot size required for materials processing and depth of focus.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
A kind of Bezier laser beam generating principle schematic diagram that Fig. 1 provides for the utility model embodiment;
A kind of apparatus structure schematic diagram producing Bezier laser beam that Fig. 2 provides for the utility model embodiment;
A kind of device cutting material schematic diagram producing Bezier laser beam that Fig. 3 provides for the utility model embodiment.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, other embodiments all that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belong to the scope of the utility model protection.
As Fig. 1-Fig. 2, the utility model embodiment provides a kind of device producing Bezier laser beam, comprises cone prism 2, first focus lamp 4 and the second focus lamp 6, and wherein, the first focus lamp 4 and the second focus lamp 6 form 4f system, concrete:
Cone prism 2, for being shaped as bessel beam 3 by Gaussian laser beam 1; Described bessel beam 3, after the first focus lamp 4, forms loop laser 5; Described loop laser 5 is after the second focus lamp 6, and form the Bezier laser 7 that rapidoprint is used, described Bezier laser 7 has the focal beam spot and depth of focus of specifying.
Preferably, the laser pulse width of described Gaussian laser beam 1 is less than 100ns.
Preferably, the two bundle Gaussian laser beams 1 through cone prism 2 can interfere generation bessel beam 3 mutually.
Preferably, the Bezier laser beam that cone prism 2 produces, its laser energy density I passes through formula:
I ( r , z ) = 2 k π ( tan 2 β ) ( n a - 1 ) 2 zI 0 e - 2 ( n - 1 ) z t a n α / ω 0
Try to achieve, wherein, k is wave vector, and β is the angle of wedge of cone prism 2, n afor the refractive index of cone prism 2, z be bessel beam 3 along direction of propagation coordinate, I 0for Gaussian laser beam 1 energy density, ω 0for the size with a tight waist of Gaussian laser beam 1.
Preferably, the Bezier laser beam that cone prism 2 produces, its depth of focus passes through formula: try to achieve, wherein, D is incident beam diameter, n afor cone prism 2 refractive index, α is that cone prism 2 carves angle.
Preferably, the laser beam that laser instrument sends first produces the Gaussian laser beam 1 of two bundle certain degree by cone prism 2, described angle passes through formula: θ ba-arccos (n acos θ a) try to achieve, wherein, n aand θ abe respectively refractive index and the semiapex angle of axicon.As shown in Figure 1, the radius of bessel beam 3 center spot that axicon produces, relevant with the wavelength of light beam with the parameter of axicon, can ρ be expressed as 0=2.405/ (ksin θ b) wherein k be the wave number of light in propagation medium.When the base angle of axicon is very little, due to the radius of the center spot of the bessel beam 3 that such axicon produces can be expressed as ρ 0 = 2.405 λ π ( n a - 1 ) ( π - 2 θ a ) .
Be greater than the condition of incident beam spot size in the aperture of axicon under, the approximate propagation distance of bessel beam 3 is approximately Z=ω 0/ tan θ b, wherein ω 0for inciding the waist radius of axicon Gaussian laser beam 1.
Preferably, the first focus lamp 4 and the second focus lamp 6 form 4f system, zoom in or out accordingly bessel beam 3, form focal beam spot and the depth of focus of material cutting needs.
Preferably, described laser instrument is for cutting the transparent material with light transmission.
Preferably, the Bezier wave-length coverage of generation is between 1000nm to 2000nm.
Preferably, when cut transparent material and laser produce relative motion, transparent material inside can produce implosion band along cut direction; After having cut, prolong cutting path at material surface and apply pressure, material splits by set cut direction.
As shown in Figure 3, light beam 11 is the Bezier laser formed by the device of generation Bezier laser beam as shown in Figure 2, focus the light beam in transparent material 13 inner, laser depth of focus 12 runs through material internal and depth of focus is not less than material thickness, when cut transparent material and laser produce relative motion, transparent material inside can produce implosion band along cut direction.
The utility model has following beneficial effect: the Gaussian laser beam 1 that the utility model embodiment utilizes laser instrument to produce is by producing the Gaussian laser beam 1 of two bundle certain degree during cone prism 2, Gaussian laser beam 1 interferes generation bessel beam 3 mutually, after a 4f system is crossed in bessel beam 3 break-through, bessel beam 3 is exaggerated or reduces and forms spot size required for materials processing and depth of focus.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.

Claims (10)

1. one kind produces the device of Bezier laser beam, it is characterized in that, comprise cone prism (2), the first focus lamp (4) and the second focus lamp (6), wherein, first focus lamp (4) and the second focus lamp (6) form 4f system, concrete:
Cone prism (2), for being shaped as bessel beam (3) by Gaussian laser beam (1);
Described bessel beam (3), after the first focus lamp (4), forms loop laser (5);
Described loop laser (5) is after the second focus lamp (6), and form the Bezier laser (7) that rapidoprint is used, described Bezier laser (7) has the focal beam spot and depth of focus of specifying.
2. device according to claim 1, is characterized in that: the laser pulse width of described Gaussian laser beam (1) is less than 100ns.
3. device according to claim 2, is characterized in that: two bundles Gaussian laser beam (1) through cone prism (2) can interfere generation bessel beam (3) mutually.
4. device according to claim 1, is characterized in that, the Bezier laser beam that cone prism (2) produces, and its laser energy density I passes through formula:
I ( r , z ) = 2 k π ( tan 2 β ) ( n a - 1 ) 2 zI 0 e - 2 ( n - 1 ) z t a n α / ω 0
Try to achieve, wherein, k is wave vector, and β is the angle of wedge of cone prism (2), n afor the refractive index of cone prism (2), z be bessel beam (3) along direction of propagation coordinate, I 0for Gaussian laser beam (1) energy density, ω 0for the size with a tight waist of Gaussian laser beam (1).
5. device according to claim 1, is characterized in that, the Bezier laser beam that cone prism (2) produces, and its depth of focus passes through formula:
Try to achieve, wherein, D is incident beam diameter, and n is cone prism (2) refractive index, and α is that cone prism (2) carves angle.
6. device according to claim 1, is characterized in that, the laser beam that laser instrument sends first produces the Gaussian laser beam (1) of two bundle certain degree by cone prism (2), described angle passes through formula:
θ b=θ a-arccos(n acosθ a)
Try to achieve, wherein, n aand θ abe respectively refractive index and the semiapex angle of axicon.
7. device according to claim 1, it is characterized in that, first focus lamp (4) and the second focus lamp (6) composition 4f system, zoom in or out accordingly to bessel beam (3), forms focal beam spot and the depth of focus of material cutting needs.
8. device according to claim 1, is characterized in that, described laser instrument has the transparent material of light transmission for cutting.
9. device according to claim 1, is characterized in that, the Bezier wave-length coverage of generation is between 1000nm to 2000nm.
10. device according to claim 1, is characterized in that, when cut transparent material and laser produce relative motion, transparent material inside can produce implosion band along cut direction; After having cut, prolong cutting path at material surface and apply pressure, material splits by set cut direction.
CN201520512683.9U 2015-07-15 2015-07-15 Produce device of bezier laser beam Active CN204975690U (en)

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105891916A (en) * 2016-06-26 2016-08-24 上海嘉强自动化技术有限公司 Aspherical mirror based on axicon and focusing mirror features
CN106994562A (en) * 2016-01-25 2017-08-01 郑钧文 The laser cutting method and laser cutting machine of hard brittle material
CN107876971A (en) * 2016-09-30 2018-04-06 上海微电子装备(集团)股份有限公司 A kind of laser cutting device and method
CN109366015A (en) * 2018-12-24 2019-02-22 武汉华工激光工程有限责任公司 With the interior cutter device coaxially positioned
CN109471265A (en) * 2018-05-30 2019-03-15 北京长城融智科技有限公司 A kind of insensitive focusing alignment methods in the space of dual-beam pumping-detection and system
CN109514099A (en) * 2018-12-12 2019-03-26 武汉华工激光工程有限责任公司 A kind of laser processing using Bayside light beam cutting frosted fragile material
CN109590618A (en) * 2017-09-28 2019-04-09 上海微电子装备(集团)股份有限公司 A kind of laser cutting system and method
CN109746569A (en) * 2019-01-26 2019-05-14 江苏先河激光研究院有限公司 Integral type laser condensing lens
CN109773330A (en) * 2017-11-14 2019-05-21 武汉华工激光工程有限责任公司 Laser output system and calculation method based on homogenizer
CN110174770A (en) * 2019-03-18 2019-08-27 首都师范大学 Multistage stablizes the generation device and method of transmission bessel beam on a kind of axis
CN111203651A (en) * 2020-01-15 2020-05-29 北京理工大学 Method for processing and calculating hologram in transparent material by space shaping femtosecond laser
CN111505831A (en) * 2020-04-01 2020-08-07 中国科学院西安光学精密机械研究所 Focal spot focal depth variable Bessel beam laser processing system and method
CN111715624A (en) * 2019-03-19 2020-09-29 武汉光谷航天三江激光产业技术研究院有限公司 Laser cleaning device
CN112440005A (en) * 2019-08-28 2021-03-05 朗美通经营有限责任公司 Bessel beam with axicon for cutting transparent materials
CN114434808A (en) * 2021-12-29 2022-05-06 深圳泰德激光技术股份有限公司 Method and device for welding transparent plastic and computer readable storage medium
CN115138997A (en) * 2022-09-07 2022-10-04 武汉引领光学技术有限公司 Multipoint Bessel beam glass punching device and method
WO2024124933A1 (en) * 2022-12-12 2024-06-20 苏州德龙激光股份有限公司 Elliptical bessel cutting head device

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106994562A (en) * 2016-01-25 2017-08-01 郑钧文 The laser cutting method and laser cutting machine of hard brittle material
CN105891916B (en) * 2016-06-26 2018-08-14 上海嘉强自动化技术有限公司 A kind of aspherical mirror based on axicon lens Yu focus lamp characteristic
CN105891916A (en) * 2016-06-26 2016-08-24 上海嘉强自动化技术有限公司 Aspherical mirror based on axicon and focusing mirror features
CN107876971A (en) * 2016-09-30 2018-04-06 上海微电子装备(集团)股份有限公司 A kind of laser cutting device and method
CN109590618A (en) * 2017-09-28 2019-04-09 上海微电子装备(集团)股份有限公司 A kind of laser cutting system and method
CN109773330A (en) * 2017-11-14 2019-05-21 武汉华工激光工程有限责任公司 Laser output system and calculation method based on homogenizer
CN109471265B (en) * 2018-05-30 2022-03-08 北京长城融智科技有限公司 Double-beam pumping-detection space insensitive focusing alignment method and system
CN109471265A (en) * 2018-05-30 2019-03-15 北京长城融智科技有限公司 A kind of insensitive focusing alignment methods in the space of dual-beam pumping-detection and system
CN109514099A (en) * 2018-12-12 2019-03-26 武汉华工激光工程有限责任公司 A kind of laser processing using Bayside light beam cutting frosted fragile material
CN109366015A (en) * 2018-12-24 2019-02-22 武汉华工激光工程有限责任公司 With the interior cutter device coaxially positioned
CN109746569A (en) * 2019-01-26 2019-05-14 江苏先河激光研究院有限公司 Integral type laser condensing lens
CN110174770A (en) * 2019-03-18 2019-08-27 首都师范大学 Multistage stablizes the generation device and method of transmission bessel beam on a kind of axis
CN110174770B (en) * 2019-03-18 2023-10-27 首都师范大学 Device and method for generating on-axis multistage stable transmission Bessel light beam
CN111715624A (en) * 2019-03-19 2020-09-29 武汉光谷航天三江激光产业技术研究院有限公司 Laser cleaning device
CN112440005A (en) * 2019-08-28 2021-03-05 朗美通经营有限责任公司 Bessel beam with axicon for cutting transparent materials
CN111203651B (en) * 2020-01-15 2021-06-22 北京理工大学 Method for processing and calculating hologram in transparent material by space shaping femtosecond laser
CN111203651A (en) * 2020-01-15 2020-05-29 北京理工大学 Method for processing and calculating hologram in transparent material by space shaping femtosecond laser
CN111505831A (en) * 2020-04-01 2020-08-07 中国科学院西安光学精密机械研究所 Focal spot focal depth variable Bessel beam laser processing system and method
CN111505831B (en) * 2020-04-01 2021-06-22 中国科学院西安光学精密机械研究所 Focal spot focal depth variable Bessel beam laser processing system and method
CN114434808A (en) * 2021-12-29 2022-05-06 深圳泰德激光技术股份有限公司 Method and device for welding transparent plastic and computer readable storage medium
CN115138997A (en) * 2022-09-07 2022-10-04 武汉引领光学技术有限公司 Multipoint Bessel beam glass punching device and method
CN115138997B (en) * 2022-09-07 2022-12-06 武汉引领光学技术有限公司 Multipoint Bessel beam glass punching device and method
WO2024124933A1 (en) * 2022-12-12 2024-06-20 苏州德龙激光股份有限公司 Elliptical bessel cutting head device

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